Integrated double-circulation cold and hot temperature control device

Abstract

The utility model discloses an integrated double-circulation cold and hot temperature control device which comprises a micro flow channel plate and an integrated cover, the integrated cover is arranged at one end of the micro flow channel plate, an integrated assembly is arranged in the integrated cover and comprises a fluid circulation power part, a refrigerating and heating part and a heat dissipation part, and the micro flow channel plate is provided with a fluid flow channel. The fluid circulation power part is used for circulating fluid to the fluid flow channel or the heat dissipation assembly, and the refrigerating and heating part is used for refrigerating or heating the fluid; the integrated double-circulation cold and hot temperature control device adopts the semiconductor chilling plate as a refrigeration source and a heating source, is low in power consumption and high in efficiency, is matched with a double-circulation flow channel circulation path, can quickly feed back temperature change to the micro flow channel plate, is high in response speed, adopts an integrated layout design, is small in occupied space, and is low in cost. The device is suitable for being used in a limited space, liquid storage in the device can be reduced, the response speed and efficiency of refrigeration and heating are further improved, and power consumption is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor refrigeration and fluid heat transfer technology, concretely is a kind of integrated double-cycle cold and hot temperature control device. BACKGROUND

[0002] With the demand of heating and cooling scene such as household, pet and medical health care for cold and hot device, more and more cold and hot devices appear in the market.

[0003] But the existing household cold and hot device, when carrying out temperature rise and drop, mainly adopt the scheme of traditional heat sink and fluid circulation plate, traditional heat sink cannot fully carry out heat transfer and lead to uneven surface temperature, local temperature difference is too large, and problems such as condensate water appear, and existing liquid circulation cold and hot device cannot meet the demand of low power consumption, high efficiency and fast response speed, and integration is not high, internal fluid is not resistant to high and low temperature, is greatly influenced by environment, when carrying out heat dissipation and cooling, it is also difficult to achieve efficient switching of cold and hot and maintenance of heat, and condensate water is easily generated during operation. At present, device mainly adopts traditional refrigeration and heating technology, such as compressor refrigeration, there are disadvantages such as large volume, high energy consumption and slow response speed, so that the existing household heat conduction device cannot meet the demand of realizing efficient cold and hot temperature control in limited space. SUMMARY

[0004] To solve the defects of the above prior art, the utility model provides a kind of integrated double-cycle cold and hot temperature control device, response speed is fast, power consumption is low, and can realize the switching of refrigeration and heating mode in limited space quickly and stably, and device efficiency is higher.

[0005] To realize the above technical purpose, the utility model adopts the following technical scheme: a kind of integrated double-cycle cold and hot temperature control device, including micro flow channel plate and integrated cover, the integrated cover is arranged at one end of micro flow channel plate, integrated assembly is arranged in the integrated cover, the integrated assembly includes fluid circulation power component, refrigeration and heating component and heat dissipation component, the micro flow channel plate is equipped with fluid flow channel, the fluid circulation power component is used to circulate fluid to fluid flow channel or heat dissipation component, and the refrigeration and heating component is used to refrigerate or heat fluid.

[0006] Preferably, the micro flow channel plate is provided with a flow channel plate heat preservation layer, and the micro flow channel plate bottom is provided with a device base.

[0007] Preferably, the integrated cover is provided with a temperature control screen on one side.

[0008] Preferably, the integrated cover is provided with a PCB board, and the PCB board is connected with the temperature control screen.

[0009] Preferably, the integrated cover is provided with a power supply interface, and the power supply interface is connected with the PCB board.

[0010] Preferably, the refrigeration and heating component includes a semiconductor refrigeration sheet connected with the PCB, and two water cooling heads respectively arranged on two sides of the semiconductor refrigeration sheet, the water cooling head is internally provided with a fluid cavity, and the water cooling head and the heat dissipation assembly or the fluid flow channel form a circulating passage.

[0011] Preferably, the heat dissipation component includes a cold row radiator internally provided with a heat dissipation cavity, and a heat dissipation fan attached to one side of the cold row radiator.

[0012] Preferably, the fluid circulation power component includes a fluid pump and a fluid pipeline, the fluid pipeline is connected between the water cooling head and the cold row radiator or connected between the water cooling head and the fluid flow channel, the water cooling head, the cold row radiator, the fluid flow channel and the fluid pipeline are all filled with fluid, and the fluid pump is used to drive the fluid to circulate and flow.

