Circuit board assembly and intelligent terminal

Abstract

The utility model provides a circuit board assembly and an intelligent terminal, and relates to the technical field of circuit boards, the circuit board assembly comprises a first circuit board, a second circuit board, a third circuit board and a heat dissipation piece, the second circuit board is arranged on the first circuit board and is connected with the first circuit board, and the second circuit board defines an annular mounting area; electronic components are arranged in the installation area, the third circuit board covers the installation area and is connected with the second circuit board, the heat dissipation piece is arranged on the side, facing the electronic components, of the third circuit board, and the projection, on the first circuit board, of the heat dissipation piece covers the projection, on the first circuit board, of the installation area. According to the circuit board assembly, the heat dissipation piece is arranged, the heat conductivity of the electronic component in the heat dissipation process is increased, and the heat dissipation amount of the electronic component is increased, so that the heat dissipation amount of the circuit board assembly is increased, the problems that the heat dissipation effect of the electronic component is poor and the local temperature of the circuit board is high are solved, and the use experience of a user is improved.

Description

Technical Field

[0001] This application relates to the field of smart terminal technology, and in particular to a circuit board assembly and a smart terminal. Background Technology

[0002] The stacked design of motherboards is widely used in the electronics industry, such as mobile phones and computers, to transform the motherboard from a single-sided flat component into a three-dimensional component. This can significantly reduce the area of ​​the motherboard and improve space utilization through stacking design.

[0003] In conceiving and implementing this application, the inventors discovered at least the following problems: In some solutions, components inside the motherboard generate heat, thus requiring heat dissipation treatment. One method is to fill the area around the heat-generating components with thermal gel. However, using thermal gel for heat dissipation results in poor heat dissipation due to the low thermal conductivity of the gel.

[0004] The preceding description is intended to provide general background information and does not necessarily constitute prior art. Utility Model Content

[0005] This application provides a circuit board assembly and a smart terminal to solve the technical problem of poor heat dissipation effect of thermal gel on heat-generating components, so as to improve the heat dissipation effect of the smart terminal and thus improve the user's experience of using the smart terminal.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] This application provides a circuit board assembly, including:

[0008] First circuit board;

[0009] A second circuit board is disposed on and connected to the first circuit board, and the second circuit board surrounds an annular mounting area, which is configured to mount electronic components.

[0010] A third circuit board is placed over the mounting area and connected to the second circuit board.

[0011] A heat sink is disposed on the side of the third circuit board facing the electronic component, and the projection of the heat sink on the first circuit board covers the projection of the mounting area on the first circuit board.

[0012] In some embodiments, the heat sink is in direct contact with the third circuit board.

[0013] In some embodiments, the heat sink is attached, soldered, or bonded to the third circuit board.

[0014] In some embodiments, a gap is formed between the heat dissipation member and the top of each electronic component.

[0015] In some embodiments, a plurality of protrusions are formed on the side of the heat dissipation member facing the electronic components, and the height of each protrusion matches the height of the corresponding electronic component in the direction perpendicular to the first circuit board, so that the gap between each protrusion and the top of the corresponding electronic component is uniform.

[0016] In some embodiments, an insulating film layer is formed on the side of the heat dissipation member facing the electronic components, and the projection of the insulating film layer on the first circuit board covers the projection of the electronic components on the first circuit board.

[0017] In some embodiments, an elastic heat-conducting member is arranged between the metal heat dissipation member and the electronic components, the elastic heat-conducting member is filled in the gap, and the thermal conductivity of the elastic heat-conducting member is less than the thermal conductivity of the heat dissipation member.

[0018] In some embodiments, the elastic heat-conducting member is a heat-conducting gel layer.

[0019] In some embodiments, at least one of the following is included:

[0020] The heat dissipation member is a metal heat dissipation member;

[0021] The heat dissipation member includes at least one of a copper heat dissipation member, a copper alloy heat dissipation member, a stainless steel heat dissipation member, a titanium heat dissipation member, and an aluminum heat dissipation member;

[0022] The heat dissipation member includes a first heat dissipation plate and a second heat dissipation plate arranged in a spaced manner in the direction perpendicular to the first circuit board, a vacuum cavity is formed between the first heat dissipation plate and the second heat dissipation plate, a heat-conducting support is arranged between the first heat dissipation plate and the second heat dissipation plate in the vacuum cavity, and the vacuum cavity is configured to accommodate a heat exchange medium.

[0023] The embodiments of the present application also provide an intelligent terminal including the circuit board assembly provided by the above embodiments.

[0024] In the circuit board assembly provided by the embodiments of the present application, a heat dissipation member is arranged on the side of the third circuit board facing the electronic components, and the projection of the heat dissipation member on the first circuit board covers the projection of the mounting area on the first circuit board, so as to improve the heat dissipation amount of the circuit board assembly and improve the heat dissipation efficiency, thereby solving the problems of poor heat dissipation effect of the electronic components and high local temperature of the circuit board, and further improving the user experience.

