Packaging pressing die device
By setting modules and limiting parts on the transmission rod, the problem of substrate warping caused by transmission rod wobbling is solved, and uniform mounting of the heat sink cover and control of substrate flatness are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-21
- Publication Date
- 2026-03-20
AI Technical Summary
The existing heat sink mounting fixture's drive rod causes force loss in other directions when it shakes, resulting in substrate warping and uneven compression of the adhesive.
A packaging molding device is designed, including a transmission rod, a molding die and a module. The module is provided with a channel along the height direction to guide the transmission rod and prevent the transmission rod from shaking. The stability of the transmission rod is ensured by a limiting part and an elastic element, so as to achieve uniform force distribution.
It effectively prevents the transmission rod from shaking, ensures that the heat sink is evenly stressed, avoids substrate warping, and improves the flatness and adhesion of the substrate.
Smart Images
Figure CN224022209U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor packaging, in particular to a packaging press device. BACKGROUND
[0002] With the development of large-size multi-chip packaging, chip heat dissipation and substrate warping become one of the problems of advanced packaging. In actual production, the method of attaching a heat dissipation cover on the substrate is used to realize chip heat dissipation and reduce product warping.
[0003] When attaching the heat dissipation cover, the heat dissipation cover is usually pressed by a heat dissipation cover attaching jig to make the heat dissipation cover attached to the substrate. The existing heat dissipation cover attaching jig usually includes a press and a transmission rod, which is used to act on the press to make the press extrude the heat dissipation cover to make it fit on the substrate. However, in actual operation, the transmission rod of the heat dissipation cover attaching jig may shake and cause loss of force in other directions, resulting in excessive pressure in some areas and insufficient or no pressure in other areas. This imbalance can cause the substrate to warp and the adhesive between the substrate and the heat dissipation cover to be extruded unevenly. CONTENT OF THE INVENTION
[0004] The embodiments of the present application at least provide a packaging press device for extruding a heat dissipation cover to make it fit on a substrate, and can prevent the transmission rod from shaking when attaching the heat dissipation cover, thereby avoiding the problem of substrate warping caused by the transmission rod shaking.
[0005] The embodiments of the present application provide a packaging press device, which includes a transmission rod, a press and a module.
[0006] The transmission rod is arranged in a vertical direction and can move vertically downward when subjected to an external force.
[0007] The press is arranged at the lower end of the transmission rod and is arranged to extrude the heat dissipation cover when the transmission rod moves vertically downward.
[0008] The module is provided with a first channel in the height direction, and the first channel is sleeved outside the transmission rod and gap-fitted with the transmission rod to guide the transmission rod.
[0009] In an optional embodiment, the module and the transmission rod are arranged to limit the fitting to limit the transmission rod from disengaging from the module when moving in the vertical direction.
[0010] In an alternative embodiment, the transmission rod is provided with a first limiting part and a second limiting part, the first limiting part is located at one end of the transmission rod close to the mold, the second limiting part is located at one end of the transmission rod away from the mold, the distance between the first limiting part and the second limiting part is greater than the length of the first hole, and the first limiting part and the second limiting part are used for limiting cooperation with the module to limit the axial movement of the transmission rod.
[0011] In an alternative embodiment, the first limiting part / second limiting part is detachably connected with the transmission rod.
[0012] In an alternative embodiment, the first limiting part has a connecting surface connected with the side of the mold facing the transmission rod.
[0013] In an alternative embodiment, the connecting surface is arranged along the circumference of the transmission rod.
[0014] In an alternative embodiment, the module is provided with a second hole and a third hole, the second hole is sleeved outside the first limiting part and gap-fitted with the first limiting part to guide the first limiting part, and the third hole is sleeved outside the second limiting part and gap-fitted with the second limiting part to guide the second limiting part.
[0015] In an alternative embodiment, the second hole has a second length in the height direction, and the third hole has a third length in the height direction, and the second length and the third length are greater than the movement stroke of the transmission rod.
[0016] In an alternative embodiment, the device further comprises an elastic member between the module and the transmission rod, and the elastic member is arranged to reset the transmission rod when the external force disappears.
[0017] In an alternative embodiment, the elastic member is a spring.
[0018] The above technical solutions of the present application have the following beneficial technical effects:
[0019] The packaging mold device of the present application is provided with a transmission rod and a module, the module can guide the transmission rod when the transmission rod is attached to the heat dissipation cover, preventing the transmission rod from shaking when the heat dissipation cover is attached, which can avoid the loss of force in other directions caused by the shaking of the transmission rod, so that the heat dissipation cover can be uniformly stressed during the attachment process, thereby effectively controlling the flatness of the substrate and avoiding the warping of the substrate.
