Integrated power module

Abstract

The utility model discloses an integrated power module, which comprises a shell, an air inlet end plate and an air outlet end plate are respectively mounted at two end parts of the shell, a power supply box and a radiator mounted on the power supply box are mounted in the shell, a first partition plate is mounted between the air inlet end plate and the radiator, and a second partition plate is mounted between the radiator and the air outlet end plate. The first partition plate, the radiator and the second partition plate divide the interior of the shell into an upper air duct and a lower air duct. A fan and a capacitor are mounted in the lower air duct; a plurality of heat pipes are embedded in the radiator at intervals, a plurality of silicon carbide IGBTs are installed on the radiator, and the heat pipes and the silicon carbide IGBTs are located on the upper air duct; a laminated busbar is arranged in the upper air duct, one end of the laminated busbar is connected with a direct current input module, the other end of the laminated busbar is connected with an alternating current output module, the connecting end of the direct current input module extends out of the air outlet end plate, and the connecting end of the alternating current output module extends out of the air inlet end plate; the high integration level of each module in the power module is realized, and the power module has a good heat dissipation effect.

Description

TECHNICAL FIELD

[0001] The utility model relates to power module technical field of frequency converter especially relates to an integrated power module. BACKGROUND

[0002] The frequency converter realizes the accurate control to the motor speed and torque through changing the power supply frequency and voltage of the motor, is widely used in electric power energy, municipal water supply, thermal power generation, mining production and each field, and the power module is the core component of the frequency converter, and the performance determines the overall performance of the frequency converter. SUMMARY

[0003] The utility model discloses a kind of integrated power modules, realize the high integration of each module in power module and have good heat dissipation effect.

[0004] To achieve the above object, the utility model provides the following technical scheme:

[0005] An integrated power module, comprising a housing, the two ends of the housing are respectively provided with an air inlet end plate and an air outlet end plate, a power supply box and a heat sink mounted on the power supply box are arranged in the housing, a first partition plate is arranged between the air inlet end plate and the heat sink, a second partition plate is arranged between the heat sink and the air outlet end plate, and the first partition plate, the heat sink and the second partition plate divide the inside of the housing into an upper air duct and a lower air duct; a fan is arranged on one side of the air inlet end plate in the lower air duct, and a capacitor is arranged on one side of the air outlet end plate; a plurality of heat pipes are arranged on the heat sink in an interval, a plurality of silicon carbide IGBTs are arranged on the heat sink in a uniform distribution along the length direction of the heat pipes, and the heat pipes and the silicon carbide IGBTs are arranged in the upper air duct; a laminated busbar is arranged in the upper air duct and connected to the plurality of silicon carbide IGBTs and the capacitor, one end of the laminated busbar is connected to a direct current input module, the other end of the laminated busbar is connected to an alternating current output module, the connection end of the direct current input module extends out of the air outlet end plate, and the connection end of the alternating current output module extends out of the air inlet end plate.

[0006] Preferably, a mounting hole is formed in the second partition plate for exposing the capacitor, a bracket is arranged in the lower air duct, and the capacitor is fixed on the bracket.

[0007] Preferably, the stacked busbar is provided with an IGBT adapter plate connected with the silicon carbide IGBT and an absorption capacitor.

[0008] Preferably, the stacked busbar is integrated with a sampling plate, the upper air duct is provided with a main control box, the main control box is provided with a main control plate, and the main control plate is connected with the sampling plate.

[0009] Preferably, the power supply box is provided with a power supply module.

[0010] Preferably, the first partition plate, the second partition plate, the power supply box and the main control box are all provided with a wire hole, and the wire hole is provided with a wire sleeve.

[0011] Preferably, the direct current input module includes a direct current input row, one end of the direct current input row is connected with the stacked busbar, and the other end of the direct current input row is bent at the part of the air outlet end plate.

[0012] Preferably, the alternating current output module includes a current sensor installed on the first partition plate, the current sensor is provided with an alternating current output row, one end of the alternating current output row is connected with the silicon carbide IGBT, and the other end of the alternating current output row extends out of the air inlet end plate.

[0013] Preferably, the air inlet end plate is integrated with a filter corresponding to the fan, and the air outlet end plate is provided with a honeycomb hole.

[0014] Preferably, the shell is provided with a handle on both sides, and the shell is provided with an inspection cover plate sealing the main control box.

