Adsorption device of thinning machine

Abstract

The utility model discloses a thinning machine adsorption device which comprises an adsorption table, a spiral adsorption groove is spirally formed in the upper end face of the adsorption table, a plurality of adsorption holes are formed in the side walls of the two sides of the spiral adsorption groove in the trend of the spiral adsorption groove, and a pressure equalizing chamber is arranged in the adsorption table. The lower end of the pressure equalizing chamber is connected with a vacuum pipe, the vacuum pipe is connected with a vacuum pump, the vacuum pipe is provided with a first valve, a wafer is placed on the adsorption table after being pasted with a blue film, and the spiral adsorption groove is completely covered. The spiral adsorption groove is connected with the vacuum pump through the adsorption hole, the pressure equalizing chamber and the vacuum pipe, so that negative pressure is generated in the spiral adsorption groove to adsorb the wafer, linear stress of the wafer is achieved, the stress area is larger, and the vacuum degree can be reduced to achieve the same adsorption strength.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field, concretely relate to a kind of thinning machine adsorption device. BACKGROUND

[0002] Wafer is usually pasted blue film on one side and then placed on thinning table when being thinned, and is polished and thinned by the polishing head above descending on surface, and cooling water is sprayed at the same time.Several vacuum adsorption holes are generally provided on the thinning table to adsorb and fix wafer, but such adsorption mode is that wafer is stressed by several points, and needs larger suction force to be adsorbed. SUMMARY

[0003] In order to solve the above technical problems in the prior art, the utility model provides a kind of thinning machine adsorption device.

[0004] In order to realize the above technical effects, the utility model adopts the following scheme:

[0005] A kind of thinning machine adsorption device, including adsorption table, the upper end face of the adsorption table is provided with spiral adsorption groove in spiral shape, the two sides of the spiral adsorption groove are provided with several adsorption holes along the direction of spiral adsorption groove, the adsorption table is provided with uniform pressure chamber, several adsorption holes are communicated with uniform pressure chamber by one communication pipe, the lower end of the uniform pressure chamber is connected with vacuum tube, the vacuum tube is connected with vacuum pump, and the first valve is provided on the vacuum tube.

[0006] In the preferred technical solution, the bottom of the uniform pressure chamber extends downward and is provided in the shape of a constricted opening.

[0007] In the preferred technical solution, the lower end of the uniform pressure chamber is connected with vertical drain pipe, the upper end of the drain pipe is connected with the lowest part of the lower end of the uniform pressure chamber, the second valve is provided on the drain pipe, the vacuum tube is connected on the drain pipe, and the connection between the vacuum tube and the drain pipe is located between the second valve and the uniform pressure chamber.

[0008] In the preferred technical solution, one part of the bottom of the spiral adsorption groove is connected with an inclined downward extending drain passage, the side surface of the adsorption table is provided with drain port, the third valve is provided on the drain port, and the lower end of the drain passage is connected with the drain port.

[0009] In the preferred technical solution, the adsorption table is further provided with heating pipe, the heating pipe is arranged close to the upper end of the adsorption table, and the heating pipe is arranged in spiral shape.

[0010] Compared with the prior art, the beneficial effects are:

[0011] The utility model discloses simple structure, convenient to use, place after the wafer is pasted with blue film on the adsorption platform, completely covers the spiral adsorption groove, and the spiral adsorption groove passes through the adsorption hole, the uniform pressure chamber and vacuum pipe connect vacuum pump and make the negative pressure adsorption of the spiral adsorption groove and hold the wafer, thereby realize the linear force of wafer, and the stress area is larger, thereby can reduce the vacuum degree and reach the same adsorption force. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is the overhead schematic view of the adsorption platform in the utility model.

[0013] Figure 2 It is the cross section schematic view of the adsorption platform in the utility model.

