COMe module based on 2K1000 processor
By using the COME module based on the 2K1000 processor and employing hardware interface reconstruction and customized circuit design, the compatibility and power consumption issues of domestically produced COME modules have been resolved, enabling highly secure and independently controllable embedded module applications that meet the needs of key industries.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-07
- Publication Date
- 2026-03-20
AI Technical Summary
Domestically produced COME modules have compatibility differences with traditional x86 architecture in terms of interface definition, power management, and peripheral drivers. They also have high signal integrity and power consumption, and domestic operating systems lack plug-and-play support, making it difficult to meet the independent and controllable needs of key industries.
The COME module, based on the 2K1000 processor, achieves high compatibility and low power consumption of the TYPE6 interface through hardware interface reconstruction and customized circuit design, combined with the Loongson processor, PHY chip and power chip, and supports plug-and-play peripherals.
It achieves high security and high compatibility of domestically produced processors in standardized embedded modules, meets the independent controllability requirements of key industries, consumes less than 8W, optimizes signal integrity, and supports long life and high reliability.
Smart Images

Figure CN224020260U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to COMe module technical field, specifically is a COMe module based on 2K1000 treater. BACKGROUND
[0002] In recent years, with the change of international situation and the improvement of independent controllable requirement of information technology, the demand of nationalization computing module in key fields (such as national defense, energy, industrial control) is increasingly urgent. Traditional embedded module is mostly x86 architecture processor (such as Intel / AMD) with foreign operating system (such as Windows Embedded, VxWorks), and there is supply chain security and technical dependence risk. Although domestic processor (such as Loongson, Feiteng) and operating system (such as Kirin, SylixOS) have gradually matured, but its integration application in standardized module (such as COMe) still faces the challenges of compatibility, performance optimization and ecological adaptation.
[0003] Prior art bottleneck
[0004] At present, COMe standard module market is mainly dominated by foreign manufacturers, and its design is based on x86 system, which has significant differences with domestic processor in interface definition, power management, peripheral driver and other aspects. For example, Loongson processor adopts MIPS / LoongArch instruction set, and needs to redesign BIOS, hardware abstraction layer (HAL) and peripheral driver; At the same time, domestic operating system lacks support for plug and play of standard module, resulting in long development cycle and large performance loss.
[0005] Insufficient compatibility of domesticization: traditional COMe module relies on x86 processor and non-domestic peripheral, and cannot realize 100% independent controllable; High-speed signal adaptation defect: domestic processor has problems of poor signal integrity and high power consumption when integrating multiple USB / PCIe on COMe TYPE6 interface;
[0006] Ecological barrier: domestic PHY chip (such as Yutai micro YT8531SH-CA) is not supported by processor official, and domestic operating system (such as sharp) lacks standard module driver framework;
[0007] Reliability short board: the existing module has low heat dissipation efficiency and large power conversion loss, which is difficult to meet the long life requirement of industrial scene.
[0008] Therefore, in view of this problem, a COMe module based on 2K1000 treater is needed. Utility model content
[0009] The utility model discloses a COMe module based on 2K1000 processor, the utility model discloses through hardware interface reconfiguration, the customization circuit design of Loongson processor on COMe TYPE6 interface,
[0010] Fill the application blank of domestic processor in the field of standardization embedded module, provide high safety, high compatible self -determination technology base for key industry, the utility model has the strong practicality.
[0011] The utility model is realized as follows:
[0012] A COMe module based on 2K1000 processor, including the COMe module of 2K1000 processor connection, including Loongson 2K1000 processor, PHY chip and power supply chip on the COMe module, PHY chip and power supply chip are connected with Loongson 2K1000 processor, the power supply chip adopts JW5079A chip.
[0013] The left side of PHY chip is connected with Loongson 2K1000 processor ethernet interface through RGMII interface,
[0014] Four USB2.0 interfaces and 2 PCIe GEN2 X4 interfaces are connected on the COMe module through TYPE6 interface.
[0015] Further, AC coupling capacitor is connected in series at the signal sending end of PCIe GEN2 X4 interface,
[0016] The AC coupling capacitor includes C7, C8, C9, C10, C13, C15, C17, C18 for CPU signal transmission, the left side one end of AC coupling capacitor is also connected with CUU PCIe interface, and the right side one end is connected with common mode choke coil, and the right side one end of common mode choke coil is connected with COMe connector. The left side of PHY chip is connected with Loongson 2K1000 processor ethernet interface through RGMII interface, and the PHY chip is also connected with PHY register. The PHY chip connected with Loongson 2K1000 processor through RGMII interface adopts YT8531SH-CA type chip. The AC coupling capacitor is 0.01uF, and the common mode choke coil is TDKACM2012.
