Limiting glue filling structure of high-power-density module power supply

Abstract

The utility model discloses a limit glue pouring structure of a high power density module power supply in the module power supply field, comprising an aluminum substrate, the top of the aluminum substrate is provided with a surrounding frame, a circuit board is arranged between the aluminum substrate and the surrounding frame, the inner side of the surrounding frame protrudes outwards to form a limit column, and the limit column is provided with a glue pouring opening. Limiting holes are correspondingly formed in the circuit board, the limiting columns are connected with the limiting holes in an inserted mode, and a glue pouring layer is arranged on the side, close to the circuit board, of the aluminum substrate. The high-power density module power supply solves the problem of glue leakage in the glue filling process of an existing high-power density module power supply, the limiting columns of the surrounding frame are connected with the limiting holes of the circuit board in an inserted mode, the limiting columns can provide supporting points for the surrounding frame, the surrounding frame is effectively prevented from deforming due to lateral pressure of a glue filling layer in the glue filling process, and the service life of the module power supply is prolonged. Therefore, the surrounding frame is prevented from being upwarped and bent due to the fact that the surrounding frame is too long and uneven in stress, the possibility of glue leakage is greatly reduced, and the smooth glue pouring process and the reliability of the quality of a glue pouring layer are guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to module power supply technical field, concretely relates to a kind of high power density module power supply's limiting glue pouring structure. BACKGROUND

[0002] High-voltage DC / DC high power density full-brick module power supply is a kind of power module using full-brick packaging design, with high power density and high efficiency characteristics, usually applicable to industrial, vehicle-mounted, military and other fields, can provide stable DC output, and has multiple protection functions, such as input under-voltage protection, output over-voltage protection, output over-current protection, short-circuit protection and over-temperature protection.

[0003] Usually, high power density module power supply includes aluminum substrate and circuit board, and the circuit board is arranged on the top of the aluminum substrate. Since the density of high power density module power supply is large, and the primary and secondary insulation strength requirements are high, the aluminum substrate needs to be treated with glue pouring to enhance the insulation effect. In the Chinese patent document with application number CN201610347491.6, a power module with cofferdam is disclosed, which includes a bottom plate, and the cofferdam is arranged around the bottom plate to form a closed environment, which can be used for pouring heat-conducting glue. However, when pouring heat-conducting glue, the cofferdam of the above-mentioned power module is long, and the heat-conducting glue has fluidity, so the heat-conducting glue will generate lateral pressure on the four edges of the cofferdam, which can easily cause the cofferdam to deform, such as bending upwards, thereby causing the glue leakage problem during the glue pouring process, which not only affects the insulation effect and heat dissipation performance of the module power supply, but also may pose a potential threat to the overall structural stability and service life of the module power supply.

[0004] The above defects need to be solved urgently. INVENTION CONTENTS

[0005] In order to solve the glue leakage problem of existing high power density module power supply during glue pouring process, the utility model provides a limiting glue pouring structure of high power density module power supply.

[0006] The technical scheme of the utility model is as follows:

[0007] A limiting glue pouring structure of high power density module power supply, comprising an aluminum substrate, a surrounding frame is arranged on the top of the aluminum substrate, a circuit board is arranged between the aluminum substrate and the surrounding frame, a limiting column is formed by protruding outward on the inner side of the surrounding frame, a limiting hole is correspondingly arranged on the circuit board, the limiting column is inserted into the limiting hole, and a glue pouring layer is arranged on the side of the aluminum substrate close to the circuit board.

[0008] According to the utility model of the above-mentioned scheme, the surrounding frame includes a top plate, the limiting column is arranged on the top plate, the four sides of the top plate are connected with side plates, and the side plates are connected with the aluminum substrate.

[0009] According to the utility model, the hollowed area is arranged on the top plate, and is used for avoiding components on the circuit board.

[0010] According to the utility model, the edge of the hollowed area is convex to the middle part to form a reinforcing part, and the limiting column is arranged on the reinforcing part.

[0011] According to the utility model, the edge of the hollowed area is provided with an inductor frame, and the inductor frame is sleeved outside the inductor on the circuit board.

[0012] According to the utility model, the height of the inductor frame is greater than the height of the surrounding frame.

[0013] According to the utility model, the diameter of the limiting column is less than the diameter of the limiting hole.

[0014] According to the utility model, the diameter of the limiting column is 0.8mm-1mm.

[0015] According to the utility model, the diameter of the limiting hole is 1.4mm-1.6mm.

[0016] According to the utility model, a plurality of welding columns are arranged on the aluminum substrate, a plurality of welding holes are correspondingly arranged on the circuit board, and the welding columns are welded with the welding holes.

