Silicon wafer drying device and laser scribing equipment

Abstract

The utility model discloses a silicon wafer drying device and laser scribing equipment. The silicon wafer drying device comprises a transmission assembly used for conveying silicon wafers; the heat preservation assembly comprises a heat preservation box covering part of the transmission assembly and an exhaust structure located in the heat preservation box, and an air outlet of the exhaust structure faces the silicon wafers on the transmission assembly; the air collecting assembly comprises at least one air chamber located below the conveying assembly, and each air chamber communicates with the air exhaust structure through a first pipeline; the heating assembly is used for heating air passing through the air chamber; the air chamber is used for collecting hot air in the heat preservation box and conveying the hot air into the air exhaust structure through the first pipeline, so that cyclic utilization of the hot air is achieved. According to the utility model, the hot air in the heat insulation box is blown to the silicon wafer again through the circulating air duct formed by the heat insulation box, the first pipeline and the air chamber, so that the composite drying of heat conduction heating air circulation is realized, the drying speed is accelerated, the heat loss is reduced, and the energy consumption is further reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor device technical field especially, it relates to a silicon wafer drying device and laser scribing equipment. BACKGROUND

[0002] Preparation high density photovoltaic module, usually need to cut the complete cell piece first into small size cell piece, then stack or piece together multiple small size cell piece into cell string. Among them, because the nondestructive laser scribing technology can realize high precision, high efficiency processing, and the damage to silicon wafer (cell piece) is small, it is widely used in the field of cell piece cutting.

[0003] When cutting cell piece by using nondestructive laser scribing technology, cooling water needs to be sprayed to cell piece, which causes the silicon wafer after scribing to have water droplets, and the water droplets on the silicon wafer need to be dried before the next process.

[0004] However, the existing silicon wafer drying mechanism usually sets a heating device under the silicon wafer conveying belt to dry the silicon wafer during the silicon wafer transmission process, but this way has slow drying speed, resulting in a too long drying conveying belt, large space occupation, serious heat loss, and high energy consumption. UTILITY MODEL CONTENTS

[0005] The utility model provides a silicon wafer drying device and laser scribing equipment for solving the problem of slow drying speed, serious heat loss, and high energy consumption of the silicon wafer drying mechanism in the prior art.

[0006] The technical scheme of the utility model is a silicon wafer drying device, which comprises a transmission assembly for conveying silicon wafers; and further comprises:

[0007] A heat preservation assembly comprises a heat preservation box covering part of the transmission assembly, and an exhaust structure located in the heat preservation box and having an air outlet facing the silicon wafers on the transmission assembly;

[0008] A wind collecting assembly comprises at least one wind chamber located below the transmission assembly, and each wind chamber is communicated with the exhaust structure through a first pipeline;

[0009] A heating assembly is used to heat the air passing through the wind chamber;

[0010] The wind chamber is used to collect the hot air in the heat preservation box and deliver it to the exhaust structure through the first pipeline, so as to realize the recycling of the hot air.

[0011] Further, the heat preservation assembly further comprises:

[0012] A flow distribution member is arranged on one or both sides of the width direction of the conveying assembly, and a plurality of air outlet openings are arranged on the flow distribution member.

[0013] Further, the conveying assembly comprises a conveying belt, and a plurality of through holes are arranged on the conveying belt in a continuous and dense manner.

[0014] The air chamber collects the hot air discharged by the air exhaust structure through the through holes.

[0015] Further, an air exhaust structure is arranged in each air chamber, and the air exhaust structure is used to draw the hot air in the heat preservation box into the air chamber.

[0016] Further, the air collecting assembly further comprises a flow collecting member and a flow collecting pipeline.

[0017] Each air chamber is a vacuum sealed structure, and an air outlet of each air chamber is communicated with the flow collecting member through a vacuum joint, and the flow collecting member is communicated with the first pipeline through at least one flow collecting pipeline.

[0018] At least one vacuum pump is arranged in the flow collecting member and / or the flow collecting pipeline and / or the first pipeline.

[0019] Further, at least one filter assembly is arranged in the vacuum joint and / or the flow collecting member and / or the flow collecting pipeline and / or the first pipeline.