[0025] The intelligent terminal provided by the embodiments of the present application has the same beneficial effects as the circuit board assembly provided by the above embodiments, and will not be described here again. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0027] Figure 1 A structural schematic diagram of the circuit board assembly provided by the embodiments of the present application;

[0028] Figure 2 A partial structural exploded view of the circuit board assembly provided by the embodiments of the present application;

[0029] Figure 3 A partial cross-sectional structural schematic diagram of the circuit board assembly in the A-A of Figure 1

[0030] Figure 4 A structural schematic diagram of the elastic heat-conducting member provided by the embodiments of the present application;

[0031] Figure 5 A structural schematic diagram of the intelligent terminal provided by the embodiments of the present application;

[0032] Figure 6 A hardware structural schematic diagram of a mobile terminal for implementing the embodiments of the present application.

[0033] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. Through the above drawings, the specific embodiments of the present application have been shown, and more detailed descriptions will be given in the following. These drawings and textual descriptions are not intended to limit the scope of the concept of the present application by any means, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0034] The exemplary embodiments will be described in detail herein with reference to the accompanying drawings. Unless otherwise indicated, the same numbers on different drawings represent the same or similar elements. The following exemplary embodiments are described in order to explain the present application and are not intended to represent all embodiments in accordance with the present application. Rather, they are merely examples in accordance with some aspects of the present application as detailed in the appended claims.

[0035] ​It should be noted that, as used in this document, the terms "include," "includes," or "including" mean including but not limited to, and the meaning is non- limiting; "comprising" means that other steps, materials, acts or devices can also be present; the description "coupled" means that two members converge together to form a single member, unless otherwise specified, and the members can or can not be in direct physical contact. The term "consisting of" means an exclusive inclusion, such that the process, method, article, or apparatus that "consists of" includes no additional elements, limited only to those elements specifically recited. The terms "a," "an" and "the" are intended to include both singular and plural forms, unless the context clearly indicates otherwise. The terms "comprises", "comprising", "includes", "including" and "contains", "containing" as used herein, are specifically intended to be open-ended and do not exclude the presence of other elements or steps. The use of "including" and "comprising" and variations thereof is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless otherwise indicated, the use of the terms "or" and "and" are intended to mean "and / or" and "and / or", respectively. The use of the term "if" is intended to mean "when" or "upon" or "in response to the

[0036] It should be noted that, as used in this document, the terms "include," "includes," or "including" mean including but not limited to, and the meaning is non- limiting; "comprising" means that other steps, materials, acts or devices can also be present; the description "coupled" means that two members converge together to form a single member, unless otherwise specified, and the members can or can not be in direct physical contact. The term "consisting of" means an exclusive inclusion, such that the process, method, article, or apparatus that "consists of" includes no additional elements, limited only to those elements specifically recited. The terms "a," "an" and "the" are intended to include both singular and plural forms, unless the context clearly indicates otherwise. The terms "comprises", "comprising", "includes", "including" and "contains", "containing" as used herein, are specifically intended to be open-ended and do not exclude the presence of other elements or steps. The use of "including" and "comprising" and variations thereof is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless otherwise indicated, the use of the terms "or" and "and" are intended to mean "and / or" and "and / or", respectively. The use of the term "if" is intended to mean "when" or "upon" or "in response to the

[0037] It should be noted that, as used in this document, the terms "include," "includes," or "including" mean including but not limited to, and the meaning is non- limiting; "comprising" means that other steps, materials, acts or devices can also be present; the description "coupled" means that two members converge together to form a single member, unless otherwise specified, and the members can or can not be in direct physical contact. The term "consisting of" means an exclusive inclusion, such that the process, method, article, or apparatus that "consists of" includes no additional elements, limited only to those elements specifically recited. The terms "a," "an" and "the" are intended to include both singular and plural forms, unless the context clearly indicates otherwise. The terms "comprises", "comprising", "includes", "including" and "contains", "containing" as used herein, are specifically intended to be open-ended and do not exclude the presence of other elements or steps. The use of "including" and "comprising" and variations thereof is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless otherwise indicated, the use of the terms "or" and "and" are intended to mean "and / or" and "and / or", respectively. The use of the term "if" is intended to mean "when" or "upon" or "in response to the

[0038] It should be understood that the specific embodiments described herein are merely exemplary and do not limit the application.

[0039] In the following description, the suffixes such as "module", "part", or "unit" used for components are merely intended for facilitating explanation of the application and are by no means specific thereto. Therefore, "module", "part", or "unit" can be mixedly used.