[0013] In summary, the integrated double-circulation cold and hot temperature control device has the following technical effects:

[0014] The integrated double-circulation cold and hot temperature control device adopts the semiconductor refrigeration sheet as the refrigeration source and the heating source, has low power consumption and high efficiency, and can quickly feed back the temperature change to the micro flow channel plate in cooperation with the double-circulation flow channel circulating passage, has high response speed, in addition, adopts the integrated layout design, occupies small space, is suitable for limited space use, and can reduce the liquid storage in the device, further improves the response speed and efficiency of refrigeration and heating, and reduces power consumption.

[0015] The technical scheme of the utility model can be widely applied to pet constant-temperature seat pad / cave pad, pet bed, intelligent mouse pad / table pad, constant-temperature office table, cold and hot temperature control seat pad, constant-temperature seat / chair, constant-temperature cup pad, vehicle-mounted temperature control seat pad and other personal and family consumption scenes, and can also be applied to physiotherapy devices, nursing beds and other medical and health care scenes. ACCURATE DRAWINGS

[0016] Figure 1 It is a three-dimensional structure schematic view of the integrated double-circulation cold and hot temperature control device of the utility model;

[0017] Figure 2 It is a structure schematic view of the integrated double-circulation cold and hot temperature control device of the utility model;

[0018] Figure 3 It is an internal structure schematic view of the integrated double-circulation cold and hot temperature control device of the utility model;

[0019] Figure 4 It is a structure schematic view of the micro flow channel plate of the integrated double-circulation cold and hot temperature control device of the utility model;

[0020] Figure 5 is a structural schematic view of the PCB board of the integrated double-circulation cold and hot temperature control device of the utility model;

[0021] Figure 6 is a structural schematic view of the refrigeration and heating component of the integrated double-circulation cold and hot temperature control device of the utility model;

[0022] Figure 7 is a structural schematic view of the fluid circulation power component of the integrated double-circulation cold and hot temperature control device of the utility model;

[0023] Figure 8 is a structural schematic view of the heat dissipation component of the integrated double-circulation cold and hot temperature control device of the utility model;

[0024] Description of the Drawings: 4, integrated assembly; 5, heat dissipation component; 6, fluid circulation power component; 7, refrigeration and heating component; 8, PCB board; 9, micro flow channel plate; 10, flow channel plate heat preservation layer; 11, device base; 12, temperature control remote control switch; 13, temperature control screen; 14, voltage reduction module; 15, power supply interface; 16, temperature control module; 17, power supply positive and negative pole control module; 18, current control module; 19, semiconductor refrigeration piece; 20, water cooling head; 22, fluid pump; 23, fluid pipeline; 24, cold row radiator; 25, heat dissipation fan; 26, fan speed regulator. DETAILED DESCRIPTION

[0025] The utility model will be further explained in detail below in combination with the drawings.

[0026] The specific embodiment is only an explanation of the utility model, and it is not a limitation of the utility model, and the person skilled in the art can make a modification without creative contribution according to the need after reading the specification, but as long as it is within the scope of the claims of the utility model, it is protected by the patent law.

[0027] In the description of the utility model, it is understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the utility model.

[0028] In addition, the terms "first", "second", "third", etc. are used only for descriptive purposes and should not be construed as indicating or implying relative importance or an indicated number of technical features. Therefore, the features defined as "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0029] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0030] In the present application, unless otherwise specifically defined and limited, the first feature is "on" or "under" the second feature. The first and second features can be in direct contact, or the first and second features can be in indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0031] Embodiment one:

[0032] As shown in Figure 1 Figure 3, an integrated double-cycle cold and hot temperature control device, comprising a micro flow channel plate 9 and an integrated cover, the integrated cover is arranged at one end of the micro flow channel plate 9, the integrated cover is provided with an integrated assembly 4, the integrated assembly 4 comprises a fluid circulation power component 6, a refrigeration and heating component 7 and a heat dissipation component 5, the micro flow channel plate 9 is provided with a fluid flow channel, the fluid circulation power component 6 is used to circulate fluid to the fluid flow channel or the heat dissipation assembly, and the refrigeration and heating component 7 is used to refrigerate or heat the fluid.

[0033] As shown in Figure 4 Figure 4, the micro flow channel plate 9 is used as a container for circulating heat of fluid, the thickness of the fluid flow channel is only 0.8-2mm, and a medium-high pressure fluid pump 22 is matched to realize faster response speed; the material can be adjusted according to the use scene, such as copper, aluminum and other materials with high thermal conductivity, or soft and tough composite materials, woven materials, etc., which are tightly installed on the lower flow channel plate heat preservation layer 10 through special glue or screws.

