Cooling mechanism for chip testing

Abstract

The utility model relates to the field of chip testing, in particular to a cooling mechanism for chip testing, which comprises a testboard, a position fixing frame is vertically arranged on the side wall of one side of the testboard, a sliding rail is vertically arranged on the upper surface of the testboard and located on one side of the position fixing frame, a sliding block is in sliding fit with the sliding rail, and a cooling unit is mounted on the sliding block. The cooling unit is provided with a sliding block, the side wall of one side of the sliding block is provided with a handle, the side, located on the handle, of the sliding block is fixedly connected with an insertion plate, the insertion plate is provided with a through hole, and a limiting mechanism is inserted in the through hole of the insertion plate. The height of the cooling unit is adjusted only by sliding the sliding block, and the position of the cooling unit is fixed through the limiting mechanism and the position fixing frame, so that the chip testing equipment can simulate the performance of a tested chip which is provided with a cooling mechanism like a case.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip testing technical field especially relates to cooling mechanism for chip test. BACKGROUND

[0002] Chip is a kind of integrated circuit, usually made of silicon material, small but powerful. It contains many microcircuits, can complete almost all the work of computer, such as operation, data processing, data transmission, storage and analysis etc., and most chips are installed on the motherboard of computer.

[0003] When manufacturing chip, it often needs to be installed on the motherboard, and then test its performance, but the temperature of chip will rise when working, and the chip installed on the case is provided with cooling mechanism, but the working temperature of chip under cooling and not under cooling needs to be tested during testing, but it is troublesome to install the air cooling of computer on the testing equipment. UTILITY MODEL CONTENTS

[0004] The utility model aims at solving the shortcomings in prior art, and provides a cooling mechanism for chip test.

[0005] In order to achieve the above object, the utility model adopts the following technical scheme:

[0006] Cooling mechanism for chip test, including test table, the vertical position fixed frame is arranged on the one side wall of test table, the vertical slide rail is arranged on the upper surface of test table and located at the one side of position fixed frame, the slide block is slidably connected on the slide rail, and the cooling unit is installed on the slide block;

[0007] The handle is arranged on the one side wall of slide block, the plugboard is fixedly connected on the one side of handle, the through hole is formed in the plugboard, and the limiting mechanism is inserted in the through hole of plugboard.

[0008] In addition, preferably, the limiting mechanism includes a limiting disc, a handle is arranged on the one side surface of the limiting disc, and a plug rod is fixedly connected to the middle of the other side surface of the limiting disc away from the handle.

[0009] In addition, preferably, a plurality of rubber rings are evenly arranged on the outer wall of the plug rod.

[0010] In addition, preferably, a test mainboard is arranged on the test table, and a to-be-tested measured chip is arranged on the test mainboard.

[0011] In addition, preferably, a plurality of limiting columns are evenly arranged on the position fixed frame along the vertical direction, a plug hole is formed in the limiting column, and the plug hole is coaxial with the through hole of the plugboard.

[0012] In addition, preferably, the cooling unit comprises a connecting frame, one end of the connecting frame is mounted on the sliding block, the other side of the connecting frame away from the sliding block is connected with a mounting frame, the bottom of the mounting frame is mounted with a cooling fan, and the cooling fan is located above the measured chip.

[0013] The chip testing device can also simulate the performance of the measured chip under the condition that the measured chip is provided with a cooling mechanism as the case. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 The measured chip is tested under the condition of cooling.

[0015] Figure 2 The measured chip is tested under the condition of cooling.

[0016] Figure 3 The measured chip is tested under the condition of cooling.

[0017] Figure 4 The measured chip is tested under the condition of cooling.

[0018] Figure 5 The measured chip is tested under the condition of cooling.

[0019] In the figure: 01 test mainboard, 02 measured chip, 1 test table, 2 position fixing frame, 21 limiting column, 22 jack, 3 sliding rail, 4 sliding block, 41 handle, 42 plugboard, 5 cooling unit, 51 connecting frame, 52 mounting frame, 53 cooling fan, 6 limiting mechanism, 61 handle, 62 limiting disc, 63 plug stick, 64 rubber ring. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments.

[0021] REFERENCE Figures 1-5A cooling mechanism for chip testing includes a test platform 1. The test platform 1 is characterized by a vertically mounted position fixing frame 2 on one side wall, a vertically mounted slide rail 3 on the upper surface of the test platform 1 and on one side of the position fixing frame 2, a sliding block 4 slidably fitted on the slide rail 3, a cooling unit 5 mounted on the sliding block 4, a handle 41 on one side wall of the sliding block 4, and a fixedly connected insert plate 42 on one side of the handle 41. The insert plate 42 has a through hole, and a limiting mechanism 6 is inserted into the through hole of the insert plate 42. The insert plate 42 is used to install the limiting mechanism 6.

