Notebook computer shell structure with heat dissipation holes

Abstract

The notebook computer shell structure comprises a notebook computer shell body, a bottom plate fixing cavity is formed in the front face of the notebook computer shell body, grid heat dissipation holes are formed in the upper portion of the middle of the bottom plate fixing cavity, the grid heat dissipation holes are arranged in an inclined mode, first supporting edges are arranged on the upper side and the lower side in the bottom plate fixing cavity respectively, and second supporting edges are arranged on the upper side and the lower side in the bottom plate fixing cavity respectively. The two supporting edges located on the upper side are arranged on the two sides of the grid heat dissipation holes, the second supporting edge is arranged in the middle of the bottom plate fixing cavity, the USB interface, the network cable jack and the grid heat dissipation holes are formed in the edge face of the left end of the notebook computer shell, and the grid heat dissipation holes are adjacent to one another. The utility model designs a notebook computer shell structure with heat dissipation holes, which comprises a notebook computer shell body, grid heat dissipation holes are arranged in a bottom plate fixing cavity of the notebook computer shell body, an inclined design mode is adopted, the grid heat dissipation holes can be used as heat dissipation hole channels, and a heat dissipation mechanism can be used for blast heat dissipation of the bottom surface of a notebook computer.

Description

TECHNICAL FIELD

[0001] The utility model belongs to notebook computer shell technical field, concretely relates to a notebook computer shell structure with heat dissipation hole. BACKGROUND

[0002] Notebook computer (English: NoteBook Computer, for short: NoteBook, NB), Chinese also called notebook, portable or laptop computer (English: Laptop Computer, can be simply Laptop), it is a small, portable personal computer, usually 1-3 kilograms. Its development trend is smaller and smaller, lighter and lighter, but the function is more and more powerful. Like Netbook, also known as netbook, the main difference from PC is that it is convenient to carry, and the abbreviation is "PC". Notebook computer can be divided into four categories according to its use: business type, fashion type, multimedia application and special purpose.

[0003] For the shell of notebook computer, generally made of aluminum alloy, in order to the usual design has the heat dissipation grid, the heat dissipation grid is arranged at the left end face position of notebook computer shell, but this heat dissipation grid / hole designed only on the left side cannot meet the heat dissipation demand, such as notebook bottom heat dissipation cannot be limitedly satisfied, in view of this, the invention is applied. CONTENT OF THE UTILITY MODEL

[0004] In order to solve the above technical problems, the utility model provides a notebook computer shell structure with heat dissipation hole can improve the above shortcomings.

[0005] The utility model relates to a notebook computer shell structure with heat dissipation hole, including notebook computer shell body, the notebook computer shell body front has bottom plate fixed cavity, the bottom plate fixed cavity middle upper position sets up grid heat dissipation hole, the grid heat dissipation hole is arranged obliquely, the bottom plate fixed cavity is arranged in the first support edge in upper and lower sides, the two support edges of upper side are arranged on both sides of grid heat dissipation hole, the bottom plate fixed cavity middle sets up the second support edge, the notebook computer shell left end's edge surface sets up USB interface, network plug hole and grid heat dissipation hole, the grid heat dissipation hole is adjacent to grid heat dissipation hole, the grid heat dissipation hole oblique direction points to the side where the grid heat dissipation hole is located.

[0006] Further, the bottom surface of the bottom plate fixed cavity is covered with a heat-conducting coating.

[0007] Further, the back surface of the notebook computer shell body is provided with a support pad at each of the four corners.

[0008] Further, a clamping groove is arranged on the upper edge of the back surface of the notebook computer shell body.

[0009] Further, the notebook shell body is arranged below the heat dissipation bottom plate frame.

[0010] Further, the heat dissipation bottom plate frame comprises a heat dissipation bottom frame, one end of the heat dissipation bottom frame is arranged with a buffer pad block for contacting the lower end of the back of the notebook shell body, the other end of the heat dissipation bottom frame is arranged with a supporting block, the supporting block is in contact with the bottom surface of the notebook shell body, and a heat dissipation mechanism is arranged in the middle of the heat dissipation bottom frame.

