Ejector pin module
By designing an independent channel structure and linear bearings, combined with position adjustment components and sealing rings, the problems of uneven air pressure and positional deviation in the ejector mechanism were solved, achieving high-precision wafer ejection and stable adsorption of the ejector module, and improving the service life and response speed of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-25
- Publication Date
- 2026-03-20
AI Technical Summary
Existing ejector mechanisms cannot accurately eject wafers due to uneven air pressure within the channel and positional deviation during ejector movement.
Design an ejector pin module, including a housing, a linear bearing, an ejector pin, and a drive component. By setting independent first and second channels, the linear bearing improves the sliding accuracy of the ejector pin, and the position adjustment component and sealing ring ensure air pressure stability and adsorption force, thereby achieving accurate positioning and stable movement of the ejector pin.
It improves the precision of the ejector module during the sliding process and the effect of adsorbing the blue film, ensuring the accuracy of wafer ejection, extending the service life of the ejector pins, and improving the flexibility and response speed of the equipment.
Smart Images
Figure CN224022230U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor production equipment especially relates to a ejector pin module. BACKGROUND
[0002] The existing fixed crystal equipment generally includes a swing arm, a wafer disc, a carrier, and an ejector pin, the wafer disc is provided with a blue film, the wafer is placed on the blue film, the carrier is used for placing a substrate, the swing arm is provided with a suction nozzle, during operation, the swing arm is first moved above the wafer disc, the ejector pin is moved upward to pierce the blue film, thereby lifting the wafer, the suction nozzle is moved downward to suck the wafer, the wafer is taken, then the ejector pin is moved downward to reset, the swing arm is moved above the carrier, the suction nozzle fixes the wafer on the substrate, and the fixed crystal is completed.
[0003] In the prior art, the existing ejector pin mechanism is usually provided with one channel, which is used for sliding the ejector pin and communicating with a vacuum pump to provide suction force to adsorb the blue film, however, due to the reciprocating movement of the ejector pin, the air pressure in the channel is uneven, which affects the adsorption of the blue film, and further causes the ejector pin to fail to accurately eject the wafer. On the other hand, the ejector pin will deviate during movement, so that the ejector pin cannot accurately eject the wafer. UTILITY MODEL CONTENTS
[0004] The utility model aims at providing an ejector pin module, which aims to solve the technical problems that the existing ejector pin mechanism is affected by uneven air pressure in the channel, and the position of the ejector pin deviates during movement, causing the ejector pin to fail to accurately eject the wafer.
[0005] To solve the above technical problems, an ejector pin module is provided for ejecting a wafer from a blue film, comprising:
[0006] A housing includes a first channel, a second channel, an air inlet, an adsorption port, and a puncture port, the first channel is nested in the second channel, the air inlet and the adsorption port are in communication with the second channel, and the puncture port is in communication with the first channel;
[0007] A linear bearing is arranged in the first channel;
[0008] An ejector pin is slidably arranged in the linear bearing;
[0009] A driving member is arranged in the housing and is spaced apart from the ejector pin to drive the ejector pin to reciprocate linearly;
[0010] A vacuum pump is in communication with the adsorption port through the first channel.
[0011] Further, the needle module further comprises a first sealing ring and a second sealing ring, the first sealing ring is arranged close to the air hole, and the second sealing ring is arranged between the needle and the first channel.
[0012] Further, the needle module further comprises an elastic member, the elastic member is abutted between the shell and the needle.
[0013] Further, the shell comprises an upper abutment part, the needle is formed with a lower abutment part, the elastic member is abutted between the upper abutment part and the lower abutment part, and the second sealing ring is assembled on the shell through the upper abutment part.
[0014] Further, the length of the needle is L1, the length of the linear bearing is L2, and the length L2 of the linear bearing is in the range of [0.3L1, 0.5L1].
[0015] Further, the suction ports are arranged in plurality, and the plurality of suction ports are uniformly distributed in a circle around the center of the puncture port.
[0016] Further, the centers of the plurality of suction ports are connected to form an outer circle, the diameter of the outer circle is D1, the diameter of the puncture port is D2, and the diameter D2 of the puncture port is in the range of [0.4D1, 0.5D1].
[0017] Further, the needle module further comprises a position adjusting assembly, the position adjusting assembly is connected with the shell to adjust the position of the needle.
[0018] Further, the position adjusting assembly comprises an X-axis adjusting part and a Y-axis adjusting part, the X-axis adjusting part is connected with the Y-axis adjusting part, the shell is connected with the Y-axis adjusting part, the X-axis adjusting part is used to drive the Y-axis adjusting part and the shell to move along the X-axis direction, the Y-axis adjusting part is used to drive the shell and the needle to move along the Y-axis direction, the needle can slide along the Z-axis direction, and the X-axis direction, the Y-axis direction and the Z-axis direction are perpendicular to each other.