[0020] Further, each air exhaust structure is correspondingly provided with a mounting bracket, and the mounting bracket comprises a first support and a second support.

[0021] The first support is vertically arranged on one side of the width direction of the conveying assembly, and the second support is horizontally arranged and extends above the conveying assembly.

[0022] A first sliding groove is arranged on one side of the second support along the axial direction of the second support, and one end of the second support is slidingly connected with the first sliding groove, and the other end of the second support is connected with the air exhaust structure.

[0023] The second support can move along the extension direction of the first sliding groove to adjust the height of the air exhaust structure relative to the conveying assembly.

[0024] Further, a second sliding groove is arranged on the other end of the second support away from the first sliding groove along the axial direction of the second support, and one end of the air exhaust structure is slidingly connected with the second sliding groove.

[0025] The air exhaust structure can move along the extension direction of the second sliding groove to adjust the transverse position of the air exhaust structure relative to the conveying assembly.

[0026] Further, the conveying assembly is sequentially provided with a heat preservation assembly and a cooling platform along its conveying direction, and the cooling platform is located downstream of the heat preservation assembly.

[0027] A visual detection assembly is arranged above the cooling platform, and the visual detection assembly is used for detecting whether the silicon wafer is damaged.

[0028] The utility model also provides a laser scribing equipment, the laser scribing equipment includes the silicon wafer drying device of above described.

[0029] Compared with the prior art, the utility model has at least the following beneficial effects:

[0030] The utility model discloses a circulating air duct formed by heat preservation box, first pipeline and air chamber, and hot air in the heat preservation box is blown to the silicon wafer again, realizes the composite drying of heat conduction heating air circulation, which not only speeds up the drying speed, but also reduces heat loss, and further reduces energy consumption. BRIEF DESCRIPTION OF DRAWINGS

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the utility model belongs; the terms used in the specification of the application are only for the purpose of describing the specific embodiments and are not intended to limit the utility model; the terms "include" and "have" in the specification and claims of the utility model and the above description of drawings are intended to cover the non-exclusive inclusion; the terms "first", "second" and the like in the specification and claims of the utility model or the above description of drawings are used to distinguish different objects, not to describe a specific sequence.

[0032] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained without creative labor under the premise of these drawings.

[0033] Figure 1 The structure diagram of the silicon wafer drying device of the utility model is shown in the figure.

[0034] Figure 2 The partial internal structure diagram of the silicon wafer drying device of the utility model is shown in the figure.

[0035] Figure 3 The enlarged schematic view of the reference sign A in the figure is shown in the figure. Figure 2

[0036] Figure 4 ​The hot air circulation schematic view of the silicon wafer drying device is provided in the utility model.

[0037] Figure 5 The partial internal structure schematic view of the bottom of the silicon wafer drying device is provided in the utility model.

[0038] Reference signs:

[0039] 10, transmission assembly; 101, conveying belt; 102, through hole;

[0040] 20, heat preservation assembly; 201, heat preservation box; 202, exhaust structure; 203, shunt; 204, exhaust port; 205, mounting frame; 2051, first support; 2052, second support; 2053, first sliding groove; 2054, second sliding groove;

[0041] 30, heating assembly;

[0042] 40, air collecting assembly; 401, air chamber; 402, first pipeline; 403, exhaust structure; 404, converging piece; 405, converging pipeline; 406, vacuum joint; 407, vacuum pump;

[0043] 50, filtering assembly;

[0044] 60, cooling platform;

[0045] 70, silicon wafer. DETAILED DESCRIPTION

[0046] In order to make the technical problems, technical schemes and beneficial effects of the utility model to be solved more clearly, the following will be further described in detail in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model, and are not used to limit the utility model. Therefore, the features mentioned in the specification are used to explain one of the features of one embodiment of the utility model, and are not meant to imply that each embodiment of the utility model must have the features explained. In addition, it should be noted that the specification describes many features. Although some features can be combined together to show possible system designs, these features can also be used in other combinations that are not explicitly described. Therefore, unless otherwise stated, the combinations explained are not intended to be limiting.

