Tinning mechanism

Abstract

The utility model relates to the technical field of tin material processing, in particular to a tinning mechanism which comprises an installation frame, a conveying mechanism and a tin soldering assembly, a feeding support and a discharging support are oppositely arranged at the two ends of the installation frame, and the feeding support and the discharging support are oppositely arranged; the conveying mechanism is connected to the feeding support and the discharging support, the height of the conveying mechanism is gradually increased in the conveying direction of the conveying mechanism, a cooling assembly is arranged at the end, close to the discharging support, of the conveying mechanism, and a preheating assembly is arranged at the end, away from the discharging support, of the conveying mechanism. The tin soldering assembly is connected to the end face, facing the conveying mechanism, of the mounting frame, the tin soldering assembly penetrates through the conveying mechanism, and the preheating assembly and the cooling assembly wrap the outer edge of the tin soldering assembly. The utility model aims to improve the working efficiency of soldering tin.

Description

TECHNICAL FIELD

[0001] The utility model relates to tin material processing technical field, especially a kind of tin feeding mechanism. BACKGROUND

[0002] PCB board often needs to be soldered for its surface in production, and the traditional soldering method generally controls welding head through mechanical arm, uses the detector set on welding head, cooperates control system, and is soldered for the specified position on PCB board with the help of mechanical arm, and the soldering method needs mechanical arm to repeatedly position, although the accuracy is improved, but it cannot improve production efficiency in the process of mass production.

[0003] In the related art, the tin feeding mechanism is provided with a tin pool, two groups of transmission tracks are oppositely arranged at the periphery of the tin pool, and a mechanical arm is drivingly connected in the middle of the transmission tracks. By loading the PCB board into the tin water contact box, the mechanical arm grabs the contact box. When the PCB board is above the tin water, the contact box is lowered. The contact box is specially customized. By setting an opening on the position of the PCB board that needs to be soldered, the tin water will solder the specified position of the PCB board along the opening. However, because the mechanical arm needs to be frequently raised and lowered, and the transmission tracks cannot work normally when the mechanical arm moves up and down, the soldering efficiency needs to be improved. SUMMARY

[0004] The main purpose of the present utility model is to provide a tin feeding mechanism to improve the working efficiency of soldering.

[0005] To achieve the above-mentioned purpose, the utility model provides a tin feeding mechanism, which comprises a mounting frame, a transmission mechanism and a soldering assembly.

[0006] The two ends of the mounting frame are oppositely provided with a feeding support and a discharging support, and the feeding support and the discharging support are oppositely arranged.

[0007] The transmission mechanism is connected to the feeding support and the discharging support. The height of the transmission mechanism gradually rises along the transmission direction of the transmission mechanism. The end of the transmission mechanism close to the discharging support is provided with a cooling assembly, and the end of the transmission mechanism away from the discharging support is provided with a preheating assembly.

[0008] The soldering assembly is connected to the end surface of the mounting frame facing the transmission mechanism. The soldering assembly is arranged in the transmission mechanism. The preheating assembly and the cooling assembly are wrapped around the outer edge of the soldering assembly.

[0009] In an embodiment of the present application, the soldering assembly comprises a tin pool and a spraying mechanism.

[0010] The tin pool is provided with a heating part and is located below the transmission mechanism.

[0011] The injection mechanism is arranged in the transmission mechanism, the injection mechanism is communicated with the tin water pool, the tin water pool is wrapped around the injection mechanism, the injection mechanism is communicated with the pressure pump, and the pressure pump is connected to the outer wall of the tin water pool.

[0012] In an embodiment of the present application, the injection mechanism comprises a rough soldering assembly and a fine soldering assembly, the rough soldering assembly and the fine soldering assembly are arranged in parallel and spaced apart, and are sequentially arranged along the extension direction of the transmission mechanism, and the height of the fine soldering assembly is higher than that of the rough soldering assembly.

[0013] In an embodiment of the present application, the rough soldering assembly comprises a tin water supply roller and a liquid suction pipe, the tin water supply roller is arranged in the transmission mechanism, and a plurality of liquid outlet holes are arranged in the transmission mechanism and face the transmission mechanism, one end of the liquid suction pipe is communicated with the supply roller, the other end is connected to the pressure pump, and the liquid suction pipe is provided with a liquid suction hole close to the end face of the bottom of the tin water pool.

