Multi-chip arranged PI heating matrix device with low power consumption design

Abstract

The utility model provides a multi-piece arranged PI heating matrix device with low power consumption design, and relates to the heating device field, the multi-piece arranged PI heating matrix device comprises a main body unit and an installation unit, the main body unit comprises a bottom plate, the top of the bottom plate is provided with six PI heating films, the surface of each PI heating film is provided with a heating wire, and the PI heating films are arranged on the bottom plate. Supporting columns are fixedly connected to the two sides of the top of the bottom plate, each mounting unit comprises a fixing ring, and the fixing rings are located on the surfaces of the supporting columns and fixedly connected with the surfaces of the supporting columns; according to the double-barrel maintenance-free moisture absorber, a heating device of the double-barrel maintenance-free moisture absorber is changed, heating through a heating rod is changed into heating through the PI heating films and the heating wires, power consumption can be reduced while heating efficiency is improved, meanwhile, the layered matrix type arrangement design is adopted, the PI heating films are placed, heating can be controlled in a layered mode, power consumption can be effectively reduced, and the service life of the double-barrel maintenance-free moisture absorber is prolonged. The layered design can accelerate heat dissipation and improve the working efficiency.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of heating device, concretely is a kind of low-power design's PI heating matrix device of multiple piece arrangement. BACKGROUND

[0002] Double-barrelled maintenance-free moisture absorber is a kind of moisture absorption device specially designed for transformer, and it can effectively remove and dry the moisture in the air, protect the transformer from humidity damage, ensure the safety and stability of power system, double-barrelled maintenance-free moisture absorber uses fan to suck humid air into machine, and through heat exchanger, the water in air is condensed into water droplets, and then dry air is discharged, to achieve the purpose of dehumidification;

[0003] The existing double-barrelled maintenance-free moisture absorber is heated by heating rod, and the current use has higher requirements for heating performance and power consumption, and requires the heating device to have lower power consumption, but in the use of double-barrelled maintenance-free moisture absorber, the power consumption of heating rod is high, and the heating rod converts electric energy into heat energy, which consumes a lot of electricity, increasing the use cost.

[0004] Therefore, the utility model provides a kind of low-power design's PI heating matrix device of multiple piece arrangement to solve above-mentioned problems. INVENTION CONTENTS

[0005] To solve the above technical problems, the utility model provides the following technical scheme:

[0006] A kind of low-power design's PI heating matrix device of multiple piece arrangement, comprising,

[0007] Main unit, the main unit includes bottom plate, the top of the bottom plate is provided with PI heating film, the number of PI heating film is six, the surface of PI heating film is provided with heating wire, the both sides of the top of the bottom plate are fixedly connected with support column;

[0008] Mounting unit, the mounting unit includes fixed ring, the fixed ring is located on the surface of support column and is fixedly connected with the surface of support column, the top of the fixed ring is provided with support ring, the number of the fixed ring and support ring is twelve, the side of the fixed ring and support ring is fixedly connected with clamping sheet.

[0009] Further, in the utility model, the surface of left side support ring and left side support column is slidably connected, and the surface of right side support ring and right side support column is movably connected by bearing.

[0010] Further, in the utility model, the side of two right side clamping sheets close to each other is fixedly connected with magnet, two magnets are magnetically opposite, and magnetically connected.

[0011] Furthermore, in this utility model, a positioning ring is fixedly connected to the surface of the left-side support column above the support ring, and a compression spring is fixedly connected between the left-side support ring and the positioning ring.

[0012] Furthermore, in this utility model, a fixing block is fixedly connected to the top of the upper clamping piece, and a pull ring is movably connected to the inner cavity of the fixing block through a bearing.

[0013] Beneficial effects: This utility model has the following beneficial effects:

[0014] This invention modifies the heating device of the dual-barrel maintenance-free dehumidifier, replacing the previous heating rod with a PI heating film and heating wire, which improves heating efficiency and reduces power consumption. At the same time, the layered matrix arrangement design, which places multiple PI heating films, allows for layered control of heating, effectively reducing power consumption. The layered design also accelerates heat dissipation and improves working efficiency. Attached Figure Description

[0015] Figure 1 This is an exploded structural diagram of the base plate and PI heating film of this utility model;

[0016] Figure 2 This is a schematic diagram of the main structure of the base plate of this utility model;

[0017] Figure 3 This is a schematic diagram of the connection structure of the left-side fixing ring, support ring, and clamping plate of this utility model;

[0018] Figure 4 This is a schematic diagram of the connection structure of the right-side fixing ring, support ring, and clamping plate of this utility model.

