Beidou No.3 miniaturized Beidou positioning communication device and communication equipment

Abstract

The utility model provides a Beidou No.3 miniaturized Beidou positioning communication device and communication equipment. The device comprises a clock circuit, a power supply circuit, and a radio frequency front-end circuit, a radio frequency chip, a baseband chip and an interface circuit which are connected in sequence, the power supply circuit is connected with the clock circuit, the radio frequency front-end circuit, the radio frequency chip, the interface circuit and the baseband chip, and the clock circuit is connected with the baseband chip; the radio frequency front-end circuit comprises a signal receiving circuit and a signal transmitting circuit which are connected with a radio frequency chip; the signal receiving circuit comprises a first receiving channel and a second receiving channel, the first receiving channel is used for receiving a B3 intermediate frequency signal of the Beidou RNSS, and the second receiving channel is used for receiving an S intermediate frequency signal of the RDSS; the signal transmitting circuit is used for transmitting a first radio frequency signal received from the radio frequency chip to the antenna so as to transmit the first radio frequency signal. The integrated design of the RNSS and the RDSS can be realized, and the RNSS signal is supported to resist narrowband interference and forwarding deception interference.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of communication, and particularly relates to a Beidou-3 miniaturized Beidou positioning communication device and a communication equipment. BACKGROUND

[0002] The Beidou-3 is composed of 24 Medium Earth Orbit (MEO) satellites, 3 Geostationary Earth Orbit (GEO) satellites and 3 Inclined GeoSynchronous Orbits (IGSO) satellites, mainly adopts a satellite radio navigation signal (Radio Navigation Satellite System, RNSS) + short message communication system, and integrates navigation and communication capabilities, has excellent service performance and powerful functions, and has positioning navigation timing, satellite-based enhancement, ground-based enhancement, precise point positioning, short message communication and international search and rescue and other service capabilities, and meets the diversified needs of users.

[0003] Based on the Beidou-3 system, the RNSS / satellite radio determination service (Radio Determination Satellite Service, RDSS) integrated terminal and module have huge market demand, and navigation equipment is developing towards miniaturization and high integration. CONTENT OF THE UTILITY MODEL

[0004] The main purpose of the embodiment of the utility model is to provide a Beidou-3 miniaturized Beidou positioning communication device, which can realize RNSS and RDSS integrated design and support RNSS signal anti-narrowband interference and anti-repeater deception jamming.

[0005] In a first aspect, a Beidou-3 miniaturized Beidou positioning communication device is provided, comprising: a clock circuit, a power supply circuit, a radio frequency front-end circuit, a radio frequency chip, a baseband chip and an interface circuit connected in sequence; the power supply circuit is connected with the clock circuit, the radio frequency front-end circuit, the radio frequency chip, the interface circuit and the baseband chip, and the clock circuit is connected with the baseband chip; the radio frequency front-end circuit comprises a signal receiving circuit and a signal transmitting circuit connected with the radio frequency chip; the signal receiving circuit comprises a first receiving channel and a second receiving channel, the first receiving channel is used for receiving a B3 intermediate frequency signal of Beidou RNSS, and the second receiving channel is used for receiving an S intermediate frequency signal of RDSS; the signal transmitting circuit is used for transmitting a first radio frequency signal received from the radio frequency chip to an antenna to emit the first radio frequency signal through the antenna.

[0006] In another possible implementation manner, the first receiving channel comprises a first filter configured to filter the received B3 intermediate frequency signal and transmit to the radio frequency chip; and the second receiving channel comprises a second filter configured to filter the received S intermediate frequency signal and transmit to the radio frequency chip.

