Cloud server host

Abstract

The utility model discloses a cloud server host, and the host comprises a housing, and a mainboard which is fixedly connected to the housing. The first cooling fin is fixedly connected to the main board and located on the side, away from the shell, of the main board; the second cooling fin is fixedly connected to the shell, located on the side, provided with the mainboard, of the shell and connected with the first cooling fin through a pipeline; the water pump is fixedly connected to the shell and connected with the first cooling fin and the second cooling fin through pipelines.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of internet hardware especially relates to a cloud server host. BACKGROUND

[0002] With the rapid development of cloud computing technology, cloud servers are increasingly widely used in data centers. Cloud servers need to handle a large amount of data computation and storage tasks, so a large amount of heat will be generated during operation. If effective cooling cannot be achieved, the performance of the server will be greatly reduced, and even hardware damage may occur, affecting the stability and reliability of the data center.

[0003] Currently, the cooling of cloud servers mainly relies on traditional air-cooled cooling systems. The air-cooled cooling system blows cold air into the server host through a fan, absorbs the heat generated by the hardware, and then discharges the hot air. However, with the improvement of server performance and the increase in density, the air-cooled cooling system faces more and more challenges. On the one hand, the noise and energy consumption of the fan are increasingly prominent, affecting the overall energy efficiency of the server; on the other hand, under high load operation, the air-cooled cooling system often fails to control the temperature inside the server within the ideal range, resulting in limited server performance and even overheating failure.

[0004] Therefore, it is necessary to provide a cloud server host that can effectively cool and improve cooling efficiency. SUMMARY

[0005] The utility model aims at providing a cloud server host that can effectively cool and improve cooling efficiency.

[0006] According to an aspect of the present application, a cloud server host is provided, which comprises:

[0007] a housing,

[0008] a mainboard fixedly connected to the housing;

[0009] a first heat sink fixedly connected to the mainboard and located on the side of the mainboard away from the housing;

[0010] a second heat sink fixedly connected to the housing and located on the side of the housing provided with the mainboard, and connected to the first heat sink in pipeline;

[0011] a water pump fixedly connected to the housing and connected to the first heat sink and the second heat sink in pipeline, respectively.

[0012] More preferably, the water pump comprises:

[0013] a fan, fixedly connected to the water pump and rotating in a first direction, as viewed in a direction perpendicular to the main board;

[0014] a bracket, fixedly connected to the water pump and located between the housing and the fan.

[0015] More preferably, the water pump is further integrally formed with a first fin portion and a second fin portion,

[0016] the first fin portion is located on a surface of the water pump and on a side of the water pump facing away from the first heat sink;

[0017] the second fin portion is located on a surface of the water pump and on a side of the water pump facing away from the second heat sink.

[0018] More preferably, the mainframe further comprises:

[0019] a water cooling block, located between the main board and the housing, as viewed in a direction parallel to the main board, the water cooling block being connected in pipeline with the first heat sink and connected in pipeline with the second heat sink and connected in pipeline with the water pump;

[0020] wherein the water cooling block contains cooling liquid to flow between the first heat sink and the water pump and between the second heat sink and the water pump.

[0021] More preferably, the housing is further integrally formed with a first heat dissipation portion and a second heat dissipation portion, as viewed in a direction perpendicular to the main board,

[0022] the first heat dissipation portion is composed of a plurality of heat dissipation fins and is located on a side of the first heat sink facing away from the water pump;

[0023] the second heat dissipation portion is composed of a plurality of heat dissipation fins and is located on a side of the water pump facing away from the first heat sink.

[0024] More preferably, the mainframe further comprises:

[0025] a processor, fixedly connected to the main board and electrically connected to the main board and located on a side of the main board facing away from the housing;

[0026] a power supply, fixedly connected to the housing and located on a side of the housing to which the main board is connected;

[0027] wherein the power supply is electrically connected to the main board and electrically connected to the water pump.

[0028] More preferably, the mainframe further comprises:

[0029] A control board is connected to the shell and is located on the side of the main board away from the power supply when viewed in a direction perpendicular to the main board.

[0030] A cover plate is connected to the shell and is located on the side of the first heat sink away from the main board.

[0031] The control board is provided with a power supply port, which is electrically connected to the power supply to supply power to the power supply.

[0032] More preferably, the host computer further comprises:

[0033] A memory bank is fixedly connected to the main board and is located on the side of the main board away from the shell.

[0034] The memory bank is in data connection with the processor and in electrical connection with the power supply.

