Plasma cleaning and clamping mechanism and device for chip packaging

Abstract

The utility model discloses a plasma cleaning and clamping mechanism and device for chip packaging, relates to the technical field of chip packaging, and can solve the problem that the cleaning effect is not good enough due to the fact that an existing chip is always in a standing state in the cleaning process. The plasma cleaning clamping mechanism for chip packaging comprises a base, a mounting ring fixed on the base, and a transmission gear arranged in the mounting ring and rotationally connected with the mounting ring, and the transmission gear protrudes out of the mounting ring in the radial direction of the mounting ring; the center of the bottom of the rotary cleaning frame is mounted at the top of a gear shaft of the transmission gear, and the rotary cleaning frame and the gear shaft are coaxially arranged; and the driving assembly is used for driving the transmission gears to rotate, and the output end of the driving assembly is meshed with all the transmission gears.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip packaging technical field, concretely relates to a kind of chip packaging's plasma cleaning clamping mechanism and device. BACKGROUND

[0002] In the packaging process of existing chip, after chip cutting is completed, chip needs to be bonded on copper net by using epoxy conductive silver adhesive when being transferred by manipulator, and then is sent into continuous furnace for hardening. After chip is fixed, plasma cleaning is also needed to remove organic contaminants on printed circuit contact surface, to avoid subsequent gap problem.

[0003] The current plasma cleaning process is generally to place the chips in batches on a support, and then send them into a plasma cleaning machine for plasma cleaning. During the entire cleaning process, the chips are in a stationary state, and the cleaning effect is not good enough. Some chips may not be cleaned thoroughly, which needs to be improved.

[0004] Based on the above background, the inventor has designed a kind of chip packaging's plasma cleaning clamping mechanism and device to solve at least one of the above problems. Thus, the present application is proposed. SUMMARY

[0005] The purpose of the present application is to provide a kind of chip packaging's plasma cleaning clamping mechanism and device, to solve the problem that the cleaning effect of existing chip is not good enough due to the stationary state during cleaning process.

[0006] To solve the above technical problems, the utility model adopts the following scheme:

[0007] On the one hand, the present application provides a kind of chip packaging's plasma cleaning clamping mechanism, including base and the installation ring fixed on the base, and the transmission gear set in the installation ring and rotationally connected therewith, and the transmission gear is installed outwards along the radial direction of the installation ring;

[0008] It also includes a rotating cleaning rack for placing a plurality of chip bodies, and the bottom center of the rotating cleaning rack is installed on the top of the gear shaft of the transmission gear and coaxially arranged therewith.

[0009] It also includes a driving assembly for driving the transmission gear to rotate, and the output end of the driving assembly is engaged with all the transmission gears.

[0010] Optionally, the rotating cleaning rack includes a top plate and a bottom plate arranged in parallel, and a fence arranged at the four corners of the top plate and the bottom plate.

[0011] A plurality of material placing plates for placing chip bodies are arranged between the top plate and the bottom plate.

[0012] A lower rotating shaft is located at the center of the bottom of the base plate, and the lower rotating shaft is locked onto the top of the gear shaft.

[0013] Optionally, the bottom of the lower rotating shaft is provided with a cross groove, and the top of the gear shaft is provided with a cross protrusion that matches the cross groove. The lower rotating shaft is coaxially mounted on the top of the gear through the mutually matching cross groove and cross protrusion.

[0014] Optionally, an upper pivot is provided at the top of the top plate;

[0015] A step is provided on the upper rotating shaft;

[0016] It also includes a stabilizing ring for improving the stability of the top of multiple rotating cleaning racks. The stabilizing ring is provided with a through hole that matches the position and size of the upper rotating shaft. The stabilizing ring is placed on the step of the rotating shaft through the through hole and is rotatably connected to the upper rotating shaft.

[0017] Optionally, of the four fences located at the four corners of the top and bottom plates, two have an L-shaped cross-section and the other two have a flat cross-section.

[0018] It also includes a vertical baffle that is set vertically through the top plate and placed on the bottom plate, with the vertical baffle abutting against the end face of the feeding plate.

[0019] Optionally, the bottom center of the rotating cleaning frame and the transmission gears are both circularly distributed;

[0020] The drive assembly includes a drive mechanism and a transmission ring sleeved on the outside of the mounting ring. The outer side of the transmission ring is poweredly connected to the output end of the drive mechanism, and the inner side of the transmission ring is provided with several internal teeth that mesh with the transmission gears.

[0021] Optionally, the drive mechanism includes a linear reciprocating drive member and a reciprocating transmission rod disposed at the output end of the drive member;

[0022] The outer side of the transmission ring is provided with several external teeth, and the reciprocating transmission rod is provided with several straight teeth that mesh with the external teeth.