[0019] Further, the driving member is configured to be spaced apart from the needle when the needle does not move, and to abut against the needle when the needle moves.
[0020] The embodiment of the present application has the following beneficial effects:
[0021] The needle module in the embodiment has the first channel and the second channel, the first channel is nested in the second channel, that is, the first channel and the second channel are independently arranged, so that the air pressure in the second channel is not affected by the needle, and the area of the blue film adsorbed by the needle module is controlled through the annular second channel, thereby further improving the effect of the needle module on the blue film adsorption. In addition, the needle module of the present application is provided with a linear bearing in the first channel, which is beneficial to improve the precision of the needle in the sliding process, thereby further improving the accuracy of the needle in ejecting the wafer. BRIEF DESCRIPTION OF DRAWINGS
[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiment or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.
[0023] Figure 1 The structure diagram of the needle module is described in the embodiment of the present application.
[0024] Figure 2 The structure diagram of the needle module is described in the embodiment of the present application. Figure 1 The local enlarged diagram of A in the embodiment of the present application.
[0025] Figure 3 The position diagram of the adsorption port and the puncture port is described in the embodiment of the present application.
[0026] Figure 4 The sectional view of the needle module is described in the embodiment of the present application.
[0027] Figure 5 The sectional view of the needle module is described in the embodiment of the present application. Figure 4 The local enlarged diagram of B in the embodiment of the present application.
[0028] Wherein: 100, needle module; 110, shell; 111, first channel; 112, second channel; 113, air port; 114, adsorption port; 115, puncture port; 116, upper abutting portion; 120, linear bearing; 130, needle; 131, lower abutting portion; 140, driving member; 150, first sealing ring; 160, second sealing ring; 170, elastic member; 180, adjusting assembly; 181, X-axis adjusting component; 182, Y-axis adjusting component. DETAILED DESCRIPTION
[0029] For the purpose of facilitating the understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and fully convey the scope of the present application to those skilled in the art.
[0030] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. The terms "vertical", "horizontal", "left", "right" and similar expressions as used herein are for the purpose of illustration only.
[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.
[0032] Reference will now be made to Figures 1-5The utility model embodiment provides a kind of ejector pin module 100, for the wafer is ejected from blue film, ejector pin module 100 includes shell 110, linear bearing 120, ejector pin 130, driving part 140 and vacuum pump (not shown in drawing).Shell 110 includes first passage 111, second passage 112, air vent 113, suction port 114 and puncture port 115, first passage 111 is nested in second passage 112, air vent 113 and suction port 114 are all communicated with second passage 112, puncture port 115 is communicated with first passage 111.Linear bearing 120 is arranged in first passage 111.Ejector pin 130 is slidably arranged in linear bearing 120.Driving part 140 is arranged in shell 110 and is spaced apart from ejector pin 130, to drive ejector pin 130 reciprocating motion along straight line.Vacuum pump is communicated with suction port 114 by first passage 111.Exemplarily, driving part 140 can be cylinder, electric push rod or telescopic motor.First passage 111 is cylindrical, second passage 112 is circular cylindrical, and first passage 111 and second passage 112 are concentric circles.The central axis of ejector pin 130 coincides with the central axis of first passage 111 and second passage 112.Nested design of first passage 111 and second passage 112 can provide more definite airflow guide path.In this structure, air vent 113 is communicated with second passage 112, and first passage 111 is communicated with puncture port 115.It is favorable to accurately position the suction position of blue film, to improve the use efficiency of airflow.In addition, it is also helpful to isolate the airflow in second passage 112 and ejector pin 130 in first passage 111, to avoid mutual influence.
[0033] Please refer to Figure 4 And Figure 5 Vacuum pump is communicated with second passage 112 by air vent 113, and driving part 140 is used to drive ejector pin 130 to move along Z axis direction.Linear bearing 120 has the characteristics of high precision, can provide accurate positioning and guiding effect for the process that ejector pin 130 slides up and down, can reduce the friction between ejector pin 130 and linear bearing 120, is favorable to reduce the wear of ejector pin 130, prolongs the service life of ejector pin 130.Working principle of ejector pin module 100: wafer is pasted on blue film, when needing to take wafer, vacuum pump starts, suction port 114 adsorbs blue film, so that blue film is fixed, driving part 140 drives ejector pin 130 to rise and makes ejector pin 130 pass through puncture port 115, to eject wafer to make wafer separate from blue film.In addition, it needs to be explained that when ejector pin module 100 works, vacuum pump is always in working state, that is to say, there is always suction force in second passage 112.