[0047] The principles and structures of the utility model will be described in detail in combination with the drawings and examples.

[0048] In some embodiments, in order to improve the drying speed, reduce heat loss and reduce energy consumption, such as Figure 1 , Figure 2 and Figure 4As shown, the utility model provides a kind of silicon wafer drying device, including the transmission component 10 for conveying silicon wafer 70;Still include:

[0049] Heat preservation component 20, including the heat preservation box 201 covering part of the transmission component 10, and the exhaust structure 202 in the heat preservation box 201 and the air outlet towards the silicon wafer 70 on the transmission component 10;

[0050] Air collecting component 40, including at least one air chamber 401 below the transmission component 10, each air chamber 401 is communicated with the exhaust structure 202 by first pipeline 402;

[0051] Heating component 30, for heating air passing through the air chamber 401;

[0052] Wherein, the air chamber 401 is used to collect hot air in the heat preservation box 201, and is delivered to the exhaust structure 202 by the first pipeline 402, to realize the recycling of hot air.

[0053] It can be understood that the silicon wafer 70 proposed in the embodiment is battery piece after cutting by non-destructive laser scribing technology.And the heat preservation box 201 top is provided with air inlet communicated with the first pipeline 402, of course, the air inlet of heat preservation box 201 can also be set on the upper portion of the sidewall of heat preservation box 201 or other positions according to actual situation, not limited here;The bottom of heat preservation box 201 towards transmission component 10 is provided with an opening.And the transmission component 10 is provided with heating component 30 in the coverage range of heat preservation box 201, and the heating component 30 is preferably heating belt arranged on the bottom of heat preservation box 201 towards transmission component 10, of course, the heating component 30 can also be set as other heating structure according to actual situation, not limited here.

[0054] It should be noted that heat preservation component 20 and air collecting component 40 are made of high-temperature resistant material.

[0055] In this way, when the silicon wafer drying device starts, the heating component 30 starts, and the heating component 30 first generates initial hot air;Then the transmission component 10 will send the silicon wafer 70 after scribing and with water droplets into the heat preservation box 201, at this time, the initial hot air generated by the heating component 30 will first dry or dry the silicon wafer 70, and at the same time, the air chamber 401 will collect the mixed gas stream formed by the hot air in the heat preservation box 201 and the residual initial hot air of the heating component 30, and the mixed gas stream is heated again by the heating component 30, and then delivered to the exhaust structure 202 by the first pipeline 402, and then the exhaust structure 202 blows hot air to the silicon wafer 70 to further dry, to realize the composite drying of heat conduction heating air circulation.

[0056] Of course, when the air exhaust structure 202 blows hot air to the silicon wafer 70, the hot air blown by the air exhaust structure 202 will reduce the temperature when drying the silicon wafer, and the hot air with reduced temperature needs to be heated by the heating assembly 30 and then collected by the air chamber 401 to form a circulation.

[0057] Therefore, the circulating air duct formed by the heat preservation box 201, the first pipeline 402 and the air chamber 401 blows the hot air in the heat preservation box 201 to the silicon wafer 70 again, realizes the composite drying of heat conduction and heating air circulation, which not only speeds up the drying speed, but also reduces the heat loss, and further reduces the energy consumption.

[0058] Compared with the silicon wafer drying mechanism of the prior art, if the silicon wafer drying mechanism needs to dry the silicon wafer, heating belts need to be arranged on both sides of the silicon wafer conveying belt to dry the silicon wafer during the conveying process, which leads to the problem that the length of the silicon wafer conveying belt is too long. In the present application, only the circulating air duct formed by the heat preservation box 201, the first pipeline 402 and the air chamber 401 is needed to form the composite drying of heat conduction and heating air circulation, which speeds up the drying speed, and the length of the conveying assembly 10 does not need to be too long, thereby reducing the occupied space of the silicon wafer drying device.

[0059] In some embodiments, in order to ensure that the air chamber 401 can stably and quickly collect the hot air in the heat preservation box 201, as shown in Figure 4 The air chamber 401 is provided with an air exhaust structure 403, and the air exhaust structure 403 is used for exhausting the hot air (the hot air is equivalent to the airflow formed by hot air) in the heat preservation box 201 into the air chamber 401.

