Quick-cooling reflow soldering furnace

Abstract

The utility model provides a fast cooling reflow soldering furnace, which comprises a furnace body, a transmission mesh belt, an upper heating device, a lower heating device and a first cooling device are arranged in the furnace body, a feed port and a discharge port are respectively arranged at two ends of the furnace body, the transmission mesh belt extends from the feed port to the discharge port, the upper heating device is arranged on the upper side of the transmission mesh belt, and the lower heating device is arranged on the lower side of the transmission mesh belt. The lower heating device is arranged on the lower side of the conveying mesh belt. The first cooling device is arranged on the side, close to the discharging port, of the upper heating device and arranged on the upper side of the conveying mesh belt. The first cooling device comprises a cooling box body, a condenser is arranged in the cooling box body, an air outlet hole is formed in the lower side of the cooling box body, and a fan is connected to the top of the cooling box body. According to the utility model, the circuit board is rapidly cooled, welding spots are rapidly solidified, internal stress is reduced, deformation of the circuit board is avoided, production efficiency is improved, and scalding caused by over-high temperature of the circuit board is avoided.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the electronic manufacturing technical field, concretely relates to a reflow soldering furnace of quick cooling. BACKGROUND

[0002] In the electronic manufacturing industry, in order to make component and circuit board pad connection firm, need to use reflow soldering furnace, its core function is through heating and make the solder paste pre-coated on circuit board pad heat melting, connect component pin or solder end with circuit board pad, form reliable solder joint. The reflow soldering furnace is usually divided into multiple temperature zones, including preheating, heat preservation, reflow, cooling. The original reflow soldering furnace uses fan to introduce external cold air into the furnace, directly blows circuit board surface, accelerates heat dissipation. This kind of mode, the cooling speed is slow, and the circuit board temperature is still above 100 DEG C when discharging, and thin circuit board is prone to deformation in high temperature for a long time, needs to increase cooling process additionally, influences production efficiency, and is prone to personal injury.

[0003] Therefore, the above problems need to be solved. INVENTION CONTENTS

[0004] The utility model discloses a reflow soldering furnace of quick cooling, which can quickly cool the circuit board, quickly solidify the solder joint, reduce the brittleness of the solder joint, improve the mechanical strength, avoid deformation, and improve the production efficiency.

[0005] Technical scheme: in order to realize the above object, the utility model provides a reflow soldering furnace of quick cooling, including furnace body, be equipped with transmission mesh belt, upper heating device, lower heating device, first cooling device in the furnace body, the both ends of furnace body are equipped with feeding port and discharge port, and the transmission mesh belt is set up from the feeding port to the discharge port, and the upper heating device is set on the upside of transmission mesh belt, and the lower heating device is set on the downside of transmission mesh belt. The first cooling device is arranged on the side of the upper heating device close to the discharge port, and the first cooling device is arranged on the upside of the transmission mesh belt. The first cooling device includes cooling box body, is equipped with condenser in the cooling box body, is equipped with air outlet hole on the downside of cooling box body, and the fan is connected with the air inlet on the top of cooling box body, and the fan sends air to the condenser from the air inlet. The upper heating device and the lower heating device are respectively combined with heating pipe and hot air machine, and the two work together to form the convection hot air, realize uniform heating. The furnace body is divided into preheating zone, heat preservation zone, welding zone and cooling zone along the transmission mesh belt, and this part structure adopts the design of conventional reflow soldering furnace. The transmission mesh belt uses chain to drive metal mesh transmission, and meets the transmission demand of different size circuit boards.

[0006] The utility model is used for circuit board reflow soldering, and circuit boards are placed on the upper side of a transmission mesh belt, the transmission mesh belt sends the circuit boards into the furnace body from a feeding port and conveys them to the side of a discharging port, the upper heating device and the lower heating device heat the circuit boards on the transmission mesh belt at the same time, the circuit boards pass through a preheating zone, a heat preservation zone and a welding zone in turn, and finally pass through a first cooling device, so that the circuit boards are rapidly cooled to about 60 DEG C, the solder joints are rapidly solidified, the brittleness of the solder joints is reduced, the mechanical strength is improved, uneven shrinkage of the circuit boards is avoided, stress is reduced, deformation is avoided, production efficiency is improved, and scalding caused by excessively high temperature of the circuit boards can be avoided.