[0014] In an embodiment of the present application, the fine soldering assembly is provided with a fine soldering platform facing the transmission mechanism, the fine soldering platform is arranged in the transmission mechanism, a plurality of liquid outlet holes are arranged on the fine soldering platform, the bottom end of the fine soldering assembly is provided with a liquid suction part and is communicated with the pressure pump.

[0015] In an embodiment of the present application, the transmission mechanism comprises two parallel and spaced apart transmission tracks, a clamping assembly is arranged between the two transmission tracks, and the bottom edge of the clamping assembly is wrapped around the soldering tin assembly.

[0016] In an embodiment of the present application, two outer walls of the transmission tracks are oppositely provided with two groups of connecting rods, the preheating assembly is provided with a plurality of groups, and the plurality of groups of the preheating assembly are uniformly connected to the two connecting rods.

[0017] The utility model discloses technical scheme is through setting the unloading support and the feeding support of high and low on the mounting bracket to install the transmission mechanism, and the unloading support and the feeding support are opposite and set in the both ends of mounting bracket, and the transmission mechanism can gradually ascend along its working direction with the help of two supports, and the soldering assembly is set below the transmission mechanism, and at least part soldering assembly is set in the transmission mechanism, and the soldering assembly is filled with tin water, and the part of the bottom end of transmission mechanism is the liquid level lifting structure, can make the tin water contact the PCB board contact box clamped by the transmission mechanism, and the transmission mechanism can make the PCB board contact the tin water and solder in the process of transportation, and setting lifting structure can send the tin water to the position of PCB board, can make the transmission mechanism can be far away from the tin water, avoid the tin water damage transmission mechanism, and the transmission mechanism is connected with cooling assembly and preheating assembly, and two components are set respectively in the both sides of soldering assembly, and preheating assembly is close to the feeding support setting, and cooling assembly is close to the unloading support setting, and preheating assembly can preheat for the PCB board, improve soldering effect, and cooling assembly can make the tin water cool down quickly, and can conveniently take out the PCB board, and the whole equipment does not need repeatedly positioning, and the transmission mechanism does not need to stop because of needing soldering, can full power operation, can effectively improve the efficiency of soldering, and avoid damaging transmission mechanism. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme in the embodiment of the utility model or prior art, the following will briefly introduce the drawing needed to be used in the embodiment or prior art description, and obviously, the drawing in the following description is only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to the structure shown in these drawings without paying creative labor.

[0019] Figure 1 It is the structural schematic diagram of the embodiment of the utility model soldering mechanism;

[0020] Figure 2 It is the front view of the embodiment of the utility model soldering mechanism;

[0021] Figure 3 It is the structural schematic diagram of the soldering assembly of the embodiment of the utility model soldering mechanism.

[0022] EXPLANATION OF DRAWINGS:

[0023] 1, mounting frame; 11, feeding support; 12, discharging support; 2, transmission mechanism; 21, transmission track; 22, clamping assembly; 23, connecting rod; 24, cooling assembly; 25, preheating assembly; 3, soldering assembly; 31, tin pool; 4, spraying mechanism; 41, pressure pump; 42, rough soldering assembly; 421, tin water supply roller; 422, liquid outlet hole; 423, liquid suction pipe; 424, liquid suction hole; 43, fine soldering assembly; 431, fine soldering platform; 432, liquid outlet; 433, liquid suction part.

[0024] The realization, functional features and advantages of the utility model will be further explained in combination with embodiments and with reference to the drawings. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0026] Reference Figures 1 to 3 In an embodiment of the utility model, a tin feeding mechanism is provided, which comprises a mounting frame 1, a transmission mechanism 2 and a soldering assembly 3. The mounting frame 1 is provided with a feeding support 11 and a discharging support 12 at opposite ends. The feeding support 11 and the discharging support 12 are arranged oppositely. The transmission mechanism 2 is connected to the feeding support 11 and the discharging support 12. The height of the transmission mechanism 2 gradually increases along the transmission direction of the transmission mechanism 2. The transmission mechanism 2 is provided with a cooling assembly 24 at one end close to the discharging support 12. The transmission mechanism 2 is provided with a preheating assembly 25 at one end away from the discharging support 12. The soldering assembly 3 is connected to the end face of the mounting frame 1 facing the transmission mechanism 2. The soldering assembly 3 is arranged through the transmission mechanism 2. The preheating assembly 25 and the cooling assembly 24 are wrapped around the outer edge of the soldering assembly 3.