[0040] Before the embodiments of the present application are described in detail, the basic concepts and terms involved in the embodiments of the present application are explained for the convenience of understanding the technical solutions of the present application:

[0041] Thermal conductivity is a measure of a material's ability to transfer heat. It represents the rate of heat transfer through a unit area of material per unit temperature gradient under steady-state conditions. Materials with high thermal conductivity can effectively conduct heat, for example, metals such as copper and aluminum have high thermal conductivity.

[0042] The stacking design of the mainboard is widely used in the electronic product industry such as mobile phones and computers, so that the mainboard is changed from a single plane ornament to a three-dimensional ornament, which can greatly reduce the area of the mainboard ornament and improve the utilization rate of the stacking space.

[0043] In the embodiments of the present application, the mainboard is also referred to as a circuit board assembly, which usually includes a plurality of circuit boards. Usually, the plurality of circuit boards are single-sided ornaments, but this increases the area of the circuit board assembly, leading to the problem of large overall volume of the intelligent terminal. Therefore, in order to reduce the area occupied by the circuit board assembly and improve the space utilization, the plurality of circuit boards can be stacked. In this way, the area occupied by the circuit board assembly can be greatly reduced, and the utilization rate of the stacking space can be improved. However, the stacked circuit board assembly increases the density of electronic components, especially the large power heat generating devices, which can increase the temperature of the local area of the circuit board assembly. In order to reduce the temperature of the circuit board assembly, the heat generating components are usually filled with heat dissipation gel around the heat generating components. However, due to the low thermal conductivity of the heat dissipation gel, the heat dissipation effect of the heat generating components is poor, and the local temperature of the mainboard containing the heat generating components is high, thereby affecting the user's experience of using related electronic products.

[0044] To solve the above technical problems, the circuit board assembly and the intelligent terminal are provided. The circuit board assembly comprises a first circuit board, a second circuit board, a third circuit board and a heat dissipation member. The second circuit board is arranged on the first circuit board and connected with the first circuit board. The second circuit board surrounds to form an annular mounting area. The mounting area is configured to mount electronic components. The third circuit board covers the mounting area and is connected with the second circuit board. The heat dissipation member is arranged on the side of the third circuit board facing the electronic components in the circuit board assembly. The projection of the heat dissipation member on the first circuit board covers the projection of the mounting area on the first circuit board. In this way, the heat generated by the circuit board assembly is conducted and dissipated by the heat sink, so as to improve the heat dissipation efficiency, solve the problems of poor heat dissipation effect of the electronic components and high local temperature of the circuit board, and further improve the user experience.

[0045] The content of the present application will be described in detail below with reference to the drawings, so that those skilled in the art can more clearly and specifically understand the content of the present application.

[0046] As shown in Figures 1 to 5 The circuit board assembly 10 comprises a first circuit board 110, a second circuit board 120, a third circuit board 130 and a heat dissipation member 140. The second circuit board 120 is arranged on the first circuit board 110 and connected with the first circuit board 110. The second circuit board 120 surrounds to form an annular mounting area 111. The mounting area 111 is configured to mount electronic components. The third circuit board 130 covers the mounting area 111 and is connected with the second circuit board 120. The heat dissipation member 140 is arranged on the side of the third circuit board 130 facing the electronic components. The projection of the heat dissipation member 140 on the first circuit board 110 covers the projection of the mounting area 111 on the first circuit board 110.

[0047] In this way, the heat generated by each electronic component in the circuit board assembly 100 can be directly conducted and dissipated by the heat dissipation member 140. In addition, the heat dissipation member 140 covers the entire mounting area 111, thereby increasing the heat dissipation area. The heat dissipation member has a large thermal conductivity, so as to improve the heat dissipation efficiency of the heat generated by the circuit board assembly, improve the heat dissipation effect, and further improve the user experience.

[0048] Optionally, the thermal conductivity of the heat dissipation member 140 is greater than that of the heat dissipation gel. Therefore, the heat generated by each electronic component in the circuit board assembly can be quickly conducted and dissipated by the heat dissipation member 140.

[0049] Optionally, the second circuit board 120 is connected with the first circuit board 110 and the third circuit board 130 respectively. The connection modes include, but are not limited to, via connection, laser drilling micro-hole connection, adhesive connection, welding, pressure connection, connector connection and the like.

[0050] Optionally, the first circuit board 110 is a mainboard in the smart terminal, for example.

[0051] In some embodiments, the second circuit board 120 surrounds to form one or more annular mounting areas 111, for example, as shown in the figure. Figure 2 As shown, the second circuit board 120 surrounds to form two mounting areas 111, which increases the support strength between the first circuit board 110 and the third circuit board 130. Optionally, the multiple partitions can also partition the electronic components according to high frequency, low frequency, reduce electromagnetic interference, or partition the electronic components of different modules to realize modular design, so that the design, testing and production of the circuit board are more flexible. Through reasonable surrounding of the mounting area 111, the performance and reliability of the circuit board can be effectively optimized, and the manufacturing and maintenance process can be simplified.