[0007] In a possible implementation manner, the first receiving channel further comprises a first capacitor, a first inductor, a second inductor, a second capacitor, a first resistor, a second resistor, a third resistor and a first radio frequency plug; the first radio frequency plug, the first capacitor, the first filter, the second capacitor and the first resistor are connected in series, the first radio frequency plug is connected with the antenna, the first resistor is connected with the radio frequency chip, the first inductor is connected in parallel between the first capacitor and the first filter, the second inductor is connected in parallel between the first filter and the second capacitor, the second resistor is connected in parallel at one end of the first resistor close to the second capacitor, and the third resistor is connected in parallel at the other end of the first resistor; and the second receiving channel further comprises a third capacitor, a third inductor, a fourth inductor, a fourth capacitor, a fourth resistor, a fifth resistor, a sixth resistor and a second radio frequency plug; the second radio frequency plug, the third capacitor, the second filter, the third capacitor and the fourth resistor are connected in series, the second radio frequency plug is connected with the antenna, the fourth resistor is connected with the radio frequency chip, the third inductor is connected in parallel between the third capacitor and the second filter, the fourth inductor is connected in parallel between the second filter and the fourth capacitor, the fifth resistor is connected in parallel at one end of the fourth resistor close to the fourth capacitor, and the sixth resistor is connected in parallel at the other end of the fourth resistor.

[0008] In another possible implementation manner, the radio frequency front-end circuit further comprises a feeding unit connected with the first receiving channel and the second receiving channel; the feeding unit comprises a fifth capacitor, a sixth capacitor, a fifth inductor, a seventh capacitor, an eighth capacitor and a sixth inductor; one end of the fifth inductor is connected with the first radio frequency plug, the other end is connected with a first power voltage, and is grounded through the mutually associated fifth capacitor and sixth capacitor; one end of the sixth inductor is connected with the second radio frequency plug, the other end is connected with the first power voltage, and is grounded through the mutually associated seventh capacitor and eighth capacitor.

[0009] In another possible implementation manner, the signal transmitting circuit comprises a temperature compensation attenuator, a third filter, a low noise amplifier, a power amplifier circuit, an isolator and a fourth filter connected in sequence; the temperature compensation attenuator is connected with the radio frequency chip, and is configured to perform temperature compensation and attenuation processing on the first radio frequency signal; the third filter and the fourth filter are configured to perform filtering processing on the first radio frequency signal; the low noise amplifier is configured to perform low noise amplification processing on the first radio frequency signal; and the power amplifier circuit is configured to perform power amplification processing on the first radio frequency signal.

[0010] In another possible implementation manner, the signal transmitting circuit comprises a seventh inductor, an eighth inductor, a ninth inductor, a ninth capacitor, a tenth capacitor, a tenth inductor, a seventh resistor, an eighth resistor and a third radio frequency plug; the warm compensation attenuator, the third filter, the seventh resistor, the tenth capacitor, the low-noise amplifier, the ninth capacitor, the power amplifier circuit, the isolator, the fourth filter and the third radio frequency plug are sequentially connected, the seventh inductor is connected in parallel between the third radio frequency plug and the fourth filter, the eighth inductor is connected in parallel between the fourth filter and the isolator, the ninth inductor is connected in parallel between the isolator and the power amplifier circuit, the tenth inductor is connected in parallel between the seventh resistor and the tenth capacitor, and the eighth resistor is connected in parallel between the seventh resistor and the third filter.

[0011] In another possible implementation manner, the signal transmitting circuit transmits the first radio frequency signal with an output power not less than 36dBm.

[0012] In another possible implementation manner, the power supply circuit comprises a first voltage reduction circuit, a voltage boosting circuit, a second voltage reduction circuit, a third voltage reduction circuit, a first voltage stabilizing circuit, a second voltage stabilizing circuit, a third voltage stabilizing circuit, a fourth voltage stabilizing circuit and a power electronic switch; the voltage boosting circuit, the second voltage reduction circuit and the third voltage reduction circuit are connected with the first voltage reduction circuit, and the first voltage stabilizing circuit, the second voltage stabilizing circuit, the third voltage stabilizing circuit, the fourth voltage stabilizing circuit and the power electronic switch are connected with the voltage boosting circuit.

