Program cooling simulation device

Abstract

The utility model relates to the technical field of device calibration, in particular to a programmed cooling simulation device, which is provided with a simulation gradient cooling box and a plurality of temperature measurement nodes which are uniformly distributed in the simulation gradient cooling box by taking a central axis as a central line at equal intervals, so that the state of a sample entering the programmed cooling box can be simulated, and the temperature measurement nodes can be used as temperature measurement nodes. The samples at all the hole sites are kept at a synchronous cooling level, and the cooling rate is consistent; a space is formed between the metal module placed at the bottom of the groove of the simulated gradient cooling box and the boss, so that the effect of slow cooling can be achieved; a temperature sensor and a data processing and communication board are installed on a circuit board arranged on a temperature measurement node, when the temperature measurement node is activated when being placed on a special interface, a computer sets the temperature sampling interval and the temperature recording time of the temperature measurement node, and collects and records a cooling curve of the program cooling simulation device placed in an ultralow temperature device. The gradient cooling rate is calculated, and the effect of the programmed cooling box can be accurately evaluated.

Description

TECHNICAL FIELD

[0001] The utility model relates to medical equipment calibration technical field especially, relates to a program cooling simulation device. BACKGROUND

[0002] Program cooling box is a kind of equipment for cell, tissue or other biological sample gradually or gradient cooling in the process of cryopreservation, does not need to rely on any liquid and the auxiliary of additive, by its material and structure design can control the change rate of the temperature of biological sample in its interior, so that sample can gradient cooling in the process of cryopreservation, avoid the ice crystal destruction sample structure and activity caused by rapid cooling, guarantee cell recovery performance stable, survival rate is high;Program cooling box generally claims that the cooling rate of sample in the box can be controlled at-1 ℃ / min, and the sample of each hole position can keep synchronous cooling level, and the cooling rate is consistent, but there is no any way to test the temperature change of sample in program cooling box, cannot judge whether it can really play the role of gradually cooling, adopts wired mode and cannot simulate sample to be placed in gradient cooling state, wireless device does not have the equipment that can be placed into the sample hole of program cooling box, therefore, there is an urgent need for a program cooling simulation device. SUMMARY

[0003] The utility model discloses a program cooling simulation device, aims at solving the technical problem existing in prior art.

[0004] The utility model discloses the following technical scheme:

[0005] A program cooling simulation device is placed into ultralow temperature device, including simulation gradient cooling box and several temperature measurement nodes evenly installed in the inside of simulation gradient cooling box, wherein,

[0006] The simulation gradient cooling box includes box body and box cover, recess provided with the central part of box body and the boss provided with the central part of box cover are inserted and connected as an organic whole after sealing, the bottom of recess is equipped with metal module for cooling;

[0007] The temperature measurement node includes circuit board and power supply battery, temperature sensor, data processing and communication board are installed on circuit board.

[0008] The boss is cylindrical, and the inner cylindrical cavity of recess is matched and attached, and the vertical central axis of boss and recess coincides with the central axis of box cover and box body.

[0009] In some embodiments, the upper pipe slots of the box cover of the ultra-low temperature aviation material are oppositely opened with the lower pipe slots of the box body of the ultra-low temperature aviation material, and the upper and lower pipe slots are aligned to form complete pipe slots with equal diameters, the pipe slots are equidistantly distributed in the simulation gradient cooling box with the center axis as the center line, and each pipe slot is provided with one temperature measuring node.

[0010] In some embodiments, the bottom planes of all the lower pipe slots and the bottom plane of the groove are on the same horizontal plane.

[0011] In some embodiments, the metal module is internally provided with a vertical center through hole, and the diameter d of the center through hole and the outer diameter D of the metal module should satisfy d / D=0.35-0.55; the metal module is horizontally placed at the bottom of the groove, the side wall of the metal module is attached to the inner wall of the groove, and the distance H between the upper plane of the metal module and the bottom plane of the boss should satisfy the preset requirement.

[0012] In some embodiments, the diameter d of the center through hole and the outer diameter D of the metal module are taken as d / D=0.45.

[0013] In some embodiments, the circuit board comprises an upper circuit board and a lower circuit board connected by flat wires, the battery is installed between the upper circuit board and the lower circuit board, the temperature sensor and the acquisition board for collecting temperature are installed on the upper circuit board, and the data processing and communication board for converting, processing and transmitting the collected data is installed on the lower circuit board.

[0014] In some embodiments, the temperature measuring node is further provided with a shell wrapped outside the upper circuit board, the battery and the lower circuit board, the shell made of PP material is matched and attached to the pipe slot, the upper end of the shell is an open end, and the temperature sensor is upwardly extended into the pipe slot from the open end.