[0022] The limiting mechanism 6 includes a limiting plate 62. A handle 61 is provided on one side of the limiting plate 62. A rod 63 is fixedly connected to the middle of the other side of the limiting plate 62 away from the handle 61. The handle 61 facilitates pulling out the limiting mechanism 6.

[0023] The outer wall of the insertion rod 63 is evenly provided with multiple rubber rings 64, which are used to increase friction.

[0024] In addition, a test motherboard 01 is set on the test bench 1, and the chip under test 02 to be tested is set on the test motherboard 01. The performance test is performed by installing the chip under test 02 on the test motherboard 01.

[0025] Furthermore, multiple limiting posts 21 are evenly arranged along the vertical direction on the position fixing frame 2. The limiting posts 21 are provided with insertion holes 22. The insertion holes 22 are coaxial with the through holes of the insertion plate 42. The insertion holes 22 are used for the insertion of the insertion rod 63.

[0026] Meanwhile, the cooling unit 5 includes a connecting frame 51, one end of which is mounted on the slider 4, and the other side of the connecting frame 51 away from the slider 4 is connected to a mounting frame 52. A cooling fan 53 is mounted at the bottom of the mounting frame 52, and the cooling fan 53 is located above the chip under test 02. The cooling fan 53 is used to cool down the chip under test 02.

[0027] In this embodiment, when testing the chip under test 02, the chip under test 02 is installed on the test motherboard 01. At this time, the cooling unit 5 is located at the top. When it is necessary to simulate the situation in the chassis, the cooling unit 5 replaces the traditional air cooling. At this time, the limiting mechanism 6 is pulled out from the top socket 22, so that the limiting mechanism 6 no longer jams the slider 4. The operator pulls the handle 41, so that the slider 4 slides on the slide rail 3 and adjusts the position of the slider 4 so that the through hole of the plug plate 42 is aligned with the bottom socket 22. Then, the plug rod 63 passes through the through hole and socket 22 of the plug plate 42, thereby fixing the position of the slider 4. At this time, the cooling fan 53 approaches the chip under test 02 below and then starts the cooling fan 53 to cool it down, simulating the working temperature under cooling. When replacing the chip under test 02, only the slider 4 needs to be moved.

[0028] In this invention, a cooling unit 5 is used to replace air cooling to cool the chip under test 02. When replacing the chip under test 02 during disassembly, the height of the cooling unit 5 can be adjusted by sliding the slider 4, and its position can be fixed by the limiting mechanism 6 and the position fixing bracket 2. In this way, the chip testing equipment can also simulate the performance of the chip under test 02 when it is equipped with a cooling mechanism like the chassis.

[0029] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A cooling mechanism for chip testing, comprising a test stage (1), characterized in that, A position fixing frame (2) is vertically installed on one side wall of the test bench (1). A slide rail (3) is vertically installed on the upper surface of the test bench (1) and on one side of the position fixing frame (2). A slider (4) is slidably fitted on the slide rail (3). A cooling unit (5) is installed on the slider (4). A handle (41) is provided on one side wall of the slider (4). A plate (42) is fixedly connected to the slider (4) on one side of the handle (41). A through hole is provided on the plate (42), and a limiting mechanism (6) is inserted into the through hole of the plate (42).

2. The cooling mechanism for chip testing according to claim 1, characterized in that, The limiting mechanism (6) includes a limiting plate (62), a handle (61) is provided on one side surface of the limiting plate (62), and a plug (63) is fixedly connected to the middle of the other side surface of the limiting plate (62) away from the handle (61).

3. The cooling mechanism for chip testing according to claim 2, characterized in that, Multiple rubber rings (64) are evenly arranged on the outer wall of the insert (63).

4. The cooling mechanism for chip testing according to claim 1, characterized in that, The test bench (1) is equipped with a test motherboard (01), and the test motherboard (01) is equipped with the chip to be tested (02).

5. The cooling mechanism for chip testing according to claim 1, characterized in that, The position fixing frame (2) has multiple limiting posts (21) evenly arranged in the vertical direction. The limiting posts (21) have insertion holes (22) and the insertion holes (22) are coaxial with the through holes of the insertion plate (42).

6. The cooling mechanism for chip testing according to claim 1, characterized in that, The cooling unit (5) includes a connecting frame (51), one end of which is mounted on the slider (4), and the other side of the connecting frame (51) away from the slider (4) is connected to a mounting frame (52). A cooling fan (53) is mounted at the bottom of the mounting frame (52), and the cooling fan (53) is located above the chip under test (02).

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