[0013] In another possible implementation manner, the clock circuit comprises a first clock generation circuit and a second clock generation circuit connected with the baseband chip, the first clock generation circuit is configured to generate a first clock signal, and the second clock generation circuit is configured to generate a second clock signal.

[0014] The second aspect also provides a communication device comprising an antenna and the Beidou-3 miniaturized Beidou positioning communication device. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments of the present application will be briefly introduced.

[0016] Figure 1 A structural schematic diagram of the Beidou-3 miniaturized Beidou positioning communication device according to an embodiment of the present application is shown in the figure.

[0017] Figure 2 A circuit schematic diagram of the first receiving channel according to an embodiment of the present application is shown in the figure.

[0018] Figure 3 A circuit schematic diagram of the second receiving channel according to an embodiment of the present application is shown in the figure.

[0019] Figure 4The circuit schematic diagram of the signal transmitting circuit of the embodiment of the utility model;

[0020] Figure 5 The structural schematic diagram of the baseband chip of the embodiment of the utility model;

[0021] Figure 6 The structural schematic diagram of the power supply circuit of the utility model. DETAILED DESCRIPTION

[0022] Embodiments of the application are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar notations represent the same or similar modules or modules with the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the application, and cannot be interpreted as a limitation on the utility model.

[0023] Those skilled in the art can understand that, unless specifically stated, the singular forms "a", "an" and "the" used herein can also include the plural forms. It should be further understood that the phrase "comprising" used in the specification of the application means that the features, integers, steps, operations, modules and / or components exist, but does not exclude the presence or addition of one or more other features, integers, steps, operations, modules, components and / or their groups. It should be understood that when we say that a module is "connected" or "coupled" to another module, it can be directly connected or coupled to other modules, or there can be intermediate modules. In addition, the "connection" or "coupling" used herein can include wireless connection or wireless coupling. The phrase "and / or" used herein includes all or any module and all combinations of the associated listed items.

[0024] In order to make the purpose, technical scheme and advantages of the application clearer, the implementation mode of the application will be described in further detail below.

[0025] The technical scheme of the application and the technical scheme of the application and the solution to the above technical problems will be described in detail below. The following specific embodiments can be combined with each other, and the same or similar concepts or processes can not be described again in some embodiments. The embodiments of the application will be described below with reference to the accompanying drawings.

[0026] As Figure 1 The structure diagram of a Beidou No. 3 miniaturized Beidou positioning communication device provided by one embodiment of the utility model is shown. As Figure 1As shown, the Beidou-3 miniaturized Beidou positioning communication device comprises: a clock circuit, a power supply circuit, a radio frequency front-end circuit, a radio frequency chip, a baseband chip and an interface circuit connected in sequence; the power supply circuit is connected with the clock circuit, the radio frequency front-end circuit, the radio frequency chip, the interface circuit and the baseband chip, and the clock circuit is connected with the baseband chip.

[0027] The radio frequency front-end circuit comprises: a signal receiving circuit and a signal transmitting circuit connected with the radio frequency chip; the signal receiving circuit comprises a first receiving channel and a second receiving channel, the first receiving channel is used for receiving a B3 intermediate frequency signal of a Beidou RNSS, and the second receiving channel is used for receiving an S intermediate frequency signal of a RDSS; the signal transmitting circuit is used for transmitting a first radio frequency signal received from the radio frequency chip to an antenna to emit the first radio frequency signal through the antenna. The radio frequency front-end circuit is connected with an external antenna, is used for receiving satellite signals and sending out the first radio frequency signal, and the first radio frequency signal is preferably an L radio frequency signal comprising short message information, and the frequency is preferably 1615MHz.

[0028] The Beidou-3 miniaturized Beidou positioning communication device can support RNSS B3 frequency point signals and RDSS short message communication functions of Beidou-3 full frequency points, realize integrated design of RNSS and RDSS, can provide positioning, speed measurement, time service and communication functions under various dynamics, and support RNSS signal anti-narrowband interference and anti-repeater deception jamming.