[0035] More preferably, the shell is made of any one or a combination of aluminum alloy, steel, and plastic.

[0036] The utility model has the following beneficial effects:

[0037] The water pump on the shell is connected to the first heat sink on the main board and the second heat sink on the shell, respectively, so that the host computer can effectively dissipate heat by transferring heat from the main board to the shell. BRIEF DESCRIPTION OF DRAWINGS

[0038] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the description of the embodiments or the prior art will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort based on these drawings.

[0039] Figure 1 It is a perspective view of the host computer in an embodiment of the present application.

[0040] Figure 2 It is a perspective view of the host computer in an embodiment of the present application.

[0041] Figure 3 It is a perspective view of the host computer in an embodiment of the present application.

[0042] Figure 4Fig. 2 is a schematic view of a planar structure of a host computer according to an embodiment of the present application;

[0043] Figure 5 Fig. 3 is a schematic view of a three-dimensional structure of a heat dissipation structure according to an embodiment of the present application;

[0044] Fig. 4 is a schematic view of a planar structure of a host computer according to an embodiment of the present application; DETAILED DESCRIPTION

[0045] In order to facilitate the understanding of the present application, a more complete understanding of the present application can be had by reference to the following description and the accompanying drawings. In the Figures, like reference numerals can be used to denote like elements throughout the several views. The present application can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.

[0046] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. The terms "vertical", "horizontal", "left", "right", and the like as used herein are used for explanation purposes only.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0048] Reference will now be made to Figure 1 - Figure 5 An embodiment of the present application provides a cloud server host computer 200, the host computer 200 comprising a housing 10, a mainboard 20, a first heat dissipation fin 30, a second heat dissipation fin 40, and a water pump 50.

[0049] The mainboard 20 is fixedly connected to the shell 10. The first heat sink 30 is fixedly connected to the mainboard 20 and located on the side of the mainboard 20 away from the shell 10. The second heat sink 40 is fixedly connected to the shell 10 and located on the side of the shell 10 provided with the mainboard 20, and is connected to the first heat sink 30 through a pipeline. The water pump 50 is fixedly connected to the shell 10 and connected to the first heat sink 30 and the second heat sink 40 through a pipeline, respectively.

[0050] The first heat sink 30 is directly fixedly connected to the mainboard 20 and located on the side of the mainboard 20 away from the shell 10, which can closely adhere to the heat generating elements on the mainboard 20, such as the processor 70 and the chipset, and timely absorb the heat generated by these elements. The second heat sink 40 is fixedly connected to the shell 10 and located on the side of the shell 10 provided with the mainboard 20, and is connected to the first heat sink 30 through a pipeline. This design can make full use of the external space of the shell 10 for heat dissipation, while avoiding the accumulation of heat inside the server 200. The water pump 50 serves as the power source for the circulation of the cooling liquid and is connected to the first heat sink 30 and the second heat sink 40 through a pipeline, respectively, forming a closed cooling liquid circulation system. The cooling liquid continuously absorbs and releases heat during the circulation process, thereby effectively reducing the temperature on the mainboard 20 and the shell 10. Through the circulation of the water pump 50, the cooling liquid can continuously flow between the heat sinks and the heat sources, improving the heat dissipation efficiency. The mainboard 20 is fixedly connected to the shell 10, which can ensure the stability of the mainboard 20 during the operation of the server. This connection method helps to prevent the mainboard 20 from being damaged due to vibration or impact, improving the reliability and durability of the server. The two heat sinks are fixedly connected to the mainboard 20 and the shell 10, which can ensure the stability of the heat sinks during the heat dissipation process. At the same time, this connection method also helps to improve the heat conduction efficiency between the heat sinks and the heat sources. In addition to the structural design of the present application, the cloud server can also add more heat sinks or upgrade the performance of the water pump 50 as needed to meet higher heat dissipation requirements.

[0051] More preferably, the water pump 50 includes a fan 51 and a bracket 52.

[0052] When viewed in a direction perpendicular to the mainboard 20, the fan 51 is fixedly connected to the water pump 50 and rotates in a first direction F1. The bracket 52 is fixedly connected to the water pump 50 and located between the shell 10 and the fan 51.

