Heat dissipation device for manufacturing diamond substrate

Abstract

The utility model discloses a heat dissipation device for manufacturing a diamond substrate, which comprises a working table, a frame is fixedly mounted at the center of the top of the working table, fixing components for fixing the diamond substrate are arranged on the inner walls of the two sides of the frame, a groove is formed in the top of the working table and corresponds to the frame, and the diamond substrate is arranged in the groove. A groove is formed in the bottom of the diamond substrate, a heat conducting plate is fixedly installed at a groove opening of the groove, a heat conducting layer is arranged at the top of the heat conducting plate, the top of the heat conducting layer is in contact with the bottom of the diamond substrate, and a heat dissipation assembly used for conducting heat dissipation on the heat conducting plate is arranged in an inner cavity of the groove. The diamond substrate is placed on the heat conducting plate in the frame and fixed through the fixing assembly, the diamond substrate makes full contact with the heat conducting plate, then the heat conducting plate can conduct out heat generated in a grinding area of the diamond substrate in time, and heat accumulation in the diamond substrate is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to the heat abstractor technical field of manufacturing diamond substrate, specifically is a kind of heat abstractor of manufacturing diamond substrate. BACKGROUND

[0002] Diamond has extremely high thermal conductivity, is several times of copper, as substrate, can quickly dissipate the heat generated when electronic device runs, avoid device to decline due to overheating performance, shortened life or even damage, substantially improve the reliability and stability of high-power, high-frequency electronic device.

[0003] At present, the Chinese patent with announcement number CN217493856U discloses a clamp structure for white single crystal diamond substrate grinding, the clamp structure for white single crystal diamond substrate grinding includes: bottom plate and the fixed frame fixedly connected on one side of the bottom plate, the polishing disc is installed on the fixed frame, the sliding slot is opened on the bottom plate, the installation cavity is slidably connected in the sliding slot, two clamping plates, two through holes are opened on the upper side wall of the installation cavity, two clamping plates are slidably connected in the through hole respectively, fixed component, the fixed component includes push plate, sliding plate, the sliding plate is slidably connected on the installation cavity, the push plate is fixedly connected on the sliding plate through spring, the fixed component is used for pre-fixing the object to be polished, the utility model in two silk cap continues to move in the middle and extrudes clamping plate respectively, so that two clamping plates move in the middle, can reach the fixation, clamping of the object to be polished.

[0004] The clamp structure for white single crystal diamond substrate grinding still has some problems in use, because diamond has extremely high hardness, when abrasive polishes diamond, friction can convert a large amount of mechanical energy into heat energy, cause the temperature of polishing area to rise sharply, destroy the crystal integrity, and further affect its physical properties. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of heat abstractor of manufacturing diamond substrate to solve the problems raised in the above background.

[0006] To achieve the above object, the utility model provides the following technical scheme:

[0007] The application discloses a heat dissipation device for manufacturing diamond substrate, which comprises a workbench, a frame is fixedly installed at the top center of the workbench, a fixing assembly for fixing the diamond substrate is arranged on the inner wall of the frame, a recess is formed in the top of the workbench and in a position corresponding to the frame, a heat conduction plate is fixedly installed at the opening of the recess, a heat conduction layer is arranged on the top of the heat conduction plate, the top of the heat conduction layer is in contact with the bottom of the diamond substrate, a heat dissipation assembly for dissipating heat of the heat conduction plate is arranged in the inner cavity of the recess, and a square groove is formed in the front side of the workbench, a cooling assembly for cooling the frame is arranged in the inner cavity of the square groove.

[0008] As a preferred technical scheme, the heat dissipation assembly comprises a containing groove formed in the front side of the workbench, a communication hole is arranged at the end of the containing groove and communicates with the recess, an exhaust hole is formed in the rear side of the workbench and communicates with the containing groove, a heat dissipation fan is fixedly inserted into the opening of the containing groove, and a plurality of groups of heat dissipation fins are fixedly connected to the bottom of the heat conduction plate.

