Computer CPU radiator

By introducing a protective frame and dust filter structure into the CPU heatsink, the problem of dust accumulation on the heatsink fins is solved, heat dissipation efficiency is improved, and the maintenance process is simplified.

CN224020229UActive Publication Date: 2026-03-20LIAONING NORMAL UNIV HAIHUA COLLEGE
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-05-07
Publication Date
2026-03-20

AI Technical Summary

Technical Problem

During use, dust easily accumulates on the heatsink fins of existing computer CPU coolers, affecting their heat dissipation performance.

Method used

A CPU cooler with a protective frame and a dust filter was designed. The protective frame covers the air inlet on the outside of the heat sink fins, and the dust filter filters dust. Combined with a limiting plate and a snap-fit ​​structure, it is easy to install and disassemble.

Benefits of technology

It effectively prevents dust from accumulating inside the heat sink fins, improves heat dissipation, and facilitates the maintenance of the cooling fan and the cleaning of the protective frame.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a computer CPU (central processing unit) radiator, which particularly relates to the technical field of computer radiating, and comprises a heat conducting plate arranged at the top end of a CPU mainboard, a plurality of heat pipes are fixedly arranged on the heat conducting plate, a plurality of radiating fins are fixedly arranged at the outer ends of the heat pipes, and a mounting plate is arranged at the front ends of the radiating fins. A cooling fan is embedded in the middle of the mounting plate; the two sides of the rear end of the mounting plate are each provided with a connecting groove, the two ends of the protective frame are inserted into the two connecting grooves respectively, the three faces of the protective frame are each provided with an air inlet, and dustproof net plates are fixedly arranged on the inner walls of the air inlets. According to the CPU radiator, the air inlet positions on the outer sides of the radiating fins are comprehensively protected through the protection frame, the situation that dust is accumulated in the radiating fins is effectively avoided, the situation that heat dissipation of the radiating fins is affected by a dust layer is further avoided, and the heat dissipation effect of the CPU radiator is good.
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Description

TECHNICAL FIELD

[0001] The utility model relates to computer heat dissipation technical field, concretely relates to a computer CPU radiator. BACKGROUND

[0002] Computer processor is the functional unit of interpretation and execution instruction, also called central processing unit or CPU, it is the central nervous system of computer, computer in the use process, CPU high -speed operation, will produce a large amount of heat, especially in the case of high ambient temperature, computer CPU slow heat dissipation needs to use CPU radiator auxiliary heat dissipation, common CPU radiator is generally by base, heat pipe, heat dissipation fin and heat dissipation fan is formed, wherein heat dissipation fin and heat pipe combination is integral, and is installed on the CPU surface through base, and heat dissipation fan is installed on heat dissipation fin.

[0003] At present, computer CPU radiator is directly exposed to air in the actual use due to the structure such as heat dissipation fin, so when the wind generated by the heat dissipation fan passes through the inside of the heat dissipation fin, the dust carried in the wind will adhere to the heat dissipation fin, when the dust layer adheres to the outer layer of the heat dissipation fin, the dust layer will affect the heat dissipation to the outside, thereby affecting the heat dissipation effect of CPU. UTILITARIAN CONTENT

[0004] The utility model aims at providing a computer CPU radiator to solve the above-mentioned shortcomings in the prior art.

[0005] In order to achieve the above-mentioned purpose, the utility model provides the following technical scheme: a computer CPU radiator, comprising:

[0006] The heat-conducting plate is provided at the top end of the CPU mainboard, a plurality of heat pipes are fixedly arranged on the heat-conducting plate, a plurality of heat dissipation fins are fixedly arranged at the outer ends of the heat pipes, an installation plate is arranged at the front ends of the heat dissipation fins, and a heat dissipation fan is embedded in the middle part of the installation plate.

[0007] The protective frame is arranged at the outer end of the heat dissipation fin, a connecting groove is formed in each of the two sides of the rear end of the installation plate, the two ends of the protective frame are inserted into the two connecting grooves respectively, an air inlet is formed in each of the three sides of the protective frame, and a dust screen is fixedly arranged on the inner wall of the air inlet.

[0008] Preferably, a first limiting plate is fixedly arranged at the top end and the rear end of the bottom end of the protective frame respectively, and the two first limiting plates are arranged at the top end and the rear end of the bottom end of the heat dissipation fin respectively, so that the protective frame can be limited on the outer side of the heat dissipation fin.

[0009] Preferably, a second limiting plate is fixedly arranged at the top end and the bottom end of the protective frame respectively, and the four second limiting plates are arranged at the top end and the bottom end of the installation plate respectively, so that the two ends of the protective frame can be limited at the top end and the bottom end of the installation plate.

[0010] Preferably, two movable grooves are formed at the top end of the mounting plate, and a clamping block is arranged in each of the two movable grooves, and the clamping block extends to the top of the mounting plate, and a clamping fixing groove is formed in the inner side of each of the two second limiting plates at the top end of the mounting plate, and one end of each of the two clamping blocks is clamped into the clamping fixing groove, so that the second limiting plates at the two ends of the protection frame can be fixed and limited.