[0023] Optionally, the bottom of the transmission ring is provided with an annular groove;

[0024] The top of the base is provided with an annular protrusion that matches the annular groove.

[0025] Optionally, the number of the rotating cleaning racks ranges from 4 to 10, and the multiple rotating cleaning racks are evenly distributed along the circumference of the mounting ring.

[0026] On the other hand, this application provides a plasma cleaning system for chip packaging, including any of the above-described plasma cleaning clamping mechanisms for chip packaging, wherein the base is a pull-out base.

[0027] It also includes a cleaning tank, and the pull-out base is slidably connected to the tank bottom of the cleaning tank.

[0028] The utility model has the advantages of:

[0029] Firstly, the application can place a batch of chips on the rotating cleaning frame, and drive the rotating cleaning frame to rotate by using the driving assembly, so that the batch of chips can be in a rotating state during the cleaning process, which can avoid dead angles and improve the cleaning effect and the cleaning rate, effectively solving the problem of poor cleaning effect due to the static state of the chips during the cleaning process.

[0030] Secondly, the rotating cleaning frame can be taken off from the top of the gear shaft, so that multiple rotating cleaning frames can be arranged on the mounting ring, and different models of rotating cleaning frames can be replaced to adapt to different models of chips. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 It is a top view structural schematic diagram of the embodiment 1 of the application.

[0032] Figure 2 It is a front view structural schematic diagram of the embodiment 1 of the application.

[0033] Figure 3 It is a front view structural schematic diagram of the rotating cleaning frame in the embodiment 1 of the application.

[0034] Figure 4 It is a top view structural schematic diagram of the rotating cleaning frame in the embodiment 1 of the application.

[0035] Figure 5 It is a top view structural schematic diagram of the embodiment 2 of the application.

[0036] Mark 1-rotating cleaning frame, 11-top plate, 111-upper rotating shaft, 112-rotating shaft step, 12-fence, 13-bottom plate, 131-lower rotating shaft, 132-cross clamping groove, 14-feeding plate, 15-vertical baffle, 2-pull-out base, 31-reciprocating transmission rod, 32-transmission ring, 321-ring-shaped sliding groove, 33-mounting ring, 4-stabilizing ring, 5-transmission gear, 501-cross clamping convex, 6-chip body, 7-cleaning tank, 71-tank bottom. DETAILED DESCRIPTION

[0037] The utility model will be further described in detail in combination with the embodiments and the drawings, but the implementation mode of the utility model is not limited thereto.

[0038] In the description of the utility model, it needs to explain that, the terms "center", "upper", "lower", "left", "right", "vertical", "longitudinal", "lateral", "horizontal", "internal", "external", "front", "back", "top", "bottom" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the utility model product is used, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0039] In the description of the utility model, it also needs to explain that, unless otherwise explicitly specified and limited, the terms "set", "open", "install", "connect", "connect" should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the communication between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0040] The utility model will be described in detail below by referring to the drawings and combining with the embodiments.

[0041] Embodiment 1:

[0042] As shown in the figure, the utility model provides a kind of plasma cleaning clamping mechanism for chip packaging, including base and the mounting ring 33 fixed on base, and the transmission gear 5 being set in mounting ring 33 and being rotationally connected with it, and transmission gear 5 is installed mounting ring 33 along the radial direction of mounting ring 33 and protrudes mounting ring 33 outward; Figures 1 to 4 It further includes rotating cleaning frame 1 for placing chip main body 6 in batches, and the bottom center of rotating cleaning frame 1 is installed on the top of gear shaft of transmission gear 5 and is coaxially arranged with it;

[0043] It further includes driving assembly for driving transmission gear 5 to rotate, and the output end of driving assembly is engaged with all transmission gears 5.

[0044] In the embodiment, a plurality of chips are placed in rotating cleaning frame 1, since the bottom center of rotating cleaning frame 1 is installed on the top of gear shaft of transmission gear 5, and the output end of driving assembly can drive transmission gear 5 to rotate, so that a plurality of chips can be in rotating state during cleaning process, which can avoid dead angle of cleaning, improve cleaning effect and cleaning rate, and effectively solve the problem that the cleaning effect of existing chips is not good enough due to the fact that they are always in stationary state during cleaning process.

[0045]

[0046] ​In addition, the rotating cleaning frame 1 of the embodiment can be taken off from the top of the gear shaft, so that multiple rotating cleaning frames 1 installed on the mounting ring 33 can be provided, and different models of rotating cleaning frames 1 can be replaced to adapt to different models of chips.