[0020] In order to make the above objectives, characteristics and advantages of the present application more apparent, more comprehensible, the following preferred embodiments are specifically described in detail below, together with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS
[0021] In order to make the above objectives, characteristics and advantages of the present application more apparent, more comprehensible, the following preferred embodiments are specifically described in detail below, together with the accompanying drawings.
[0022] Figure 1 Fig. 1 shows a structural schematic diagram of a packaging press mold device provided by an embodiment of the present application;
[0023] Figure 2 Fig. 1 shows a structural schematic diagram of a packaging press mold device provided by an embodiment of the present application;
[0024] REFERENCE NUMERALS:
[0025] 10, transmission rod; 11, first limiting part; 11a, connecting surface; 12, second limiting part; 20, press mold; 30, mold; 31, first hole; 32, second hole; 33, third hole; 40, elastic member; 50, heat dissipation cover; 60, substrate; 70, chip; 80, adhesive; 90, organic heat dissipation adhesive. DETAILED DESCRIPTION
[0026] With the development of large-size multi-chip packaging, chip heat dissipation and substrate warping have become one of the problems of advanced packaging. In actual production, the way of attaching a heat dissipation cover on the substrate is adopted to realize chip heat dissipation and reduce product warping.
[0027] When attaching the heat dissipation cover, it is usually necessary to apply pressure to the heat dissipation cover by means of a heat dissipation cover attaching jig so as to attach the heat dissipation cover on the substrate. The existing heat dissipation cover attaching jig usually comprises a press mold and a transmission rod, which is used to act on the press mold so as to make the press mold extrude the heat dissipation cover to make it fit on the substrate. However, in actual operation, the transmission rod of the heat dissipation cover attaching jig may cause loss of force in other directions due to shaking, thereby causing excessive pressure on some areas and insufficient or no pressure on other areas, which will cause the substrate to warp and the adhesive between the substrate and the heat dissipation cover to be extruded unevenly.
[0028] To this end, the embodiment of the present application provides a packaging press device for pressing the heat dissipation cover to fit on the substrate, and can prevent the transmission rod from shaking when the heat dissipation cover is attached, thereby avoiding the problem of substrate warping caused by the shaking of the transmission rod.
[0029] Reference Figure 1 And Figure 2 In some embodiments, the packaging press device 20 includes a transmission rod 10, a press 20, and a module 30. The transmission rod 10 is arranged in the vertical direction, and the transmission rod 10 can move vertically downward when subjected to external force (manual force, mechanical power, etc.). The press 20 is arranged at the lower end of the transmission rod 10, and the side of the press 20 away from the transmission rod 10 can press the heat dissipation cover 50 when the transmission rod 10 moves vertically downward. The module 30 is fixedly arranged and has a first channel 31 arranged in the height direction, and the first channel 31 is sleeved outside the transmission rod 10 and gap-fitted with the transmission rod 10 to guide the transmission rod 10. Specifically, the packaging press device 20 adds the module 30 to the transmission rod 10 and the press 20, and the module 30 can guide the transmission rod 10 to prevent the transmission rod 10 from shaking when the heat dissipation cover 50 is attached (i.e., when the transmission rod 10 moves axially), thereby avoiding the problem of substrate warping caused by the shaking of the transmission rod 10.
[0030] In some embodiments, the module 30 can be a rectangular block structure. Of course, in other embodiments, the module 30 can also be other shapes of structures, such as a cylindrical structure, a triangular prism structure, etc.
[0031] In some embodiments, the first channel 31 of the module 30 is a circular hole. Of course, in other embodiments, the first channel 31 of the module 30 can also be other shapes of channels, such as channels with a square, elliptical cross-section, etc.
[0032] In some embodiments, the first channel 31 of the module 30 has a first length in the height direction, and the first length is equal to one-half of the length of the transmission rod 10. Of course, in other embodiments, the length of the first channel 31 of the module 30 can also be other lengths, such as one-third, one-fourth, etc. of the length of the transmission rod 10. It should be understood that when the two ends of the transmission rod 10 protrude out of the first channel 31, the greater the length of the first channel 31, the greater the fitting length of the transmission rod 10. With the increase of the fitting length of the two, the stability of the transmission rod 10 is also better.
[0033] In some embodiments, the module 30 and the transmission rod 10 are arranged to be limit-fitted to limit the transmission rod 10 from disengaging from the module 30 when moving in the vertical direction. In this way, the transmission rod 10 can be prevented from separating from the module 30 to maintain the guiding function of the first channel 31 of the module 30 to the transmission rod 10.