[0029] In the embodiment of the utility model, the radio frequency chip processes two-way receiving signals inputted by the radio frequency front-end circuit and outputs to the baseband chip, and changes BPSK signal outputted by the baseband chip into first radio frequency signal and inputs to the radio frequency front-end circuit. RX3701 radio frequency chip contains two-way receiving channels, receives Beidou RNSS B3 frequency point and RDSS S frequency point signal respectively, becomes intermediate frequency signal after amplification, down conversion and filtering and gives baseband chip signal processing. The radio frequency chip also contains a signal transmitting circuit, filters, modulates BPSK digital signal outputted by the baseband chip, up-converts as RDSS L frequency point signal and inputs to the radio frequency front-end circuit output.

[0030] The first receiving channel comprises a first filter, which is used for filtering the received B3 intermediate frequency signal and transmitting to the radio frequency chip. The second receiving channel comprises a second filter, which is used for filtering the received S intermediate frequency signal and transmitting to the radio frequency chip. The radio frequency chip is preferably a radio frequency chip with model RX3701, the first filter is preferably a filter with model PV2G68F, and the second filter is preferably a filter with model RSFK2492F009C1. The signal receiving circuit selects frequency through two-way different filters, distinguishes B3 frequency point signal of 1268.52MHz and S frequency point signal of 2491.75MHz, and inputs two frequency band signals to the radio frequency chip.

[0031] Referring to Figure 2 , the first receiving channel further comprises a first capacitor C1, a first inductor L1, a second inductor L2, a second capacitor C2, a first resistor R1, a second resistor R2, a third resistor R3 and a first radio frequency plug RF1. The first radio frequency plug RF1, the first capacitor C1, the first filter U1, the second capacitor C2 and the first resistor R1 are connected in series, the first radio frequency plug RF1 is connected with the antenna, the first resistor R1 is connected with the radio frequency chip, the first inductor L1 is connected in parallel between the first capacitor C1 and the first filter U1, the second inductor L2 is connected in parallel between the first filter U1 and the second capacitor C2, the second resistor R2 is connected in parallel at one end of the first resistor R1 close to the second capacitor C2, and the third resistor R3 is connected in parallel at the other end of the first resistor R1.

[0032] Referring to Figure 3 , the second receiving channel further comprises a third capacitor C3, a third inductor L3, a fourth inductor L4, a fourth capacitor C4, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6 and a second radio frequency plug RF2. The second radio frequency plug RF2, the third capacitor C3, the second filter U2, the third capacitor C3 and the fourth resistor R4 are connected in series, the second radio frequency plug RF2 is connected with the antenna, the fourth resistor R4 is connected with the radio frequency chip, the third inductor L3 is connected in parallel between the third capacitor C3 and the second filter U2, the fourth inductor L4 is connected in parallel between the second filter U2 and the fourth capacitor C4, the fifth resistor R5 is connected in parallel at one end of the fourth resistor R4 close to the fourth capacitor C4, and the sixth resistor R6 is connected in parallel at the other end of the fourth resistor R4.

[0033] The radio frequency front-end circuit further comprises a power supply unit connected with the first receiving channel and the second receiving channel. Referring to Figure 2 and Figure 3 , the power supply unit comprises a fifth capacitor C5, a sixth capacitor C6, a fifth inductor L5, a seventh capacitor C7, an eighth capacitor C8 and a sixth inductor L6; one end of the fifth inductor L5 is connected with the first radio frequency plug RF1, the other end is connected with the first power supply voltage ANT_PWR, and is grounded through the fifth capacitor C5 and the sixth capacitor C6; one end of the sixth inductor L6 is connected with the second radio frequency plug RF2, the other end is connected with the first power supply voltage ANT_PWR, and is grounded through the seventh capacitor C7 and the eighth capacitor C8.

[0034] The signal transmitting circuit is responsible for amplifying and filtering the L radio frequency signal and outputting it to the antenna. The signal output by the radio frequency chip of model RX3701 is amplified by the attenuator, the third filter and the low noise amplifier (LNA) and then output to the power amplifier circuit and transmitted through the power amplifier circuit. The output power of the first radio frequency signal sent by the signal transmitting circuit is not less than 36dBm.

