Trimming device and trimming system for polishing pad

Abstract

The utility model relates to the technical field of trimming of semiconductor silicon wafer polishing pads, and discloses a trimming device and a trimming system for a polishing pad. The dressing device comprises a dressing wheel, and the two opposite sides of the dressing wheel are the first side and the second side respectively. The trimming device further comprises a plurality of first bristles, the multiple first bristles are arranged on the first side, the multiple first bristles are arranged in the circumferential direction of the trimming wheel in a surrounding mode, and the first bristles are used for brushing the polishing pad located on the first side. The trimming device further comprises a plurality of second bristles, the second bristles are arranged on the second side, the second bristles are arranged in the circumferential direction of the trimming wheel in a surrounding mode, and the second bristles are used for brushing the polishing pad located on the second side. In this way, the finishing efficiency and the finishing effect of the polishing pad can be improved.

Description

Technical Field

[0001] This application relates to the field of polishing pad technology for semiconductor silicon wafers, specifically to a polishing pad polishing device and polishing system. Background Technology

[0002] Polishing pads are one of the core consumables in the chemical mechanical polishing (CMP) process of semiconductor silicon wafers. They are mainly used for planarization of the silicon wafer surface to meet the flatness requirements of integrated circuit manufacturing. During the silicon wafer polishing process, impurities are generated on the polishing pad surface, leading to a reduction in the volume and number of micropores and a decrease in surface roughness. Furthermore, molecular recombination occurs on the polishing pad surface, forming a glaze layer of a certain thickness, which reduces polishing efficiency and quality. Therefore, polishing pads need to be trimmed to improve surface cleanliness and roughness. However, current polishing pad trimming efficiency is low, and the trimming effect is poor. Utility Model Content

[0003] This application provides a dressing device and dressing system for polishing pads, which can improve the dressing efficiency and dressing effect of polishing pads.

[0004] This application provides a dressing device for a polishing pad. The dressing device includes a dressing wheel, with a first side and a second side on opposite sides. The dressing device also includes a plurality of first bristles disposed on the first side and arranged circumferentially around the dressing wheel, the first bristles being used to brush the polishing pad located on the first side. The dressing device also includes a plurality of second bristles disposed on the second side and arranged circumferentially around the dressing wheel, the second bristles being used to brush the polishing pad located on the second side.

[0005] In one embodiment of this application, the trimming device has a first direction and a second direction that are perpendicular to each other, and the trimming wheel has a first side and a second side on both sides in the first direction; the first bristles and the second bristles are staggered in the second direction.

[0006] In one embodiment of this application, a first mounting groove is provided on the surface of the dressing wheel facing the first side, and a first bristle is disposed in the first mounting groove; a second mounting groove is provided on the surface of the dressing wheel facing the second side, and a second bristle is disposed in the second mounting groove.

[0007] In one embodiment of this application, the trimming device has a first direction and a second direction that are perpendicular to each other, and the trimming wheel has a first side and a second side on both sides of the first direction; wherein the first mounting groove and the second mounting groove are staggered in the second direction.

[0008] In one embodiment of this application, the trimming device has a first direction, and the trimming wheel has a first side and a second side on both sides of the first direction; wherein the first mounting groove and the second mounting groove are arranged opposite to each other and communicate with each other in the first direction.

[0009] In one embodiment of this application, the dressing wheel is provided with a flow passage extending to a first side and a second side, the flow passage being configured to allow cleaning liquid to pass through.

[0010] In one embodiment of this application, both the first bristles and the second bristles are tufted bristles.

[0011] Accordingly, this application also provides a trimming system, comprising: a first polishing pad; a second polishing pad disposed opposite to the first polishing pad; a trimming device as described in the above embodiments, the trimming device being disposed between the first polishing pad and the second polishing pad; a first bristle of the trimming wheel of the trimming device being used to brush the first polishing pad, and a second bristle of the trimming wheel of the trimming device being used to brush the second polishing pad; and a drive device being drivenly connected to the trimming device, the drive device being configured to drive the trimming device to move between the first polishing pad and the second polishing pad to brush the first polishing pad and the second polishing pad.