[0019] In the picture:

[0020] 1. Main unit; 101. Base plate; 102. PI heating film; 103. Heating wire; 104. Support column; 2. Mounting unit; 201. Fixing ring; 202. Support ring; 203. Clamping plate; 204. Magnet; 205. Positioning ring; 206. Compression spring; 207. Fixing block; 208. Pull ring. Detailed Implementation

[0021] To better understand the technical content of this utility model, specific embodiments are described below in conjunction with the accompanying drawings. Various aspects of this utility model are described in this disclosure with reference to the accompanying drawings, which illustrate numerous illustrative embodiments. The embodiments of this disclosure are not necessarily defined to include all aspects of this utility model. It should be understood that the various concepts and embodiments described above, as well as those described in more detail below, can be implemented in any of many ways, because the concepts and embodiments disclosed in this utility model are not limited to any particular implementation. Furthermore, some aspects of this utility model can be used alone or in any suitable combination with other aspects disclosed in this utility model.

[0022] Example 1

[0023] like Figures 1-4 As shown, this is the first embodiment of the present invention. This embodiment provides a low-power design multi-chip arranged PI heating matrix device, including,

[0024] The main unit 1 includes a base plate 101. A PI heating film 102 is provided on the top of the base plate 101. There are six PI heating films 102. A heating wire 103 is provided on the surface of the PI heating film 102. Support columns 104 are fixedly connected to both sides of the top of the base plate 101.

[0025] Mounting unit 2 includes a fixing ring 201, which is located on the surface of the support column 104 and is fixedly connected to the surface of the support column 104. A support ring 202 is provided on the top of the fixing ring 201. There are twelve fixing rings 201 and twelve support rings 202. A clamping piece 203 is fixedly connected to one side of both the fixing ring 201 and the support ring 202.

[0026] like Figures 1-4 As shown, there are six PI heating films 102 arranged in a heating matrix. The PI heating films 102 have good insulation, flexibility and high temperature resistance. The heating wires 103 on the surface generate heat when energized, realizing the heating function and achieving efficient heating. The arrangement of multiple heating films can expand the heating area to meet different heating needs. At the same time, the low power consumption design can reduce energy consumption and save operating costs. The support column 104 plays a supporting and positioning role, providing an installation position for the installation unit 2. There are twelve fixing rings 201 and twelve support rings 202, providing an installation base for the clamping plate 203. The left support ring 202 is slidably connected to the surface of the support column 104, and the right support ring 202 is movably connected to the surface of the support column 104 through a bearing. This design allows the support rings 202 to move and rotate flexibly, which is convenient for clamping and adjusting the PI heating films 102. The clamping plate 203 is used to clamp the PI heating films 102 to ensure that the position of the PI heating films 102 is fixed.

[0027] Example 2

[0028] Reference Figures 1-4 This is the second embodiment of the present invention, which is based on the previous embodiment.

[0029] In this embodiment, the left support ring 202 is slidably connected to the surface of the left support column 104, and the right support ring 202 is movably connected to the surface of the right support column 104 through a bearing.

[0030] On the right side, the two clamping plates 203 are fixedly connected to magnets 204 on the side that are close to each other. The two magnets 204 have opposite magnetic properties and are magnetically connected.

[0031] like Figures 1-4 As shown, magnets 204 with opposite magnetic properties are fixedly connected to the side of the two clamping plates 203 on the right side. The clamping force is enhanced by the magnetic connection. Without the use of additional tools, the attractive force of the magnets 204 is used to achieve a tight fit between the clamping plates 203, making the PI heating film 102 clamp more firmly. At the same time, it is easy to disassemble and install, improving the convenience of operation.