[0009] As a preferred technical scheme, the cooling assembly comprises a heat dissipation coil pipe arranged in the frame, a water storage tank is arranged in the inner cavity of the square groove, a circulating water pump is arranged in the inner cavity of the square groove and located at one side of the water storage tank, the input end of the circulating water pump communicates with the inner cavity of the water storage tank, the output end of the circulating water pump is communicated with a conveying pipe, the other end of the conveying pipe is communicated with the input end of the heat dissipation coil pipe, and the output end of the heat dissipation coil pipe is connected with the water storage tank through a communication assembly.

[0010] As a preferred technical scheme, the communication assembly comprises a connecting pipe communicated with the output end of the heat dissipation coil pipe, the other end of the connecting pipe extends to the inner cavity of the containing groove, a heat dissipation pipe is connected to the end of the connecting pipe located in the inner cavity of the containing groove, the other end of the heat dissipation pipe penetrates through the containing groove and is communicated with an output pipe, and the other end of the output pipe is communicated with the inner cavity of the water storage tank.

[0011] As a preferred technical scheme, the heat dissipation pipe is arranged in a spiral shape.

[0012] As a preferred technical scheme, the fixing assembly comprises two groups of U-shaped frames inserted into the surfaces of the two sides of the frame, the openings of the two groups of U-shaped frames are oppositely arranged, the openings of the two groups of U-shaped frames are fixedly connected with clamping plates, the middle parts of the opposite sides of the two groups of U-shaped frames are threadedly connected with screw rods, the screw rods are respectively threadedly penetrated through the surfaces of the corresponding U-shaped frames and are rotationally connected to the corresponding surfaces of the frame through connecting columns, and the opposite ends of the two groups of screw rods are fixedly connected with hand wheels.

[0013] As a preferred technical scheme, the four corners of the frame are provided with air suction pipes, the mouths of the four groups of air suction pipes are located in the inner cavities of the frame, the other ends of the four groups of air suction pipes extend downward and are communicated with the inner cavities of the grooves, and the four groups of air suction pipes are communicated with filtering assemblies for filtering air in the air suction pipes to prevent the air from entering the grooves.

[0014] As a preferred technical scheme, the filtering assembly comprises a box body communicated with the middle part of the air suction pipe, the inner cavities of the box body are sealedly provided with N-shaped plates, the bottom mouths of the N-shaped plates are fixedly connected with filtering plates, the outer sides of the top parts of the box bodies are fixedly connected with fixing strips, the surfaces of the N-shaped plates are fixedly connected with connecting strips, the top parts of the fixing strips are provided with connecting bolts, and the connecting bolts pass through the fixing strips and are screw-connected to the top parts of the connecting strips.

[0015] Compared with the prior art, the utility model has the advantages that:

[0016] 1、The diamond substrate is placed on the heat-conducting plate in the frame and is fixed through the fixing assembly, so that the diamond substrate is in full contact with the heat-conducting plate, the heat-conducting plate can timely conduct the heat generated in the polishing area of the diamond substrate, heat accumulation in the diamond substrate is avoided, external air is sucked into the containing slot through the heat-dissipating fan, the air enters the groove through the communication holes and is in full contact with the heat-conducting plate and the heat-dissipating fins at the bottom of the heat-conducting plate, the air can absorb the heat transferred by the heat-conducting plate and is discharged from the exhaust hole, the bottom of the diamond substrate is continuously cooled, the heat generated by the diamond substrate can be quickly and effectively dissipated to the external environment, the temperature of the diamond substrate is reduced, and the influence of high temperature on the microstructure and crystal integrity of the diamond substrate is reduced.

[0017] 2、The cooling assembly is arranged, the cooling liquid is circulated in the heat-dissipating coil pipe and the heat-dissipating pipe through the circulating water pump, the cooling liquid absorbs the heat of the frame when flowing in the heat-dissipating coil pipe, the temperature of the frame can be effectively reduced, the heat generated by the frame due to diamond polishing work can be quickly absorbed, and the influence on the diamond is avoided.