[0027] In the tin installation mechanism of the present application, a high and low discharging support 12 and a feeding support 11 are arranged on the mounting frame 1 to install the transmission mechanism 2, the discharging support 12 and the feeding support 11 are oppositely arranged at the two end portions of the mounting frame 1, the transmission mechanism 2 can gradually rise along its working direction with the help of the two supports, the soldering assembly 3 is arranged below the transmission mechanism 2, and at least part of the soldering assembly 3 is arranged in the transmission mechanism 2, the soldering assembly 3 is filled with tin water, the part arranged in the bottom end of the transmission mechanism 2 is a liquid level lifting structure, which can make the tin water contact the PCB contact box clamped by the transmission mechanism 2, the transmission mechanism 2 rises along the transmission direction, which can make the PCB contact the tin water for soldering during transportation, the lifting structure can send the tin water to the position of the PCB, which can make the transmission mechanism 2 away from the tin water to avoid damaging the transmission mechanism 2, and the transmission mechanism 2 is connected with a cooling assembly 24 and a preheating assembly 25, the two assemblies are arranged at the two side edges of the soldering assembly 3 respectively, the preheating assembly 25 is arranged close to the feeding support 11, and the cooling assembly 24 is arranged close to the discharging support 12, the preheating assembly 25 can preheat the PCB to improve the soldering effect, and the cooling assembly 24 can quickly cool the tin water, which can facilitate taking out the PCB, the whole device does not need to be positioned repeatedly, the transmission mechanism 2 does not need to stop for soldering, and can work at full power, which can effectively improve the soldering efficiency and avoid damaging the transmission mechanism 2.

[0028] Further, the transmission mechanism 2 includes two parallel and spaced transmission tracks 21, and a clamping assembly 22 is oppositely arranged between the two transmission tracks 21, which can clamp the PCB contact box, the PCB contact box is fixedly installed with the PCB to be soldered, and a plurality of through holes are oppositely arranged at the bottom edge of the PCB contact box at the position where the PCB needs to be soldered, so that when the PCB contact box carries the PCB to contact the tin water, the tin water will solder the PCB through the through holes, two connecting rods 23 are arranged at the outer edges of the two opposite transmission mechanisms 2, the preheating assembly 25 is slidingly / rotatably connected to the connecting rod 23, the preheating assembly 25 can be provided in multiple groups, the multiple groups of preheating assemblies 25 are uniformly connected together, and the multiple groups of uninterrupted preheating assemblies 25 can improve the preheating effect of the PCB, and the preheating assemblies 25 at different positions can be arranged along the direction close to the soldering assembly 3, the preheating assembly 25 close to the tin pool 31 has a higher temperature, the preheating effect is improved through the stepped preheating mode, and the quality of the finished product after soldering is improved, after the PCB passes through the soldering assembly 3, the PCB enters the cooling assembly 24, the cooling assembly 24 can cool the PCB through air cooling, which can improve the solidification efficiency of the tin water and facilitate taking out the PCB.

[0029] Further, the soldering assembly 3 comprises a tin pool 31 and a spraying mechanism 4, the tin pool 31 is provided with a heating part, and the tin is kept in the tin water state by the heating pipe and the like, so that the soldering is facilitated, the tin pool 31 and the tin water level are all below the PCB contact box, so that the transmission mechanism 2 is away from the tin water, and the transmission mechanism 2 is prevented from being burnt by the tin water, the spraying mechanism 4 can locally raise the liquid level of the tin water, and the spraying mechanism 4 is transmitted to the bottom of the transmission mechanism 2, so that the PCB contact box can contact the tin water when passing above the spraying mechanism 4, the mechanism can normally solder, and the soldering efficiency can be effectively improved.