[0015] In some embodiments, the single-chip microcomputer for controlling the collection of temperature, the memory for storing data information, the wireless communication module for communication connection with the computer and the Bluetooth wireless module for wirelessly connecting the temperature measuring node with the computer through a special interface are fixedly connected to the circuit board.

[0016] In some embodiments, the special interface is provided with a platform for placing the temperature measuring node, the special interface is provided with an activator, the Bluetooth wireless module is activated and opened by the activator, and the computer sets the temperature sampling interval and the temperature recording time of the temperature measuring node.

[0017] Advantages:

[0018] The utility model discloses a program cooling simulation device, compared with prior art, the utility model has the following advantages:

[0019] A programmed cooling simulation device, by setting up a simulated gradient cooling box and a number of temperature measuring nodes evenly distributed around the central axis within the simulated gradient cooling box, can simulate the state of a sample when it is placed in the programmed cooling box, while ensuring that the samples at each well position maintain a synchronous cooling level and a consistent cooling rate. The simulated gradient cooling box includes a box body and a box cover. A groove in the center of the box body and a boss in the center of the box cover are inserted and sealed together. A metal module placed at the bottom of the groove has a gap between it and the boss, which can achieve a slow cooling effect. The temperature measurement node has a temperature sensor and a data acquisition board installed on the upper circuit board for collecting temperature data, and a data processing and communication board installed on the lower circuit board for converting, processing, and transmitting the collected data. When the temperature measurement node is placed on the dedicated interface, the Bluetooth wireless module is activated by the activator. The computer sets the temperature sampling interval and temperature recording time of the temperature measurement node. When the programmed cooling simulation device is placed in the ultra-low temperature device for cooling, the cooling curve is collected and recorded, the temperature change process during the cooling process is analyzed, and the gradient cooling rate is calculated, which can accurately evaluate the effect of the programmed cooling box. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below, constituting a part of this utility model. The illustrative embodiments of this utility model and their descriptions explain this utility model and do not constitute an improper limitation of this utility model; in the drawings:

[0021] Figure 1 This is a schematic diagram of the technical solution structure disclosed in the embodiments of this utility model;

[0022] Figure 2 for Figure 1 AA section view;

[0023] Figure 3 This is a simulated view of the gradient cooling box.

[0024] Figure 4 for Figure 3 BB cross-sectional view (excluding metal modules);

[0025] Figure 5 A schematic diagram of the technical solution structure for the temperature measurement node;

[0026] Figure 6 A schematic diagram of the technical solution for placing a temperature measurement node onto a dedicated interface;

[0027] Figure 7 A schematic diagram of the technical solution for placing a programmed cooling simulation device into an ultra-low temperature device for cooling.

[0028] Figure 8 This is a temperature curve during the cooling process.

[0029] In the diagram: 1. Simulation gradient cooling box; 11. Box body; 111. Groove; 112. Lower tube groove; 12. Box cover; 121. Upper tube groove; 122. Boss; 13. Metal module; 2. Temperature measuring node; 21. Circuit board; 211. Upper circuit board; 212. Lower circuit board; 22. Temperature sensor; 23. Acquisition board; 24. Data processing and communication board; 25. Battery; 26. Flat wire; 27. Housing; 271. Inner cavity; 3. Ultra-low temperature freezer; 4. Dedicated interface; 41. Platform; 42. Bluetooth activator; 5. Computer; 6. Wireless temperature recorder. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. In the description of this utility model, it should be noted that the term "comprising" mentioned in the specification and claims is an open-ended term and should therefore be interpreted as "including but not limited to".

[0031] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0032] Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments; based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0033] like Figures 1-8 As shown, the technical solution disclosed in this utility model is as follows:

[0034] A programmed cooling simulation device is placed in an ultra-low temperature freezer 3, comprising a simulation gradient cooling box 1 and a plurality of temperature measuring nodes 2 evenly distributed inside the simulation gradient cooling box 1; wherein,

[0035] The simulated gradient cooling box 1 includes a box body 11 and a box cover 12. The groove 111 in the center of the box body 11 is inserted into and sealed to form a whole with the protrusion 122 in the center of the box cover 12. The bottom of the groove 111 is provided with a metal module 13 for cooling.

[0036] The temperature measurement node 2 includes a circuit board 21 and a power supply battery 25. A temperature sensor 22 and a data processing and communication board 24 are installed on the circuit board 21.

[0037] The boss 122 is a cylinder that matches and fits the inner cylindrical cavity of the groove 111, and the vertical central axis of the boss 122 and the groove 111 coincides with the central axis of the cover 12 and the box body 11.

