Thermal imager equipment compatible with multi-system platform

Abstract

The utility model discloses thermal imager equipment compatible with a multi-system platform, which comprises an infrared thermal imaging module used for acquiring and obtaining images and temperature data; the USB interface is used for being physically connected with a terminal with a USB port; the control device is electrically connected with the infrared thermal imaging module and the USB interface and comprises an SOC module and an MFi authentication chip used for being compatible with an iOS system, the SOC module comprises a USB communication port, and the MFi authentication chip is electrically connected with the USB communication port so as to achieve authentication communication connection of an iOS system platform. According to the utility model, the USB interface is physically connected with the terminal with the USB port, so that a single device is compatible with a plurality of system platforms such as Android, iOS, gap and Windows through a USB communication technology, data transmission and instruction control compatible with the plurality of system platforms are established, and the problem that the existing device cannot be compatible and accessed to different platforms at the same time is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to thermal imager technical field, concretely relates to a thermal imager equipment compatible with multiple system platforms. BACKGROUND

[0002] Before iPhone15, the USB interface of the apple mobile phone adopts lightning interface, however, the Android mobile phone uses type-C interface, which makes the mobile phone thermal imager unable to simultaneously compatible with apple mobile phone and Android mobile phone in hardware design, and since the apple iOS system has certain closed nature, the accessories communicating with apple need to strictly adapt to the communication protocol standard of apple. And the existing mobile phone thermal imager usually only supports single platform (such as Android or iOS) in system design, cannot realize cross multiple platform compatibility, and limits its application range. Therefore, with the Type-C of the USB interface of apple mobile phone, the existing thermal imager is difficult to simultaneously meet the compatibility of multiple system platforms and the use demand of users in different scenes. SUMMARY

[0003] In order to overcome the above technical problems, the utility model discloses a kind of thermal imager equipment compatible with multiple system platforms.

[0004] The technical scheme that the utility model is used to realize the above-mentioned purpose is as follows:

[0005] A kind of thermal imager equipment compatible with multiple system platforms, the equipment includes:

[0006] Infrared thermal imaging module, for acquisition acquisition image and temperature data;

[0007] USB interface, for being physically connected with terminal with USB port, to support compatible system platform including but not limited to Android, iOS, Hongmeng, Windows;

[0008] Control device, respectively with the infrared thermal imaging module and USB interface electric connection, including SOC module and the MFi authentication chip for compatible iOS system, the SOC module includes USB communication port, the MFi authentication chip is electrically connected with the USB communication port, to realize the authentication communication connection of iOS system platform.

[0009] The thermal imager equipment compatible with multiple system platforms described above, wherein the SOC module further includes I2C1 port, and the I2C1 port is electrically connected with the infrared thermal imaging module through I2C bus.

[0010] The thermal imager device compatible with multiple system platforms, wherein the SOC module further comprises a DVP port electrically connected with the infrared thermal imaging module to realize transmission of image data.

[0011] The thermal imager device compatible with multiple system platforms, wherein the SOC module further comprises a first GPIO port electrically connected with the infrared thermal imaging module to realize sending of a control signal to the infrared thermal imaging module.

[0012] The thermal imager device compatible with multiple system platforms, wherein the SOC module further comprises an I2C2 port, and the SOC module is electrically connected with the analog-to-digital converter ADC through the I2C2 port, and the analog-to-digital converter ADC is electrically connected with the infrared thermal imaging module.

[0013] The thermal imager device compatible with multiple system platforms, wherein the SOC module further comprises an EMMC memory and a DDR4 memory.

[0014] The thermal imager device compatible with multiple system platforms, wherein the SOC module further comprises a second GPIO port, and the SOC module is electrically connected with a driver through the second GPIO port to realize control and operation.

[0015] The thermal imager device compatible with multiple system platforms, wherein the device further comprises a temperature sensor electrically connected with the SOC module.

[0016] The thermal imager device compatible with multiple system platforms, wherein an ARM processor is integrated in the SOC module, the ARM processor adopts an ARM Cortex-A53 dual-core processor with a main frequency of 1GHz and runs a Linux operating system.