[0035] Referring to Figure 4 The signal transmitting circuit comprises, in sequence, a temperature compensation attenuator U8, a third filter U7, a low-noise amplifier U6, a power amplifier circuit U5, an isolator U4, and a fourth filter U3. The temperature compensation attenuator U8 is connected with the radio frequency chip, and is used for temperature compensation and attenuation processing of the first radio frequency signal. The third filter U7 and the fourth filter U3 are used for filtering processing of the first radio frequency signal. The low-noise amplifier U6 is used for low-noise amplification processing of the first radio frequency signal. The power amplifier circuit U5 is used for power amplification processing of the first radio frequency signal. The isolator U4 is used for signal isolation.

[0036] The signal transmitting circuit further comprises a seventh inductor L7, an eighth inductor L8, a ninth inductor L9, a ninth capacitor C9, a tenth capacitor C10, a tenth inductor L10, a seventh resistor R7, an eighth resistor R8, and a third radio frequency plug RF3. The temperature compensation attenuator U8, the third filter U7, the seventh resistor R7, the tenth capacitor C10, the low-noise amplifier U6, the ninth capacitor C9, the power amplifier circuit U5, the isolator U5, the fourth filter U3, and the third radio frequency plug RF3 are connected in sequence. The seventh inductor L7 is connected in parallel between the third radio frequency plug RF3 and the fourth filter U3. The eighth inductor L8 is connected in parallel between the fourth filter U3 and the isolator U4. The ninth inductor L9 is connected in parallel between the isolator U4 and the power amplifier circuit U5. The tenth inductor L10 is connected in parallel between the seventh resistor R7 and the tenth capacitor C10. The eighth resistor R8 is connected in parallel between the seventh resistor R7 and the third filter U7.

[0037] The baseband chip is used for receiving the intermediate frequency signal transmitted by the radio frequency chip, and outputting a BPSK signal to the radio frequency chip. Referring to Figure 5 The baseband chip comprises an intermediate frequency AD conversion module, an electric text analysis module, an interface control module, and a time service output module. The AD conversion module receives the signal transmitted by the radio frequency chip, performs AD conversion, and then transmits the signal to the electric text analysis module for communication electric text analysis. The interface control module is connected with the interface circuit, and is used for inputting and outputting information. The time service output module outputs the received time service information through a second pulse output pin in the baseband chip. The baseband chip is a core component of the Beidou-3 miniaturized Beidou positioning communication device, and is responsible for intermediate frequency AD conversion, electric text analysis, interface control, time service output, and the like of the Beidou-3 miniaturized Beidou positioning communication device. The signal from the radio frequency front-end circuit to the radio frequency chip is down-converted, and then reaches the baseband chip to perform satellite signal acquisition, tracking, demodulation, despreading, bit synchronization, frame synchronization, RDSS decoding, RNSS decoding, and PVT solving, and the like, and output positioning, communication, and the like. The baseband chip selects a baseband chip with a model number of BP2020-L, and has small chip size, low power consumption, supports Beidou-3 RNSS frequency points, and supports Beidou-3 RDSS transceiving frequency points.

[0038] Referring toFigure 1 The clock circuit includes a first clock generation circuit and a second clock generation circuit connected with the baseband chip. The first clock generation circuit is used to generate a first clock signal, and the second clock generation circuit is used to generate a second clock signal. The clock circuit is responsible for providing the clock required for the operation of the entire Beidou-III miniaturized Beidou positioning communication device, mainly including two crystal oscillator circuits for providing the clock for the radio frequency chip and the baseband chip. The first clock signal generated by the first clock generation circuit is preferably a 10MHz crystal oscillator, which is used to provide a reference for the RX3701 radio frequency chip. The second clock signal generated by the second clock generation circuit is preferably a 20MHz crystal oscillator, which is used to provide a system clock for the BP2020-L baseband chip, so as to ensure that the internal ARM system can work normally. In the radio frequency chip, three channels of local oscillator signals are generated by the PLL, and a 62MHz sampling clock is also generated to provide the baseband chip internal ADC and the baseband module for signal processing.