[0034] Please refer to Figure 4 And Figure 5The top pin module 100 in the embodiment has the first channel 111 and the second channel 112, and the first channel 111 is nested in the second channel 112, that is, the first channel 111 and the second channel 112 are independently arranged, so that the air pressure in the second channel 112 is not affected by the top pin 130, and the area of the blue film adsorbed by the second channel 112 is controlled, and the effect of the top pin module 100 on the blue film adsorption is further improved. In addition, the top pin module 100 of the present application is provided with a linear bearing 120 in the first channel 111, which is beneficial to improve the precision of the top pin 130 in the sliding process, so as to further improve the accuracy of the top pin 130 in ejecting the wafer.
[0035] Please refer to Figure 4 and Figure 5 In a possible implementation, the top pin module 100 further comprises a first sealing ring 150 and a second sealing ring 160. The first sealing ring 150 is arranged near the air inlet 113, and the second sealing ring 160 is arranged between the top pin 130 and the first channel 111. The first sealing ring 150 and the second sealing ring 160 are arranged to improve the sealing performance of the top pin module 100 and prevent gas leakage. This is beneficial to maintain the sealing state between the vacuum pump and the adsorption port 114 and ensure the stability and reliability of the adsorption force. In addition, the first sealing ring 150 and the second sealing ring 160 can maintain the stability of the air pressure in the second channel 112. In addition, the sealing ring can prevent external pollutants from entering the inside of the top pin module 100, keep the inside clean, and avoid equipment failure or performance decline caused by pollution.
[0036] Please refer to Figure 4 and Figure 5 In a possible implementation, the top pin module 100 further comprises a resilient member 170 abutting between the housing 110 and the top pin 130. The resilient member 170 is arranged as a compression spring. When the top pin 130 does not slide, the top pin 130 is in the initial position, and at this time the resilient member 170 is not stressed. When the top pin 130 needs to slide, the driving member 140 is started to push the top pin 130 to slide upward, and at this time the resilient member 170 is compressed and stressed. When the external force applied by the driving member 140 to the top pin 130 is removed, the top pin 130 returns to the initial position under the action of the resilient member 170.
[0037] Please refer to Figure 4 and Figure 5In a possible implementation, the shell 110 comprises an upper abutment 116, the ejector pin 130 is formed with a lower abutment 131, the elastic member 170 is abutted between the upper abutment 116 and the lower abutment 131, and the second sealing ring 160 is assembled on the shell 110 through the upper abutment 116. Exemplarily, the upper abutment 116 and the lower abutment 131 are both configured as grooves for placing the elastic member 170.
[0038] In a possible implementation, the length of the ejector pin 130 is L1, and the length of the linear bearing 120 is L2, and the length L2 of the linear bearing 120 is in a range of [0.3L1, 0.5L1]. Exemplarily, the linear bearing 120 is a guide rail for the sliding of the ejector pin 130, and the length L2 directly affects the stability of the movement of the ejector pin 130. If L2 is too short, it may not provide sufficient support, resulting in deviation or vibration of the ejector pin 130 during movement; if L2 is too long, it may increase the volume and weight of the ejector pin module 100, affecting its flexibility and response speed. By limiting L2 to a certain proportion of L1, the stability of the movement of the ejector pin 130 can be ensured, and the volume and weight of the ejector pin module 100 can be controlled to be within a reasonable range, so as to facilitate integration into a semiconductor production device.
[0039] Please refer to Figure 2 and Figure 3 In a possible implementation, a plurality of suction ports 114 are provided, and the plurality of suction ports 114 are uniformly distributed in a circle with the center of the puncture port 115. Exemplarily, the plurality of suction ports 114 are uniformly distributed in the second channel 112, so that the airflow is uniformly distributed between the suction ports 114, providing uniform suction force, which is conducive to ensuring the stability and uniformity of the wafer during the ejecting process.
[0040] Please refer to Figure 2 and Figure 3 In a possible implementation, the centers of the plurality of suction ports 114 are connected to form an outer circle, the diameter of the outer circle is D1, and the diameter of the puncture port 115 is D2, and the diameter D2 of the puncture port 115 is in a range of [0.4D1, 0.5D1]. Exemplarily, the proportional relationship between the diameter D2 of the puncture port 115 and the diameter D1 of the outer circle (formed by connecting the centers of the plurality of suction ports 114) can affect the distribution of the suction force. By limiting D2 to a certain proportion of D1, it can be ensured that the suction force is uniformly distributed on the wafer, thereby improving the effect of the ejector pin module 100 in suctioning the blue film.