[0038] like Figures 1-8 As shown, the preferred embodiment of this utility model is as follows:

[0039] A programmed cooling simulation device includes a simulation gradient cooling box 1 and a plurality of temperature measuring nodes 2 evenly distributed inside the simulation gradient cooling box 1.

[0040] The simulated gradient cooling box 1 includes a box body 11 and a box cover 12. Both the box body 11 and the box cover 12 are made of polyethylene foam, which is an ultra-low temperature aerospace material and has the characteristics of being safe, pollution-free, and reusable.

[0041] In this embodiment, both the box body 11 and the box cover 12 are cylindrical. The box body 11 has a groove 111 at its center, and the box cover 12 has a boss 122 at its center. The boss 122 is inserted into the groove 111 and then sealed together as a whole. The vertical central axis of the boss 122 and the groove 111 coincides with the central axis of the box cover 12 and the box body 11. The bottom plane of the boss 122 is spaced a certain distance from the bottom plane of the groove 111.

[0042] The cover 12 has an upper tube groove 121 with a downward opening, and the body 11 has a lower tube groove 112 with an upward opening. The upper tube groove 121 and the lower tube groove 112 have the same diameter and are aligned to form a complete tube groove of equal diameter. Each tube groove is equipped with a temperature measuring node 2.

[0043] A metal module 13 is placed at the bottom of the groove 111. The metal module 13 has a vertical central through hole 131, and the diameter d of the central through hole 131 and the outer diameter D of the metal module 13 should satisfy the following: d / D = 0.35 to 0.55. The metal module 13 is placed horizontally at the bottom of the groove 111, and its sidewall is in contact with the inner wall of the groove 111. There is a distance H between its upper plane and the bottom plane of the boss 122. H can be set according to the actual size and needs of the simulation gradient cooling box 1.

[0044] The optimal ratio of the diameter d of the central through hole 131 to the outer diameter D of the metal module 13 is d / D = 0.45.

[0045] The metal module 13 is arranged at the bottom of the groove 111, and a vertical center through hole 131 is arranged on the metal module 13, which effectively plays a role of rapid cooling or slow cooling.

[0046] That is, the center axis of the center through hole 131, the groove 111, the box cover 12 and the box body 11 are coaxial.

[0047] The pipe grooves are arranged in the simulation gradient cooling box 1 at equal intervals with the center axis as the center line, and the bottom planes of all the lower pipe grooves 112 and the bottom plane of the groove 111 are on the same horizontal plane. Figure 1 、 Figure 2 As shown in the drawings.

[0048] The temperature measuring node 2 includes a circuit board 21 and a power supply battery 25, and a temperature sensor 22 and a data processing and communication board 24 are arranged on the circuit board 21.

[0049] The circuit board 21 includes an upper circuit board 211 and a lower circuit board 212 connected by a flat wire 26 arranged on one side, and the battery 25 is arranged between the upper circuit board 211 and the lower circuit board 212, the temperature sensor 22 and the acquisition board 23 for collecting temperature are arranged on the upper circuit board 211, the data processing and communication board 24 for converting, processing and transmitting the collected data is arranged on the lower circuit board 212, and a Bluetooth wireless module is arranged on the data processing and communication board 24.

[0050] The temperature measuring node 2 is further provided with an outer shell 27, and the upper circuit board 211, the battery 25 and the lower circuit board 212 are arranged in the inner cavity 271 of the shell 27, the shell 27 made of PP material is matched and attached to the pipe groove, the upper end of the shell 27 is an open end, the temperature sensor 22 extends upward from the open end to the pipe groove, the shell 27 has a certain hardness, which can ensure the structural stability of the temperature measuring node 2.

[0051] The circuit board 21 is provided with a single-chip microcomputer for controlling the acquisition board 23 to collect temperature, a memory for storing data information, a wireless module for communication connection with the computer 5, and a Bluetooth wireless module for wirelessly connecting the temperature measuring node 2 and the computer 5 through a special interface 4; the data processing and communication board 24 is provided with a Bluetooth wireless module, which transmits the data information converted and processed to the computer 5, and also transmits the instructions of the computer 5 to the circuit board 21.

[0052] The special interface 4 is provided with a platform 41 for placing the temperature measuring node 2, and the special interface 4 is provided with a Bluetooth activator 42, the Bluetooth wireless module is activated and opened by the Bluetooth activator 42, so that the computer 5 sets temperature sampling interval, temperature recording time and the like for the temperature measuring node 2.