[0017] According to the utility model, first connecting holes are arranged at four corners of the aluminum substrate, second connecting holes are correspondingly arranged at four corners of the surrounding frame, one end of the connecting piece is connected with the first connecting hole, and the other end of the connecting piece is connected with the second connecting hole.

[0018] According to the utility model, the four corners of the circuit board are provided with avoiding notches for avoiding the connecting piece.

[0019] The utility model has the advantages of the following:

[0020] In the limiting glue filling structure of the high power density module power supply, the limiting column of the surrounding frame is inserted into the limiting hole of the circuit board, the limiting column can provide a fulcrum for the surrounding frame, effectively prevents the deformation of the surrounding frame caused by the lateral pressure of the glue filling layer during the glue filling process, prevents the surrounding frame from being curved upward due to uneven stress caused by the excessive length of the surrounding frame, greatly reduces the possibility of glue leakage, and ensures the smooth progress of the glue filling process and the reliability of the glue filling layer quality.

[0021] In addition, the aluminum substrate is provided with a glue pouring layer on the side close to the circuit board, which can not only tightly connect the surrounding frame and the aluminum substrate, but also strengthen the insulation effect of the aluminum substrate, further enhancing the electrical safety of the module power supply; meanwhile, as a heat conducting medium, the glue pouring layer can efficiently transfer the heat generated by the circuit board to the aluminum substrate for heat dissipation, improving the heat dissipation effect of the aluminum substrate. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a structure schematic view of the utility model;

[0023] Figure 2 It is a structure schematic view of the utility model;

[0024] Figure 3 It is Figure 2 It is a sectional view of the structure of B-B;

[0025] Figure 4 It is Figure 3 It is an enlarged view of A part;

[0026] Figure 5 It is a split view of the utility model;

[0027] Figure 6 It is Figure 5 It is an enlarged view of B part;

[0028] Figure 7 It is Figure 5 It is an enlarged view of C part;

[0029] Figure 8 It is a split view of the utility model;

[0030] Figure 9 It is Figure 8 It is an enlarged view of D part.

[0031] In the drawings, 1, aluminum substrate; 11, welding column; 12, first connecting hole; 2, surrounding frame; 21, limiting column; 22, top plate; 23, side plate; 24, hollowed-out area; 25, reinforcing part; 26, second connecting hole; 27, inductance frame; 3, circuit board; 31, limiting hole; 32, welding hole; 33, avoiding notch; 4, connecting piece. DETAILED DESCRIPTION

[0032] In order to make the technical problems, technical schemes and beneficial effects to be solved by the utility model more clearly understood, the utility model will be further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model, and are not used to limit the utility model.

[0033] As Figures 1 to 4As shown, the utility model provides a kind of high power density module power supply's limit glue pouring structure, including aluminium substrate 1, aluminium substrate 1 as the substrate of heat conduction, effectively disperses the heat generated by internal component to go out.In addition, aluminium substrate 1 top is provided with surround frame 2, surround frame 2 not only plays the role of protection and support, also provides necessary frame for subsequent glue pouring process.In addition, aluminium substrate 1 is provided with circuit board 3 between surround frame 2, the inside of surround frame 2 is outwardly convex and forms limit post 21, limit hole 31 is correspondingly provided on circuit board 3, limit post 21 is inserted with limit hole 31, limit post 21 can provide fulcrum for surround frame 2, effectively prevent the deformation of surround frame 2 due to the lateral pressure of glue pouring layer in glue pouring process, to prevent the overlength of surround frame 2 from being unevenly stressed and warped, in turn greatly reduce the possibility of glue leakage, ensure the smooth progress of glue pouring process and the reliability of glue pouring layer quality.

[0034] In the embodiment, aluminium substrate 1 is provided with glue pouring layer (not shown in the drawing) on the side close to circuit board 3, i.e. glue pouring layer covers the surface of aluminium substrate 1, which can not only tightly connect surround frame 2 and aluminium substrate 1, but also strengthen the insulation effect of aluminium substrate 1, further enhance the electrical safety of module power supply.In addition, as a heat conducting medium, glue pouring layer can efficiently transfer the heat generated by circuit board 3 to aluminium substrate 1 for heat dissipation, improve the heat dissipation effect of aluminium substrate 1.