[0030] Further, the spraying mechanism 4 comprises a pressure pump 41, a rough soldering assembly 42 and a fine soldering assembly 43, in the embodiment, the pressure pump 41 is relatively provided with two groups, the two groups of pressure pumps 41 are connected to the rough soldering assembly 42 and the fine soldering assembly 43 respectively, so that the two assemblies can normally work, the rough soldering assembly 42 and the fine soldering assembly 43 are arranged in parallel along the transmission direction of the transmission mechanism 2, and the height of the rough soldering assembly 42 is lower than that of the fine soldering assembly 43, so that the PCB can pass through the rough soldering assembly 42 and the fine soldering assembly 43 in sequence, the soldering efficiency can be guaranteed, and the two assemblies can normally work, the rough soldering assembly 42 comprises a tin water supply roller 421 and a liquid suction pipe 423, the tin water supply roller 421 is transmitted to the transmission mechanism 2, and the end face of the tin water supply roller 421 facing the PCB is uniformly and spacedly provided with a plurality of liquid outlet holes 422, which are used for outputting the tin water to preliminarily solder the PCB, the liquid suction pipe 423 is communicated with the tin water supply roller 421, the tin pool 31 and the pressure pump 41, and a plurality of liquid suction holes 424 are uniformly arranged on the end part of the liquid suction pipe 423 close to the bottom end of the tin pool 31, the tin water at this position is the highest in temperature and the strongest in activity due to the existence of the heating part, and can be easily sucked and output through the liquid outlet holes 422, and the fine soldering assembly 43 is provided with a fine soldering platform 431 facing the PCB, the fine soldering platform 431 is arrayed with a plurality of liquid outlets 432, and the bottom of the fine soldering assembly 43 is provided with a liquid suction part 433, which is used for sucking the tin water in cooperation with the pressure pump 41, and the arrangement of the liquid outlet 432 and the fine soldering platform 431 can make the tin water at this position more calm and stable, and the amount of the tin water is larger, so that the PCB can be more uniformly and stably soldered for the second time in the fine soldering assembly 43 after passing through the rough soldering assembly 42, a part of the tin water is used for soldering the PCB through the two assemblies, and another part of the tin water is returned to the tin pool 31 after passing through the assemblies, so that the circulation is completed, the waste can be avoided to the greatest extent, and a complete set of harmful gas absorption and purification assembly is arranged at the position of the spraying mechanism 4 facing the spraying mechanism 4, so that the polluted gas generated by the mechanism can be effectively treated, the environment is protected, and the safety of the user is protected, and through the above structure, the soldering efficiency of the tin feeding mechanism can be effectively improved.

[0031] For reference Figures 1 to 3In one embodiment of this application, the soldering assembly 3 includes a solder bath 31 and a spraying mechanism 4. The solder bath 31 is provided with a heating part and is located below the transmission mechanism 2. The spraying mechanism 4 passes through the transmission mechanism 2 and is connected to the solder bath 31. The solder bath 31 surrounds the spraying mechanism 4. The spraying mechanism 4 is connected to a pressure pump 41, which is connected to the outer wall of the solder bath 31.

[0032] In one type of tinning mechanism of this application, the soldering assembly 3 includes a tin pool 31 and a spraying mechanism 4. The tin pool 31 is equipped with a heating element, which keeps the tin in a stable molten state through heating tubes or other means, facilitating soldering. The tin pool 31 and the molten tin are both located below the PCB board contact box, which keeps the conveying mechanism 2 away from the molten tin and prevents the conveying mechanism 2 from being burned by the molten tin. The spraying mechanism 4 can locally raise the molten tin level. The spraying mechanism 4 is located at the bottom of the conveying mechanism 2. This design allows the PCB board contact box to come into contact with the molten tin when passing over the spraying mechanism 4, enabling the mechanism to solder normally and effectively improving soldering efficiency.

[0033] See also Figure 3 In one embodiment of this application, the spraying mechanism 4 includes a rough welding component 42 and a fine welding component 43. The rough welding component 42 and the fine welding component 43 are arranged in parallel and spaced apart, and are arranged sequentially along the extension direction of the transmission mechanism 2. The height of the fine welding component 43 is higher than that of the rough welding component 42.