[0011] Preferably, a fixing rod is fixedly arranged in the movable groove, one end of the fixing rod penetrates through the clamping block, and a reset spring is sleeved on the outer end of the fixing rod, and the other end of the reset spring is fixedly connected with the other end of the clamping block and one end of the movable groove, so that the clamping block can be guided and automatically reset.

[0012] Preferably, a push plate is fixedly arranged on the other end of the clamping block, and the push plate is arranged at the top end of the mounting plate, so that the clamping block can be pushed to move.

[0013] Preferably, the heat-conducting plate is made of copper material, and a heat-conducting silicone grease layer is coated between the heat-conducting plate and the CPU mainboard, so that the heat on the CPU mainboard can be quickly conducted out.

[0014] In the above technical solution, the technical effects and advantages of the present application are provided:

[0015] 1. The protection frame protects the air inlet outside the heat dissipation fins in all directions, effectively preventing dust from accumulating inside the heat dissipation fins, thereby preventing the dust layer from affecting the heat dissipation of the heat dissipation fins, and improving the heat dissipation effect of the CPU radiator.

[0016] 2. The first limiting plate, the second limiting plate and the clamping block are used to connect and fix the heat dissipation fins, the protection frame and the mounting plate together, so that the mounting and dismounting of the mounting plate, the heat dissipation fan and the protection frame are more convenient, and the heat dissipation fan is convenient to maintain and the protection frame is convenient to clean. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art based on these drawings.

[0018] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0019] Figure 2 It is a schematic diagram of the overall bottom view structure of the present application;

[0020] Figure 3 It is the three-dimensional structure schematic view of the heat conduction plate, heat pipe and radiating fin of the utility model;

[0021] Figure 4 It is the three-dimensional structure schematic view of the mounting plate, radiating fan and protective frame of the utility model;

[0022] Figure 5 It is the three-dimensional structure schematic view of the Figure 4 Amplification structure schematic view of middle A;

[0023] Figure 6 It is the three-dimensional sectional structure schematic view of the clamping block of the utility model.

[0024] Mark explanation:

[0025] 1, heat conduction plate;2, CPU mainboard;3, heat pipe;4, radiating fin;5, mounting plate;6, radiating fan;7, protective frame;8, air inlet;9, dust screen plate;10, first limiting plate;11, second limiting plate;12, connecting groove;13, movable groove;14, clamping block;15, clamping fixed groove;16, fixed rod;17, reset spring;18, push plate;19, heat-conducting silicone grease layer. Specific implementation

[0026] In order to make the technical personnel of the prior art better understand the technical scheme of the utility model, the utility model will be further introduced in detail below in conjunction with the drawings.

[0027] The utility model provides a kind of computer CPU radiator as Figures 1 to 4 As shown in the figure, including:

[0028] Heat conduction plate 1 is arranged at the top of CPU mainboard 2, and a plurality of heat pipes 3 are fixedly arranged on heat conduction plate 1, a plurality of radiating fins 4 are fixedly arranged on the outer end of heat pipe 3, a mounting plate 5 is arranged at the front end of a plurality of radiating fins 4, and a radiating fan 6 is embedded in the middle of mounting plate 5;

[0029] Protective frame 7 is arranged at the outer end of radiating fin 4, and a connecting groove 12 is formed in the rear end of mounting plate 5 on both sides;The two ends of protective frame 7 are respectively inserted into the two connecting grooves 12, and an air inlet 8 is formed in three sides of protective frame 7, and a dust screen plate 9 is fixedly arranged on the inner wall of air inlet 8.

[0030] Heat conduction plate 1 is made of copper material, and heat-conducting silicone grease layer 19 is coated between heat conduction plate 1 and CPU mainboard 2.

[0031] The CPU mainboard 2 is first coated with a layer of heat-conducting silicone grease 19, and then the bottom end of the CPU mainboard 2 is connected with the heat-conducting silicone grease 19 together, the heat generated by the CPU mainboard 2 during operation is transmitted to the heat-conducting plate 1 through the heat-conducting silicone grease 19, and then transmitted to the heat pipe 3 and the heat dissipation fins 4, the heat dissipation fan 6 is started, the external air enters the inside of the heat dissipation fins 4 through the plurality of air inlets 8, and then is pumped to the outside by the heat dissipation fan 6, so that the wind can take away the heat on the heat dissipation fins 4, and the dust in the air passing through the air inlets 8 is filtered on the outside of the dust screen plate 9, so that the inside of the heat dissipation fins 4 will not accumulate dust.

[0032] The protective frame 7 is used for all-round protection of the air inlet outside the heat dissipation fins 4, effectively avoiding the accumulation of dust inside the heat dissipation fins 4, thereby avoiding the influence of the dust layer on the heat dissipation of the heat dissipation fins 4, and the heat dissipation effect of the CPU radiator is better.

[0033] The utility model provides a kind of computer CPU radiator as Figure 1 And Figures 4 to 6 As shown in one, the first limiting plate 10 is fixedly arranged at the top end and the bottom end rear of the heat dissipation fins 4, and the second limiting plate 11 is fixedly arranged at the top end and the bottom end of the mounting plate 5.