[0060] It can be understood that the air exhaust structure 403 in the present embodiment is preferably an air exhaust pump.

[0061] The side of the air chamber 401 facing the conveying assembly 10 is provided with at least one air return port, and the air return port is correspondingly arranged with an air exhaust nozzle of the air exhaust structure 403, so that the air return port generates a suction force to suck the hot air in the heat preservation box 201 into the air chamber 401.

[0062] In some embodiments, as shown in Figure 1 and Figure 4 The conveying assembly 10 includes a conveying belt 101, and the conveying belt 101 is provided with continuous and dense through holes 102.

[0063] The air chamber 401 collects the hot air exhausted by the air exhaust structure 202 through the through holes 102.

[0064] It should be noted that the material of the conveying belt 101 is preferably Teflon belt, and the shape of the through hole 102 is preferably H-shaped. Of course, the shape of the through hole 102 can be circular, square or other suitable shape according to actual conditions, which is not limited here.

[0065] In this way, when the air exhaust structure 202 blows hot air to the silicon wafer 70, the heat is concentrated on the Teflon belt to further dry the silicon wafer 70; the heating assembly 30 reheats the hot air with reduced temperature, and then the hot air is sucked into the air return port of the air chamber 401 through the through hole 102, and then the hot air is circulated to the heat preservation box 201, so as to accelerate the drying speed, reduce the heat loss, and thus reduce the energy consumption.

[0066] In some embodiments, as shown in Figure 2 The embodiment provides a specific structure of the heat preservation assembly 20.

[0067] The heat preservation assembly 20 further comprises:

[0068] A flow dividing piece 203 is arranged on one side or both sides of the width direction of the conveying belt 101, and a plurality of air exhaust ports 204 are arranged on the flow dividing piece 203. Each air exhaust port 204 is matched and communicated with one air exhaust structure 202 through a second pipeline (not shown, the same below).

[0069] It can be understood that the width direction of the conveying assembly 10 is equivalent to the width direction of the conveying belt 101, and the conveying direction of the conveying assembly 10 is equivalent to the conveying direction of the conveying belt 101, and the same below.

[0070] The shape of the flow dividing piece 203 is preferably a circular tube or a square tube. The heat preservation box 201, the air exhaust structure 202, the flow dividing piece 203 and the second pipeline are all made of high-temperature resistant materials.

[0071] In this way, the hot air in the first pipeline 402 first passes through the flow dividing piece 203, the flow dividing piece 203 uniformly disperses the input hot air to the air exhaust structure 202 through the second pipeline, avoids local temperature being too high or too low, ensures the overall heating consistency, and then is blown to the silicon wafer 70 by the air exhaust structure 202 to achieve the purpose of drying the silicon wafer 70.

[0072] It should be noted that the air exhaust structure 202 is preferably an air knife, so that the air knife forms a high-speed airflow (similar to the effect of “blade”) through the long and narrow air outlet, and forcibly blows the hot air to the target area (such as the surface of the silicon wafer 70) accurately and uniformly, thereby enhancing the heat exchange efficiency.

[0073] In some embodiments, in order to ensure the stable operation of the circulating air duct, as shown in Figure 4 and Figure 5As shown, the embodiment proposes a specific structure of the air collecting assembly 40:

[0074] The air collecting assembly 40 further comprises a converging member 404 and a converging pipe 405;

[0075] The air chambers 401 are all vacuum sealed structures, the air outlets of the air chambers 401 are communicated with the converging member 404 through vacuum joints 406, and the converging member 404 is further communicated with the first pipe 402 through at least one converging pipe 405;

[0076] The converging member 404 and / or the converging pipe 405 and / or the first pipe 402 are provided with at least one vacuum pump 407.

[0077] It can be understood that the shape of the converging member 404 is preferably a circular tube or a square tube. The converging member 404, the converging pipe 405 and the vacuum joint 406 are all made of high-temperature-resistant materials.

[0078] The vacuum pump 407 proposed in the embodiment is exemplified at the connection between the converging pipe 405 and the first pipe 402.