[0034] In some embodiments, the transmission rod 10 is provided with a first limiting portion 11 and a second limiting portion 12, the first limiting portion 11 is arranged at one end of the transmission rod 10 close to the pressing die 20, and the second limiting portion 12 is arranged at one end of the transmission rod 10 away from the pressing die 20, the distance between the first limiting portion 11 and the second limiting portion 12 is greater than the length of the first hole channel 31, and the first limiting portion 11 and the second limiting portion 12 are used for limiting cooperation with the module 30 to limit the axial movement of the transmission rod 10. Specifically, the first limiting portion 11 is in limiting cooperation with the lower surface of the module 30 to limit the upward vertical movement of the transmission rod 10 from the module 30. The second limiting portion 12 is in limiting cooperation with the upper surface of the module 30 to limit the downward vertical movement of the transmission rod 10 from the module 30. In this way, the module 30 and the transmission rod 10 can be arranged to be capable of limiting cooperation to limit the vertical movement of the transmission rod 10 from the module 30. In addition, since the first limiting portion 11 and the second limiting portion 12 are in limiting cooperation with the lower surface and the upper surface of the module 30 respectively, the cooperation length of the first hole channel 31 of the module 30 with the transmission rod 10 remains unchanged, which can ensure the stability of the transmission rod 10 during movement.
[0035] In some embodiments, the first limiting portion 11 can be a ring structure, and the first limiting portion 11 is sleeved on the transmission rod 10 and connected and fixed with the transmission rod 10. In a specific arrangement, the first limiting portion 11 can be a rectangular ring structure. Of course, in other embodiments, the first limiting portion 11 can also be other shapes of structures, such as a circular ring structure, an elliptical ring structure, etc.
[0036] In some embodiments, the first limiting portion 11 has a connecting surface 11a connected with the side of the pressing die 20 facing the transmission rod 10. In this way, the transmission rod 10 and the first limiting portion 11 can simultaneously transmit pressure to the pressing die 20, which can ensure that the pressing die 20 is uniformly stressed to improve the reliability of the structure. It should be understood that in specific implementation, the connecting surface 11a and the pressing die 20 can be connected by screws, adhesive glue, etc.
[0037] In some embodiments, the connecting surface 11a is arranged along the circumference of the transmission rod 10. In this way, the first limiting portion 11 can uniformly transmit pressure to the pressing die 20 to further ensure that the pressing die 20 is uniformly stressed. It should be understood that in specific implementation, the connecting surface 11a can be an entire annular surface, or can be a plurality of independent flat surfaces uniformly distributed along the circumference of the transmission rod 10.
[0038] In some embodiments, the second limiting portion 12 can be a ring structure or a block structure, and the second limiting portion 12 is connected to one end of the transmission rod 10 away from the pressing die 20. In a specific arrangement, the second limiting portion 12 can be a circular block structure. Of course, in other embodiments, the second limiting portion 12 can also be other shapes of structures, such as a circular ring structure, a square block structure, etc.
[0039] In some embodiments, the second limiting part 12 is also used to transmit an external force (pressure) to the transmission rod 10. For example, the side of the second limiting part 12 away from the transmission rod 10 is provided with a force receiving surface, and the second limiting part 12 is used to receive the external force through the force receiving surface and transmit the external force to the transmission rod 10. It should be understood that in specific implementations, the external force can be directly transmitted to the transmission rod 10 without being transmitted to the transmission rod 10 by the second limiting part 12.
[0040] In some embodiments, the first limiting part 11 and the second limiting part 12 are detachably connected with the transmission rod 10. In this way, the module 30 can be easily installed on the transmission rod 10. It should be understood that in specific implementations, the first limiting part 11 and the second limiting part 12 can also be integrally formed with the transmission rod 10, and the module 30 is installed on the transmission rod 10 by being separately arranged.
[0041] In some embodiments, the module 30 is provided with a second channel 32 and a third channel 33 in the height direction. The second channel 32 is located on the lower surface of the module 30, and the second channel 32 is sleeved outside the first limiting part 11 and is in clearance fit with the first limiting part 11 to guide the first limiting part 11. The third channel 33 is located on the upper surface of the module 30, and the third channel 33 is sleeved outside the second limiting part 12 and is in clearance fit with the second limiting part 12 to guide the second limiting part 12. In use, the second channel 32 can guide the first limiting part 11, and the third channel 33 can guide the second limiting part 12, which can facilitate to improve the reliability of the structure. It should be understood that in specific implementations, the module 30 can be provided as a multi-layer structure, the multi-layer structure is stacked and connected and fixed in the height direction, and the multi-layer structure is respectively used to arrange different channels, which can facilitate the processing of the channels.
[0042] In some embodiments, the second channel 32 has a second length in the height direction, and the third channel 33 has a third length in the height direction, and the second length and the third length are greater than the movement stroke of the transmission rod 10. In this way, the first limiting part 11 and the second limiting part 12 can be kept in the second channel 32 and the third channel 33 respectively when the transmission rod 10 moves, which can further improve the reliability of the structure.