[0012] In one embodiment of this application, the driving device includes an internal gear and an external gear ring, the external gear ring being sleeved on the outer periphery of the internal gear, and the dressing device meshing between the internal gear and the external gear ring. The internal gear and the external gear ring are configured to cooperate in driving the dressing device to rotate on its own axis and to revolve around the internal gear in the circumferential direction.

[0013] In one embodiment of this application, the trimming system further includes: a first polishing disc, a first polishing pad disposed on the first polishing disc; and a liquid supply line disposed on the first polishing disc, the liquid supply line being configured to output cleaning liquid between the first polishing pad and the second polishing pad.

[0014] The beneficial effects of this application are as follows: Unlike existing technologies, this application provides a polishing pad dressing device and system. A first side of the dressing wheel is provided with multiple first bristles, which are used to brush the polishing pad located on the first side. A second side of the dressing wheel is provided with multiple second bristles, which are used to brush the polishing pad located on the second side. In this application, the first and second bristles can efficiently brush the polishing pad, effectively removing stubborn particles remaining on the surface of the polishing pad and unclogging the pores of the polishing pad. This improves the dressing efficiency and effect of the polishing pad and significantly reduces the risk of damage to the silicon wafer surface.

[0015] Furthermore, the first and second bristles of this application are arranged around the circumference of the dressing wheel, so that the first and second bristles have a large contact area with the polishing pad, which can simultaneously brush a large area of ​​the polishing pad surface, further improving the dressing efficiency and dressing effect of the polishing pad. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a top view schematic diagram of an embodiment of the trimming device of this application;

[0018] Figure 2 This is a cross-sectional structural schematic diagram of an embodiment of the trimming device of this application;

[0019] Figure 3 This is a cross-sectional structural schematic diagram of another embodiment of the trimming device of this application;

[0020] Figure 4 This is a schematic diagram of the structure of an embodiment of the trimming system of this application.

[0021] Explanation of reference numerals in the attached figures:

[0022] 10 Dressing device; 11 Dressing wheel; 11a First side; 11b Second side; 111 First mounting groove; 112 Second mounting groove; 114 Flow hole; 12 First bristles; 13 Second bristles; 21 First polishing pad; 22 Second polishing pad; 23 First polishing disc; 24 Second polishing disc; 30 Drive device; 31 Internal gear; 32 External gear ring; 40 Liquid supply pipeline. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "up," "down," "left," and "right" generally refer to up, down, left, and right in the actual use or working state of the device, specifically the drawing directions in the accompanying drawings.

[0024] In this application, unless otherwise expressly specified and limited, the terms "connected," "linked," "stacked," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0025] This application provides a dressing device and a dressing system for a polishing pad, which are described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, in the following embodiments, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.

[0026] To address the problems of low dressing efficiency and poor dressing effect of polishing pads in the prior art, one embodiment of this application provides a dressing device for polishing pads. The dressing device includes a dressing wheel, with a first side and a second side on opposite sides. The dressing device also includes a plurality of first bristles disposed on the first side and arranged circumferentially around the dressing wheel, used to brush the polishing pad located on the first side. The dressing device also includes a plurality of second bristles disposed on the second side and arranged circumferentially around the dressing wheel, used to brush the polishing pad located on the second side. The details are described below.

[0027] Please see Figure 1 and Figure 2 , Figure 1 This is a top view schematic diagram of an embodiment of the trimming device of this application. Figure 2 This is a cross-sectional structural schematic diagram of an embodiment of the trimming device of this application.

[0028] In one embodiment, the dressing device 10 is used to dress a polishing pad. The dressing device 10 includes a dressing wheel 11, with a first side 11a and a second side 11b on opposite sides. The dressing device 10 also includes a plurality of first bristles 12 disposed on the first side 11a and arranged circumferentially around the dressing wheel 11, the first bristles 12 being used to brush the polishing pad located on the first side 11a. The dressing device 10 also includes a plurality of second bristles 13 disposed on the second side 11b and arranged circumferentially around the dressing wheel 11, the second bristles 13 being used to brush the polishing pad located on the second side 11b.