[0017] The thermal imager device compatible with multiple system platforms, wherein the infrared thermal imaging module comprises but is not limited to an infrared lens and a non-cooled infrared detector.

[0018] The thermal imager device compatible with multiple system platforms has the following advantages:

[0019] (1) The thermal imager device is small in size, convenient to carry and use, and simple to operate, can realize real-time viewing and analysis of thermal imaging data by connecting a corresponding system platform of a terminal through a USB interface and cooperating with application software of the corresponding system platform.

[0020] (2) Based on the physical connection between the USB interface and the terminal with a USB port, a single device is compatible with Android, iOS, Harmony and Windows multiple system platforms through USB communication technology, data transmission and instruction control compatible with multiple system platforms are established, the problem that existing devices cannot be simultaneously compatible with different platforms is solved, and the applicability and compatibility of the device are improved.

[0021] (3) The MFi authentication chip is integrated on the SOC module to complete the identity authentication of the Apple peripheral, and the communication of the Apple iOS system is established. BRIEF DESCRIPTION OF DRAWINGS

[0022] The utility model will be further described below in combination with the drawings and embodiments.

[0023] Fig. 1 It is a structural perspective view of the utility model;

[0024] Fig. 2 It is a circuit structure schematic view of the utility model. DETAILED DESCRIPTION

[0025] The utility model will be further described below in combination with the drawings and embodiments.

[0026] Embodiment: Refer to Figs. 1-2 The device provided by the embodiment comprises:

[0027] An infrared thermal imaging module 1 is used for collecting image and temperature data.

[0028] A USB interface 2 is used for physical connection with a terminal with a USB port to support system platforms compatible with, but not limited to, Android, iOS, Harmony and Windows. The terminal adopts at least one of the Android, iOS, Harmony and Windows system platforms.

[0029] A control device is electrically connected with the infrared thermal imaging module 1 and the USB interface 2, and comprises a SOC module and an MFi authentication chip for compatibility with the iOS system. The SOC module comprises a USB communication port, and the MFi authentication chip is electrically connected with the USB communication port to realize authentication communication connection with the iOS system platform.

[0030] Specifically, based on the physical connection between the USB interface 2 and the terminal with a USB port, a single device is compatible with Android, iOS, Harmony and Windows multiple system platforms through USB communication technology, data transmission and instruction control compatible with multiple system platforms are established, the problem that existing devices cannot be simultaneously compatible with different platforms is solved, and the applicability and compatibility of the device are improved; wherein the MFi authentication chip is integrated on the SOC module to complete the authentication of Apple peripheral identity and establish communication of the Apple iOS system.

[0031] Specifically, the USB interface 2 adopts a USB2.0 interface, preferably a Type-C interface.

[0032] Specifically, the infrared thermal imaging module 1 includes but is not limited to an infrared lens and a non-cooled infrared detector.

[0033] Further, the SOC module further includes an I2C1 port, which is electrically connected to the infrared thermal imaging module 1 through an I2C bus.

[0034] Further, the SOC module further includes a DVP port electrically connected to the infrared thermal imaging module 1 to realize transmission of image data.

[0035] Further, the SOC module further includes a first GPIO port electrically connected to the infrared thermal imaging module 1 to realize sending of a control signal to the infrared thermal imaging module 1.

[0036] Further, the SOC module further includes an I2C2 port, the SOC module is electrically connected to the analog-to-digital converter ADC through the I2C2 port, and the analog-to-digital converter ADC is electrically connected to the infrared thermal imaging module 1.

[0037] Further, the SOC module further includes an EMMC memory and a DDR4 memory; specifically, the storage space of the EMMC memory is 4GB, and the storage space of the DDR4 memory is 512MB, so as to provide sufficient storage space for the SOC module.

[0038] Further, the SOC module further includes a second GPIO port, the SOC module is electrically connected to a driver through the second GPIO port to realize control and operation.

[0039] Preferably, the device further includes a temperature sensor, which is electrically connected to the SOC module; the temperature sensor is used to detect the temperature of the SOC module.

[0040] In the embodiment, the SOC module is integrated with an ARM processor, the ARM processor adopts an ARM Cortex-A53 dual-core processor, the main frequency is 1GHz, and a Linux operating system is run.