[0035] As shown in the drawing, Figures 4 to 6 In the embodiment, surround frame 2 includes top plate 22, and limit post 21 is arranged on top plate 22, which not only ensures the accurate alignment between limit post 21 and limit hole 31 of circuit board 3, but also enhances the stability of limit post 21 through the support of top plate 22.In the glue pouring process, limit post 21 acts as a physical fulcrum, effectively preventing the deformation of surround frame 2 due to the lateral pressure of glue pouring layer, ensuring the uniform distribution of glue pouring layer and the smooth progress of glue pouring process.In addition, side plate 23 is connected around top plate 22, and side plate 23 is connected with aluminium substrate 1, when glue pouring, glue pouring layer covers the surface of aluminium substrate 1, and through the filling and solidification of glue pouring layer, side plate 23 of surround frame 2 can be tightly connected with aluminium substrate 1, improving the stability of assembly.

[0036] As shown in the drawing, Figure 5 、 Figure 6As shown, in the embodiment, the top plate 22 is provided with a hollowed-out area 24 for avoiding the components on the circuit board 3, and the hollowed-out area 24 enables the top plate 22 to be closely attached to the circuit board 3 without interference caused by the components on the circuit board 3, thereby optimizing the spatial layout between the top plate 22 and the circuit board 3 and making the entire structure more compact. In addition, the edges of the hollowed-out area 24 are protruded to the middle part to form a reinforcing part 25, and the design of the reinforcing part 25 increases the structural strength of the top plate 22 around the hollowed-out area 24, preventing the deformation or damage of the top plate 22 caused by the hollowing-out, and improving the stability of the entire structure. In addition, the limiting column 21 is arranged on the reinforcing part 25, and arranging the limiting column 21 on the reinforcing part 25 instead of directly on the edges of the hollowed-out area 24 can ensure that the limiting column 21 has higher stability and supporting force, which helps to maintain the accurate position of the limiting column 21 in subsequent operations (such as glue filling, assembly, etc.). At the same time, the design of the reinforcing part 25 also provides more stable support for the installation of the limiting column 21, simplifies the assembly process, and reduces the assembly difficulty and cost.

[0037] As shown in Figure 5 , Figure 8 Due to the high density of the high-power-density module power supply, the primary and secondary insulation strength requirements are high, and the aluminum substrate 1 needs to be filled with glue to strengthen the insulation, and the inductors on the circuit board 3 also need to be filled with glue for heat dissipation. The traditional method is to fill glue to the aluminum substrate 1 and the inductors through two independent frames, which requires two sets of molds, increasing the manufacturing cost and production cost. In the embodiment, the edges of the hollowed-out area 24 are provided with an inductor frame 27, the inductor frame 27 is integrally formed with the surrounding frame 2, and the inductor frame 27 is sleeved outside the inductors on the circuit board 3, realizing simultaneous glue filling treatment of the aluminum substrate 1 and the inductors, that is, the utility model only needs one set of mold, which can reduce the manufacturing cost and production cost.

[0038] As shown in Figure 5 , Figure 8 In the embodiment, the height of the inductor frame 27 is greater than the height of the surrounding frame 2, and the inductor frame 27 can more effectively resist external impact and vibration during transportation, installation and use, reducing the risk of damage to the inductors. At the same time, after the glue filling treatment, the glue filling material can better cover the inductor frame 27, forming a more extensive heat dissipation channel, which helps to more effectively dissipate the heat generated by the inductors.

[0039] In the embodiment, the diameter of the limiting column 21 of the surrounding frame 2 is smaller than the diameter of the limiting hole 31 of the circuit board 3, the larger diameter of the limiting hole 31 can provide a margin for the installation of the limiting column 21, facilitate the insertion of the limiting column 21 and the limiting hole 31, and when the surrounding frame 2 needs to be disassembled for maintenance or replacement, the limiting column 21 can be easily pulled out without causing disassembly difficulties due to the size being too tight. In addition, when the surrounding frame 2 and the circuit board 3 are connected, even if there is a slight positional deviation or manufacturing tolerance, the limiting column 21 can smoothly pass through the limiting hole 31 to realize accurate docking of the two. At the same time, due to the installation margin, the assembler does not need to accurately align the limiting column 21 and the limiting hole 31, thereby reducing the assembly difficulty and improving the assembly efficiency.

[0040] In the embodiment, the diameter of the limiting column 21 is 0.8mm-1mm, and the diameter of the limiting column 21 can be designed as any value in the interval of 0.8mm, 0.82mm, 0.84mm, 0.86mm, 0.88mm, 0.9mm, 0.92mm, 0.94mm, 0.96mm, 0.98mm, 1mm, etc. In actual design, the diameter of the limiting column 21 can be designed according to actual needs.

