Spin coating collection cup

Abstract

The utility model provides a spin coating collecting cup, including upper layer collecting cup, annular baffle and lower layer collecting cup wherein the upper layer collecting cup includes cup body, cup body encloses and forms an accommodation space, the cup body is equipped with top opening and bottom opening, the edge of bottom opening is equipped with first connecting part, the inner wall of cup body is equipped with a plurality of equidistant triangular prism along the circumference, and the bottom opening is equipped with second connecting part. The annular baffle is located in the containing space, the outer edge of the annular baffle is connected with the cup body, the lower-layer collecting cup comprises an outer-layer side wall, an annular bottom plate and an inner-layer side wall which are sequentially connected to form a liquid receiving groove, and the top of the outer-layer side wall is provided with a second connecting part matched with the first connecting part; and the first connecting part is connected with the second connecting part to connect the upper-layer collecting cup and the lower-layer collecting cup. The spin-coating collecting cup disclosed by the utility model can avoid backwash of photoresist or developing liquid medicine, so that the yield of wafers is improved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor integrated circuit manufacturing technology and relates to a spin coating collection cup. Background Technology

[0002] In semiconductor manufacturing, photoresist coating, exposure, and development are key steps in photolithography, directly affecting the pattern accuracy and yield of chips. In spin-coating photoresist, photoresist is uniformly coated onto the wafer surface. Then, the pattern on the photomask is transferred to the photoresist through an exposure process. Finally, the unexposed or exposed areas are removed through a development process to form the desired pattern. During coating or development, the wafer rotates at high speed, and excess photoresist or developer is ejected, impacting the inner wall of the collection cup and flowing into the waste liquid collection tank. However, the smooth inner wall of existing collection cups cannot effectively prevent backsplatter of photoresist or developer, easily causing it to splash back onto the wafer surface, leading to pattern defects and particle contamination, resulting in reduced wafer yield.

[0003] Therefore, how to provide a spin-coating collection cup to avoid the backsplattering of photoresist or developer solutions and improve wafer yield has become an important problem that needs to be solved by those skilled in the art.

[0004] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a spin coating collection cup to solve the problem that spin coating of photoresist or developing solution is prone to backsplattering, resulting in pattern defects and particle contamination.

[0006] To achieve the above and other related objectives, this utility model provides a spin coating collection cup, comprising:

[0007] The upper collection cup includes a cup body that forms a receiving space. The cup body has a top opening and a bottom opening. A first connecting part is provided on the edge of the bottom opening. Multiple triangular prisms are evenly spaced along the circumference of the inner wall of the cup body.

[0008] An annular baffle is located within the receiving space, and the outer edge of the annular baffle is connected to the cup body;

[0009] The lower collection cup includes an outer sidewall, an annular bottom plate, and an inner sidewall connected in sequence to form a liquid receiving groove. The top of the outer sidewall is provided with a second connecting part that cooperates with the first connecting part. The first connecting part and the second connecting part are connected to connect the upper collection cup and the lower collection cup.

[0010] Optionally, the cross-sectional diameter of the cup gradually decreases in the direction from the bottom opening to the top opening.

[0011] Optionally, the spacing between two adjacent triangular prisms is 5mm to 10mm, the length of the triangular prism is 30mm to 100mm, and the height of the triangular prism protruding from the inner wall of the cup is 3mm to 7mm.

[0012] Optionally, the outer edge of the annular baffle is connected to the edge of the top opening of the cup body.

[0013] Optionally, the plane containing the inner edge of the annular baffle is lower than the plane containing the top opening.

[0014] Optionally, the inner side of the annular base plate is connected to the bottom of the inner sidewall, and the outer side of the annular base plate is connected to the bottom of the outer sidewall.

[0015] Optionally, a liquid guide port is provided at the bottom of the liquid receiving groove.

[0016] Optionally, the number of liquid inlets may be one or more.

[0017] Optionally, it also includes a connector for fixing the lower collection cup to the machine base, one end of the connector being fixedly connected to the bottom surface of the annular base plate away from the upper collection cup.

[0018] Optionally, the number of the connectors may be one or more.