[0052] In some embodiments, on the basis of the thermal conductivity being greater than 3.5 W / m·k, the material of the heat dissipation member 140 includes but is not limited to metal materials, carbon-based materials, ceramic materials, synthetic materials, etc.

[0053] Optionally, the material of the heat dissipation member 400 is a metal material, that is, the heat dissipation member 140 is a metal heat dissipation member, and the metal heat dissipation member includes at least one of a copper heat dissipation member, a copper alloy heat dissipation member, a stainless steel heat dissipation member, a titanium heat dissipation member, and an aluminum heat dissipation member.

[0054] In some embodiments, the heat dissipation member 400 can also be a uniform temperature plate, including a first heat dissipation plate and a second heat dissipation plate arranged at intervals along the direction perpendicular to the first circuit board 110, a vacuum cavity formed between the first heat dissipation plate and the second heat dissipation plate, and a heat conduction support arranged between the first heat dissipation plate and the second heat dissipation plate in the vacuum cavity. The vacuum cavity is configured to accommodate a heat exchange medium.

[0055] Optionally, the above-mentioned uniform temperature plate also has a capillary structure, and optionally, a metal mesh. When the heat generating component in the electronic component conducts heat to the uniform temperature plate, the heat exchange medium absorbs heat and evaporates in the corresponding area of the uniform temperature plate, that is, the hotter area. The gaseous heat exchange medium generated by evaporation diffuses in the vacuum cavity and diffuses to other areas of the uniform temperature plate, that is, the colder area. In the colder area, the gaseous heat exchange medium condenses and releases heat to change into a liquid state, and is transported back to the hotter area through the capillary structure, thereby completing a heat dissipation cycle, and repeating to diffuse the heat in the electronic component through the uniform temperature plate.

[0056] In some embodiments, the heat exchange medium in the above-mentioned vapor chamber includes but is not limited to pure water, acetone, methanol, ethanol, ammonia, etc. For example, the heat exchange medium in the vapor chamber is pure water. When the heat generated by the electronic components is conducted to the pure water, the pure water evaporates to absorb heat and take away the heat generated by the electronic components. The gaseous water after evaporation diffuses to a relatively cold area, i.e., an area of the vapor chamber that does not contact the heat of the electronic components, and then condenses to release heat and change into liquid water, which is transported back to a relatively hot area, i.e., an area of the vapor chamber that contacts the heat of the electronic components, thereby completing a heat dissipation cycle. The cycle is repeated to diffuse the heat in the electronic components. The pure water is a colorless, odorless, non-toxic, and non-flammable liquid, which has high safety. When the pure water leaks from the vapor chamber, it does not pollute the environment, which has high environmental protection.

[0057] As shown in Figure 3 , the heat dissipation member 400 directly contacts the third circuit board 130. For example, the heat dissipation member 400 can be fixedly arranged on the side of the third circuit board 130 facing the electronic components by means of pasting, welding, bonding, or dispensing, etc. to conduct and dissipate the heat generated by the electronic components through the heat dissipation member 140.

[0058] In some embodiments, to achieve the purpose of dissipating heat of the electronic components, the heat dissipation member 140 can directly contact the electronic components or have a certain distance from the electronic components. For example, as shown in Figure 3 , the heat dissipation member 400 has a gap between the top of each electronic component, which avoids the direct contact between the heat dissipation member 140 and the electronic components, thereby avoiding the vibration of the third circuit board 130 or the heat dissipation member 140 being transmitted to the electronic components when subjected to mechanical stress, which causes damage to the electronic components.

[0059] As shown in Figure 3 , the side of the heat dissipation member 400 facing the electronic components has a plurality of protrusions 141. In the direction perpendicular to the first circuit board 110, the height of each protrusion 141 matches the height of the corresponding electronic component, so that the gap between each protrusion 141 and the top of the corresponding electronic component is consistent.

[0060] In some embodiments, the shape of the heat dissipation member 140 includes but is not limited to a regular plate, a plate with protrusions, etc. Optionally, as shown in Figure 3As shown, the heat sink 140 is a plate-shaped three-dimensional structure with protrusions. The side of the heat sink 140 facing away from the electronic components has a shape that matches the third circuit board 130, facilitating connection with the third circuit board 130. By utilizing the space in the second circuit board 120, the side of the heat sink 140 facing the electronic components has multiple protrusions 141 to increase the heat dissipation volume of the heat sink 140, increase the thermal conductivity of the electronic components during the heat dissipation process, thereby increasing the heat dissipation of the electronic components, improving the heat dissipation effect of the electronic components, increasing the heat dissipation of the circuit board assembly, reducing the local temperature of the circuit board, and improving the user experience.