[0011] Further, the heat dissipation mechanism comprises a bottom plate and a heat dissipation mesh cover buckled on the bottom plate, a micro heat dissipation motor and a heat dissipation fan blade are arranged on the bottom plate, and a rotating structure is formed between the micro heat dissipation motor and the heat dissipation fan blade.

[0012] Further, the notebook shell body is arranged on the heat dissipation bottom frame and forms an inclination of 4°-15° with the horizontal plane.

[0013] The utility model discloses a notebook shell structure with heat dissipation holes, including notebook shell body, setting up the grid heat dissipation hole in the bottom plate fixed cavity of notebook shell body, and adopt the way of inclination design, can be used as heat dissipation hole channel, simultaneously setting up USB interface, network jack and grid heat dissipation hole on the rib of notebook shell left -hand end, the grid heat dissipation hole is adjacent with grid heat dissipation hole, wherein the grid heat dissipation hole inclination direction points to the side where the grid heat dissipation hole is, and the design strengthens the through -property of heat dissipation hole channel, still designs the heat dissipation bottom plate frame in the application, and the heat dissipation mechanism on the heat dissipation bottom plate frame can be used for heat dissipation, and the heat dissipation mechanism can be used for the air -blowing heat dissipation of notebook local bottom surface. ACCURACY OF DRAWINGS

[0014] Figure 1 It is the structure schematic drawing of the utility model.

[0015] Figure 2 It is the structure schematic drawing of the grid heat dissipation hole.

[0016] Figure 3 It is Figure 2 The enlarged view of A in the middle.

[0017] Figure 4 It is the end surface structure schematic drawing of notebook shell.

[0018] Figure 5 It is the back structure schematic drawing of notebook shell.

[0019] Figure 6 It is the contact schematic drawing of notebook shell and heat dissipation bottom plate frame.

[0020] Figure 7 It is the structure schematic drawing of heat dissipation mechanism.

[0021] Figure 8 It is the structure schematic drawing of buffer rubber pad.

[0022] Illustration: 1 Laptop casing body, 101 Base plate fixing cavity, 102 Convergence surface, 2 First support ridge, 3 Grid heat dissipation hole, 31 Heat dissipation grid, 32 Copper sheet, 301 Rounded corner surface, 4 Second support ridge, 5 USB interface, 6 Network cable socket, 7 Support pad, 8 Buffer pad, 9 Card slot, 10 Heat dissipation base, 100 Thermal conductive coating, 11 Buffer pad, 12 Heat dissipation mechanism, 121 Base plate, 122 Heat dissipation mesh cover, 123 Vertical support ridge, 125 Mini heat dissipation motor, 126 Heat dissipation fan blade. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the scope of the present utility model.

[0024] Example 1: As Figures 1-5 As shown, this utility model relates to a laptop shell structure with heat dissipation holes, including a laptop shell body 1 made of aluminum alloy. The front of the laptop shell body has a base plate fixing cavity 101. A grid heat dissipation hole 3 is provided in the upper middle position of the base plate fixing cavity. The wall of the grid heat dissipation hole is inclined. A rounded corner surface 301 is provided at the opening of the grid heat dissipation hole to facilitate airflow. At the same time, a copper sheet 32 ​​is provided on the hole wall. First support ribs 2 are provided on the upper and lower sides of the base plate fixing cavity. The two support ribs on the upper side are located on both sides of the grid heat dissipation hole. A second support rib 4 is provided in the middle of the base plate fixing cavity. The length direction of the second support rib is perpendicular to the length direction of the first support rib. The first and second support ribs are used to support the motherboard in the base plate fixing cavity and play a spacing role to ensure that there is a certain gap space between the motherboard and the base plate. This design is not found in the prior art. At the same time, this design also has the advantage that in the laptop... This design features only 5 support points (4 first support edges and 1 second support edge), resulting in a small contact area with the motherboard and a larger heat dissipation area. A common design is that the base plate is tightly attached to the outer shell. Due to the presence of support edges, heat dissipation channels can be formed between the back of the motherboard and the ground inside the base plate mounting cavity. To facilitate heat dissipation, a converging surface 102 is also provided on the base plate mounting cavity. The converging surface is a grooved surface with an inclined surface and a fish scale pattern to increase the heat dissipation area. Its inclined end points towards the grid heat dissipation holes. A layer of heat dissipation copper sheet (not shown in the figure) with a thickness of 0.01mm to 0.05mm is provided on the converging surface. Matching clip edges are provided around the opening surface of the base plate mounting cavity. The edge surface at the left end of the laptop shell is provided with a USB interface 5, a network cable socket 6, and a grid heat dissipation hole 31. The grid heat dissipation holes are adjacent to each other. To accelerate heat dissipation, the inclined direction of the grid heat dissipation holes points towards the side where the grid heat dissipation holes are located.