[0007] Further, in the rapid cooling reflow soldering furnace, the condenser comprises a shell, the shell is provided with a baffle in a drawer shape at one end, the shell is connected to the cooling box, a fin module and a condenser pipe are connected in the shell, the condenser pipe is coiled in the fin module in a snakelike manner, and the two ends of the condenser pipe are connected to the baffle and a water cooler. The fin module is composed of a series of heat dissipation fins. The water cooler injects cooling water into the condenser pipe to take away the heat of the condenser pipe. The fin module absorbs heat in the air and transmits the heat to the condenser pipe to achieve cooling. The fan blows the cooled air around the fin module to the surface of the circuit board to rapidly cool the surface of the circuit board, thereby rapidly cooling the circuit board and improving production efficiency.

[0008] Further, in the rapid cooling reflow soldering furnace, a filter screen is connected to the upper side of the fin module. The air sucked by the fan is filtered by the filter screen to prevent dust, metal debris or flux residues in the air from entering the condenser, so that the fin module is not attached to the fin module, the fin module is not eroded, the heat exchange efficiency of the fin is not affected, the service life is prolonged, the surface of the circuit board is not polluted, and the yield is improved.

[0009] Further, in the rapid cooling reflow soldering furnace, a pressing strip is arranged on the side of the baffle away from the shell, the pressing strip is connected to the lug provided on the side wall of the cooling box, a hand screw bolt is threadedly connected to the pressing strip, and the hand screw bolt abuts against the baffle through the pressing strip. The lug on the side wall of the cooling box is a square plate provided with an opening, and the lug is welded to the side wall of the cooling box. The pressing strip is long strip-shaped, and the two ends of the pressing strip are connected to the openings of the lugs, respectively. The hand screw bolt is adjusted to press the baffle, so that the baffle is tightly attached to the side wall of the cooling box, the structure of the first cooling device is compact, external air is prevented from entering the condenser, the pollution of the condenser is reduced, and the cooling effect is ensured.

[0010] Further, in the rapid cooling reflow soldering furnace, one or more condensers are arranged, and the fan and the condenser are arranged correspondingly. One or more condensers increase the flow of cooling water, improve the cooling effect, and improve the production efficiency.

[0011] Further, the rapid cooling reflow soldering furnace has the following beneficial effects: the rapid cooling reflow soldering furnace is capable of rapidly cooling the circuit board to about 0 DEG C through the first cooling device, rapidly solidifying the soldering points, reducing the brittleness of the soldering points, improving the mechanical strength, avoiding deformation, improving the production efficiency, and avoiding scalding caused by the high temperature of the circuit board.

[0012] Further, the rapid cooling reflow soldering furnace has the following beneficial effects: the rapid cooling reflow soldering furnace is capable of rapidly cooling the circuit board to about 0 DEG C through the first cooling device, rapidly solidifying the soldering points, reducing the brittleness of the soldering points, improving the mechanical strength, avoiding deformation, improving the production efficiency, and avoiding scalding caused by the high temperature of the circuit board.

[0013] Further, the rapid cooling reflow soldering furnace has the following beneficial effects: the rapid cooling reflow soldering furnace is capable of rapidly cooling the circuit board to about 0 DEG C through the first cooling device, rapidly solidifying the soldering points, reducing the brittleness of the soldering points, improving the mechanical strength, avoiding deformation, improving the production efficiency, and avoiding scalding caused by the high temperature of the circuit board.

[0014] The technical scheme can achieve the following beneficial effects: the rapid cooling reflow soldering furnace is capable of rapidly cooling the circuit board to about 0 DEG C through the first cooling device, rapidly solidifying the soldering points, reducing the brittleness of the soldering points, improving the mechanical strength, avoiding deformation, improving the production efficiency, and avoiding scalding caused by the high temperature of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 Fig. 1 is a structural schematic view of the rapid cooling reflow soldering furnace;

[0016] Figure 2 Fig. 2 is a sectional view of the rapid cooling reflow soldering furnace;

[0017] Figure 3 Fig. 4 is a side view of the first cooling device;

[0018] Figure 4 Fig. 6 is a structural schematic view of the condenser;

[0019] Figure 5 is a side view of the furnace cover;

[0020] Figure 6 is an exploded view of the second cooling device.