[0014] Reference signs: 1, adsorption platform, 2, spiral adsorption groove, 3, adsorption hole, 4, uniform pressure chamber, 5, vacuum pipe, 6, first valve, 7, drain pipe, 8, second valve, 9, drainage channel, 10, third valve, 11, heating pipe, 12, communication pipe. DETAILED DESCRIPTION

[0015] The technical scheme in the embodiments of the utility model will be clearly and completely described below in combination with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0016] A kind of thinning machine adsorption device, including adsorption platform 1, the upper end face of the adsorption platform 1 is opened with spiral adsorption groove 2 in spiral, the two side walls of the spiral adsorption groove 2 are all equipped with several adsorption holes 3 along the trend of spiral adsorption groove 2, the adsorption platform 1 is equipped with uniform pressure chamber 4, several adsorption holes 3 are communicated with uniform pressure chamber 4 by a communication pipe 12 respectively, the lower end of the uniform pressure chamber 4 is connected with vacuum pipe 5, the vacuum pipe 5 is connected with vacuum pump, first valve 6 is equipped on the vacuum pipe 5.

[0017] Place after the wafer is pasted with blue film on adsorption platform 1, completely cover spiral adsorption groove 2, and spiral adsorption groove 2 passes through adsorption hole 3, uniform pressure chamber 4 and vacuum pipe 5 to connect vacuum pump to make the negative pressure adsorption in spiral adsorption groove 2 and hold the wafer, thereby realize the linear force of wafer, and the stress area is larger, thereby can reduce the vacuum degree and reach the same adsorption force.

[0018] Preferred technical scheme, the bottom of the uniform pressure chamber 4 extends towards the downward and is set in the shape of necking.

[0019] Preferably, the lower end of the pressure equalizing chamber 4 is connected with a vertical drain pipe 7, the upper end of the drain pipe 7 is connected with the lowest part of the lower end of the pressure equalizing chamber 4, a second valve 8 is arranged on the drain pipe 7, and the vacuum pipe 5 is connected with the drain pipe 7, and the connection part of the vacuum pipe 5 with the drain pipe 7 is located between the second valve 8 and the pressure equalizing chamber 4. When the thickness is reduced, cooling water is sprayed, and the cooling water enters the pressure equalizing chamber 4 through the adsorption holes 3 and the communication pipe 12, and the second valve 8 is opened regularly to drain the accumulated water through the drain pipe 7.

[0020] Preferably, one bottom of the spiral adsorption groove 2 is connected with a downwardly inclined drain passage 9, the side surface of the adsorption table 1 is provided with a drain port, the drain port is provided with a third valve 10, and the lower end of the drain passage 9 is connected with the drain port. The third valve 10 is opened to drain the water in the spiral adsorption groove 2.

[0021] Preferably, the adsorption table 1 is further provided with a heating pipe 11, the heating pipe 11 is arranged close to the upper end of the adsorption table 1, and the heating pipe 11 is arranged in a spiral shape. The surface of the adsorption table 1 can be dried faster through the heating of the heating pipe 11.

[0022] In the description of the present application, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the present application is used, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0023] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0024] Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

Claims

1. A thinning machine adsorption device, characterized in that, The device includes an adsorption platform (1), on the upper surface of which a spiral adsorption groove (2) is spirally formed. On both sides of the spiral adsorption groove (2), there are several adsorption holes (3) along the direction of the spiral adsorption groove (2). The adsorption platform (1) is provided with a pressure equalization chamber (4). The several adsorption holes (3) are connected to the pressure equalization chamber (4) through a connecting pipe (12). The lower end of the pressure equalization chamber (4) is connected to a vacuum pipe (5). The vacuum pipe (5) is connected to a vacuum pump. The vacuum pipe (5) is provided with a first valve (6). The bottom of the pressure equalization chamber (4) extends downward and is set in a constricted shape; The lower end of the pressure equalization chamber (4) is connected to a vertical drain pipe (7), the upper end of the drain pipe (7) is connected to the lowest point of the lower end of the pressure equalization chamber (4), a second valve (8) is provided on the drain pipe (7), the vacuum pipe (5) is connected to the drain pipe (7), and the connection between the vacuum pipe (5) and the drain pipe (7) is located between the second valve (8) and the pressure equalization chamber (4).

2. The adsorption device for a thinning machine as described in claim 1, characterized in that, The bottom of the spiral adsorption tank (2) is connected to a downwardly extending drainage channel (9), the side of the adsorption platform (1) is provided with a drain outlet, the drain outlet is provided with a third valve (10), and the lower end of the drainage channel (9) is connected to the drain outlet.

3. The adsorption device for a thinning machine as described in claim 1, characterized in that, The adsorption platform (1) is also provided with a heating tube (11), which is located near the upper end of the adsorption platform (1) and is arranged in a spiral shape.

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