[0034] The integrated dual-cycle cooling and heating temperature control device of this embodiment uses a semiconductor cooling chip 19 as both the cooling and heating source. It features low power consumption and high efficiency. Furthermore, with the dual-cycle flow channel circulation path, it can quickly feed back temperature changes to the micro-flow channel plate 9, resulting in a fast response speed. In addition, the integrated layout design occupies little space, making it suitable for use in limited spaces. It can also reduce the amount of liquid inside the device, further improving the response speed and efficiency of cooling and heating, and reducing power consumption.

[0035] The micro-flow channel plate 9 is provided with a flow channel plate insulation layer 10, and the bottom of the micro-flow channel plate 9 is provided with a device base 11;

[0036] The flow channel plate insulation layer 10 serves to insulate the micro flow channel plate 9, allowing the device to operate without continuous operation, thus achieving low power consumption and high energy efficiency. The material can be adjusted according to the application scenario, such as PE, EVA, etc. It can also serve as a shock absorber and buffer, and is installed on the lower base and above the micro flow channel plate 9.

[0037] The device base 11, as the base plate of the entire device, is made of high-strength pressure-resistant materials, such as lightweight materials like honeycomb aluminum plates, to provide support and prevent deformation of the micro-flow channel plate 9.

[0038] like Figure 5 As shown, a temperature control screen 13 is provided on one side of the integrated cover; a PCB board 8 is provided inside the integrated cover, and the PCB board 8 is connected to the temperature control screen 13 and the semiconductor cooling chip 19; the integrated cover is provided with a power interface 15, which is connected to the PCB board 8; a temperature control module 16, a power positive and negative control module 17, and a current control module 18 are provided on the PCB board 8; the power connector is connected to the step-down module 14.

[0039] The temperature control screen 13 uses an internal temperature sensor to reflect the surface temperature of the device to the outside in real time, making the temperature visible and enabling temperature control operations.

[0040] The step-down module 14 is used to reduce the input 24V power supply to 12V and output it to the cooling fan 25 and the fluid pump 22;

[0041] The power interface 15 is used to connect to an external power source. The temperature control module 16 is used to receive the monitoring information from the temperature sensor and feed it back to the temperature control screen 13. The temperature sensor is set on the micro flow channel plate 9. The temperature control module 16 integrates a receiver and can work with the external temperature control remote control switch 12 to remotely control the operation of the entire device and switch between cooling and heating modes.

[0042] The power supply positive and negative control module 17 is used to control the positive and negative polarity of the electrodes, thereby controlling the switching of the cooling and heating modes of the semiconductor refrigeration chip 19.

[0043] The current control module 18 is used for controlling the total current, controlling the working temperature of the semiconductor refrigeration sheet 19, and achieving the purpose of refrigeration and heating temperature control.

[0044] As shown in Figure 6 The refrigeration and heating component 7 includes the semiconductor refrigeration sheet 19 and two water cooling heads 20, the semiconductor refrigeration sheet 19 is connected with the PCB, and the two water cooling heads 20 are arranged on the two sides of the semiconductor refrigeration sheet 19, the water cooling head 20 is internally provided with a fluid cavity, the heat dissipation component 5 includes the cold row radiator 24 and the heat dissipation fan 25, the cold row radiator 24 is internally provided with a heat dissipation cavity, the heat dissipation cavity is communicated with the fluid cavity, and the heat dissipation fan 25 is attached to one side of the cold row radiator 24; the fluid circulation power component 6 includes the fluid pump 22 and the fluid pipeline 23, the fluid pipeline 23 is communicated between the water cooling head 20 and the cold row radiator 24 or between the water cooling head 20 and the fluid flow channel, the water cooling head 20, the cold row radiator 24, the fluid flow channel and the fluid pipeline 23 are all filled with fluid, and the fluid pump 22 is used for driving the fluid to circulate and flow.

[0045] The two water cooling heads 20 and the cold row radiator 24 and the fluid flow channel form a double circulation passage, the circulation passage formed by the water cooling head 20 and the fluid flow channel is used for refrigeration and heating of the micro flow channel plate 9, and the circulation passage formed by the water cooling head 20 and the cold row radiator 24 is used for quickly dissipating heat at the hot end of the semiconductor refrigeration sheet 19 or increasing the heat capacity of the cold end, so as to achieve the purpose of continuous refrigeration and heating.