[0015] Beneficial effects:

[0016] The shell is divided into an upper air duct and a lower air duct by the heat sink, the first partition plate and the second partition plate. The lower air duct transports external cold air through the fan and accelerates the heat sink to dissipate heat, maintaining rapid heat exchange and heat dissipation in the lower air duct. The capacitor has good temperature resistance and is not affected by the heat generated during the heat exchange process. The silicon carbide IGBT reduces the heat generated during operation, and the heat pipe integrated on the heat sink accelerates the heat exchange of the silicon carbide IGBT, improving the heat dissipation effect. At the same time, the direct current input module, alternating current output module and other devices with small heat generation are integrated in the upper air duct. The temperature in the upper air duct is kept low due to the rapid heat dissipation of the silicon carbide IGBT, which does not affect the normal operation of the devices. The lower air duct mainly accelerates the heat dissipation and circulation, and continuously maintains the heat exchange and heat dissipation effect of the heat sink.

[0017] Therefore, by optimizing the arrangement of the internal devices of the power module and the heat dissipation air duct, the heat dissipation effect is maintained while the integration is improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 This is a first-view perspective three-dimensional structural diagram of an embodiment of the present utility model;

[0019] Figure 2 This is a second-view perspective three-dimensional structural diagram of an embodiment of the present utility model;

[0020] Figure 3 This is a cross-sectional structural diagram of an embodiment of the present utility model;

[0021] Figure 4 This is a first-view perspective three-dimensional structural diagram of the embodiment of the present invention with the outer shell removed;

[0022] Figure 5 This is a second-view perspective three-dimensional structural diagram of the embodiment of the present invention with the outer shell removed;

[0023] Figure 6 This is a schematic diagram of the structure of a silicon carbide IGBT mounted on a heat sink in an embodiment of this utility model;

[0024] exist Figures 1 to 6 In the diagram, the correspondence between component names or lines and the drawing numbers is as follows:

[0025] 1. Housing; 2. Air inlet end plate; 3. Air outlet end plate; 4. Power supply box; 5. Heat sink; 6. First partition; 7. Second partition; 8. Upper air duct; 9. Lower air duct; 10. Fan; 11. Capacitor; 12. Heat pipe; 13. Silicon carbide IGBT; 14. Laminated busbar; 15. Mounting hole; 16. Bracket; 17. IGBT adapter board; 18. Absorption capacitor; 19. Sampling board; 20. Main control box; 21. Power module; 22. Cable sheath; 23. DC input busbar; 24. Current sensor; 25. AC output busbar; 26. Handle; 27. Inspection cover; 28. Main control board. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0027] See Figures 1-6As shown, the utility model discloses an integrated power module, including shell 1, the both ends of shell 1 are installed with air inlet end plate 2 and air outlet end plate 3 respectively, and the internal cavity is formed by air inlet end plate 2, air outlet end plate 3 and shell 1, is used to carry out integrated installation to internal device, when being applied to frequency converter, directly installs the whole through shell 1 can. Specific, install power box 4 and radiator 5 installed on power box 4 in the shell 1, install first baffle 6 between air inlet end plate 2 and radiator 5, install second baffle 7 between radiator 5 and air outlet end plate 3, first baffle 6, radiator 5 and second baffle 7 divide shell 1 into upper air duct 8 and lower air duct 9, by dividing into upper air duct 8 and lower air duct 9, facilitate the realization of heat different device separation integration, keep internal heat dissipation effect and avoid the case of heat interference.

[0028] Specific, install fan 10 located air inlet end plate 2 one side and capacitor 11 located air outlet end plate 3 one side in lower air duct 9, by fan 10 quickly introduce external air and pass through radiator 5 to realize radiator 5 in lower air duct 9 fast heat dissipation, and capacitor 11 has good temperature resistance, and will not produce greater influence in the process of fast heat dissipation in lower air duct 9, and capacitor 11 is at air outlet also can accelerate hot air to flow out quickly.

[0029] Meanwhile, a plurality of heat pipes 12 are embedded on the radiator 5, a plurality of silicon carbide IGBT 13 are installed on the radiator 5 along the length direction of the heat pipe 12, the heat pipe 12 and the silicon carbide IGBT 13 are located in the upper air duct 8, the heat pipe 12 accelerates the heat exchange between the heat generated by the silicon carbide IGBT 13 and the radiator 5, and the silicon carbide IGBT 13 has low heat generation, so that the heat exchange efficiency and the heat dissipation effect of the silicon carbide IGBT 13 are improved by accelerating the heat exchange, thereby avoiding the heat accumulation in the upper air duct 8, and the temperature in the upper air duct 8 can be kept in a low range, and the lower air duct 9 can be cooled by the fan 10, so that all the devices in the shell 1 can operate in a good temperature range.