[0039] The Beidou-III miniaturized Beidou positioning communication device further includes a reset circuit connected with the baseband chip, an RTC chip connected with the baseband chip and the radio frequency chip, and a buffer. The reset circuit is preferably a reset chip with a model of SGM800-2.93YN5G / TR, which is used to control the reset of the baseband chip. The RTC chip is an I2C ultra-low power RTC real-time clock chip, and is preferably an RTC chip with a model of INS5902A. The buffer is preferably a three-state output logic buffer chip with a model of SGM7SZ126YC5G / TR.

[0040] Referring to Figure 6The power supply circuit includes: a first buck circuit, a boost circuit, a second buck circuit, a third buck circuit, a first voltage regulator circuit, a second voltage regulator circuit, a third voltage regulator circuit, a fourth voltage regulator circuit, and a power electronic switch. The boost circuit, the second buck circuit, and the third buck circuit are connected to the first buck circuit, while the first voltage regulator circuit, the second voltage regulator circuit, the third voltage regulator circuit, the fourth voltage regulator circuit, and the power electronic switch are connected to the boost circuit. The power supply circuit is responsible for supplying power to the baseband chip, RF chip, and peripheral circuits inside the BeiDou-3 miniaturized BeiDou positioning and communication device. The interface circuit power input range is +2.6V to +5.5V. The input power is transformed into the required voltage by the various power supply circuit components and then connected to the chips inside the BeiDou-3 miniaturized BeiDou positioning and communication device to ensure its normal operation. For example, if the power supply circuit inputs a 2.6V to 5.5V power signal, the first buck circuit provides a -0.8V second source voltage VDD to the baseband chip core. A second buck circuit provides a 1.2V power supply to the memory (DDR) in the baseband chip or RF chip. A boost circuit provides a power supply of 3.8V to 5.5V. A third buck circuit provides a 1.8V power supply to the RF chip. A first regulator circuit provides a 1.8V power supply to the intermediate frequency AD conversion module and memory (DDR) in the baseband chip, and also provides the digital power supply voltage. A second regulator circuit provides a 3.3V output power supply to the crystal oscillator. A third regulator circuit provides a 3.3V power supply to the digital power supply and the RF chip. A fourth regulator circuit provides a 3.3V power supply to the low-noise amplifier in the signal transmission circuit. A power electronic switch feeds the B3 and S antennas, providing a first power supply voltage ANT_PWR of 3.6V to 5.5V. The first, second, and third buck circuits preferably use ETA3451 buck chips. The boost circuit preferably uses ETA1090 boost chips. The first, second, third, and fourth voltage regulator circuits preferably use a voltage regulator chip of model SGM2036-3.3YUDH4G / TR. The power electronic switch is preferably a load switch of model SGM2553YTDI6G.

[0041] The interface circuit is responsible for connecting the Beidou No. 3 miniaturized Beidou positioning communication device with external equipment, including power supply, signal and data connection. The external signal is connected with the chip in the Beidou No. 3 miniaturized Beidou positioning communication device to ensure the normal communication of the signal. In order to reduce the size of the Beidou No. 3 miniaturized Beidou positioning communication device and facilitate installation, a BTB connector is adopted. The external interface includes serial communication, reset signal, second pulse output and RDSS SIM card interface. The serial port is LVTTL 3.3V level, supports baud rates of 115200, 230400, 460800 and the like (the default baud rate is 115200), and the baud rate can be configured through the serial port; the reset signal can reset the Beidou No. 3 miniaturized Beidou positioning communication device through the nRESET pin, and the low level is effective; the second pulse output outputs rough 1PPS after power-on by default, and outputs accurate 1PPS through local clock adjustment after positioning; the RDSS SIM card interface can be connected with an external RDSS SIM card through the port.