[0032] Example 3

[0033] Reference Figure 3 This is the third embodiment of the present invention, which is based on the first two embodiments.

[0034] In this embodiment, a positioning ring 205 is fixedly connected to the surface of the left support column 104 and above the support ring 202, and a compression spring 206 is fixedly connected between the left support ring 202 and the positioning ring 205.

[0035] A fixing block 207 is fixedly connected to the top of the upper clamping plate 203, and a pull ring 208 is movably connected to the inner cavity of the fixing block 207 through a bearing.

[0036] like Figure 3 As shown, the positioning ring 205 and compression spring 206 provide elastic support, allowing the support ring 202 to move up and down within a certain range and maintain a certain pressure. They can be adaptively adjusted according to the thickness of the PI heating film 102 to ensure the uniformity and stability of the clamping force. At the same time, when the PI heating film 102 is removed, the elasticity of the compression spring 206 can automatically reset the support ring 202 for easy use next time. The pull ring 208 facilitates the user's operation of the clamping plate 203. By pulling the pull ring 208, the clamping plate 203 can be easily opened or closed, improving the convenience of operation and making the installation and removal of the PI heating film 102 easier and faster.

[0037] During use, the maintenance-free dehumidifier is powered by 220AC and uses PI heating elements. A heating wire 103 is placed inside the PI heating film 102 to achieve rapid heating and heat dissipation. The heating wire 103 is connected to the circuit and heats up when powered on. Inside the dual-barrel design, the PI heating films 102 are arranged in a matrix-like layered manner. This arrangement allows for individual control of the heating of each PI heating film 102. There is a certain space between each heating element, which allows for layered heating of the moisture-absorbing silica gel. This effectively reduces the high power consumption problem caused by the previous heating rod heating method. At the same time, layered management allows for the selection of how many PI heating films 102 to be heated based on the moisture absorption level of the silica gel, thereby achieving more precise control over the required heating time and temperature. When the humidity is not so high, only two films can be heated, which can effectively reduce power consumption. This design also allows for faster heat dissipation and effectively improves heat dissipation efficiency.

[0038] All standard parts used in this application can be purchased from the market, and can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. The control method is automatic control through a controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art and is common knowledge in the field. Since this application is mainly used to protect mechanical devices, the control method and circuit connection will not be explained in detail in this application.

[0039] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this invention shall be determined by the claims.

Claims

1. A low-power design for a multi-chip arranged PI heating matrix device, characterized in that: include, The main body unit (1) includes a base plate (101), and a PI heating film (102) is provided on the top of the base plate (101). There are six PI heating films (102), and heating wires (103) are provided on the surface of the PI heating film (102). Support columns (104) are fixedly connected to both sides of the top of the base plate (101). The installation unit (2) includes a fixing ring (201), which is located on the surface of the support column (104) and is fixedly connected to the surface of the support column (104). A support ring (202) is provided on the top of the fixing ring (201). There are twelve fixing rings (201) and twelve support rings (202). A clamping piece (203) is fixedly connected to one side of both the fixing ring (201) and the support ring (202).

2. The low-power design of the multi-chip arranged PI heating matrix device as described in claim 1, characterized in that: The support ring (202) on the left side is slidably connected to the surface of the support column (104) on the left side, and the support ring (202) on the right side is movably connected to the surface of the support column (104) on the right side through a bearing.

3. The low-power design of the multi-chip arranged PI heating matrix device as described in claim 1, characterized in that: Magnets (204) are fixedly connected to the side of the two clamping plates (203) on the right side that are close to each other. The two magnets (204) have opposite magnetic properties and are magnetically connected.

4. The low-power design of the multi-chip arranged PI heating matrix device as described in claim 1, characterized in that: A positioning ring (205) is fixedly connected to the surface of the left support (104) and above the support ring (202), and a compression spring (206) is fixedly connected between the left support ring (202) and the positioning ring (205).

5. The low-power design of the multi-chip arranged PI heating matrix device as described in claim 1, characterized in that: The top of the clamping plate (203) at the upper end is fixedly connected to a fixing block (207), and the inner cavity of the fixing block (207) is movably connected to a pull ring (208) through a bearing.

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