[0029] In this embodiment, the first side 11a of the dressing wheel 11 is provided with a plurality of first bristles 12, which are used to brush the polishing pad located on the first side 11a. The second side 11b of the dressing wheel 11 is provided with a plurality of second bristles 13, which are used to brush the polishing pad located on the second side 11b. In this embodiment, the first bristles 12 and the second bristles 13 can efficiently brush the polishing pad, effectively removing stubborn particles remaining on the surface of the polishing pad and unclogging the pores of the polishing pad, improving the polishing pad's ability to carry polishing fluid, and improving the dressing efficiency and dressing effect of the polishing pad. Since the first bristles 12 and the second bristles 13 in this embodiment have a good dressing effect, they can reduce the risk of hard particles remaining on the surface of the polishing pad, thereby reducing the risk of the silicon wafer surface being scratched by hard particles remaining on the surface of the polishing pad when the polishing pad is subsequently applied to the polishing operation of the silicon wafer. Therefore, the risk of silicon wafer surface damage is greatly reduced, which is conducive to ensuring the surface quality of the silicon wafer and improving production efficiency.

[0030] Furthermore, in this embodiment, the first bristles 12 and the second bristles 13 are arranged around the circumference of the dressing wheel 11, so that the first bristles 12 and the second bristles 13 have a large contact area with the polishing pad, which can simultaneously brush a large area of ​​the polishing pad surface, further improving the dressing efficiency and dressing effect of the polishing pad.

[0031] It should be noted that the arrangement of multiple first bristles 12 around the circumference of the dressing wheel 11 in this embodiment should be understood as the multiple first bristles 12 being spaced apart around the circumference of the dressing wheel 11, and the multiple first bristles 12 forming a complete ring structure around the outer periphery of the central axis of the dressing wheel 11. This allows the first bristles 12 to have the largest possible contact area with the polishing pad, further improving the dressing efficiency and dressing effect of the polishing pad. Similarly, the arrangement of multiple second bristles 13 around the circumference of the dressing wheel 11 in this embodiment should be understood as the multiple second bristles 13 being spaced apart around the circumference of the dressing wheel 11, and the multiple second bristles 13 forming a complete ring structure around the outer periphery of the central axis of the dressing wheel 11. This allows the second bristles 13 to have the largest possible contact area with the polishing pad, further improving the dressing efficiency and dressing effect of the polishing pad.

[0032] In one embodiment, the surface of the dressing wheel 11 facing the first side 11a is provided with a first mounting groove 111, and the first bristles 12 are disposed in the first mounting groove 111. The surface of the dressing wheel 11 facing the second side 11b is provided with a second mounting groove 112, and the second bristles 13 are disposed in the second mounting groove 112. In this way, the first bristles 12 and the second bristles 13 can be installed on the dressing wheel 11. In this embodiment, by providing the first mounting groove 111, the first bristles 12 can be embedded in the first mounting groove 111, which can ensure the stability of the first bristles 12 installed on the dressing wheel 11. In this embodiment, by providing the second mounting groove 112, the second bristles 13 can be embedded in the second mounting groove 112, which can ensure the stability of the second bristles 13 installed on the dressing wheel 11.

[0033] For example, the first bristles 12 and the second bristles 13 can be tufted bristles. The first bristles 12 and the second bristles 13 can be made of materials such as nylon. The first bristles 12 and the second bristles 13 have sufficient hardness and toughness to ensure that they efficiently and stably brush the polishing pad, guaranteeing the polishing pad's dressing efficiency and effect. Furthermore, the first bristles 12 and the second bristles 13 can also possess properties such as high temperature resistance and corrosion resistance, ensuring the structural reliability of the first bristles 12 and the second bristles 13. The dressing wheel 11 can be made of materials such as PEEK (Polyetheretherketone). The dressing wheel 11 is drilled to a certain depth to form the first mounting groove 111 and the second mounting groove 112. The first bristles 12 are embedded into the first mounting groove 111 by machine stamping or other methods; similarly, the second bristles 13 can also be embedded into the second mounting groove 112 by machine stamping or other methods.