[0042] Compared with the prior art, the Beidou No. 3 miniaturized positioning communication module has the advantages that: the Beidou No. 3 miniaturized positioning communication module can support RNSS B3 frequency point signal and RDSS short message communication function of Beidou No. 3 full frequency point, realize integrated design of RNSS and RDSS, provide positioning, speed measurement, time service and communication function under various dynamic conditions, and support RNSS signal anti-narrowband interference and anti-repeater deception jamming. The Beidou No. 3 miniaturized positioning communication module has compact appearance size, the size is 58.2mm*42.6mm*10.1mm, is convenient for user integration, and can be applied to various devices such as vehicle-mounted, ship-mounted and handheld.

[0043] In summary, the Beidou No. 3 miniaturized Beidou positioning communication device comprises: a clock circuit, a power supply circuit, a radio frequency front-end circuit, a radio frequency chip, a baseband chip and an interface circuit connected in sequence; the power supply circuit is connected with the clock circuit, the radio frequency front-end circuit, the radio frequency chip, the interface circuit and the baseband chip, and the clock circuit is connected with the baseband chip; the radio frequency front-end circuit comprises: a signal receiving circuit and a signal transmitting circuit connected with the radio frequency chip; the signal receiving circuit comprises a first receiving channel and a second receiving channel, the first receiving channel is used for receiving B3 intermediate frequency signal of Beidou RNSS, and the second receiving channel is used for receiving S intermediate frequency signal of RDSS; the signal transmitting circuit is used for transmitting the first radio frequency signal received from the radio frequency chip to an antenna to emit the first radio frequency signal through the antenna, so that integrated design of RNSS and RDSS can be realized, and RNSS signal anti-narrowband interference and anti-repeater deception jamming can be supported.

[0044] The communication device comprises an antenna and the aforementioned Beidou No. 3 miniaturized Beidou positioning communication device. The communication device can be various devices such as vehicle-mounted, ship-mounted and handheld.

[0045] The above is only part of the implementation of the present application, it should be noted that for those skilled in the art, without departing from the principles of the present application, can make a number of improvements and refinements, these improvements and refinements should also be considered within the scope of the present application.

Claims

1. A miniaturized BeiDou positioning and communication device for BeiDou-3, characterized in that, The positioning and communication device includes: a clock circuit, a power supply circuit, a radio frequency front-end circuit, a radio frequency chip, a baseband chip, and an interface circuit connected in sequence; the power supply circuit is connected to the clock circuit, the radio frequency front-end circuit, the radio frequency chip, the interface circuit, and the baseband chip, and the clock circuit is connected to the baseband chip; The radio frequency front-end circuit includes: a signal receiving circuit and a signal transmitting circuit connected to the radio frequency chip; the signal receiving circuit includes a first receiving channel and a second receiving channel, the first receiving channel being used to receive the B3 intermediate frequency signal of Beidou RNSS, and the second receiving channel being used to receive the S intermediate frequency signal of RDSS; the signal transmitting circuit is used to transmit the first radio frequency signal received from the radio frequency chip to the antenna to transmit the first radio frequency signal through the antenna.

2. The positioning and communication device as described in claim 1, characterized in that, The first receiving channel includes a first filter for filtering the received B3 intermediate frequency signal and transmitting it to the radio frequency chip; The second receiving channel includes a second filter for filtering the received S-IF signal and transmitting it to the RF chip.