[0019] As described above, this utility model provides a spin coating collection cup, including an upper collection cup, an annular baffle, and a lower collection cup. The upper collection cup includes a cup body that forms a receiving space, and the cup body has a top opening and a bottom opening. A first connecting portion is provided on the edge of the bottom opening. Multiple triangular prisms are evenly spaced along the circumference of the inner wall of the cup body. The annular baffle is located within the receiving space, and its outer edge is connected to the cup body. The lower collection cup includes an outer sidewall, an annular bottom plate, and an inner sidewall connected in sequence to form a liquid receiving groove. A second connecting portion, which mates with the first connecting portion, is provided at the top of the outer sidewall. The first connecting portion and the second connecting portion connect the upper and lower collection cups. This spin coating collection cup, by providing multiple triangular prisms on the inner wall of the upper collection cup, increases the cup's ability to block photoresist or developer splashing, thereby preventing photoresist or developer from splashing back onto the wafer surface and improving wafer yield. Attached Figure Description

[0020] Figure 1 The diagram shown is a structural schematic of the spin coating collection cup of this utility model.

[0021] Figure 2 The diagram shown is a structural schematic of the upper collecting cup of this utility model.

[0022] Figure 3 Shown is a cross-sectional view of a triangular prism of this utility model (along...). Figure 2 (in the AA' direction).

[0023] Explanation of reference numerals in the attached figures

[0024] 1 Spin coating collection cup

[0025] 101 Top opening

[0026] 102 Bottom opening

[0027] 103 Cup Body

[0028] 104 First connecting part

[0029] 105 Triangular Prism

[0030] 106 Annular baffle

[0031] 107 Inner sidewall

[0032] 108 Outer sidewall

[0033] 109 Circular Base Plate

[0034] 110 Liquid receiving groove

[0035] 111 Second connecting part

[0036] 112 Connector

[0037] S is the distance between two adjacent triangular prisms.

[0038] L is the length of the triangular prism.

[0039] H is the height of the triangular prism protruding from the inner wall of the cup. Detailed Implementation

[0040] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0041] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, whole, step, or component, but does not exclude the presence or addition of one or more other features, wholes, steps, or components.

[0042] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0043] In the detailed description of the embodiments of this utility model, for ease of explanation, the schematic diagrams illustrating the device structure may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the protection of this utility model. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0044] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the drawings for devices in use or operation. Furthermore, when a layer is referred to as being “between” two layers, it may be the only layer between the two layers, or there may be one or more layers in between.

[0045] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0046] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0047] Please see Figure 1 The diagram shows the structure of the spin coating collection cup of this utility model. The spin coating collection cup 1 includes an upper collection cup, an annular baffle, and a lower collection cup. The upper collection cup includes a cup body that forms a receiving space. The cup body has a top opening and a bottom opening. A first connecting part is provided on the edge of the bottom opening. A plurality of triangular prisms are evenly spaced along the circumference of the inner wall of the cup body. The annular baffle is located in the receiving space and its outer edge is connected to the cup body. The lower collection cup includes an outer sidewall, an annular bottom plate, and an inner sidewall that are connected in sequence to form a liquid receiving groove. The top of the outer sidewall has a second connecting part that cooperates with the first connecting part. The first connecting part and the second connecting part are connected to connect the upper collection cup and the lower collection cup.

[0048] Specifically, when the wafer is undergoing a photoresist coating or developing process, the spin-coating collection cup 1 is installed on the developing machine stage and placed around the wafer adsorption stage. When the wafer rotates at high speed, centrifugal force throws excess photoresist or developing solution onto the inner wall of the cup body 103 of the upper collection cup. The multiple triangular prisms 105 can prevent photoresist or developing solution from splashing back onto the wafer, thereby reducing the probability of photoresist or developing solution splashing back, avoiding pattern defects and particle contamination, and thus improving the wafer yield.

[0049] For example, please refer to Figure 2 The diagram shows the structure of the upper collecting cup of this utility model. The distance S between two adjacent triangular prisms 105 is in the range of 5mm to 10mm, and the length L of the triangular prism 105 is in the range of 30mm to 100mm.

[0050] For example, please refer to Figure 3 The image shown is a cross-sectional view of one of the triangular prisms 105 of this invention (along...). Figure 2 (in the AA' direction), the height H of the triangular prism 105 protruding from the inner wall of the cup body 103 is in the range of 3mm to 7mm.

[0051] As an example, in the direction from the bottom opening 102 to the top opening 101, the cross-sectional diameter of the cup body 103 gradually decreases, which helps to accelerate the flow of photoresist or developing solution blocked by the triangular prism 105 into the liquid receiving groove 110 of the lower collection cup along the cup body 103, further reducing the probability of photoresist or developing solution splashing back.

[0052] As an example, the outer edge of the annular baffle 106 is connected to the edge of the top opening 102 of the cup body 103.