[0034] In one embodiment, the first bristles 12 and the second bristles 13 are staggered in the second direction X. In other words, adjacent first bristles 12 and second bristles 13 are spaced apart in the second direction X. In this way, by setting the first bristles 12 and the second bristles 13 to be staggered in the second direction X, this embodiment helps to reduce the overall size of the trimming device 10 in the first direction Z.

[0035] Specifically, in the example described above where the first bristle 12 is disposed in the first mounting groove 111 and the second bristle 13 is disposed in the second mounting groove 112, the first mounting groove 111 and the second mounting groove 112 are staggered in the second direction X. That is, adjacent first mounting grooves 111 and second mounting grooves 112 in the second direction X are spaced apart from each other, so that the first bristle 12 and the second bristle 13 are staggered in the second direction X. In this way, by setting the first mounting groove 111 and the second mounting groove 112 to be staggered in the second direction X, this embodiment reduces the size of the dressing wheel 11 in the first direction Z while ensuring that both the first mounting groove 111 and the second mounting groove 112 have sufficient depth.

[0036] Please refer to the following: Figure 3 , Figure 3 This is a cross-sectional structural schematic diagram of another embodiment of the trimming device of this application.

[0037] In an alternative embodiment, the difference between this embodiment and the above embodiment is that the first mounting groove 111 and the second mounting groove 112 are arranged opposite to each other and are interconnected in the first direction Z. In other words, unlike the above embodiment where the first mounting groove 111 and the second mounting groove 112 are staggered in the second direction X, in this embodiment the first mounting groove 111 and the second mounting groove 112 are not staggered in the second direction X. Furthermore, in this embodiment, the first mounting groove 111 and the second mounting groove 112 are interconnected, allowing a through hole to be formed on the dressing wheel 11 through a single drilling process, thereby forming the first mounting groove 111 and the second mounting groove 112, which simplifies the forming process of the first mounting groove 111 and the second mounting groove 112.

[0038] Please refer to the following: Figure 4 , Figure 4 This is a schematic diagram of the structure of an embodiment of the trimming system of this application.

[0039] In one embodiment, the dressing system includes a first polishing pad 21 and a second polishing pad 22, which are disposed opposite to each other. The dressing system also includes a dressing device 10 disposed between the first polishing pad 21 and the second polishing pad 22. The first bristles 12 of the dressing wheel 11 of the dressing device 10 are used to brush the first polishing pad 21, and the second bristles 13 of the dressing wheel 11 are used to brush the second polishing pad 22. The dressing system also includes a drive device 30, which is kinetically connected to the dressing device 10. The drive device 30 is configured to drive the dressing device 10 to move between the first polishing pad 21 and the second polishing pad 22 to brush the first polishing pad 21 and the second polishing pad 22.

[0040] In this embodiment, the first polishing pad 21 and the second polishing pad 22 of the dressing system are distributed along a first direction Z. In the first direction Z, the dressing device 10 is disposed between the first polishing pad 21 and the second polishing pad 22. The first polishing pad 21 is located on the first side 11a of the dressing wheel 11 of the dressing device 10, and the second polishing pad 22 is located on the second side 11b of the dressing wheel 11. The dressing device 10 simultaneously brushes the first polishing pad 21 and the second polishing pad 22 with the first bristles 12 and the second bristles 13 on both sides of its dressing wheel 11, thereby improving the dressing efficiency of the polishing pads.

[0041] In one embodiment, the drive device 30 includes an internal gear 31 and an external gear ring 32. The external gear ring 32 is sleeved on the outer periphery of the internal gear 31, and the dressing device 10 meshes between the internal gear 31 and the external gear ring 32. The internal gear 31 and the external gear ring 32 are configured to cooperate in driving the dressing device 10 to rotate on its own axis and to revolve around the internal gear 31 in the circumferential direction.