[0047] Specifically, in the embodiment, the rotating cleaning frame 1 comprises a top plate 11 and a bottom plate 13 arranged in parallel, and a fence 12 arranged at four corners of the top plate 11 and the bottom plate 13.

[0048] A plurality of material placing plates 14 for placing chip bodies 6 are further arranged between the top plate 11 and the bottom plate 13.

[0049] A lower rotating shaft 131 is arranged at the center of the bottom of the bottom plate 13, and the lower rotating shaft 131 is clamped on the top of the gear shaft. In the embodiment, the top and bottom of the fence 12 are fixed on the top plate 11 and the bottom plate 13 respectively, and the material placing plates 14 are fixedly connected on the fence 12 in multiple layers, and each layer of the material placing plates 14 is provided with at least one plate, and four plates are provided in the embodiment, so as to reduce the contact area between the material placing plates 14 and the chips and improve the cleaning effect.

[0050] Specifically, in the embodiment, a cross-shaped clamping groove 132 is arranged at the bottom of the lower rotating shaft 131, and a cross-shaped clamping convex 501 adapted to the cross-shaped clamping groove 132 is arranged on the top of the gear shaft, and the lower rotating shaft 131 is coaxially arranged on the top of the gear shaft through the cross-shaped clamping groove 132 and the cross-shaped clamping convex 501. By arranging the cross-shaped clamping groove 132 and the cross-shaped clamping convex 501, the lower rotating shaft 131 cannot rotate relative to the gear shaft, and the lower rotating shaft 131 cannot be moved out in the horizontal direction, but only the rotating cleaning frame 1 can be installed or taken out in the vertical direction, which not only ensures the stability of the rotating cleaning frame 1 driven by the gear shaft to rotate, but also takes into account the portability of mass cleaning.

[0051] Specifically, in the embodiment, an upper rotating shaft 111 is arranged at the top of the top plate 11.

[0052] A rotating shaft step 112 is arranged on the upper rotating shaft 111.

[0053] A stabilizing ring 4 for improving the stability of the top of the multiple rotating cleaning frames 1 is further included, and a through hole adapted to the position and size of the upper rotating shaft 111 is arranged on the stabilizing ring 4. The stabilizing ring 4 is placed on the rotating shaft step 112 through the through hole and is rotationally connected with the upper rotating shaft 111. By arranging the stabilizing ring 4, the stability of the top of the rotating cleaning frame 1 during rotation can be improved.

[0054] Specifically, in the embodiment, among the four fences 12 arranged at the four corners of the top plate 11 and the bottom plate 13, the cross sections of two of the fences 12 are L-shaped, and the cross sections of the other two of the fences 12 are flat.

[0055] It also includes a vertical baffle 15 that is set vertically through the top plate 11 and placed on the bottom plate 13. The vertical baffle 15 is set against the end face of the feeding plate 14. The vertical baffle 15 is set to facilitate the placement of chips.

[0056] Specifically, in this embodiment, the bottom center of the rotating cleaning frame 1 and the transmission gear 5 are both circularly distributed;

[0057] The drive assembly includes a drive mechanism and a transmission ring 32 sleeved on the outside of the mounting ring 33. The outer side of the transmission ring 32 is poweredly connected to the output end of the drive mechanism. The inner side of the transmission ring 32 is provided with several internal teeth that mesh with the transmission gear 5. The transmission ring 32 can be driven to rotate by the drive mechanism, thereby causing the internal teeth of the transmission ring 32 to drive the transmission gear 5 to rotate.

[0058] Specifically, in this embodiment, the driving mechanism includes a linear reciprocating drive (not shown in the figure) and a reciprocating transmission rod 31 disposed at the output end of the drive;

[0059] The transmission ring 32 has a number of external teeth on its outer side, and the reciprocating transmission rod 31 has a number of straight teeth that mesh with the external teeth. The linear reciprocating drive in this embodiment can be a cylinder or other drive components, which will not be described in detail here.

[0060] Specifically, in this embodiment, the bottom of the transmission ring 32 is provided with an annular groove 321;

[0061] The top of the base is provided with an annular protrusion that matches the annular groove 321, improving the stability of the transmission ring 32 during rotation.

[0062] Optionally, the number of rotating cleaning racks 1 is 4, and the 4 rotating cleaning racks 1 are evenly distributed along the circumference of the mounting ring 33. In some embodiments, the number of rotating cleaning racks 1 can be set to 6, 8, or other numbers as needed, which will not be elaborated here.

[0063] Example 2:

[0064] like Figure 5 As shown, this embodiment provides a plasma cleaning device for chip packaging, including any of the above-described plasma cleaning clamping mechanisms for chip packaging, wherein the base is a pull-out base 2.