[0018] 3、The air suction pipe is arranged, the hot air in the frame is sucked into the groove through the air suction pipe due to the negative pressure formed by the heat-dissipating fan in the groove, the hot air is discharged from the exhaust hole, and the temperature in the frame can be effectively controlled. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a structure schematic view of the heat-dissipating device for manufacturing the diamond substrate of the utility model;

[0020] Figure 2 It is a sectional structure schematic view of the workbench of the utility model;

[0021] Figure 3 It is the structure schematic view of the heat dissipation pipe of the utility model;

[0022] Figure 4 It is the structure schematic view of the frame of the utility model.

[0023] Figure 5 It is the structure schematic view of the box of the utility model.

[0024] In the drawing,

[0025] 100, workbench; 101, frame; 102, suction pipe; 103, square groove; 104, containing groove; 105, communication hole; 106, recess; 107, heat conduction plate; 108, heat dissipation fin; 109, exhaust hole;

[0026] 200, U-shaped frame; 201, hand wheel; 202, screw; 203, connecting column; 204, clamping plate;

[0027] 300, heat conduction layer;

[0028] 400, water storage tank; 401, heat dissipation pipe; 402, output pipe; 403, circulating water pump; 404, conveying pipe; 405, connecting pipe; 406, heat dissipation coil pipe; 407, heat dissipation wind;

[0029] 500, box; 501, connecting bolt; 502, fixed strip; 503, U-shaped plate; 504, filter plate; 505, connecting strip. DETAILED DESCRIPTION

[0030] The technical scheme in the embodiments of the utility model will be described clearly and completely below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor are within the protection scope of the utility model.

[0031] Please refer to Figures 1-5The embodiment provides a heat dissipation device for manufacturing a diamond substrate, which comprises a workbench 100, a frame 101 is fixedly installed at the top center of the workbench 100, a fixing assembly for fixing the diamond substrate is arranged on the inner wall of the frame 101, a recess 106 is formed at the top of the workbench 100 and in a position corresponding to the frame 101, a heat conduction plate 107 is fixedly installed at the opening of the recess 106, a heat conduction layer 300 is arranged at the top of the heat conduction plate 107, the top of the heat conduction layer 300 is in contact with the bottom of the diamond substrate, a heat dissipation assembly for dissipating heat of the heat conduction plate 107 is arranged in the inner cavity of the recess 106, a square groove 103 is formed at the front side of the workbench 100, and a cooling assembly for cooling the frame 101 is arranged in the inner cavity of the square groove 103.

[0032] The heat dissipation assembly comprises a containing groove 104 formed at the front side of the workbench 100, the end of the containing groove 104 is provided with a communication hole 105 in communication with the recess 106, an exhaust hole 109 in communication with the containing groove 104 is formed at the back side of the workbench 100, a heat dissipation fan 407 is fixedly inserted into the opening of the containing groove 104, and a plurality of groups of heat dissipation fins 108 are fixedly connected to the bottom of the heat conduction plate. Through the arrangement of the heat dissipation assembly, the diamond substrate is placed on the heat conduction plate 107 in the frame 101 and is fixed through the fixing assembly, so that the diamond substrate is in full contact with the heat conduction plate 107, and then the heat conduction plate 107 can timely conduct the heat generated in the polishing area of the diamond substrate to the outside, thereby avoiding the accumulation of heat in the diamond substrate. Meanwhile, the heat dissipation fan 407 sucks the external air into the containing groove 104 from the opening of the containing groove 104, the air enters the recess 106 through the communication hole 105 and is in full contact with the heat conduction plate 107 and the heat dissipation fins 108 at the bottom of the heat conduction plate 107, the air can absorb the heat transferred by the heat conduction plate 107 and is then discharged from the exhaust hole 109, thereby continuously dissipating heat at the bottom of the diamond substrate, and the heat generated by the diamond substrate can be quickly and effectively dissipated to the external environment, the temperature of the diamond substrate is reduced, and the influence of high temperature on the microstructure and the crystal integrity of the diamond substrate is reduced.

[0033] The heat conduction layer 300 is one or a combination of copper, aluminum, boron nitride and diamond sheet.