[0025] As a technical improvement, the bottom surface of the base plate fixing cavity is covered with a thermally conductive coating 100. The material can be a mixture of high thermal conductivity rubber resin and graphene powder, or a mixture of high thermal conductivity rubber resin and boron nitride powder. This is because high thermal conductivity rubber resin has both viscosity and thermal conductivity, and both graphene powder and boron nitride powder are materials with excellent thermal conductivity.

[0026] As a technical improvement, the back of the laptop casing is provided with support pads 7 at the four corners, and cushioning pads 8 are provided inside the support pads.

[0027] As a technical improvement, a snap-fit ​​groove 9 is provided on the edge of the back of the laptop casing. The function of the snap-fit ​​groove is to install it with the front casing of the laptop.

[0028] As a technical improvement, a heat dissipation base plate 10 is provided at the bottom of the laptop casing.

[0029] Example 2: Figures 1-7 As shown, this utility model relates to a laptop shell structure with heat dissipation holes, including a laptop shell body 1 made of aluminum alloy. The front of the laptop shell body has a bottom plate fixing cavity 101. A grid heat dissipation hole 3 is provided in the upper middle position of the bottom plate fixing cavity. The walls of the grid heat dissipation hole are inclined. First support ridges 2 are provided on the upper and lower sides of the bottom plate fixing cavity. The two support ridges on the upper side are provided on both sides of the grid heat dissipation hole. A second support ridge 4 is provided in the middle of the bottom plate fixing cavity. The length direction of the second support ridge is perpendicular to the length direction of the first support ridge. The first and second support ridges are used to support the motherboard in the bottom plate fixing cavity and play a spacing role to ensure that there is a certain gap space between the motherboard and the bottom plate. This design is not found in the prior art. Due to the presence of support ridges, heat dissipation channels can be formed between the back of the motherboard and the ground in the bottom plate fixing cavity. A USB interface 5, a network cable socket 6 and a grid heat dissipation hole 31 are provided on the edge surface of the left end of the laptop shell. The grid heat dissipation holes are adjacent to each other. In order to accelerate heat dissipation, the inclined direction of the grid heat dissipation holes points to the side where the grid heat dissipation holes are located.

[0030] As a technical improvement, the bottom surface of the base plate fixing cavity is covered with a thermally conductive coating 100. The material can be a mixture of high thermal conductivity rubber resin and graphene powder, or a mixture of high thermal conductivity rubber resin and boron nitride powder. This is because high thermal conductivity rubber resin has both viscosity and thermal conductivity, and both graphene powder and boron nitride powder are materials with excellent thermal conductivity.

[0031] As a technical improvement, support pads 7 are provided at the four corners of the back of the laptop casing, and cushioning pads 8 are provided inside the support pads. Figure 8As shown, the supporting cushion is provided with a containing groove 71 in the middle, the buffer rubber pad is arranged in the containing groove, the inner wall of the containing groove is provided with a convex rib 72 which plays a role of anti-dropping, the top surface of the buffer rubber pad is convex to the groove mouth of the containing groove, the plug rod 73 is arranged on the groove bottom surface and extends into the buffer rubber pad, the buffer rubber pad has elasticity and is generally made of TPU thermoplastic material. The TPU thermoplastic elastomer rubber material is a kind of rubber material which can repeatedly soften or change under certain heat, but it can keep the shape unchanged at room temperature. It can play a good role in supporting the notebook computer. At the same time, the friction coefficient of the rubber material is large, and the friction between the foot pad made of this material and the desktop is also large, so the computer can be more safely protected from accidental collision and damage.

[0032] As a technical improvement, the edge on the back of the notebook shell body is provided with a clamping groove 9, and the clamping groove is used for mounting the front shell of the notebook.