[0065] It also includes a cleaning box 7, and a pull-out base 2 is slidably connected to the bottom 71 of the cleaning box 7. The pull-out base 2 can facilitate the removal and installation of the cleaning rack 1.

[0066] The remaining structures in this embodiment are the same as those in Embodiment 1 above, and will not be described again here.

[0067] It can be understood that the above implementation is only an exemplary embodiment for illustrating the principle of the present application, but the present application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present application, and these modifications and improvements are also considered as the protection scope of the present application.

Claims

1. A plasma cleaning clamping mechanism for chip packaging, characterized in that, Includes a base and a mounting ring (33) fixed on the base, and a transmission gear (5) disposed in the mounting ring (33) and rotatably connected thereto, wherein the transmission gear (5) protrudes outward from the mounting ring (33) along the radial direction of the mounting ring (33); It also includes a rotating cleaning rack (1) for batch placement of chip bodies (6), the bottom center of the rotating cleaning rack (1) is mounted on the top of the gear shaft of the transmission gear (5) and is coaxial with it; It also includes a drive assembly for driving the rotation of the transmission gears (5), the output end of which meshes with all the transmission gears (5).

2. The plasma cleaning clamping mechanism for chip packaging according to claim 1, characterized in that, The rotating cleaning rack (1) includes a top plate (11) and a bottom plate (13) arranged in parallel, and railings (12) set at the four corners of the top plate (11) and the bottom plate (13); Between the top plate (11) and the bottom plate (13), there are also several feeding plates (14) for placing the chip body (6); A lower rotating shaft (131) is provided at the bottom center of the base plate (13), and the lower rotating shaft (131) is locked at the top of the gear shaft.

3. The plasma cleaning clamping mechanism for chip packaging according to claim 2, characterized in that, The bottom of the lower rotating shaft (131) is provided with a cross groove (132), and the top of the gear shaft is provided with a cross protrusion (501) that matches the cross groove (132). The lower rotating shaft (131) is coaxially mounted on the top of the gear through the mutually matching cross groove (132) and cross protrusion (501).

4. The plasma cleaning clamping mechanism for chip packaging according to claim 2, characterized in that, The top of the top plate (11) is provided with an upper rotating shaft (111); A rotating shaft step (112) is provided on the upper rotating shaft (111); It also includes a stabilizing ring (4) for improving the stability of the top of the multiple rotating cleaning racks (1). The stabilizing ring (4) is provided with a through hole that matches the position and size of the upper rotating shaft (111). The stabilizing ring (4) is placed on the rotating shaft step (112) through the through hole and is rotatably connected to the upper rotating shaft (111).

5. The plasma cleaning clamping mechanism for chip packaging according to claim 2, characterized in that, Of the four fences (12) located at the four corners of the top plate (11) and the bottom plate (13), two have an L-shaped cross-section and the other two have a flat cross-section. It also includes a vertical baffle (15) that runs vertically through the top plate (11) and is placed on the bottom plate (13), with the vertical baffle (15) abutting against the end face of the feeding plate (14).

6. The plasma cleaning clamping mechanism for chip packaging according to claim 1, characterized in that, The bottom center of the rotating cleaning frame (1) and the transmission gear (5) are both circularly distributed; The drive assembly includes a drive mechanism and a transmission ring (32) sleeved on the outside of the mounting ring (33). The outer side of the transmission ring (32) is poweredly connected to the output end of the drive mechanism. The inner side of the transmission ring (32) is provided with a number of internal teeth that mesh with the transmission gear (5).

7. The plasma cleaning clamping mechanism for chip packaging according to claim 6, characterized in that, The drive mechanism includes a linear reciprocating drive component and a reciprocating transmission rod (31) disposed at the output end of the drive component; The transmission ring (32) has a number of external teeth on its outer side, and the reciprocating transmission rod (31) has a number of straight teeth that mesh with the external teeth.

8. The plasma cleaning clamping mechanism for chip packaging according to claim 6, characterized in that, The bottom of the transmission ring (32) is provided with an annular groove (321); The top of the base is provided with an annular protrusion that matches the annular groove (321).

9. The plasma cleaning clamping mechanism for chip packaging according to claim 1, characterized in that, The number of the rotating cleaning racks (1) ranges from 4 to 10, and the multiple rotating cleaning racks (1) are evenly distributed along the circumferential direction of the mounting ring (33).

10. A plasma cleaning apparatus for chip packaging, comprising a plasma cleaning clamping mechanism for chip packaging as described in any one of claims 1-9, characterized in that, The base is a pull-out base (2); It also includes a cleaning tank (7), and a pull-out base (2) is slidably connected to the bottom (71) of the cleaning tank (7).

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