[0034] The cooling assembly comprises a heat dissipation coil 406 arranged inside the frame 101, the inner cavity of the square groove 103 is provided with a water storage tank 400, the inner part of the square groove 103 and the side of the water storage tank 400 are provided with a circulating water pump 403, the input end of the circulating water pump 403 is communicated with the inner part of the water storage tank 400, the output end of the circulating water pump 403 is communicated with a conveying pipe 404, the other end of the conveying pipe 404 is communicated with the input end of the heat dissipation coil 406, and the output end of the heat dissipation coil 406 is connected with the water storage tank 400 through a communication assembly. Through the arrangement of the cooling assembly, the circulating water pump 403 makes the cooling liquid circulate in the heat dissipation coil 406 and the heat dissipation pipe 401, the cooling liquid absorbs the heat of the frame 101 when flowing in the heat dissipation coil 406, so that the temperature of the frame 101 can be effectively reduced, thereby the heat generated by the diamond polishing operation can be quickly absorbed, and the diamond is prevented from being affected.

[0035] The communication assembly comprises a connecting pipe 405 communicated with the output end of the heat dissipation coil 406, the other end of the connecting pipe 405 extends to the inner cavity of the containing groove 104, the end of the connecting pipe 405 arranged in the containing groove 104 is connected with the heat dissipation pipe 401, the other end of the heat dissipation pipe 401 penetrates the containing groove 104 and is communicated with the output pipe 402, and the other end of the output pipe 402 is communicated with the inner part of the water storage tank 400; the heat dissipation pipe 401 is arranged in a spiral shape, the connecting pipe 405 connects the heat dissipation coil 406 and the heat dissipation pipe 401, the heat dissipation pipe 401 is arranged in a spiral shape in the containing groove 104, and the heat dissipation fan 407 blows the wind to cool, and the output pipe 402 sends the cooled cooling liquid back to the water storage tank 400, so that the energy is fully utilized, and the spiral heat dissipation pipe 401 significantly increases the heat dissipation area, prolongs the heat dissipation path and residence time of the cooling liquid, and enables the cooling liquid to be more fully cooled.

[0036] The fixing assembly comprises two groups of U-shaped frames 200 inserted into the surfaces of the frame 101, the mouths of the two groups of U-shaped frames 200 are arranged in opposition, the mouths of the two groups of U-shaped frames 200 are fixedly connected with clamping plates 204, the middle parts of the sides of the two groups of U-shaped frames 200 are threadedly connected with screw rods 202, the two groups of screw rods 202 are respectively threadedly penetrated through the surfaces of the corresponding sides of the U-shaped frames 200 and are rotationally connected to the corresponding side surfaces of the frame 101 through connecting columns 203, and the opposite ends of the two groups of screw rods 202 are fixedly connected with hand wheels 201. Through the arrangement of the fixing assembly, the screw rod 202 is driven to rotate by rotating the hand wheel 201, so that the U-shaped frame 200 moves along the surface of the frame 101, the clamping plate 204 clamps and fixes the diamond substrate, the operation is simple and convenient, the adjustment is flexible, and the diamond substrate of different sizes can be adapted.

[0037] The four upper corners of the frame 101 are inserted with air suction pipes 102, the mouths of the four groups of air suction pipes 102 are located in the inner cavity of the frame 101, the other ends of the four groups of air suction pipes 102 extend downward and communicate with the inner cavity of the groove 106, the four groups of air suction pipes 102 are communicated with filter assemblies for filtering the air in the air suction pipe to prevent it from entering the groove 106. Through the arrangement of the air suction pipe 102, the hot air in the frame 101 is sucked into the groove 106 through the air suction pipe 102 due to the negative pressure formed by the heat dissipation fan 407, so that the hot air is discharged from the exhaust hole 109, thereby effectively controlling the temperature inside the frame 101.