[0041] Please refer to Figure 1 and Figure 4In a possible implementation, the ejector module 100 further comprises a position adjustment assembly 180 connected with the housing 110 to adjust the position of the ejector pin 130. The position adjustment assembly 180 allows accurate adjustment of the position of the ejector pin 130, which facilitates accurate ejection of the wafer from the blue film.
[0042] For example, Figure 1 and Figure 4 In a possible implementation, the position adjustment assembly 180 comprises an X-axis adjustment component 181 and a Y-axis adjustment component 182, the X-axis adjustment component 181 is connected with the Y-axis adjustment component 182, the housing 110 is connected with the Y-axis adjustment component 182, the X-axis adjustment component 181 is used to drive the Y-axis adjustment component 182 and the housing 110 to move along the X-axis direction, the Y-axis adjustment component 182 is used to drive the housing 110 and the ejector pin 130 to move along the Y-axis direction, the ejector pin 130 can slide along the Z-axis direction, and the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other. For example, through the X-axis adjustment component 181 and the Y-axis adjustment component 182, the ejector module 100 can move along the X-axis and the Y-axis directions, which increases the flexibility of the device and makes it adapt to the ejection requirements of wafers in different positions.
[0043] For example, Figure 4 and Figure 5 In a possible implementation, the driving member 140 is configured to be spaced apart from the ejector pin 130 when the ejector pin 130 does not move, and abut against the ejector pin 130 when the ejector pin 130 moves. For example, on the one hand, when the ejector pin 130 does not move, the driving member 140 is kept spaced apart from the ejector pin 130, which can reduce the contact between the two, thereby reducing the wear caused by the contact friction and prolonging the service life of the two. On the other hand, since the driving member 140 does not contact the ejector pin 130 in the non-working state, the starting resistance of the system can be reduced, and when the ejector pin 130 needs to move, the driving member 140 can respond and push the ejector pin 130 faster, thereby improving the response speed of the system.
[0044] The above-described embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.
Claims
1. A ejector module for ejecting a wafer from a blue film, characterized in that, include: The shell includes a first channel, a second channel, a vent, an adsorption port, and a puncture port. The first channel is nested within the second channel. The vent and the adsorption port are both connected to the second channel, and the puncture port is connected to the first channel. A linear bearing is disposed within the first channel; The ejector pin is slidably disposed within the linear bearing; A driving component is disposed within the housing and spaced apart from the ejector pin, for driving the ejector pin to reciprocate along a straight line; A vacuum pump is connected to the adsorption port through the first channel.
2. The ejector pin module according to claim 1, characterized in that, The ejector pin module also includes a first sealing ring and a second sealing ring. The first sealing ring is located near the vent, and the second sealing ring is located between the ejector pin and the first channel.
3. The ejector pin module according to claim 2, characterized in that, The ejector pin module also includes an elastic element that abuts against the housing and the ejector pin.
4. The ejector pin module according to claim 3, characterized in that, The housing includes an upper abutment portion, the ejector pin has a lower abutment portion, the elastic element abuts between the upper abutment portion and the lower abutment portion, and the second sealing ring is assembled onto the housing through the upper abutment portion.
5. The ejector pin module according to claim 1, characterized in that, Let the length of the ejector pin be L1 and the length of the linear bearing be L2. Then the value range of the linear bearing length L2 is [0.3L1, 0.5L1].
6. The ejector pin module according to claim 1, characterized in that, The adsorption port is provided in multiple ways, and the multiple adsorption ports are evenly distributed in a circle with the center of the puncture port.
7. The ejector pin module according to claim 6, characterized in that, The centers of multiple adsorption ports are connected to form an outer ring. Let the diameter of the outer ring be D1 and the diameter of the puncture port be D2. Then the value range of the puncture port diameter D2 is [0.4D1, 0.5D1].
8. The ejector pin module according to claim 1, characterized in that, The ejector pin module also includes a position adjustment component, which is connected to the housing to adjust the position of the ejector pin.
9. The ejector pin module according to claim 8, characterized in that, The position adjustment assembly includes an X-axis adjustment component and a Y-axis adjustment component. The X-axis adjustment component is connected to the Y-axis adjustment component, and the housing is connected to the Y-axis adjustment component. The X-axis adjustment component is used to drive the Y-axis adjustment component and the housing to move along the X-axis direction, and the Y-axis adjustment component is used to drive the housing and the ejector pin to move along the Y-axis direction. The ejector pin can slide along the Z-axis direction, and the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other.
10. The ejector pin module according to claim 1, characterized in that, The driving member is configured such that when the ejector pin is not moving, the driving member is spaced apart from the ejector pin, and when the ejector pin moves, the driving member abuts against the ejector pin.