[0053] In use, the temperature measuring node 2 is taken out and placed on the special interface 4, so that the communication between the temperature measuring node 2 and the computer 5 is established, the sampling interval of the temperature node, the temperature recording time can be set on the software interface of the computer 5, after all the temperature nodes are set, the temperature measuring node 2 is placed into the simulation gradient cooling box 1, the box cover 12 is covered, the whole is placed into the ultra-low temperature refrigerator 3, at the same time, a wireless temperature recorder 6 for comparison test is placed in the ultra-low temperature refrigerator 3 and outside the simulation gradient cooling box 1, the temperature change in the ultra-low temperature refrigerator is directly tested for comparison, as shown in Figure 7 The temperature curve in the whole cooling process can be collected and recorded, as shown in Figure 8 Through analysis of the curve, the temperature change in the simulation gradient cooling box 1 can be calculated, such as cooling rate, cooling consistency, stable state and non-stable state temperature change trend, and the effect of the program cooling box can be accurately evaluated.

[0054] Figure 8 The temperature curves of four temperature measuring nodes and one wireless temperature recorder for comparison test are shown in the figure, the comparison is placed outside the simulation gradient cooling box, the temperature change in the ultra-low temperature refrigerator 3 is directly tested, it can be seen that the cooling in the gradient cooling box is lagged, the cooling is delayed, the cooling law of the four temperature measuring nodes is consistent, and the gradient cooling rate can be calculated according to the needs.

[0055] The embodiments of the utility model are described above in combination with the drawings, but the utility model is not limited to the above-mentioned specific embodiments, the above-mentioned specific embodiments are only illustrative, but not restrictive, the ordinary skilled in the art can make many forms under the inspiration of the utility model without departing from the purpose of the utility model and the scope protected by the claims, all belong to the protection of the utility model.

Claims

1. A programmed cooling simulation device, placed in an ultra-low temperature device, characterized in that: It includes a simulated gradient cooling box and several temperature measuring nodes evenly distributed inside the simulated gradient cooling box; wherein, The simulated gradient cooling box includes a box body and a box cover. The groove in the center of the box body is connected to the boss in the center of the box cover and sealed together. The bottom of the groove is provided with a metal module for cooling. The temperature measurement node includes a circuit board and a power supply battery. The circuit board is equipped with a temperature sensor and a data processing and communication board.

2. The programmed cooling simulation device according to claim 1, characterized in that: The boss is a cylinder that fits snugly into the inner cylindrical cavity of the groove, and the vertical central axis of the boss and the groove coincides with the central axis of the lid and the box body.

3. The programmed cooling simulation device according to claim 2, characterized in that: The upper tube groove of the box cover made of ultra-low temperature aerospace material and the lower tube groove of the box body made of ultra-low temperature aerospace material open towards each other and are aligned to form a complete tube groove of the same diameter. There are several tube grooves, which are evenly distributed in the simulated gradient cooling box with the central axis as the center line. Each tube groove is equipped with a temperature measuring node.

4. The programmed cooling simulation device according to claim 3, characterized in that: The bottom plane of all the lower pipe grooves and the bottom plane of the recesses are on the same horizontal plane.

5. The programmed cooling simulation device according to claim 1, characterized in that: The metal module has a vertical central through hole inside, and the diameter d of the central through hole and the outer diameter D of the metal module should satisfy: d / D=0.35~0.55; the metal module is placed horizontally at the bottom of the groove, its sidewall is in contact with the inner wall of the groove, and the distance H from its upper plane to the bottom plane of the boss of the box cover should meet the preset requirements.

6. The programmed cooling simulation device according to claim 5, characterized in that: The diameter d of the central through hole and the outer diameter D of the metal module are selected as: d / D=0.

45.

7. The programmed cooling simulation device according to claim 3, characterized in that: The circuit board includes an upper circuit board and a lower circuit board connected by flat wires. A battery is installed between the upper circuit board and the lower circuit board. A temperature sensor and a data acquisition board for collecting temperature are installed on the upper circuit board. A data processing and communication board for converting, processing and transmitting the collected data is installed on the lower circuit board.

8. The programmed cooling simulation device according to claim 7, characterized in that: The temperature measuring node is also provided with a housing that is enclosed outside the upper circuit board, the battery and the lower circuit board. The housing, made of PP material, is fitted to the tube groove. The upper end of the housing is an open end, and the temperature sensor extends upward from the open end into the tube groove.

9. The programmed cooling simulation device according to claim 8, characterized in that: The circuit board is fixedly connected to a microcontroller for controlling the collected temperature, a memory for storing data information, a wireless communication module for communicating with a computer, and a Bluetooth wireless module for wirelessly connecting the temperature measuring node to the computer through a dedicated interface.

10. The programmed cooling simulation device according to claim 9, characterized in that: The dedicated interface is equipped with a platform for placing the temperature measuring node. An activator is installed inside the dedicated interface. The Bluetooth wireless module is activated and turned on by the activator, so that the computer can set the temperature sampling interval and temperature recording time of the temperature measuring node.

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