[0021] In the figure: 1, furnace body, 11, feeding port, 12, discharging port, 13, furnace cover, 131, main furnace cover, 132, auxiliary furnace cover, 3, upper heating device, 4, lower heating device, 5, first cooling device, 51, cooling box, 511, air outlet hole, 52, condenser, 521, shell, 522, fin module, 523, condensing pipe, 524, baffle, 526, pressing strip, 527, hand screw bolt, 53, fan, 6, second cooling device, 61, air inlet cover, 62, fan. DETAILED DESCRIPTION

[0022] Example 1

[0023] As Figures 1-3 shown in a rapid cooling reflow soldering furnace, including furnace body 1, the furnace body 1 is provided with transmission mesh belt, upper heating device 3, lower heating device 4, first cooling device 5, the furnace body 1 both ends are respectively provided with feeding port 11 and discharging port 12, the transmission mesh belt extends from feeding port 11 to discharging port 12, the upper heating device 3 is arranged on the upper side of the transmission mesh belt, the lower heating device 4 is arranged on the lower side of the transmission mesh belt. The first cooling device 5 is arranged on the side of the upper heating device 3 close to the discharging port 12, and the first cooling device 5 is arranged on the upper side of the transmission mesh belt 2. The first cooling device 5 includes a cooling box 51, the cooling box 51 is provided with a condenser 52, the lower side of the cooling box 51 is provided with an air outlet hole 511, the top of the cooling box 51 is connected with a fan 53, the fan 53 sends air to the condenser 52 from the air inlet provided on the top of the cooling box 51. The condenser 52 is provided with two or more, and the fan 53 and the condenser 52 are correspondingly arranged.

[0024] In this embodiment, the upper heating device 3 and the lower heating device 4 are respectively combined with heating pipe and air heater, which work together to form convective hot air and realize uniform heating. The furnace body 1 is divided into preheating zone, holding zone, welding zone and cooling zone along the transmission mesh belt, and this part of structure adopts the design of conventional reflow soldering furnace. The transmission mesh belt uses chain to drive metal mesh, and the circuit board is placed on the surface of the metal mesh, the metal mesh drives the transmission of the circuit board, which meets the transmission demand of circuit boards of different sizes.

[0025] As Figures 3-4The rapidly cooling reflow oven shown includes a condenser 52 comprising a housing 521. One end of the housing 521 has a drawer-shaped baffle 524. The housing 521 is connected to a cooling box 51. A fin module 522 and a condenser tube 523 are connected inside the housing 521. The condenser tube 523 is coiled in a serpentine pattern within the fin module 522, with its ends extending through the baffle 524 and connected to a chiller. The fin module 522 consists of a series of heat dissipation fins. The chiller injects cooling water into the condenser tube 523, carrying away heat from the condenser tube 523. The fin module 522 absorbs heat from the air and transfers it to the condenser tube 523, achieving cooling. A fan 53 blows the cooled air around the fin module 522 onto the circuit board surface for rapid cooling. A filter screen is connected inside the housing 521 and attached to the upper side of the fin module 522. The air drawn by the fan 53 is filtered through a filter screen to prevent dust, metal shavings, flux residue, or other particulate matter in the air from entering the condenser 52.

[0026] In this embodiment, a pressure strip 526 is provided on the side of the baffle 524 away from the housing 521. The pressure strip 526 is connected to a hanging lug provided on the side wall of the cooling box 51. A hand-tightening bolt 527 is threaded onto the pressure strip 526, and the hand-tightening bolt 527 passes through the pressure strip 526 and abuts against the baffle 524. The hanging lug on the side wall of the cooling box 51 is a square plate with an opening, which is welded to the side wall of the cooling box 51. The pressure strip 526 is long and narrow, with both ends connected to the openings of the hanging lug. By adjusting the hand-tightening bolt 527, the hand-tightening bolt 527 is pressed against the baffle 524 to ensure that the baffle 524 is against the side wall of the cooling box 51.

[0027] like Figure 5 The rapidly cooling reflow oven shown has a furnace cover 13 on top of the furnace body 1, with one side of the furnace cover 13 hinged to the furnace body 1. The furnace cover 13 includes a main furnace cover 131 and a secondary furnace cover 132. The main furnace cover 131 is set along the furnace body 1 and has a notch at one end near the first cooling device 5. The secondary furnace cover 132 is located within the notch of the main furnace cover 131, and one side of the secondary furnace cover 132 is hinged to the main furnace cover 131. The secondary furnace cover 132 is located on one side of the first cooling device 5. Opening the secondary furnace cover 132 can provide a targeted maintenance channel for the first cooling device 5. Combined with the drawer-shaped condenser 52, the condenser can be quickly inspected and repaired, shortening the troubleshooting time.