[0042] Specifically, the dressing wheel 11 meshes between the internal gear 31 and the external gear ring 32. The internal gear 31 and the external gear ring 32 work together to drive the dressing wheel 11 to rotate on its own axis and to revolve around the internal gear 31 in the circumferential direction. This causes the first bristles 12 and the second bristles 13 on the dressing wheel 11 to revolve around the internal gear 31 while the dressing wheel 11 rotates on its own axis. The first bristles 12 and the second bristles 13 can efficiently brush the polishing pad, effectively brushing away stubborn particles remaining on the surface of the polishing pad and unclogging the pores of the polishing pad, thereby improving the dressing efficiency and dressing effect of the polishing pad.

[0043] In one embodiment, the finishing system further includes a first polishing disc 23 and a second polishing disc 24. The first polishing disc 23 and the second polishing disc 24 are distributed along a first direction Z. A first polishing pad 21 is disposed on the surface of the first polishing disc 23 near the second polishing disc 24, and a second polishing pad 22 is disposed on the surface of the second polishing disc 24 near the first polishing disc 23. The first polishing disc 23 may be located above the second polishing disc 24, that is, the first polishing pad 21 may be located above the second polishing pad 22. Of course, in other embodiments of this application, the first polishing disc 23 may be located below the second polishing disc 24, that is, the first polishing pad 21 may be located below the second polishing pad 22; this is not limited here.

[0044] In one embodiment, the dressing system further includes a liquid supply line 40 disposed on the first polishing pad 23. The liquid supply line 40 is configured to output cleaning liquid between the first polishing pad 21 and the second polishing pad 22 to assist the dressing device 10 in dressing the first polishing pad 21 and the second polishing pad 22, thereby improving the dressing efficiency and dressing effect of the first polishing pad 21 and the second polishing pad 22.

[0045] Specifically, the dressing wheel 11 is provided with a flow hole 114 extending through the first side 11a and the second side 11b, that is, the flow hole 114 is provided through the dressing wheel 11 along the first direction Z. The flow hole 114 is configured to allow the passage of cleaning liquid. In other words, the cleaning liquid output from the liquid supply line 40 passes through the first polishing pad 21 and flows to the dressing wheel 11. The cleaning liquid flows through the flow hole 114 on the dressing wheel 11 to the second polishing pad 22, so that both the first polishing pad 21 and the second polishing pad 22 can be wetted by the cleaning liquid. Then, the first polishing pad 21 is brushed by the first bristles 12 and the second polishing pad 22 is brushed by the second bristles 13 to ensure the dressing efficiency and dressing effect of the first polishing pad 21 and the second polishing pad 22.

[0046] Alternatively, the cleaning liquid may be pure water, detergent, or a mixture of pure water and detergent, etc., without limitation.

[0047] The working process of the trimming system according to the embodiments of this application is described below.

[0048] Three dressing devices 10 are evenly placed on the second polishing disc 24, which is covered with the second polishing pad 22. The dressing wheel 11 is fixed in place by the internal gear 31 and the external gear ring 32. The pre-set program is started, causing the first polishing disc 23, which is covered with the first polishing pad 21, to descend and come into contact with the first brush bristles 12 and the second brush bristles 13 on the dressing wheel 11. After reaching a pressure of 150 to 250 Dan, the liquid supply pipe 40 on the first polishing disc 23 flows out 7 to 10 L of 35-degree pure water per minute. At the same time, the first polishing disc 23 and the second polishing disc 24 are rotated in the opposite direction, as are the internal gear 31 and the external gear ring 32 (the rotation direction is switched every three minutes, and the two wheels are circulated). This allows the first brush bristles 12 and the second brush bristles 13 to thoroughly and evenly brush the first polishing pad 21 and the second polishing pad 22. The pure water output from the liquid supply pipe 40 flows through the flow hole 114 hollowed out in the center of the dressing wheel 11 to the second polishing pad 22 and is discharged from the disc surface under the action of centrifugal force.