[0079] In this way, the vacuum pump 407 is started, the hot air in the air chamber 401 is directed to be drawn away to the converging member 404 through the vacuum joint 406, so as to avoid the accumulation of heat affecting the stability of the air chamber 401; then the converging member 404 uniformly distributes the hot air to the converging member 404, so as to prevent the local pressure from being too high; then the hot air in the converging pipe 405 enters the first pipe 402 through the vacuum pump 407, and the hot air in the first pipe 402 enters the shunt member 203 and the second pipe in turn and is blown out from the air exhaust structure 202, forming a circulating air duct, thereby reducing energy consumption and maintaining temperature consistency.

[0080] In some embodiments, as shown in the drawings, Figure 4 The vacuum joint 406 and / or the converging member 404 and / or the converging pipe 405 and / or the first pipe 402 are provided with at least one filter assembly 50.

[0081] It should be noted that the embodiment exemplifies that the filter assembly 50 is provided in the connection between the converging pipe 405 and the vacuum pump 407.

[0082] In this way, the filter assembly 50 can decontaminate or remove particulate pollutants and remove odor from the hot air before injecting the hot air into the vacuum pump 407 and the heat preservation box 201. Of course, the filter assembly 50 can be provided with multiple ones for multiple filtering, which is not limited herein.

[0083] In some embodiments, as shown in the drawings, Figure 3As shown, each of the exhaust structures 202 is provided with a mounting frame 205, which comprises a first support 2051 and a second support 2052;

[0084] The first support 2051 is vertically arranged on one side of the width direction of the conveying belt 101, and the second support 2052 is horizontally arranged and extends above the conveying belt 101;

[0085] The first support 2051 is provided with a first sliding groove 2053 on one side of the second support 2052 along the axial direction, and one end of the second support 2052 is slidably connected with the first sliding groove 2053; the other end of the second support 2052 is connected with the exhaust structure 202;

[0086] The second support 2052 can move along the extension direction of the first sliding groove 2053 to adjust the height of the exhaust structure 202 relative to the conveying belt 101.

[0087] It should be noted that the exhaust structure 202, the first support 2051 and the second support 2052 are all made of high-temperature-resistant materials. The shapes of the first support 2051 and the second support 2052 are preferably long rod-shaped.

[0088] It can be understood that the end of the second support 2052 away from the exhaust structure 202 is provided with a first sliding block which can be matched and inserted into the first sliding groove 2053 and slidably connected with the first sliding groove 2053.

[0089] In this way, the second support 2052 can move along the extension direction of the first sliding groove 2053, thereby adjusting the height of the exhaust structure 202 relative to the conveying belt 101, and further ensuring that the hot air blown by the exhaust structure 202 can reach the surface of the silicon wafer 70 more quickly for drying, thereby accelerating the drying speed of the silicon wafer 70.

[0090] In some embodiments, as shown in the drawings, Figure 3 The other end of the second support 2052 away from the first sliding groove 2053 is provided with a second sliding groove 2054 along the axial direction, and one end of the exhaust structure 202 is slidably connected with the second sliding groove 2054;

[0091] The exhaust structure 202 can move along the extension direction of the second sliding groove 2054 to adjust the transverse position of the exhaust structure 202 relative to the conveying belt 101.

[0092] It can be understood that the outer surface of the exhaust structure 202 is provided with a second sliding block which can be matched and inserted into the second sliding groove 2054 and slidably connected with the second sliding groove 2054.

[0093] In this way, the second support 2052 can move along the extension direction of the first sliding groove 2053, so as to adjust the height of the air exhaust structure 202 relative to the conveying belt 101, and then the air exhaust structure 202 moves along the extension direction of the second sliding groove 2054, so as to adjust the transverse position of the air exhaust structure 202 relative to the conveying belt 101, thereby ensuring that the air outlet of the air exhaust structure 202 is located directly above the silicon wafer 70, and the hot air blown by the air exhaust structure 202 can reach the surface of the silicon wafer 70 more quickly to dry the silicon wafer 70, thereby accelerating the drying speed of the silicon wafer 70.