[0061] In some embodiments, the thickness of the plurality of protrusions 141 may be the same or different, such as Figure 3 As shown, the thickness of the multiple protrusions 141 is not uniform. The thickness of each protrusion 141 can also be set according to the distance of the electronic component relative to the third circuit board 130, so that the gap height between each protrusion 141 and the top of the corresponding electronic component is consistent, thereby increasing the heat dissipation volume of the heat sink 140.

[0062] To prevent a short circuit between the metal heat sink 140 and the electronic components below it, therefore, in this embodiment of the application, as... Figure 3 As shown, the heat sink 400 has an insulating film layer 142 on the side facing the electronic components. The projection of the insulating film layer 142 on the first circuit board 110 covers the projection of the electronic components on the first circuit board 110, so as to isolate the heat sink 140 and the electronic components through the insulating film layer, thereby improving the safety, reliability and performance stability of each electronic component in the circuit board assembly.

[0063] In some embodiments, such as Figure 3 As shown, an insulating film layer covers the side of the heat sink 140 facing the electronic components and has the same protruding shape as that side of the heat sink 140. The material type of the insulating film layer varies depending on different physical and electrical properties, including but not limited to polyimide, epoxy resin, polyester film, etc. It has the function of electrical insulation to prevent leakage current from the electronic components from forming a path between the heat sink 140 and the individual components, which could lead to short circuits.

[0064] In other embodiments, the insulating film layer may also be an insulating varnish sprayed on the side of the heat sink 140 facing the electronic components, in order to avoid short circuits between the heat sink and the electronic components, thereby improving the working reliability and performance stability of each electronic component.

[0065] like Figure 3As shown, an elastic thermal conductive element 150 is also provided between the heat sink 400 and the electronic component. The elastic thermal conductive element 150 fills the gap, which helps to directly transfer the heat generated by the electronic component to the heat sink 140 through thermal conduction, thereby increasing the thermal conductivity between the electronic component and the heat sink 140, thereby increasing the heat dissipation of the electronic component, improving the heat dissipation effect of the electronic component, and enhancing the user experience.

[0066] In some embodiments, to increase the thermal conductivity during the heat dissipation process of electronic components, the thermal conductivity of the heat sink 400 is not less than the thermal conductivity of the elastic thermal conductive element 150 and is less than the thermal conductivity of the heat sink 140. For example, the elastic thermal conductive element 500 is a thermally conductive gel layer, which can be a silicon-based thermally conductive gel. To increase the thermal conductivity of the thermally conductive gel layer, thermally conductive fillers can also be added to the gel, such as alumina, boron nitride, zinc oxide, carbon-based materials, etc.

[0067] Optionally, a thermally conductive gel layer can be coated between the heat-generating electronic components and the heat sink 140 to fill the gap between them. This allows the heat generated by the heat-generating electronic components to be directly conducted to the heat sink 140 through the thermally conductive gel layer, improving thermal conductivity and achieving rapid heat conduction and dissipation. Alternatively, filling the gap between the electronic components and the heat sink 140 with the thermally conductive gel layer can also buffer and protect the electronic components, preventing direct contact between them and thus preventing damage to the electronic components or heat sink during vibration.

[0068] Optionally, electronic components that generate heat may include, for example, chips, power management devices, and radio frequency devices.

[0069] In some embodiments, the distribution positions of the elastic thermal conductive elements 150 on the first circuit board 110 are as follows: Figure 4 As shown, the elastic heat-conducting element 150 is covered on the heat-generating electronic components to increase the thermal conductivity of the heat-generating electronic components during the heat dissipation process and increase the heat dissipation of the electronic components. For other areas of the mounting area 111, that is, areas where no heat-generating electronic components are installed, the elastic heat-conducting element 150 may not be installed, thereby saving materials and reducing costs.

[0070] Optionally, for electronic components of different heights corresponding to the heat sink 140, the thickness of different regions of the heat sink 140 can be different. Optionally, the thickness of each region of the heat sink 140 can be adaptively matched according to the height of the corresponding electronic components, so that the gap between the heat sink 140 and each electronic component is consistent or approximately consistent. In this way, the thickness of the thermally conductive gel layer filling between each electronic component and the heat sink 140 is consistent or approximately consistent, thereby improving the uniformity of heat conduction and heat dissipation.

[0071] Therefore, in the circuit board assembly provided by the embodiment of the present application, the heat dissipation member is arranged on the side of the third circuit board facing the electronic component, the projection of the heat dissipation member on the first circuit board covers the projection of the mounting area on the first circuit board, and the thermal conductivity of the heat dissipation member is greater than 3.5 W / m·k, so as to improve the heat dissipation amount of the circuit board assembly, thereby improving the heat dissipation efficiency, solving the problems of poor heat dissipation effect of the electronic component and high local temperature of the circuit board, and further improving the user experience.