[0028] This invention is used for reflow soldering of circuit boards. The circuit board is placed on the upper side of the conveyor belt, which feeds the circuit board into the furnace body 1 from the feed port 11 and transports it to the discharge port 12. The upper heating device 3 and the lower heating device 4 simultaneously heat the circuit board on the conveyor belt. The circuit board passes through the preheating zone, the heat preservation zone, and the soldering zone in sequence. After passing through the first cooling device 5, the circuit board is rapidly cooled to about 60°C, which allows the solder joints to solidify quickly, reduces the brittleness of the solder joints, and avoids burns caused by excessively high circuit board temperatures.

[0029] Example 2

[0030] The difference between this embodiment and Embodiment 1 is that, Figure 1 The rapidly cooling reflow oven shown has a first cooling device 5 with a second cooling device 6 installed near the discharge port 12. The second cooling device 6 is mounted on the upper side of the conveyor belt. Figure 2 The rapidly cooling reflow oven shown includes a second cooling device 6 comprising an air inlet hood 61 with an opening at the top. A fan 62 is installed inside the air inlet hood 61 and is connected to the oven body 1 via a bracket. The fan 62 is arranged along the bracket array. After the circuit board is cooled by the first cooling device 5, it passes through the second cooling device 6. The fan 62 of the second cooling device 6 blows indoor air onto the surface of the circuit board, providing a secondary cooling effect.

[0031] The above embodiments are exemplary and are intended to illustrate the technical concept and features of this utility model, so that those skilled in the art can understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the scope of protection of this utility model.

Claims

1. A rapid cooling reflow oven, characterized in that: The furnace includes a furnace body (1), which contains a conveyor belt, an upper heating device (3), a lower heating device (4), and a first cooling device (5). The furnace body (1) has a feeding port (11) and a discharge port (12) at both ends. The conveyor belt extends from the feeding port (11) to the discharge port (12). The upper heating device (3) is located on the upper side of the conveyor belt, and the lower heating device (4) is located on the lower side of the conveyor belt. The first cooling device (5) is located on the upper heating device. The device (3) is located near the discharge port (12). The first cooling device (5) is located on the upper side of the conveyor belt. The first cooling device (5) includes a cooling box (51), a condenser (52) is provided inside the cooling box (51), an air outlet (511) is provided on the lower side of the cooling box (51), and a fan (53) is connected to the top of the cooling box (51). The fan (53) sends air to the condenser (52) from the air inlet provided on the top of the cooling box (51).

2. The rapid cooling reflow oven according to claim 1, characterized in that: The condenser (52) includes a housing (521), one end of which is provided with a baffle (524) in the shape of a drawer. The housing (521) is connected to the cooling box (51). A fin module (522) and a condenser tube (523) are connected inside the housing (521). The condenser tube (523) is coiled in a serpentine shape inside the fin module (522). The two ends of the condenser tube (523) pass through the baffle (524) and are connected to the chiller.

3. The rapid cooling reflow oven according to claim 2, characterized in that: A filter screen is connected inside the housing (521), and the filter screen is connected to the upper side of the fin module (522).

4. The rapid cooling reflow oven according to claim 2, characterized in that: A pressure strip (526) is provided on the side of the baffle (524) away from the shell (521). The pressure strip (526) is connected to the hanging ear provided on the side wall of the cooling box (51). A hand-tightening bolt (527) is threaded on the pressure strip (526). The hand-tightening bolt (527) passes through the pressure strip (526) and abuts against the baffle (524).

5. The rapid cooling reflow oven according to claim 1, characterized in that: The condenser (52) is provided in two or more units, and the fan (53) is provided in correspondence with the condenser (52).

6. The rapid cooling reflow oven according to claim 1, characterized in that: The furnace body (1) is provided with a furnace cover (13) on the top, and one side of the furnace cover (13) is hinged to the furnace body (1).

7. The rapid cooling reflow oven according to claim 6, characterized in that: The furnace cover (13) includes a main furnace cover (131) and a secondary furnace cover (132). The main furnace cover (131) is set along the furnace body (1). The main furnace cover (131) has a notch at one end near the first cooling device (5). The secondary furnace cover (132) is set inside the notch of the main furnace cover (131). The secondary furnace cover (132) is hinged to the main furnace cover (131) on one side.

8. The rapid cooling reflow oven according to claim 1, characterized in that: The first cooling device (5) is provided with a second cooling device (6) on the side near the discharge port (12). The second cooling device (6) is mounted on the upper side of the conveyor belt. The second cooling device (6) includes an air inlet hood (61), the upper end of which is open. A fan (62) is provided inside the air inlet hood (61). The fan (62) is connected to the furnace body (1) through a bracket. The fan (62) is arranged along the bracket array.

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