[0094] In some embodiments, as shown in FIG. 1, the conveying belt 101 is sequentially provided with a heat preservation assembly 20 and a cooling platform 60 along the conveying direction of the conveying belt 101, and the cooling platform 60 is located downstream of the heat preservation assembly 20. Figure 1

[0095] A visual detection assembly (not shown, the same throughout) is arranged above the cooling platform 60, and the visual detection assembly is used to detect whether the silicon wafer 70 is damaged.

[0096] In this way, the silicon wafer 70 dried by the heat preservation assembly 20 can enter the cooling platform 60 through the conveying belt 101, so as to be naturally cooled to room temperature, thereby reducing the micro-cracks or structural deformation of the silicon wafer 70 caused by sudden temperature change, and facilitating stable operation of subsequent processes; and the visual detection assembly can detect whether the silicon wafer 70 is damaged, such as edge collapse, surface scratch or crack, so as to prevent the damaged silicon wafer 70 from entering the subsequent processes to cause equipment pollution or process failure, and reduce the frequency of equipment cleaning and maintenance costs.

[0097] Of course, in other embodiments (not shown in the drawings), the silicon wafer drying device can also be provided with a mechanical hand between the heat preservation assembly 20 and the cooling platform 60, and the silicon wafer 70 dried by the heat preservation assembly 20 can be picked up by the mechanical hand to the cooling platform 60. Of course, each heat preservation assembly 20 and cooling platform 60 is respectively provided with a transmission belt for transporting the silicon wafer 70.

[0098] In some embodiments, a laser scribing device includes the above-mentioned silicon wafer drying device.

[0099] In the present embodiment, the use process of the laser scribing device is as follows:

[0100] When the laser scribing device is started, the heating assembly 30 is started, and the heating assembly 30 first generates initial hot air to ensure that the air temperature in the heat preservation box 201 is higher than the room temperature when the silicon wafer 70 enters the heat preservation box 201.

[0101] ​Then the conveyor belt 101 will send the sliced and water droplet containing silicon wafer 70 into the incubator 201, at this time the initial hot air generated by the heating assembly 30 will perform the first drying of the silicon wafer 70; start the vacuum pump 407, so that the air return port of the air chamber 401 inhales the mixed gas stream formed by the hot air in the incubator 201 and the residual initial hot air of the heating assembly 30, the mixed gas stream is heated twice by the heating assembly 30, then enters the first pipeline 402 in turn through the vacuum joint 406, the flow converging piece 404, the flow converging pipe 405, the filter assembly 50 and the vacuum pump 407, then the hot air in the first pipeline 402 is blown to the silicon wafer 70 from the exhaust structure 202 in turn through the flow dividing piece 203 and the second pipeline, so as to achieve the purpose of composite drying of the silicon wafer 70, thereby accelerating the drying speed, reducing heat loss, and thereby reducing energy consumption.

[0102] Then the heating assembly 30 will heat the hot air again after the exhaust structure 202 is blown to the silicon wafer 70 and the temperature is lowered, and then the hot air is sucked into the air return port of the air chamber 401 through the through hole 102 of the conveyor belt 101, thereby forming a circulating air duct.

[0103] Then, the dried silicon wafer 70 will pass through the conveyor belt 101 into the cooling platform 60, ensuring that the dried silicon wafer 70 is naturally cooled to room temperature, and at the same time, the visual detection assembly detects whether the silicon wafer 70 has edge collapse, surface scratches or cracks and other damage, preventing damaged silicon wafer 70 from entering subsequent processes to cause equipment contamination or process failure, reducing equipment downtime cleaning frequency and maintenance cost. Then the cooled silicon wafer 70 enters the next process.

[0104] Obviously, the above-described embodiments are only a part of the embodiments of the present application, not all the embodiments, and the preferred embodiments of the present application are given in the drawings, but do not limit the patent scope of the present application. The present application can be realized in many different forms, and conversely, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or equivalently replace some of the technical features. Any equivalent structure made by using the contents of the present application specification and drawings, directly or indirectly applied to other related technical fields, is also within the patent protection scope of the present application.