[0043] In some embodiments, the device further comprises an elastic member 40 between the module 30 and the transmission rod 10, which is arranged to reset the transmission rod 10 when the external force disappears. For example, the elastic member 40 can be a spring, which is sleeved on the transmission rod 10 and located between the second limiting portion 12 and the module 30. In the process of attaching the heat dissipation cover 50, when the transmission rod 10 moves vertically downward under the action of the external force, the spring can contract and accumulate elastic potential energy, and when the attachment work is completed, the external force acting on the transmission rod 10 disappears, the spring can return to the initial state, and in the recovery process, the spring can exert a pushing force on the second limiting portion 12 to reset the transmission rod 10.
[0044] The working principle of the packaging press mold 20 device of the embodiment of the application is as follows: the mold adhesive 80 is attached around the upper surface of the substrate 60, and the organic heat dissipation adhesive 90 is applied to the upper surface of the chip 70, and the heat dissipation cover 50 is vertically attached to the position of the substrate 60 where the mold adhesive 80 is applied; an external force is applied to the transmission rod 10, the transmission rod 10 pushes the press mold 20 to extrude the heat dissipation cover 50 downward to make the mold adhesive 80 fully adhere to the substrate 60 and the heat dissipation cover 50, and solidify under high temperature and high pressure; at the same time, the organic heat dissipation adhesive 90 on the upper surface of the chip 70 also fully adheres to the chip 70 and the heat dissipation cover 50, so that heat can be conducted to the heat dissipation cover 50 through the organic heat dissipation adhesive 90 to achieve the heat dissipation function.
[0045] The packaging press mold 20 device of the embodiment of the application is provided with the transmission rod 10 and the module 30, the module 30 can guide the transmission rod 10 when attaching the heat dissipation cover 50, and prevent the transmission rod 10 from shaking when attaching the heat dissipation cover 50, so that the loss of force in other directions caused by the shaking of the transmission rod 10 can be avoided, the heat dissipation cover 50 can be uniformly stressed during the attachment process, and the flatness of the substrate 60 can be effectively controlled to avoid the warping of the substrate 60.
[0046] The terms "first", "second" in the specification and claims of the application can explicitly or implicitly include one or more features. In the description of the application, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally means that the front and rear associated objects are in an "or" relationship.
[0047] In the description of the application, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the purpose of facilitating the description of the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation to the application.
[0048] In the description of the application, it needs to be explained that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above-mentioned terms in the application can be understood according to the specific circumstances.
[0049] One or more embodiments of the present specification are intended to cover all such alternatives, modifications and variations falling within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent replacements, improvements and the like made in the spirit and principles of one or more embodiments of the present specification shall be included in the protection scope of the present application.
[0050] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A packaging molding device for pressing a heat sink cover to adhere it to a substrate, characterized in that, The device includes a transmission rod, a pressing mold, and a module; The transmission rod is arranged vertically and can move vertically downward when subjected to external force; The mold is disposed at the lower end of the transmission rod, and the mold is configured to press the heat dissipation cover when the transmission rod moves vertically downward; The module has a first channel along its height direction. The first channel is sleeved on the outside of the transmission rod and is in clearance fit with the transmission rod to guide the transmission rod.
2. The packaging molding device according to claim 1, characterized in that, The module and the transmission rod are configured to engage in a limiting action to prevent the transmission rod from disengaging from the module when it moves vertically.
3. The packaging molding device according to claim 2, characterized in that, The transmission rod is provided with a first limiting part and a second limiting part. The first limiting part is located at the end of the transmission rod closer to the mold, and the second limiting part is located at the end of the transmission rod away from the mold. The distance between the first limiting part and the second limiting part is greater than the length of the first channel. The first limiting part and the second limiting part are used to cooperate with the module to limit the axial movement of the transmission rod.
4. The packaging molding device according to claim 3, characterized in that, The first limiting part / the second limiting part is detachably connected to the transmission rod.
5. The packaging molding device according to claim 3, characterized in that, The first limiting part has a connecting surface, which is connected to the side of the mold facing the transmission rod.
6. The packaging molding device according to claim 5, characterized in that, The connecting surface is arranged circumferentially along the transmission rod.
7. The packaging molding device according to claim 3, characterized in that, The module is provided with a second channel and a third channel. The second channel is sleeved outside the first limiting part and has a clearance fit with the first limiting part to guide the first limiting part. The third channel is sleeved outside the second limiting part and has a clearance fit with the second limiting part to guide the second limiting part.
8. The packaging molding device according to claim 7, characterized in that, The second channel has a second length along the height direction, and the third channel has a third length along the height direction. Both the second length and the third length are greater than the travel of the transmission rod.
9. The packaging molding device according to claim 1, characterized in that, The device also includes an elastic element located between the module and the transmission rod, the elastic element being configured to reset the transmission rod when the external force disappears.
10. The packaging molding device according to claim 9, characterized in that, The elastic element is a spring.