[0034] In the tin feeding mechanism of the application, the spraying mechanism 4 comprises a pressure pump 41, a rough soldering assembly 42 and a fine soldering assembly 43. In the embodiment, two groups of pressure pumps 41 are arranged oppositely, and the two groups of pressure pumps 41 are connected to the rough soldering assembly 42 and the fine soldering assembly 43 respectively, so that the two assemblies can work normally. The rough soldering assembly 42 and the fine soldering assembly 43 are arranged in parallel along the transmission direction of the transmission mechanism 2, and the height of the rough soldering assembly 42 is lower than that of the fine soldering assembly 43. Such a structure can make the PCB pass through the rough soldering assembly 42 and the fine soldering assembly 43 in sequence, so as to guarantee the soldering efficiency and make the two assemblies work normally. The rough soldering assembly 42 comprises a tin water supply roller 421 and a liquid suction pipe 423. The tin water supply roller 421 is arranged on the transmission mechanism 2 and is provided with a plurality of liquid outlet holes 422 on the end surface facing the PCB in uniform intervals, which is used to output tin water for preliminary soldering of the PCB. The liquid suction pipe 423 is connected to the tin water supply roller 421, the tin water tank 31 and the pressure pump 41, and a plurality of liquid suction holes 424 are uniformly arranged on the end portion of the liquid suction pipe 423 close to the bottom end of the tin water tank 31. The tin water at this position has the highest temperature and the strongest activity due to the existence of the heating portion, and can be easily sucked and output through the liquid outlet holes 422. The fine soldering assembly 43 is provided with a fine soldering platform 431 facing the PCB. The fine soldering platform 431 is provided with a plurality of liquid outlets 432 in an array, and the bottom of the fine soldering assembly 43 is provided with a liquid suction portion 433. The liquid suction portion 433 is used to suck tin water in cooperation with the pressure pump 41. The arrangement of the liquid outlets 432 and the fine soldering platform 431 can make the tin water at this position more calm and stable, and the amount of tin water is larger, so that the PCB can be soldered more uniformly and stably by the fine soldering assembly 43 after passing through the rough soldering assembly 42. Part of the tin water is used for soldering the PCB through the two assemblies, and the other part of the tin water is returned to the tin water tank 31 after passing through the assemblies, so as to complete the circulation. Through the above structure, the soldering efficiency can be effectively guaranteed, and the utilization rate of tin water can be improved.

[0035] In combination with the drawings Figure 3 In an embodiment of the application, the rough soldering assembly 42 comprises a tin water supply roller 421 and a liquid suction pipe 423. The tin water supply roller 421 is arranged on the transmission mechanism 2 and is provided with a plurality of liquid outlet holes 422 in an array facing the transmission mechanism 2. One end of the liquid suction pipe 423 is connected to the supply roller, and the other end is connected to the pressure pump 41. The end surface of the liquid suction pipe 423 close to the bottom of the tin water tank 31 is provided with a liquid suction hole 424.

[0036] In the tin feeding mechanism, the rough soldering assembly 42 comprises a tin water supply roller 421 and a liquid suction pipe 423, the tin water supply roller 421 is connected to the conveying mechanism 2, and a plurality of liquid outlet holes 422 are uniformly arranged on the end surface of the tin water supply roller 421, which faces the PCB board, for outputting tin water to preliminarily solder the PCB board, the liquid suction pipe 423 is connected to the tin water supply roller 421, the tin water tank 31 and the pressure pump 41, and a plurality of liquid suction holes 424 are uniformly arranged on the end of the liquid suction pipe 423 close to the bottom end of the tin water tank 31, the tin water at this position is the hottest and most active due to the existence of the heating part, and can be easily sucked and output through the liquid outlet holes 422, and the tin feeding for the PCB board can be very efficient through the rough soldering assembly 42.

[0037] With reference to Figure 3 In an embodiment of the present application, the fine soldering assembly 43 is provided with a fine soldering platform 431 facing the conveying mechanism 2, the fine soldering platform 431 is arranged through the conveying mechanism 2, a plurality of liquid outlet holes 432 are arranged on the fine soldering platform 431, and the bottom end of the fine soldering assembly 43 is provided with a liquid suction part 433 connected to the pressure pump 41.

[0038] In the tin feeding mechanism, the fine soldering assembly 43 is provided with a fine soldering platform 431 facing the PCB board, a plurality of liquid outlet holes 432 are arranged on the fine soldering platform 431, and the bottom of the fine soldering assembly 43 is provided with a liquid suction part 433 for cooperating with the pressure pump 41 to suck tin water, and the arrangement of the liquid outlet holes 432 and the fine soldering platform 431 can make the tin water at this position more calm and stable, and the amount of tin water is larger, so that the PCB board can be more uniformly and stably soldered for the second time after passing through the rough soldering assembly 42, and the quality of soldering is improved.