[0033] As a technical improvement, the notebook shell body is provided with a heat dissipation bottom plate frame 10 below.

[0034] As a technical improvement, the heat dissipation bottom plate frame comprises a heat dissipation bottom frame 121, one end of the heat dissipation bottom frame is provided with a buffer pad block 11 for contacting the lower end of the back of the notebook shell body, the other end of the heat dissipation bottom frame is provided with a supporting block 13 which contacts the bottom surface of the notebook shell body, so that the notebook shell is inclined and suspended, and a heat dissipation mechanism 12 is arranged in the middle of the heat dissipation bottom frame.

[0035] As a technical improvement, the heat dissipation mechanism comprises a bottom plate and a heat dissipation mesh cover buckled on the bottom plate, a micro heat dissipation motor 125 and a heat dissipation fan blade 126 are arranged on the bottom plate, a rotating structure is formed between the micro heat dissipation motor and the heat dissipation fan blade, and the micro heat dissipation motor adopts a fan direct-current brushless motor. A power management chip for converting external alternating current power into working voltage of the heat dissipation mechanism and a temperature sensor are arranged on the bottom plate, and they are arranged on a circuit board, a single-chip microcomputer controller is arranged on the circuit board, the single-chip microcomputer controller obtains the temperature collected by the temperature sensor to control the rotation of the fan.

[0036] As a technical improvement, the notebook shell body is arranged on the heat dissipation bottom frame to form an inclination of 4°-15° with the horizontal plane, and the angle can make the notebook not be inclined too much and facilitate typing.

Claims

1. A notebook computer case structure with heat dissipation holes, comprising a notebook computer case body, characterized in that: The notebook computer shell body front surface has a bottom plate fixing cavity, a grid heat dissipation hole is arranged at the upper middle position of the bottom plate fixing cavity, the grid heat dissipation hole is arranged obliquely, first support edges are arranged on the upper and lower sides in the bottom plate fixing cavity, the two support edges on the upper side are arranged on the two sides of the grid heat dissipation hole, a second support edge is arranged in the middle of the bottom plate fixing cavity, a USB interface, a network plug hole and a grid heat dissipation hole are arranged on the edge surface of the left end of the notebook computer shell, the grid heat dissipation hole is adjacent to the grid heat dissipation hole, and the oblique direction of the grid heat dissipation hole points to the side where the grid heat dissipation hole is located.

2. The notebook computer housing structure with heat dissipation holes according to claim 1, characterized in that: The bottom surface of the bottom plate fixing cavity is covered with a heat-conducting coating.

3. The notebook computer housing structure with heat dissipation holes according to claim 1, wherein: Support pads are arranged at the four corner positions on the back surface of the notebook computer shell body, and buffer rubber pads are arranged in the support pads.

4. The notebook computer housing structure with heat dissipation holes according to claim 1, wherein: A clamping groove is arranged on the upper edge of the back surface of the notebook computer shell body.

5. The notebook computer housing structure with heat dissipation holes according to claim 1, wherein: A heat dissipation bottom plate frame is arranged below the notebook computer shell body.

6. The notebook computer housing structure with heat dissipation holes according to claim 5, characterized in that: The heat dissipation bottom plate frame comprises a heat dissipation bottom frame, a buffer pad block for contacting the lower end of the back surface of the notebook computer shell body is arranged at one end of the heat dissipation bottom frame, a support block is arranged at the other end of the heat dissipation bottom frame, the support block contacts the bottom surface of the notebook computer shell body, and a heat dissipation mechanism is arranged in the middle of the heat dissipation bottom frame.

7. The notebook computer housing structure with heat dissipation holes according to claim 6, characterized in that: The heat dissipation mechanism comprises a bottom plate and a heat dissipation mesh cover buckled on the bottom plate, a micro heat dissipation motor and heat dissipation fan blades are arranged on the bottom plate, and a rotating structure is formed between the micro heat dissipation motor and the heat dissipation fan blades.

8. The notebook computer housing structure with heat dissipation holes according to claim 1, wherein: The notebook computer shell body is arranged on the heat dissipation bottom frame and forms an inclination of 4°-15° with the horizontal plane.

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