[0046] The semiconductor refrigeration sheet 19 is used as a cold and hot source for refrigeration and heating, is tightly attached between the two water cooling heads 20 by being uniformly covered with heat-conductive silicone grease on both sides, and has the effect of high-efficiency heat transfer, and the model is selected as 40*80mm TEC1-25506 semiconductor refrigeration sheet 19 under the banner of Jiangsu Xinghe Electronics;

[0047] The water cooling head 20 is used as a container for high-efficiency heat transfer between the fluid and the refrigeration sheet, and the model is selected as 40*80mm water cooling head 20 under the banner of Jiangsu Xinghe Electronics;

[0048] The fluid is used as the core of the whole container, has the characteristics of high thermal conductivity, high temperature resistance, low temperature resistance and the like, has strong environmental adaptability, has a small storage capacity in the container, and cooperates with the remaining devices to realize the characteristics of low power consumption, high operation efficiency and fast response speed of the devices, and the fluid material is selected as the antifreeze solution under the banner of Great Hornet Automobile Technology, and can also be selected as an alcohol mixed formula solution, an amine solution and the like according to actual conditions;

[0049] The fluid pump 22 is used as the power source for fluid circulation, controls the flow rate of fluid circulation, is screwed on the inner wall of the integrated cover, adopts a medium-high pressure fluid pump 22, and the model is selected as 358 fluid pump 22 under the banner of Shunbao Technology;

[0050] The fluid pipe 23 is used as a pipe container of fluid, and is made of material which is not easy to age and is not easy to be excessively bent.

[0051] The cold radiator 24 is used for expanding the area of fluid, and is matched with the heat dissipation fan 25 to dissipate heat for the semiconductor refrigeration sheet 19, so that the purpose of continuous refrigeration and heating is achieved.

[0052] The heat dissipation fan 25 is used for inhaling air in the internal space, and the air flow is quickly and widely passed through the internal heat dissipation structure of the cold radiator 24 by the large air pressure generated by the fan, so that the high-efficiency heat dissipation effect is achieved.

[0053] The fan speed regulator 26 is arranged on the heat dissipation fan 25, and is used for controlling the rotating speed of the heat dissipation fan 25, so that the device is economically operated, and the noise generated by the device is greatly reduced when the device is operated at a lower rotating speed.

[0054] The technical scheme of the utility model can be widely applied to pet constant-temperature seat cushions / pet bed, intelligent mouse cushions / table cushions, constant-temperature office tables, cold and hot temperature control seat cushions, constant-temperature seats / couches, constant-temperature cup cushions, vehicle-mounted temperature control seat cushions and other personal and family consumption scenes, and can also be applied to physiotherapy devices, nursing beds and other medical and health care scenes.

[0055] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form, and any simple modification, equivalent change and modification made according to the technical essence of the utility model to the above embodiment are within the scope of the technical scheme of the utility model.

Claims

1. An integrated dual-cycle hot and cold temperature control device, characterized in that, The device includes a micro-flow channel plate and an integrated cover. The integrated cover is disposed at one end of the micro-flow channel plate. The integrated cover contains an integrated component, which includes a fluid circulation power component, a cooling and heating component, and a heat dissipation component. The micro-flow channel plate has a fluid flow channel. The fluid circulation power component is used to circulate fluid to the fluid flow channel or the heat dissipation component. The cooling and heating component is used to cool or heat the fluid.

2. The integrated dual-cycle hot and cold temperature control device according to claim 1, characterized in that, The micro-flow channel plate is provided with a flow channel plate insulation layer, and a device base is provided at the bottom of the micro-flow channel plate.

3. The integrated dual-cycle hot and cold temperature control device according to claim 1, characterized in that, A temperature control screen is provided on one side of the integrated cover.

4. The integrated dual-cycle hot and cold temperature control device according to claim 3, characterized in that, The integrated cover contains a PCB board, which is connected to the temperature control screen.

5. The integrated dual-cycle hot and cold temperature control device according to claim 4, characterized in that, The integrated cover is equipped with a power interface, which is connected to the PCB board.

6. The integrated dual-cycle hot and cold temperature control device according to claim 4, characterized in that, The cooling and heating component includes a thermoelectric cooler and two water cooling heads. The thermoelectric cooler is connected to the PCB, and the two water cooling heads are respectively disposed on both sides of the thermoelectric cooler. Each water cooling head has a fluid cavity inside, and the water cooling head forms a circulation path with the heat dissipation component or fluid flow channel.

7. The integrated dual-cycle hot and cold temperature control device according to claim 6, characterized in that, The heat dissipation component includes a radiator and a cooling fan. The radiator has a heat dissipation cavity that is connected to a fluid cavity. The cooling fan is attached to one side of the radiator.

8. The integrated dual-cycle hot and cold temperature control device according to claim 7, characterized in that, The fluid circulation power component includes a fluid pump and a fluid pipe. The fluid pipe connects the water cooling head to the radiator or connects the water cooling head to the fluid flow channel. The water cooling head, radiator, fluid flow channel, and fluid pipe are all filled with fluid. The fluid pump is used to drive the fluid circulation flow.

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