[0039] With reference to Figure 1 In an embodiment of the present application, the conveying mechanism 2 comprises two parallel and spaced conveying tracks 21, and a clamping assembly 22 is arranged between the two conveying tracks 21, and the bottom edge of the clamping assembly 22 surrounds the soldering assembly 3.

[0040] In the tin feeding mechanism, the conveying mechanism 2 comprises two parallel and spaced conveying tracks 21, and a clamping assembly 22 is arranged between the two conveying tracks 21, and the clamping assembly 22 can clamp the PCB board contact box, the PCB board to be soldered is fixedly arranged in the PCB board contact box, and a plurality of through holes are arranged on the bottom edge of the PCB board contact box at the positions where the PCB board needs to be soldered, so that when the PCB board contact box carries the PCB board to contact the tin water, the tin water will pass through the through holes to solder the PCB board, and the soldering efficiency can be effectively improved through this structure.

[0041] With reference to Figures 1 to 2In an embodiment of the present application, the outer walls of the two transmission rails 21 are oppositely provided with two groups of connecting rods 23, and the preheating assembly 25 is provided with multiple groups, and the multiple groups of preheating assemblies 25 are uniformly connected to the two connecting rods 23.

[0042] In an embodiment of the present application, the outer walls of the two transmission rails 21 are oppositely provided with two groups of connecting rods 23, and the preheating assembly 25 is provided with multiple groups, and the multiple groups of preheating assemblies 25 are uniformly connected to the two connecting rods 23.

[0043] In the drawings of the present embodiment, the same or similar reference numerals correspond to the same or similar parts; in the description of the present application, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate the orientation or positional relationship shown in the drawings, they are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the terms describing the positional relationship in the drawings are only used for exemplary illustration, and cannot be understood as a limitation of the present patent, for those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0044] The above is only a preferred embodiment of the present application, and does not limit the present application, any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A tinning mechanism, characterized in that, include: The mounting frame has an upper support and an lower support at both ends, which are arranged opposite to each other. A conveying mechanism connected to the loading bracket and the unloading bracket, the height of the conveying mechanism gradually increasing along the conveying direction, a cooling component being provided at the end of the conveying mechanism near the unloading bracket, and a preheating component being provided at the end of the conveying mechanism away from the unloading bracket; and A soldering assembly is connected to the end face of the mounting bracket facing the transmission mechanism, the soldering assembly passes through the transmission mechanism, and the preheating assembly and cooling assembly surround the outer edge of the soldering assembly.

2. The tinning mechanism according to claim 1, characterized in that, The solder assembly includes: A tin bath, wherein a heating element is provided within the tin bath and is located below the conveying mechanism; and The spraying mechanism passes through the transmission mechanism, is connected to the tin bath, is surrounded by the spraying mechanism, and is connected to a pressure pump, which is connected to the outer wall of the tin bath.

3. The tinning mechanism according to claim 2, characterized in that, The spraying mechanism includes a rough welding component and a fine welding component, which are arranged in parallel and spaced apart, and are arranged sequentially along the extension direction of the transmission mechanism. The height of the fine welding component is higher than that of the rough welding component.

4. The tinning mechanism according to claim 3, characterized in that, The rough soldering assembly includes a solder supply roller and a liquid extraction pipe. The solder supply roller passes through the transmission mechanism and has multiple liquid outlet holes arrayed facing the transmission mechanism. One end of the liquid extraction pipe is connected to the supply roller, and the other end is connected to the pressure pump. The end face of the liquid extraction pipe near the bottom of the solder pool has a liquid extraction hole.

5. The tinning mechanism according to claim 3, characterized in that, The precision welding assembly is provided with a precision welding platform facing the transmission mechanism. The precision welding platform passes through the transmission mechanism and has multiple liquid outlets arrayed on it. The bottom end of the precision welding assembly is provided with a liquid suction part and is connected to the pressure pump.

6. A tinning mechanism according to any one of claims 1 to 4, characterized in that, The transmission mechanism includes two parallel and spaced transmission tracks, with a clamping component between the two transmission tracks, the bottom edge of which wraps around the soldering component.

7. A tinning mechanism according to claim 6, characterized in that, Two sets of connecting rods are provided opposite to each other on the outer walls of the two transmission tracks. The preheating components are provided in multiple sets, and the multiple sets of preheating components are evenly connected to the two connecting rods.

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