[0072] The embodiment of the present application also provides a smart terminal, which comprises the circuit board assembly 100 provided by the above-described embodiment.

[0073] Optionally, the structure of the circuit board assembly 100 has been described in detail in the above-described embodiment, and will not be described here again.

[0074] In the smart terminal provided by the embodiment of the present application, the heat dissipation member 140 is added in the circuit board assembly 100, so as to increase the thermal conductivity of the electronic component in the heat dissipation process, increase the heat dissipation amount of the electronic component, improve the heat dissipation efficiency of the electronic component, thereby increase the heat dissipation amount of the circuit board assembly, avoid the problem of high local temperature of the circuit board, and further improve the user experience of the electronic product.

[0075] Optionally, the smart terminal can be implemented in various forms. For example, the smart terminal described in the present application can include a mobile terminal such as a mobile phone, a tablet computer, a notebook computer, a palm computer, a personal digital assistant (PDA), a portable media player (PMP), a navigation device, a wearable device, a smart bracelet, a pedometer, and the like, and a fixed terminal such as a digital TV, a desktop computer, and the like.

[0076] In the following description, a mobile terminal will be taken as an example for illustration, and those skilled in the art will understand that, in addition to the elements specially used for mobile purposes, the configuration according to the embodiment of the present application can also be applied to a smart terminal of a fixed type.

[0077] Please refer to Figure 6 which is a hardware structure schematic diagram of a mobile terminal for implementing various embodiments of the present application. The mobile terminal 300 can include an RF (Radio Frequency) unit 301, a WiFi module 302, an audio output unit 303, an A / V (Audio / Video) input unit 304, a sensor 305, a display unit 306, a user input unit 307, an interface unit 308, a memory 309, a processor 310, a power supply 311, and the like. Those skilled in the art can understand that Figure 6The mobile terminal structure shown in the figure is not intended to limit the mobile terminal, and the mobile terminal can include more or fewer components than shown, or combine certain components, or arrange different components.

[0078] The following will be described in detail Figure 6 The components of the mobile terminal will be described in detail:

[0079] The radio frequency unit 301 can be used for receiving and sending signals in the process of information or communication. Specifically, after receiving the downlink information of the base station, the processor 310 processes it. In addition, the uplink data is sent to the base station. Generally, the radio frequency unit 301 includes but is not limited to an antenna, at least one amplifier, a transceiver, a coupler, a low-noise amplifier, a duplexer, etc. In addition, the radio frequency unit 301 can also communicate with the network and other devices through wireless communication. The above wireless communication can use any communication standard or protocol, including but not limited to GSM (Global System for Mobile Communication), GPRS (General Packet Radio Service), CDMA2000 (Code Division Multiple Access 2000), WCDMA (Wideband Code Division Multiple Access), TD-SCDMA (Time Division-Synchronous Code Division Multiple Access), FDD-LTE (Frequency Division Duplexing-Long Term Evolution), TDD-LTE (Time Division Duplexing-Long Term Evolution), 5G and 6G, etc.

[0080] WiFi belongs to short-range wireless transmission technology. The WiFi module 302 can help users send and receive emails, browse web pages, and access streaming media, etc. It provides users with wireless broadband Internet access. Although Figure 6 The WiFi module 302 is shown, but it is understood that it does not belong to the mobile terminal, and it can be omitted according to the needs without changing the essence of the invention.

[0081] The audio output unit 303 can convert audio data, which are received from the radio frequency unit 301 or the WiFi module 302 or stored in the memory 309, into an audio signal and output the audio signal as sound when the mobile terminal 300 is in a call signal reception mode, a call mode, a record mode, a voice recognition mode, a broadcast reception mode, and the like. Moreover, the audio output unit 303 can provide a specific function related to a particular function performed by the mobile terminal 300 (e.g., a call signal reception sound, a message reception sound, and the like). The audio output unit 303 can include a speaker, a buzzer, and the like.

[0082] The A / V input unit 104 is for receiving audio or video signals. The A / V input unit 304 can include a graphic processor (GPU) 3041 and a microphone 3042. The graphic processor 3041 processes image data of a still picture or a video obtained by an image capture device (e.g., a camera) in a video call mode or an image call mode. Processed image frames can be displayed on the display unit 306. The image frames processed by the graphic processor 3041 can be stored in the memory 309 (or other storage medium) or transmitted via the radio frequency unit 301 or the WiFi module 302. The microphone 3042 can receive sound (audio data) in a phone call mode, a recording mode, a voice recognition mode, and the like via the microphone 3042, and can process such sound into audio data. Processed audio (voice) data can be converted into a format transmittable to a mobile communication base station in a phone call mode and outputted via the radio frequency unit 301. The microphone 3042 can implement various types of noise removal (or cancellation) algorithms to remove (or cancel) noise generated in the process of receiving and transmitting audio signals.