[0030] Specific, a laminated busbar 14 connected to the plurality of silicon carbide IGBT 13 and the capacitor 11 is arranged in the upper air duct 8, one end of the laminated busbar 14 is connected to a direct current input module, the other end of the laminated busbar 14 is connected to an alternating current output module, the connection end of the direct current input module extends out of the air outlet end plate 3, and the connection end of the alternating current output module extends out of the air inlet end plate 2, the laminated busbar 14 is used for electrically connecting the devices, and the direct current input module and the alternating current output module are used for electrically connecting the devices outside the shell 1.

[0031] Therefore, by dividing the air ducts inside the outer casing 1 and integrating the heat generated by the internal components separately, the heat dissipation is accelerated and the heat dissipation efficiency is improved by utilizing the divided air ducts, thus achieving a good heat dissipation effect while reducing the overall size and increasing the integration of internal components.

[0032] It should be noted that the main improvements in this embodiment are in reducing the size of the entire power module, integrating and arranging internal components, and improving heat dissipation. The specific circuit control and operating logic between internal electrical components are existing technologies and will not be elaborated in this embodiment.

[0033] Specifically, a mounting hole 15 is provided on the second partition 7 to expose the capacitor 11. A bracket 16 is installed in the lower air duct 9, and the capacitor 11 is fixed on the bracket 16. The bracket 16 provides support and fixes the position of the capacitor 11, while the mounting hole 15 is used to limit the circumferential movement of the capacitor 11 to ensure the installation stability of the capacitor 11.

[0034] Meanwhile, an IGBT adapter board 17 and an absorption capacitor 18 are installed on the stacked busbar 14 to connect the silicon carbide IGBT 13. The IGBT adapter board 17 and the absorption capacitor 18 are matched to the silicon carbide IGBT 13 for operation. The heat generated by the IGBT 17 and the absorption capacitor 18 are low and can be kept at a low temperature when integrated in the upper air duct 8.

[0035] Meanwhile, a sampling board 19 is integrated on the stacked busbar 14, and a main control box 20 is installed in the upper air duct 8. A main control board 28 is installed in the main control box 20 and connected to the sampling board 19. Similarly, the sampling board 19, which does not generate much heat, is integrated in the upper air duct 8. At the same time, the main control box 20 provides heat insulation for the main control board 28 and other modules, ensuring the stability of the devices on the main control board 28.

[0036] The power module 21 is installed inside the power box 4. The power module 21 generates a lot of heat. After being insulated by the power box 4, the heat dissipation to the bottom and outside of the outer shell 1 is accelerated. The continuous airflow in the lower air duct 9 also keeps the temperature of the power box 4 low. At the same time, the heat sink 5 is in direct contact with the power box 4, which can also accelerate heat exchange, thereby maintaining the heat dissipation efficiency at the location of the power module 21.

[0037] To facilitate the protection of internal wiring and to provide a certain degree of isolation between the upper air duct 8 and the lower air duct 9, wiring holes are provided on the first partition 6, the second partition 7, the power supply box 4, and the main control box 20. A cable protection sleeve 22 is embedded in the wiring hole. After the cable passes through the cable protection sleeve 22, it is protected and avoids the risk of being worn by touching the edge of the wiring hole.

[0038] Specifically, the direct current input module includes a direct current input row 23, one end of the direct current input row 23 is connected to the laminated female row 14, and the other end of the direct current input row 23 is bent at a position extending out of the air outlet end plate 3. By extending the bent position of the direct current input row 23 out of the shell 1, the conductive connection can be facilitated. The bent position is provided with a threaded hole to facilitate wiring operation.

[0039] The alternating current output module includes a current sensor 24 mounted on the first partition plate 6, and an alternating current output row 25 is mounted on the current sensor 24. One end of the alternating current output row 25 is connected to the silicon carbide IGBT 13, and the other end extends out of the air inlet end plate 2. During alternating current output, the current sensor 24 realizes current detection, and the alternating current output row 25 realizes conductive connection and extends the end out of the shell 1. Therefore, the wiring ends of the overall module are located outside the shell 1, facilitating quick wiring operation without interfering with the internal devices of the shell 1.