[0053] As an example, the plane containing the inner edge of the annular baffle 106 is lower than the plane containing the top opening 102.

[0054] As an example, the inner side of the annular base plate 109 is connected to the bottom of the inner sidewall 107, and the outer side of the annular base plate 109 is connected to the bottom of the outer sidewall 108.

[0055] As an example, the bottom of the liquid receiving groove 110 is provided with a liquid guide port, which is connected to a waste liquid tank to collect the photoresist or developing solution that falls into the liquid receiving groove 110, so as to prevent excessive photoresist or developing solution in the liquid receiving groove 110 from flowing back to the wafer adsorption stage 3 and to prevent the wafer from being contaminated.

[0056] As an example, the number of liquid inlets is one or more, and setting multiple liquid inlets is beneficial to improving the collection efficiency of the waste liquid tank.

[0057] As an example, the spin coating collection cup 1 further includes a connector 112 for fixing the lower collection cup to the machine base. One end of the connector 112 is fixedly connected to the side of the annular base plate 109 away from the upper collection cup. Please refer to [further details omitted]. Figure 2 The connector 112 is used to fix the spin coating collection cup 1 to the developing machine table.

[0058] As an example, the number of connectors 112 may be one or more, and the specific number of connectors 112 may be determined according to the size of the spin coating collection cup 1. No further restrictions are imposed here.

[0059] In summary, this utility model provides a spin coating collection cup, including an upper collection cup, an annular baffle, and a lower collection cup. The upper collection cup includes a cup body that forms a receiving space, and the cup body has a top opening and a bottom opening. A first connecting portion is provided on the edge of the bottom opening. Multiple triangular prisms are evenly spaced along the circumference of the inner wall of the cup body. The annular baffle is located within the receiving space, and its outer edge is connected to the cup body. The lower collection cup includes an outer sidewall, an annular bottom plate, and an inner sidewall connected in sequence to form a liquid receiving groove. A second connecting portion, which mates with the first connecting portion, is provided at the top of the outer sidewall. The first connecting portion and the second connecting portion connect the upper and lower collection cups. This spin coating collection cup, by providing multiple triangular prisms on the inner wall of the upper collection cup, increases the cup's ability to block photoresist or developer splashes, thereby preventing photoresist or developer from splashing back onto the wafer surface and improving wafer yield. Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0060] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A spin-coating collection cup, characterized in that, include: The upper collection cup includes a cup body that forms a receiving space. The cup body has a top opening and a bottom opening. A first connecting part is provided on the edge of the bottom opening. Multiple triangular prisms are evenly spaced along the circumference of the inner wall of the cup body. An annular baffle is located within the receiving space, and the outer edge of the annular baffle is connected to the cup body; The lower collection cup includes an outer sidewall, an annular bottom plate, and an inner sidewall connected in sequence to form a liquid receiving groove. The top of the outer sidewall is provided with a second connecting part that cooperates with the first connecting part. The first connecting part and the second connecting part are connected to connect the upper collection cup and the lower collection cup.

2. The spin-coating collection cup according to claim 1, characterized in that: The cross-sectional diameter of the cup gradually decreases in the direction from the bottom opening to the top opening.

3. The spin-coating collection cup according to claim 1, characterized in that: The spacing between two adjacent triangular prisms ranges from 5mm to 10mm, the length of the triangular prism ranges from 30mm to 100mm, and the height of the triangular prism protruding from the inner wall of the cup ranges from 3mm to 7mm.

4. The spin-coating collection cup according to claim 1, characterized in that: The outer edge of the annular baffle is connected to the edge of the top opening of the cup.

5. The spin-coating collection cup according to claim 1, characterized in that: The plane containing the inner edge of the annular baffle is lower than the plane containing the top opening.

6. The spin-coating collection cup according to claim 1, characterized in that: The inner side of the annular base plate is connected to the bottom of the inner sidewall, and the outer side of the annular base plate is connected to the bottom of the outer sidewall.

7. The spin-coating collection cup according to claim 1, characterized in that: The bottom of the liquid receiving groove is provided with a liquid guide port.

8. The spin-coating collection cup according to claim 7, characterized in that: The number of liquid inlets is one or more.

9. The spin-coating collection cup according to claim 1, characterized in that: It also includes a connector for fixing the lower collection cup to the machine base, one end of which is fixedly connected to the bottom surface of the annular base plate away from the upper collection cup.

10. The spin-coating collection cup according to claim 9, characterized in that: The number of the connectors is one or more.

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