[0038] The filter assembly includes a box body 500 communicated with the middle part of the air suction pipe 102, the inner cavity of the box body 500 is sealed and inserted with a U-shaped plate 503, the bottom of the U-shaped plate 503 is fixedly connected with a filter plate 504, the outer top of the box body 500 is fixedly connected with a fixed strip 502, the surface of the U-shaped plate 503 is fixedly connected with a connecting strip 505, the top of the fixed strip 502 is inserted with a connecting bolt 501, the connecting bolt 501 penetrates through the fixed strip 502 and is screw-connected to the top of the connecting strip 505. Through the arrangement of the filter assembly, the impurities in the hot air can be filtered to prevent them from accumulating in the groove 106 and affecting the heat dissipation effect of the heat dissipation fins 108. At the same time, when the filter plate 504 accumulates too many impurities to affect the filtering effect, the operator only needs to unscrew the connecting bolt 501 to easily remove the U-shaped plate 503 and the filter plate 504 for cleaning or replacement. The convenient maintenance design ensures that the filter assembly can always maintain good filtering performance and continuously and effectively intercept impurities in the hot air.

[0039] Working principle;

[0040] Firstly, the diamond substrate is placed on the heat conduction plate 107 in the frame 101, and the position is adjusted to a suitable state;

[0041] Subsequently, the hand wheels 201 on the two groups of U-shaped frames 200 are rotated, the hand wheels 201 drive the rotation of the screw rods 202, the rotation of the screw rods 202 drives the U-shaped frames 200 to move towards each other along the surface of the frame 101, so that the clamps 204 of the mouths of the U-shaped frames 200 gradually approach and clamp the diamond substrate, and the diamond substrate is fixed, and a polishing tool is used to polish the diamond substrate;

[0042] At this time, the heat dissipation fan 407 is started, the fan sucks the external air from the mouth of the containing groove 104, the air enters the groove 106 through the communication hole 105, fully contacts with the heat conduction plate 107 and the heat dissipation fins 108 at the bottom thereof, and is discharged from the exhaust hole 109 after absorbing the heat transferred to the heat conduction plate 107 by the diamond substrate, thereby continuously dissipating heat at the bottom of the diamond substrate;

[0043] When the fan is started, the circulating water pump 403 is started, the circulating water pump 403 draws water from the water storage tank 400, and the cooling liquid is sent into the heat dissipation coil 406 in the frame 101 through the delivery pipe 404, the cooling liquid flows in the heat dissipation coil 406, absorbs the heat of the frame 101, and then enters the heat dissipation pipe 401 in the containing groove 104 through the connecting pipe 405, at the same time, the heat dissipation pipe 401 is spiral, which increases the heat dissipation area and the residence time of the cooling liquid, the cooling liquid is fully cooled in the heat dissipation pipe 401, and finally flows back to the water storage tank 400 through the output pipe 402, forming a circulating cooling, and continuously cooling the frame 101.

[0044] During the operation of the equipment, the recess 106 forms a negative pressure due to the action of the heat dissipation fan 407, the hot air in the frame 101 is sucked into the recess 106 through the air suction pipe 102, at the same time, when the hot air passes through the box body 500 in the middle part of the air suction pipe 102, the impurities in the hot air are intercepted by the filter plate 504 at the bottom of the amphisbaena plate 503, the filtered clean air enters the recess 106 and is discharged from the air outlet hole 109.

[0045] The blockage of the filter plate 504 is checked regularly, if there are many impurities on the filter plate 504, the amphisbaena plate 503 can be disassembled by the connecting bolt 501, and the filter plate 504 is cleaned or replaced to ensure the filtering effect. At the same time, the running state of each part is checked, such as the working state of the heat dissipation fan 407 and the circulating water pump 403, and whether each pipe is leaked or not, so as to ensure the stable operation of the equipment.

[0046] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device for manufacturing diamond substrates, characterized in that, The device includes a workbench (100), a frame (101) fixedly mounted at the top center of the workbench (100), and fixing components for fixing a diamond substrate provided on the inner walls of both sides of the frame (101). A groove (106) is provided on the top of the workbench (100) and at a position corresponding to the frame (101). A heat-conducting plate (107) is fixedly mounted at the opening of the groove (106). A heat-conducting layer (300) is provided on the top of the heat-conducting plate (107). The top of the heat-conducting layer (300) contacts the bottom of the diamond substrate. A heat dissipation component for dissipating heat from the heat-conducting plate (107) is provided in the inner cavity of the groove (106). A square groove (103) is provided on the front side of the workbench (100). A cooling component for cooling the frame (101) is provided in the inner cavity of the square groove (103).