[0040] Meanwhile, a filter corresponding to the fan 10 is integrated on the air inlet end plate 2, and a honeycomb hole is formed on the air outlet end plate 3 to filter the external air when it enters, avoiding too many impurities from entering the inside of the shell 1. In order to facilitate the pulling of the entire module, handles 26 are arranged on both sides of the shell 1. Meanwhile, a maintenance cover plate 27 is arranged on the shell 1 to seal the main control box 20. The maintenance cover plate 27 can be detached from the shell 1 to expose the main control box 20, facilitating the related maintenance, replacement and other operations of the main control plate 28 outside the shell 1, thereby improving the convenience.

[0041] In the present application, unless otherwise clearly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense. For example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium; it can be the communication between two elements or the interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0042] In the description of the present application, it should be pointed out that the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship commonly used when the product of the present application is used, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the devices or elements referred to must have a specific orientation, structure and operation. Therefore, it cannot be understood as a limitation on the present application. In addition, the terms "first", "second" and the like are only used for differentiation, and cannot be understood as indicating or implying relative importance.

[0043] It will be apparent to those skilled in the art that the application is not limited to the details of the above-exemplified embodiments and that the application can be implemented in other particular forms without departing from the spirit or essential characteristics of the application. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. No feature of the application is considered critical unless it is expressly stated in the claims.

Claims

1. An integrated power module, characterized in that: Includes an outer shell (1), with an air inlet plate (2) and an air outlet plate (3) installed at both ends of the outer shell (1), and a power supply box (4) and a heat sink (5) installed inside the outer shell (1). A first partition (6) is installed between the air inlet plate (2) and the heat sink (5), and a second partition (7) is installed between the heat sink (5) and the air outlet plate (3). The first partition (6), the heat sink (5) and the second partition (7) divide the interior of the outer shell (1) into an upper air duct (8) and a lower air duct (9). The downdraft duct (9) is equipped with a fan (10) located on one side of the air inlet end plate (2) and a capacitor (11) located on one side of the air outlet end plate (3). The radiator (5) is provided with multiple heat pipes (12) at intervals, and multiple silicon carbide IGBTs (13) are installed on the radiator (5) along the length direction of the heat pipes (12). The heat pipes (12) and the silicon carbide IGBTs (13) are located in the upper air duct (8). The upper air duct (8) is provided with a stacked busbar (14) connecting multiple silicon carbide IGBTs (13) and the capacitor (11). One end of the stacked busbar (14) is connected to a DC input module, and the other end of the stacked busbar (14) is connected to an AC output module. The connection end of the DC input module extends out of the air outlet plate (3), and the connection end of the AC output module extends out of the air inlet plate (2).

2. The integrated power module according to claim 1, characterized in that: The second partition (7) has a mounting hole (15) for exposing the capacitor (11), and a bracket (16) is installed in the lower air duct (9), and the capacitor (11) is fixed on the bracket (16).

3. An integrated power module according to claim 2, characterized in that: The stacked busbar (14) is equipped with an IGBT adapter board (17) for connecting silicon carbide IGBTs (13) and an absorption capacitor (18) (11).

4. An integrated power module according to claim 3, characterized in that: The stacked busbar (14) integrates a sampling board (19), the upper air duct (8) is equipped with a main control box (20), the main control box (20) is equipped with a main control board (28), and the main control board (28) is connected to the sampling board (19).

5. An integrated power module according to claim 4, characterized in that: The power supply box (4) contains a power module (21).

6. An integrated power module according to claim 5, characterized in that: The first partition (6), the second partition (7), the power supply box (4) and the main control box (20) are all provided with wire holes, and wire protection sleeves (22) are embedded in the wire holes.

7. An integrated power module according to any one of claims 4-6, characterized in that: The DC input module includes a DC input busbar (23), one end of which is connected to the stacked busbar (14), and the other end of which extends out of the air outlet plate (3) and is bent.

8. An integrated power module according to claim 7, characterized in that: The AC output module includes a current sensor (24) mounted on the first partition (6), and an AC output bar (25) is mounted on the current sensor (24). One end of the AC output bar (25) is connected to a silicon carbide IGBT (13), and the other end extends out of the air inlet end plate (2).

9. An integrated power module according to claim 8, characterized in that: The air inlet plate (2) is integrated with a filter corresponding to the fan (10), and the air outlet plate (3) is provided with honeycomb holes.

10. An integrated power module according to claim 9, characterized in that: The outer casing (1) is provided with handles (26) on both sides, and the outer casing (1) is provided with a maintenance cover (27) that seals the main control box (20).

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