[0041] The utility model discloses when carrying out thermal imaging operation, including the following steps:

[0042] Step 1, the thermal imager equipment is connected to the terminal through the USB interface 2 and is automatically started after the terminal is connected to the USB interface 2 and is automatically started;

[0043] Step 2, the SOC module is initialized;

[0044] If the USB interface 2 is connected to the terminal of the iOS system platform, then the response of the iOS system to the iOS detection frame is received, and MFi authentication is started;

[0045] If authentication succeeds, then the RequestAppLaunch message is sent, and if authentication fails, then MFi authentication is aborted;

[0046] Step 3, the infrared thermal imaging module 1 is initialized;

[0047] Step 4, the infrared thermal imaging module 1 collects infrared thermal imaging data of the object to be measured and feeds back the infrared thermal imaging data to the SOC module;

[0048] Step 5, the SOC module separates the infrared thermal imaging data into infrared image data and temperature data, and after the infrared image data and the temperature data are processed by an algorithm respectively, the infrared image data and the temperature data are transmitted to the terminal of the corresponding system platform through the USB structure;

[0049] Step 6, the infrared image and the temperature are displayed on the terminal.

[0050] The utility model discloses reasonable and ingenious, based on the USB interface and the terminal with USB port carry out physical connection, realize single equipment through USB communication technology compatible Android, iOS, Hongmeng and Windows multiple system platform, establish compatible multiple system platform's data transmission and instruction control, solve the problem that existing equipment cannot simultaneously compatible access different platform, improve the applicability and compatibility of equipment, wherein, the Mfi authentication chip is integrated on the SOC module, to complete the identity authentication of apple peripheral, realize the communication of apple iOS system.

[0051] The above merely describes preferred embodiments of the present application, and is not intended to limit the present application in any form. Any person skilled in the art, without departing from the technical scheme of the present application, can make many possible changes and modifications to the technical scheme of the present application, or modify it into equivalent embodiments with equivalent changes. Therefore, any equivalent changes made according to the shape, structure and principle of the present application, without departing from the technical scheme of the present application, should be covered by the protection scope of the present application.

Claims

1. A thermal imaging device compatible with multiple system platforms, characterized in that, The device includes: Infrared thermal imaging module, used to acquire image and temperature data; The USB interface is used for physical connection to a terminal with a USB port to support system platforms including but not limited to Android, iOS, HarmonyOS, and Windows. The control device is electrically connected to the infrared thermal imaging module and the USB interface, and includes a SOC module and an MFi authentication chip for compatibility with the iOS system. The SOC module includes a USB communication port, and the MFi authentication chip is electrically connected to the USB communication port to realize authentication communication connection with the iOS system platform.

2. The thermal imaging device compatible with multiple system platforms according to claim 1, characterized in that, The SOC module also includes an I2C1 port, which is electrically connected to the infrared thermal imaging module via an I2C bus.

3. The thermal imaging device compatible with multiple system platforms according to claim 1, characterized in that, The SOC module also includes a DVP port electrically connected to the infrared thermal imaging module to enable image data transmission.

4. The thermal imaging device compatible with multiple system platforms according to claim 1, characterized in that, The SOC module also includes a first GPIO port electrically connected to the infrared thermal imaging module to send control signals to the infrared thermal imaging module.

5. The thermal imaging device compatible with multiple system platforms according to claim 1, characterized in that, The SOC module also includes EMMC memory and DDR4 memory.

6. The thermal imaging device compatible with multiple system platforms according to claim 1, characterized in that, The SOC module also includes a second GPIO port, through which the SOC module is electrically connected to the driver to achieve control and operation.

7. The thermal imaging device compatible with multiple system platforms according to claim 1, characterized in that, The device also includes a temperature sensor, which is electrically connected to the SOC module.

8. The thermal imaging device compatible with multiple system platforms according to claim 1, characterized in that, The SOC module integrates an ARM processor, which is an ARM Cortex-A53 dual-core processor with a main frequency of 1GHz and runs the Linux operating system.

9. The thermal imaging device compatible with multiple system platforms according to claim 1, characterized in that, The infrared thermal imaging module includes, but is not limited to, an infrared lens and an uncooled infrared detector.

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