3. The positioning and communication device as described in claim 2, characterized in that, The first receiving channel further includes: a first capacitor, a first inductor, a second inductor, a second capacitor, a first resistor, a second resistor, a third resistor, and a first RF connector; the first RF connector, the first capacitor, the first filter, the second capacitor, and the first resistor are connected in series, the first RF connector is connected to the antenna, the first resistor is connected to the RF chip, the first inductor is connected in parallel between the first capacitor and the first filter, the second inductor is connected in parallel between the first filter and the second capacitor, the second resistor is connected in parallel at the end of the first resistor closest to the second capacitor, and the third resistor is connected in parallel at the other end of the first resistor; The second receiving channel further includes: a third capacitor, a third inductor, a fourth inductor, a fourth capacitor, a fourth resistor, a fifth resistor, a sixth resistor, and a second RF connector; the second RF connector, the third capacitor, the second filter, the third capacitor, and the fourth resistor are connected in series, the second RF connector is connected to the antenna, the fourth resistor is connected to the RF chip, the third inductor is connected in parallel between the third capacitor and the second filter, the fourth inductor is connected in parallel between the second filter and the fourth capacitor, the fifth resistor is connected in parallel at the end of the fourth resistor closest to the fourth capacitor, and the sixth resistor is connected in parallel at the other end of the fourth resistor.

4. The positioning and communication device as described in claim 3, characterized in that, The radio frequency front-end circuit further includes a power supply unit connected to the first receiving channel and the second receiving channel; the power supply unit includes a fifth capacitor, a sixth capacitor, a fifth inductor, a seventh capacitor, an eighth capacitor, and a sixth inductor; one end of the fifth inductor is connected to the first radio frequency plug, the other end is connected to the first power supply voltage, and is grounded through the interconnected fifth capacitor and the sixth capacitor; one end of the sixth inductor is connected to the second radio frequency plug, the other end is connected to the first power supply voltage, and is grounded through the interconnected seventh capacitor and the eighth capacitor.

5. The positioning and communication device as described in claim 1, characterized in that, The signal transmitting circuit includes: a temperature-compensated attenuator, a third filter, a low-noise amplifier, a power amplifier circuit, an isolator, and a fourth filter connected in sequence; the temperature-compensated attenuator is connected to the RF chip and is used to perform temperature compensation and attenuation processing on the first RF signal; the third filter and the fourth filter are used to perform filtering processing on the first RF signal; the low-noise amplifier is used to perform low-noise amplification processing on the first RF signal; and the power amplifier circuit is used to perform power amplification processing on the first RF signal.

6. The positioning and communication device as described in claim 5, characterized in that, The signal transmitting circuit includes: a seventh inductor, an eighth inductor, a ninth inductor, a ninth capacitor, a tenth capacitor, a tenth inductor, a seventh resistor, an eighth resistor, and a third RF connector; the temperature-compensated attenuator, the third filter, the seventh resistor, the tenth capacitor, the low-noise amplifier, the ninth capacitor, the power amplifier circuit, the isolator, the fourth filter, and the third RF connector are connected in sequence; the seventh inductor is connected in parallel between the third RF connector and the fourth filter; the eighth inductor is connected in parallel between the fourth filter and the isolator; the ninth inductor is connected in parallel between the isolator and the power amplifier circuit; the tenth inductor is connected in parallel between the seventh resistor and the tenth capacitor; and the eighth resistor is connected in parallel between the seventh resistor and the third filter.

7. The positioning and communication device as described in claim 1, characterized in that, The output power of the first radio frequency signal transmitted by the signal transmitting circuit is not less than 36dBm.

8. The positioning and communication device as described in claim 1, characterized in that, The power supply circuit includes: a first buck circuit, a boost circuit, a second buck circuit, a third buck circuit, a first voltage regulator circuit, a second voltage regulator circuit, a third voltage regulator circuit, a fourth voltage regulator circuit, and a power electronic switch; the boost circuit, the second buck circuit, and the third buck circuit are connected to the first buck circuit, and the first voltage regulator circuit, the second voltage regulator circuit, the third voltage regulator circuit, the fourth voltage regulator circuit, and the power electronic switch are connected to the boost circuit.

9. The positioning and communication device as described in claim 1, characterized in that, The clock circuit includes a first clock generation circuit and a second clock generation circuit connected to the baseband chip. The first clock generation circuit is used to generate a first clock signal, and the second clock generation circuit is used to generate a second clock signal.

10. A communication device, characterized in that, The communication equipment includes: an antenna and a miniaturized BeiDou positioning and communication device as described in any one of claims 1-9.

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