[0083] The mobile terminal 300 further includes at least one sensor 305, such as a light sensor, a motion sensor, and the like. The light sensor includes an ambient light sensor and a proximity sensor, and the ambient light sensor can adjust the brightness of the display panel 3061 according to the brightness of ambient light, and the proximity sensor can turn off the display panel 3061 and / or the backlight when the mobile terminal 300 is moved to the ear. As one of the motion sensors, the accelerometer sensor can detect the magnitude and direction of acceleration in each direction (generally, three axes), and can detect the magnitude and direction of gravity when at rest, and can be used for applications of recognizing the posture of the mobile terminal (such as switching between landscape and portrait screens, relevant games, magnetometer posture calibration), vibration recognition related functions (such as a pedometer, a knock), and the like. As for the other sensors that can be configured in the mobile terminal, such as a fingerprint sensor, a pressure sensor, an iris sensor, a molecule sensor, a gyroscope, a barometer, a hygrometer, a thermometer, an infrared sensor, and the like, detailed descriptions thereof will not be repeated here.

[0084] The display unit 306 displays information input by a user or information provided for the user. The display unit 106 can include a display panel 3061, which can be configured in the form of a Liquid Crystal Display (LCD), an Organic Light-Emitting Diode (OLED), or the like.

[0085] The user input unit 307 can be used to receive input of numerical or character information, and to generate key signal input with respect to user settings of the mobile terminal and control of the functions thereof. Optionally, the user input unit 307 can include a touch panel 3071 and another input device 3072. The touch panel 3071, which is also called a touch screen, can collect touch operations of a user (such as operations of the user using a finger, a pen, or any suitable object or accessory on or near the touch panel 3071) on or near the touch panel 3071 and drive a corresponding connection device according to a pre-set program. The touch panel 3071 can include two parts, a touch detecting device and a touch controller. The touch detecting device detects a user's touch position and detects a signal caused by a touch operation, and transmits the signal to the touch controller; the touch controller receives touch information from the touch detecting device, converts it into touch coordinates, and sends it to the processor 310, and can receive commands from the processor 310 and execute them. In addition, the touch panel 3071 can be implemented in various types such as a resistive type, a capacitive type, an infrared type, and a surface acoustic wave type. In addition to the touch panel 3071, the user input unit 307 can include another input device 3072. Optionally, the other input device 3072 can include one or more of, but is not limited to, a physical keyboard, a function key (such as a volume control key, an on / off key, etc.), a trackball, a mouse, a joystick, etc.

[0086] Optionally, the touch panel 3071 can cover the display panel 3061, and when the touch panel 3071 detects a touch operation on or near it, it transmits to the processor 310 to determine the type of touch event, and then the processor 310 provides corresponding visual output on the display panel 3061 according to the type of touch event. Although in the above description, the touch panel 3071 and the display panel 3061 are implemented as two independent components to realize the input and output functions of the mobile terminal, in some embodiments, the touch panel 3071 and the display panel 3061 can be integrated to realize the input and output functions of the mobile terminal, which is not limited here. Figure 6

[0087] ​The interface unit 308 serves as an interface through which at least one external device can be connected with the mobile terminal 300. For example, the external device can include a wired or wireless headset port, an external power (or battery charger) port, a wired or wireless data port, a memory card port, a port for connecting a device having an identification module (such as, for example, a home use device), an audio input / output (I / O) port, a video I / O port, an earphone port, and / or the like. The interface unit 308 can be implemented, for example, in the form of a socket for connecting a plug of the external device to the mobile terminal 300. The interface unit 308 can be used as a path through which input data is input to the mobile terminal 300 and / or through which the mobile terminal 300 accesses data from the outside.

[0088] The memory 309 is operable to store software programs and various data. The memory 309 can include a program area and a data area, and the program area can store, for example, an operating system, application programs (such as, for example, a sound play function, a picture play function, and / or the like) required for at least one function, and / or the like. The data area can store, for example, data created according to the use of the mobile terminal (such as, for example, audio data, a phonebook, and / or the like), and / or the like. In addition, the memory 309 can include a high-speed random access memory, and can further include a nonvolatile memory such as, for example, at least one disk storage device, a flash memory device, or other nonvolatile solid state memory device.

[0089] The processor 310 is a control center of the mobile terminal, and connects various parts of the mobile terminal with each other via a variety of interfaces and lines, and controls overall operations of the mobile terminal by executing or processing software programs and / or modules stored in the memory 309 and by invoking data stored in the memory 309. The processor 310 can include one or more processing units. Preferably, the processor 310 can include an application processor and a modem processor, and the application processor can mainly process an operating system, a user interface, and application programs, and the modem processor can mainly process wireless communication. It is understood that the modem processor can not be integrated into the processor 310.