Claims

1. A silicon wafer drying apparatus comprising a transport assembly (10) for conveying silicon wafers; characterized in that, Also include: The heat preservation assembly (20) includes a heat preservation box (201) covering the conveying assembly (10), and an exhaust structure (202) located in the heat preservation box (201) and having an air outlet facing the silicon wafer on the conveying assembly (10); The air collecting assembly (40) includes at least one air chamber (401) located below the conveying assembly (10), and each air chamber (401) is communicated with the exhaust structure (202) through a first pipeline (402); The heating assembly (30) is used for heating air passing through the air chamber (401); The air chamber (401) is used for collecting hot air in the heat preservation box (201) and delivering the hot air to the exhaust structure (202) through the first pipeline (402) to realize recycling of the hot air.

2. The silicon wafer drying apparatus according to claim 1, wherein The heat preservation assembly (20) further includes: A flow dividing member (203) is arranged on one side or both sides of the conveying assembly (10) in the width direction, and a plurality of air outlets (204) are arranged on the flow dividing member (203), and each air outlet (204) is matched and connected with one exhaust structure (202) through a second pipeline.

3. The silicon wafer drying apparatus of claim 1, wherein The conveying assembly (10) includes a conveying belt (101), and the conveying belt (101) is provided with continuous and dense through holes (102); The air chamber (401) collects hot air discharged by the exhaust structure (202) through the through holes (102).

4. The silicon wafer drying apparatus of claim 1, wherein The air chamber (401) is provided with an air extraction structure (403), and the air extraction structure (403) is used for extracting hot air in the heat preservation box (201) into the air chamber (401).

5. The silicon wafer drying apparatus of claim 1, wherein The air collecting assembly (40) further includes a flow collecting member (404) and a flow collecting pipeline (405); The air chamber (401) is a vacuum sealed structure, the air outlet of the air chamber (401) is communicated with the flow collecting member (404) through a vacuum joint (406), and the flow collecting member (404) is communicated with the first pipeline (402) through at least one flow collecting pipeline (405); The flow collecting member (404) and / or the flow collecting pipeline (405) and / or the first pipeline (402) are provided with at least one vacuum pump (407).

6. The silicon wafer drying apparatus of claim 5, wherein The vacuum joint (406) and / or the flow collecting member (404) and / or the flow collecting pipeline (405) and / or the first pipeline (402) are provided with at least one filter assembly (50).

7. The silicon wafer drying apparatus of claim 1, wherein Each exhaust structure (202) is provided with a mounting bracket (205), and the mounting bracket (205) includes a first support (2051) and a second support (2052); The first support (2051) is vertically arranged on one side of the conveying assembly (10) in the width direction, and the second support (2052) is horizontally arranged and extends above the conveying assembly (10); The first support (2051) is provided with a first sliding groove (2053) on one side of the second support (2052) and along the axial direction of the first sliding groove (2053), one end of the second support (2052) is in sliding connection with the first sliding groove (2053), and the other end of the second support (2052) is connected with the air exhaust structure (202); The second support (2052) can move along the extension direction of the first sliding groove (2053) to adjust the height of the air exhaust structure (202) relative to the transmission assembly (10).

8. The silicon wafer drying apparatus of claim 7, wherein The other end of the second support (2052) is provided with a second sliding groove (2054) away from the first sliding groove (2053) and along the axial direction of the second sliding groove (2054), and one end of the air exhaust structure (202) is in sliding connection with the second sliding groove (2054); The air exhaust structure (202) can move along the extension direction of the second sliding groove (2054) to adjust the transverse position of the air exhaust structure (202) relative to the transmission assembly (10).

9. The silicon wafer drying apparatus of claim 1, wherein The transmission assembly (10) is sequentially provided with a heat preservation assembly (20) and a cooling platform (60) along the conveying direction of the transmission assembly (10), and the cooling platform (60) is located downstream of the heat preservation assembly (20); An optical detection assembly is arranged above the cooling platform (60), and the optical detection assembly is used to detect whether the silicon wafer is damaged.

10. A laser scribing apparatus, characterized by, The laser scribing device comprises the silicon wafer drying device according to any one of claims 1-9.

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