[0041] In the embodiment, the diameter of the limiting hole 31 is 1.4mm-1.6mm, and the diameter of the limiting column 21 can be designed as any value in the interval of 1.4mm, 1.42mm, 1.44mm, 1.46mm, 1.48mm, 1.5mm, 1.52mm, 1.54mm, 1.56mm, 1.58mm, 1.6mm, etc. In actual design, the diameter of the limiting hole 31 can be designed according to actual needs.

[0042] In the embodiment, the aluminum substrate 1 is provided with a plurality of welding columns 11, and the circuit board 3 is correspondingly provided with a plurality of welding holes 32, and the welding column 11 and the welding hole 32 are welded to connect the circuit board 3 and the aluminum substrate 1. The aluminum substrate 1 has good heat conduction performance and can quickly conduct heat away from the circuit board 3. Through the connection of the welding column 11 and the welding hole 32, the heat conduction path between the aluminum substrate 1 and the circuit board 3 is more direct and efficient, which helps to reduce the temperature of the circuit board 3 and improve the heat dissipation performance of the electronic product.

[0043] As Figure 7 , Figure 8 , Figure 9As shown, in the embodiment, the four corners of the aluminum substrate 1 are provided with first connecting holes 12, the four corners of the surrounding frame 2 are correspondingly provided with second connecting holes 26, one end of the connecting piece 4 is connected with the first connecting hole 12, and the other end of the connecting piece 4 is connected with the second connecting hole 26, which not only can ensure that the connection between the aluminum substrate 1 and the surrounding frame 2 is more stable, but also can support the surrounding frame 2, which is helpful to enhance the structural strength of the surrounding frame 2, and maintain the stability and durability of the surrounding frame 2. In addition, the four corners of the circuit board 3 are provided with avoiding notches 33 for avoiding the connecting piece 4, so that the circuit board 3 can smoothly avoid the connecting piece 4 during installation, and avoid interference with the connecting piece 4, which not only helps to simplify the installation process, but also can ensure good fit between the circuit board 3 and the aluminum substrate 1 and the surrounding frame 2, and improve the overall assembly accuracy and reliability.

[0044] It should be understood that the above description can be improved or changed by those skilled in the art, and all these improvements and changes shall belong to the protection scope of the appended claims of the utility model.

[0045] The above has described the utility model patent by way of example in combination with the drawings, and obviously the implementation of the utility model patent is not limited by the above manner. As long as various improvements are made by adopting the method concept and technical scheme of the utility model patent, or the concept and technical scheme of the utility model patent is directly applied to other occasions without improvement, all of them are within the protection scope of the utility model.

Claims

1. A limiting potting structure for a high power density modular power supply, characterized in that, The device includes an aluminum substrate, a surrounding frame is provided on the top of the aluminum substrate, a circuit board is provided between the aluminum substrate and the surrounding frame, a limiting post is formed by the inner side of the surrounding frame protruding outward, a limiting hole is provided on the circuit board, the limiting post is inserted into the limiting hole, and a potting layer is provided on the side of the aluminum substrate close to the circuit board.

2. The limiting potting structure for a high power density modular power supply according to claim 1, characterized in that, The surrounding frame includes a top plate, the limiting post is disposed on the top plate, and side plates are connected to all four sides of the top plate, the side plates being connected to the aluminum substrate.

3. The limiting potting structure for a high power density module power supply according to claim 2, characterized in that, The top plate has a cutout area, which is used to avoid components on the circuit board.

4. The limiting potting structure for a high power density modular power supply according to claim 3, characterized in that, The edge of the excavated area protrudes towards the center to form a reinforcing part, and the limiting post is disposed on the reinforcing part.

5. The limiting potting structure for a high power density modular power supply according to claim 3, characterized in that, An inductor frame is provided at the edge of the cutout area, and the inductor frame is fitted onto the outside of the inductor on the circuit board.

6. The limiting potting structure for a high power density module power supply according to claim 5, characterized in that, The height of the inductor frame is greater than the height of the surrounding frame.

7. The limiting potting structure for a high power density modular power supply according to claim 1, characterized in that, The diameter of the limiting post is smaller than the diameter of the limiting hole.

8. The limiting potting structure for a high power density modular power supply according to claim 1, characterized in that, The aluminum substrate has multiple welding pillars, and the circuit board has multiple welding holes corresponding to them. The welding pillars are welded to the welding holes.

9. The limiting potting structure for a high power density modular power supply according to claim 1, characterized in that, The aluminum substrate has a first connection hole at each of its four corners, and the surrounding frame has a second connection hole at each of its four corners. One end of the connector is connected to the first connection hole, and the other end of the connector is connected to the second connection hole.

10. The limiting potting structure for a high power density modular power supply according to claim 9, characterized in that, The circuit board has clearance notches at its four corners to avoid the connector.

Images