[0090] The mobile terminal 300 can further include a power supply 311 (such as, for example, a battery) that provides power to each of the components, and the power supply 311 can be, for example, logically connected with the processor 310 via a power management system, and the power management system can perform functions such as, for example, charging, discharging, and power consumption management.

[0091] Although Figure 6 Figure 6 The mobile terminal 300 can further include a Bluetooth module and / or the like, which are not shown.

[0092] It can be understood that the above scenarios are only as examples and do not constitute a limitation on the application scenarios of the technical solutions provided by the embodiments of the present application. The technical solutions provided by the embodiments of the present application can also be applied to other scenarios. For example, those skilled in the art can know that, as the system architecture evolves and new business scenarios emerge, the technical solutions provided by the embodiments of the present application are also applicable to similar technical problems.

[0093] The above sequence numbers of the embodiments of the present application are only for description, and do not represent the advantages and disadvantages of the embodiments.

[0094] The steps in the method of the embodiments of the present application can be adjusted in sequence, combined and deleted according to actual needs.

[0095] The units in the device of the embodiments of the present application can be combined, divided and deleted according to actual needs.

[0096] In the present application, for the same or similar term concept, technical solution and / or application scenario description, generally only detailed description is made when it appears for the first time, and for the sake of brevity, it is generally not repeated when it repeatedly appears, and when understanding the technical solutions and the like of the present application, the same or similar term concept, technical solution and / or application scenario description and the like which are not described in detail can be referred to the relevant description before.

[0097] In the present application, the description of each embodiment has its own emphasis, and the parts not described or recorded in a certain embodiment can be referred to the relevant description of other embodiments.

[0098] The technical features of the technical solutions of the present application can be combined arbitrarily, and in order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combination of these technical features does not exist contradictory, it should be considered as the range recorded in the present application.

[0099] The above is only the preferred embodiments of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation using the contents of the present application specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A circuit board assembly, characterized in that, include: First circuit board (110); A second circuit board (120) is disposed on and connected to the first circuit board (110). The second circuit board (120) surrounds an annular mounting area (111), and the mounting area (111) is configured to mount electronic components. A third circuit board (130) covers the mounting area (111) and is connected to the second circuit board (120); A heat sink (140) is disposed on the side of the third circuit board (130) facing the electronic component, and the projection of the heat sink (140) on the first circuit board (110) covers the projection of the mounting area (111) on the first circuit board (110).

2. The circuit board assembly according to claim 1, characterized in that, The heat sink (140) is in direct contact with the third circuit board (130).

3. The circuit board assembly according to claim 2, characterized in that, The heat sink (140) is attached, soldered or bonded to the third circuit board (130).

4. The circuit board assembly according to any one of claims 1-3, characterized in that, There is a gap between the heat sink (140) and the top of each of the electronic components.

5. The circuit board assembly according to claim 4, characterized in that, The heat sink (140) has a plurality of protrusions (141) on the side facing the electronic component. Along the direction perpendicular to the first circuit board (110), the height of each protrusion (141) matches the height of the corresponding electronic component so that the gap between each protrusion (141) and the top of the corresponding electronic component is consistent.

6. The circuit board assembly according to any one of claims 1-3, characterized in that, The heat sink (140) has an insulating film layer (142) on the side facing the electronic component, and the projection of the insulating film layer (142) on the first circuit board (110) covers the projection of the electronic component on the first circuit board (110).

7. The circuit board assembly according to claim 4, characterized in that, An elastic thermal conductive element (150) is provided between the heat sink (140) and the electronic component. The elastic thermal conductive element (150) fills the gap. The thermal conductivity of the elastic thermal conductive element (150) is less than that of the heat sink (140).

8. The circuit board assembly according to claim 7, characterized in that, The elastic thermally conductive element (150) is a thermally conductive gel layer.

9. The circuit board assembly according to any one of claims 1-3, characterized in that, Includes at least one of the following: The heat sink (140) is a metal heat sink; The heat sink (140) includes at least one of copper heat sink, copper alloy heat sink, stainless steel heat sink, titanium heat sink and aluminum heat sink. The heat sink (140) includes a first heat sink and a second heat sink spaced apart along a direction perpendicular to the first circuit board (110), a vacuum cavity is formed between the first heat sink and the second heat sink, a thermally conductive support is provided in the vacuum cavity and supported between the first heat sink and the second heat sink, and the vacuum cavity is configured to accommodate a heat exchange medium.

10. A smart terminal, characterized in that, Includes the circuit board assembly as described in any one of claims 1-9.

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