[0049] In summary, this application provides a polishing pad dressing device and a dressing system. A first side of the dressing wheel is provided with multiple first bristles for brushing the polishing pad located on the first side. A second side of the dressing wheel is provided with multiple second bristles for brushing the polishing pad located on the second side. In this application, the first and second bristles can efficiently brush the polishing pad, effectively removing stubborn particles remaining on the surface of the polishing pad and unclogging the pores of the polishing pad, thereby improving the dressing efficiency and effect of the polishing pad and significantly reducing the risk of damage to the silicon wafer surface.

[0050] Furthermore, the first and second bristles of this application are arranged around the circumference of the dressing wheel, so that the first and second bristles have a large contact area with the polishing pad, which can simultaneously brush a large area of ​​the polishing pad surface, further improving the dressing efficiency and dressing effect of the polishing pad.

[0051] The polishing pad dressing device and dressing system provided in this application have been described in detail above. Specific examples have been used to illustrate the principle and implementation of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this application. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A dressing device for a polishing pad, characterized in that, The trimming device includes: The dressing wheel has two opposite sides, namely the first side and the second side; A plurality of first bristles are disposed on the first side and arranged circumferentially around the dressing wheel. The first bristles are used to brush a polishing pad located on the first side. A plurality of second bristles are disposed on the second side and arranged circumferentially around the dressing wheel, the second bristles being used to brush the polishing pad located on the second side.

2. The trimming device according to claim 1, characterized in that, The trimming device has a first direction and a second direction that are perpendicular to each other, and the trimming wheel has a first side and a second side on both sides of the first direction; the first bristles and the second bristles are staggered in the second direction.

3. The trimming device according to claim 1, characterized in that, The dressing wheel has a first mounting groove on its surface facing the first side, and the first bristles are disposed in the first mounting groove; the dressing wheel has a second mounting groove on its surface facing the second side, and the second bristles are disposed in the second mounting groove.

4. The trimming device according to claim 3, characterized in that, The dressing device has a first direction and a second direction that are perpendicular to each other, and the dressing wheel has a first side and a second side on both sides of the first direction; The first mounting slot and the second mounting slot are staggered in the second direction.

5. The trimming device according to claim 3, characterized in that, The dressing device has a first direction, and the dressing wheel has a first side and a second side on both sides of the first direction; The first mounting slot and the second mounting slot are arranged opposite to each other in the first direction and are interconnected.

6. The trimming device according to any one of claims 1 to 5, characterized in that, The dressing wheel is provided with a flow passage extending to the first side and the second side, the flow passage being configured to allow the passage of cleaning liquid.

7. The trimming device according to any one of claims 1 to 5, characterized in that, Both the first bristles and the second bristles are tufted bristles.

8. A trimming system, characterized in that, include: First polishing pad; The second polishing pad is disposed opposite to the first polishing pad; The dressing device as described in any one of claims 1 to 6 is disposed between the first polishing pad and the second polishing pad; the first bristles of the dressing wheel of the dressing device are used to brush the first polishing pad, and the second bristles of the dressing wheel of the dressing device are used to brush the second polishing pad. as well as A drive unit is connected to the dressing device and is configured to drive the dressing device to move between the first polishing pad and the second polishing pad to brush the first polishing pad and the second polishing pad.

9. The trimming system according to claim 8, characterized in that, The driving device includes an internal gear and an external gear ring. The external gear ring is sleeved on the outer circumference of the internal gear. The dressing device meshes between the internal gear and the external gear ring. The internal gear and the external gear ring are configured to cooperate in driving the dressing device to rotate on its own axis and to revolve around the internal gear in the circumferential direction.

10. The trimming system according to claim 8, characterized in that, The trimming system also includes: A first polishing disc, wherein the first polishing pad is disposed on the first polishing disc; and A liquid supply line is disposed on the first polishing pad, and the liquid supply line is configured to output cleaning liquid between the first polishing pad and the second polishing pad.

Images