2. The heat dissipation device for manufacturing a diamond substrate according to claim 1, characterized in that: The heat dissipation assembly includes a receiving groove (104) opened on the front side of the workbench (100), the end of the receiving groove (104) is provided with a connecting hole (105) for connecting groove (106), the rear side of the workbench (100) is provided with an exhaust hole (109) for connecting the receiving groove (104), a cooling fan (407) is fixedly inserted into the opening of the receiving groove (104), and a number of heat dissipation fins (108) are fixedly connected to the bottom of the heat conduction plate.

3. The heat dissipation device for manufacturing a diamond substrate according to claim 2, characterized in that: The cooling assembly includes a heat dissipation coil (406) disposed inside the frame (101). A water storage tank (400) is disposed in the inner cavity of the square groove (103). A circulating water pump (403) is disposed inside the square groove (103) and on one side of the water storage tank (400). The input end of the circulating water pump (403) is connected to the inside of the water storage tank (400). The output end of the circulating water pump (403) is connected to a delivery pipe (404). The other end of the delivery pipe (404) is connected to the input end of the heat dissipation coil (406). The output end of the heat dissipation coil (406) is connected to the water storage tank (400) through a connecting assembly.

4. A heat dissipation device for manufacturing a diamond substrate according to claim 3, characterized in that: The connecting component includes a connecting pipe (405) connected to the output end of the heat dissipation coil (406), the other end of the connecting pipe (405) extending into the inner cavity of the receiving groove (104), the end of the connecting pipe (405) located inside the receiving groove (104) is connected to a heat dissipation pipe (401), the other end of the heat dissipation pipe (401) passes through the receiving groove (104) and is connected to an output pipe (402), the other end of the output pipe (402) is connected to the interior of the water storage tank (400).

5. A heat dissipation device for manufacturing a diamond substrate according to claim 4, characterized in that: The heat dissipation pipe (401) is arranged in a spiral shape.

6. A heat dissipation device for manufacturing a diamond substrate according to claim 1, characterized in that: The fixing assembly includes U-shaped frames (200) inserted into the two side surfaces of the frame (101). The openings of the two sets of U-shaped frames (200) are arranged opposite to each other. Each opening of the two sets of U-shaped frames (200) is fixedly connected to a clamp (204). Each side of the two sets of U-shaped frames (200) is threaded with a screw (202). Each set of screws (202) is threaded through the surface of the corresponding side U-shaped frame (200) and rotatably connected to the corresponding side surface of the frame (101) through a connecting post (203). Each opposite end of the two sets of screws (202) is fixedly connected to a handwheel (201).

7. A heat dissipation device for manufacturing a diamond substrate according to claim 1, characterized in that: The four corners of the frame (101) are each connected to an air intake tube (102). The openings of the four air intake tubes (102) are located in the inner cavity of the frame (101). The other ends of the four air intake tubes (102) extend downward and connect to the inner cavity of the groove (106). The four air intake tubes (102) are all connected to a filter assembly for filtering the air in the intake tube to prevent it from entering the groove (106).

8. A heat dissipation device for manufacturing a diamond substrate according to claim 7, characterized in that: The filter assembly includes a housing (500) connected to the middle of the intake pipe (102). The inner cavity of the housing (500) is sealed with U-shaped plates (503). The bottom opening of each U-shaped plate (503) is fixedly connected with a filter plate (504). The top outer side of the housing (500) is fixedly connected with a fixing strip (502). The surface of the U-shaped plate (503) is fixedly connected with a connecting strip (505). The top of the fixing strip (502) is inserted with a connecting bolt (501). The connecting bolt (501) passes through the fixing strip (502) and is threaded to the top of the connecting strip (505).

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