[0034] The mounting plate 5 is provided with two movable grooves 13 at the top end, and each movable groove 13 is provided with a clamping block 14, the clamping block 14 extends to the top of the mounting plate 5, the second limiting plate 11 is provided with a clamping fixed groove 15 at the top end of the mounting plate 5, and the clamping block 14 is clamped into the clamping fixed groove 15, the movable groove 13 is fixedly provided with a fixed rod 16, the fixed rod 16 penetrates the clamping block 14, the fixed rod 16 is provided with a reset spring 17, the reset spring 17 is fixedly connected to the clamping block 14 and the movable groove 13, and the clamping block 14 is provided with a push plate 18.

[0035] When the mounting plate 5 and the heat dissipation fan 6 are connected with the heat dissipation fins 4, the mounting plate 5 is attached to the front end of the heat dissipation fins 4, and then the protective frame 7 is moved from the rear end of the heat dissipation fins 4 to the front, so that the two side walls of the protective frame 7 are attached to the two sides of the heat dissipation fins 4. When the protective frame 7 is moved, the fingers hook the push plate 18 to pull the two clamping blocks 14 towards each other, and the two clamping blocks 14 will compress the two return springs 17. At this time, the two ends of the protective frame 7 are inserted into the two connecting grooves 12, the two first limiting plates 10 are moved to the top and bottom of the rear end of the heat dissipation fins 4, and the four second limiting plates 11 are moved to the top and bottom of the mounting plate 5. At this time, the push plate 18 is released, and the two clamping blocks 14 are clamped into the two clamping fixing grooves 15 under the elastic force of the two return springs 17. In this way, the clamping block 14 can limit and fix the second limiting plate 11 on the mounting plate 5, so as to connect and fix the mounting plate 5 and the protective frame 7 together, and the first limiting plate 10 and the second limiting plate 11 can connect the heat dissipation fins 4 with the protective frame 7 and the mounting plate 5 together. The heat dissipation fins 4, the protective frame 7 and the mounting plate 5 are connected and fixed together through the first limiting plate 10, the second limiting plate 11 and the clamping block 14, so that the installation and disassembly of the mounting plate 5, the heat dissipation fan 6 and the protective frame 7 are relatively convenient, thereby facilitating the maintenance of the heat dissipation fan 6 and the cleaning of the protective frame 7.

[0036] The above only describes certain exemplary embodiments of the present application by way of illustration, and it is needless to say that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present application. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present application.

Claims

1. A computer CPU heatsink, characterized in that, include: A heat-conducting plate (1) is provided on the top of the CPU motherboard (2). Multiple heat pipes (3) are fixedly provided on the heat-conducting plate (1). Multiple heat dissipation fins (4) are fixedly provided at the outer ends of the heat pipes (3). A mounting plate (5) is provided at the front end of the multiple heat dissipation fins (4). A cooling fan (6) is embedded in the middle of the mounting plate (5). The protective frame (7) is located at the outer end of the heat dissipation fins (4). A connecting groove (12) is provided on both sides of the rear end of the mounting plate (5). The two ends of the protective frame (7) are respectively inserted into the two connecting grooves (12). An air inlet (8) is provided on three sides of the protective frame (7). A dustproof mesh plate (9) is fixed on the inner wall of the air inlet (8).

2. A computer CPU heatsink according to claim 1, characterized in that: The protective frame (7) is fixed with a first limiting plate (10) at the top and bottom rear, and the two first limiting plates (10) are respectively located at the top and bottom rear of the heat dissipation fins (4).

3. A computer CPU heatsink according to claim 1, characterized in that: The protective frame (7) has a second limiting plate (11) fixed at both ends of the upper and lower parts, and four second limiting plates (11) are respectively located at the top and bottom of the mounting plate (5).

4. A computer CPU heatsink according to claim 3, characterized in that: The top of the mounting plate (5) has two movable slots (13), and each of the two movable slots (13) has a snap-fit ​​block (14) inside. The top of the snap-fit ​​block (14) extends to the top of the mounting plate (5). Each of the two second limiting plates (11) located at the top of the mounting plate (5) has a snap-fit ​​fixing slot (15) inside. One end of each of the two snap-fit ​​blocks (14) is snapped into the two snap-fit ​​fixing slots (15).

5. A computer CPU heatsink according to claim 4, characterized in that: A fixing rod (16) is fixedly provided inside the movable groove (13). One end of the fixing rod (16) passes through the snap-fit ​​block (14). A reset spring (17) is sleeved on the outer end of the fixing rod (16). The two ends of the reset spring (17) are fixedly connected to the other end of the snap-fit ​​block (14) and one end inside the movable groove (13), respectively.

6. A computer CPU heatsink according to claim 4, characterized in that: A push plate (18) is fixed on both sides of the other end of the snap-fit ​​block (14), and the push plate (18) is located at the top of the mounting plate (5).

7. A computer CPU heatsink according to claim 1, characterized in that: The heat-conducting plate (1) is made of copper, and a thermal grease layer (19) is coated between the heat-conducting plate (1) and the CPU motherboard (2).