[0017] Compared with the prior art, the utility model has the advantages that through hardware interface reconfiguration, the customization circuit design of Loongson processor on COMe TYPE6 interface, fill the application blank of domestic processor in the field of standardization embedded module, provide high safety, high compatible self -determination technology base for key industry, the power supply chip of the application, full load power consumption is less than or equal to 8W, and supports peripheral plug and play, the utility model has the strong practicality. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of the connection of the conjugate coil of this utility model;
[0020] Figure 2 This is a connection circuit diagram of the PCIe GEN2 X4 interface of this utility model;
[0021] Figure 3 This is a connection circuit diagram of the USB 2.0 interface of this utility model;
[0022] Figure 4 This is the connection circuit diagram of the PHY chip of this utility model;
[0023] Figure 5 This is a schematic diagram of the PCB structure of this utility model. Detailed Implementation
[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.
[0025] Please see Figures 1-5 A COME module based on a 2K1000 processor includes a COME module connected to the 2K1000 processor. The COME module includes a Loongson 2K1000 processor, a PHY chip, and a power chip. The PHY chip and the power chip are both connected to the Loongson 2K1000 processor. The power chip is a JW5079A chip.
[0026] The left side of the PHY chip is connected with a Loongson 2K1000 processor Ethernet interface through an RGMII interface.
[0027] Four USB2.0 interfaces and two PCIe GEN2 X4 interfaces are connected to the COMe module through TYPE6 interfaces.
[0028] In this embodiment, an AC coupling capacitor is connected in series at the signal sending end of the PCIe GEN2 X4 interface.
[0029] The AC coupling capacitor includes C7, C8, C9, C10, C13, C15, C17 and C18 for CPU to send signals to the outside, and the left side of the AC coupling capacitor is further connected with a CUU PCIe interface, and the right side of the AC coupling capacitor is connected with a common mode choke coil; the right side of the common mode choke coil is connected with a COMe connector. The PHY chip is connected with the Loongson 2K1000 processor Ethernet interface through an RGMII interface, and the PHY chip is further connected with a PHY register. The PHY chip connected with the Loongson 2K1000 processor through the RGMII interface is a YT8531SH-CA type chip. The AC coupling capacitor is 0.01uF, and the common mode choke coil is a TDKACM2012 type.
[0030] In this embodiment, as Figures 1-3 , the PCB layer design of the circuit of the utility model: 16 layers of board are adopted, the top layer and the bottom layer are signal layers, and the middle layer is a power supply / ground plane layer.
[0031] The eye diagram test shows that the jitter of the PCIe Gen2x4 is less than 0.15UI, and the USB2.0 signal edge monotonicity meets the standard.
[0032] In this embodiment, as Figure 4 , the circuit modification of the PHY chip compatibility: the YT8531SH-CA hardware configuration is an IO interface level of 3.3V, which is consistent with the interface level of the 2K1000; the left side of the PHY chip is connected with the CPU Ethernet interface through an RGMII interface
[0033] Drive adaptation: increase the PHY register configuration;
[0034] Performance verification: the gigabit Ethernet continuously transmits for 72 hours without packet loss, and the rate is stable at 940Mbps.
[0035] In this embodiment, the power consumption and heat dissipation test
[0036] Power supply scheme: the 12V to 1.1V circuit of the JW5079A chip, the actual measurement efficiency is 92.5% (load current 4A);
[0037] Thermal simulation: the processor is equipped with a special radiator, and the module works for a long time under the environment temperature of 40 DEG C, and the core temperature is less than or equal to 75 DEG C.
[0038] Lifetime prediction: the derating design makes the MTBF increase to 100,000 hours.
[0039] The preferred embodiments of the present application are described above, and are not intended to limit the present application. For those skilled in the art, the present application can be variously changed and modified. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A COME module based on a 2K1000 processor, comprising a COME module connected to the 2K1000 processor, characterized in that: The COME module includes a Loongson 2K1000 processor, a PHY chip, and a power chip; both the PHY chip and the power chip are connected to the Loongson 2K1000 processor. The left side of the PHY chip is connected to the Ethernet interface of the Loongson 2K1000 processor via the RGMII interface; The COME module has four USB 2.0 ports and two PCIe Gen2 X4 ports connected via the TYPE6 interface.
2. The COME module based on the 2K1000 processor according to claim 1, characterized in that, An AC coupling capacitor is connected in series at the signal transmitting end of the PCIe GEN2 X4 interface. The AC coupling capacitors, including C7, C8, C9, C10, C13, C15, C17, and C18, are used by the CPU to send signals to the outside world. The left end of the AC coupling capacitor is also connected to the CUU PCIe interface, and the right end is connected to a common mode choke. The right end of the common mode choke is connected to a COME connector.
3. The COME module based on the 2K1000 processor according to claim 1, characterized in that, The PHY chip connected to the Loongson 2K1000 processor via the RGMII interface is a YT8531SH-CA type chip.
4. The COME module based on the 2K1000 processor according to claim 1, characterized in that, The power supply chip used is the JW5079A chip.
5. A COME module based on a 2K1000 processor according to claim 2, characterized in that, The AC coupling capacitor is 0.01uF, and the common mode choke is a TDK ACM2012.
6. A COME module based on a 2K1000 processor according to claim 2, characterized in that, The left side of the PHY chip is connected to the Ethernet interface of the Loongson 2K1000 processor via the RGMII interface, and the PHY chip is also connected to a PHY register.