[0053] The fan 51 is fixedly connected to the water pump 50 and rotates in a specific direction, generating airflow and accelerating the flow of surrounding air. This flowing air helps to carry away the heat on the water pump 50 and the heat sink, further improving the heat dissipation efficiency. Through the active cooling of the fan 51, the stability of the heat dissipation system during long-time high-load operation can be ensured. This helps to prevent hardware failure caused by overheating and prolongs the service life of the server. In addition, the fan 51 is connected to the control circuit and can automatically adjust the speed according to the temperature of the server. This intelligent cooling method can more accurately control the cooling effect while reducing energy consumption and noise. The bracket 52 supports the fan 51 and ensures that the fan 51 does not fall off or be damaged due to vibration or external force during rotation.

[0054] More preferably, the water pump 50 is also integrally formed with a first fin 53 and a second fin 54. The first fin 53 is located on the surface of the water pump 50 and on the side of the water pump 50 away from the first heat sink 30. The second fin 54 is located on the surface of the water pump 50 and on the side of the water pump 50 away from the second heat sink 40.

[0055] The first fin 53 and the second fin 54 are located on the surface of the water pump 50 and on the side of the water pump 50 away from the first heat sink 30 and the second heat sink 40, respectively. Such a design increases the heat dissipation area of the water pump 50, so that more heat can be transferred from the water pump 50 to the surrounding air through heat conduction and convection. By providing fins on the water pump 50, the heat dissipation path can be optimized. During circulation, the coolant carries away the heat on the motherboard 20 and the heat sink and transfers it to the fins through the water pump 50. The design of the fins allows heat to be dissipated more quickly into the air, thereby improving the heat dissipation efficiency. The provision of fins helps to disperse the heat on the water pump 50 and prevent local overheating. When the water pump 50 is operated for a long time, it will generate some heat. If the heat cannot be dissipated in time, it may cause the water pump 50 to degrade in performance or even be damaged. By adding fins, the heat can be more evenly distributed to the surface of the water pump 50, reducing the local temperature and improving the stability of the heat dissipation system. The fins as part of the water pump 50 can simplify the heat dissipation structure. Compared with traditional heat dissipation methods, such as using additional heat sinks or fans 51, this design is more compact and efficient. It reduces the number and complexity of components, making installation and maintenance easier.

[0056] More preferably, the host computer 200 further comprises a water cooling block 60. The water cooling block 60 is located between the mainboard 20 and the shell 10 in a direction parallel to the mainboard 20. The water cooling block 60 is connected to the first heat sink 30, the second heat sink 40, and the water pump 50. The water cooling block 60 contains cooling liquid that circulates between the first heat sink 30, the water cooling block 60, and the second heat sink 40, and between the second heat sink 40 and the water pump 50.

[0057] The water cooling block 60 contains cooling liquid that circulates between the first heat sink 30, the water cooling block 60, and the second heat sink 40, and between the second heat sink 40 and the water pump 50. The cooling liquid can absorb heat generated by the mainboard 20 and other heat sources, and transfer the heat to the heat sinks through circulation, and finally dissipate the heat to the air. This cooling method is more efficient than traditional air cooling, and can quickly reduce the temperature inside the host computer 200. The water cooling block 60 usually has a large heat dissipation area, which can more effectively absorb and dissipate heat. By cooperating with the heat sinks, a more perfect cooling system can be formed to ensure that the server maintains a stable temperature during high-load operation. The water cooling system can reduce temperature fluctuations, allowing the server to operate in a more stable environment. This helps to extend the service life of the server and improve the stability and reliability of the system. Compared with air cooling systems, water cooling systems usually have lower noise levels. This is because the speed of the water pump 50 and the cooling fan 51 can be more accurately controlled, reducing noise. This is particularly important for servers that need to run for a long time, as it can provide a quieter working environment.

[0058] More preferably, the shell 10 further integrally forms a first heat dissipation part 11 and a second heat dissipation part 12. The first heat dissipation part 11 is composed of a plurality of heat dissipation fins and is located on the side of the first heat sink 30 away from the water pump 50. The second heat dissipation part 12 is composed of a plurality of heat dissipation fins and is located on the side of the water pump 50 away from the first heat sink 30.

[0059] The first heat dissipation part 11 and the second heat dissipation part 12 are composed of a plurality of heat dissipation fins, which greatly increase the heat dissipation area. The increase in heat dissipation area means that more heat can be transferred from the inside of the mainframe 200 to the external environment through heat conduction and convection, thereby improving the heat dissipation efficiency. The design of the heat dissipation fins enables heat to be dissipated more quickly into the air. When the heat inside the mainframe 200 is transferred to the shell 10 through the heat dissipation fins and the cooling liquid, the heat dissipation fins can quickly dissipate these heat, avoiding the accumulation of heat inside the mainframe 200. The arrangement of the heat dissipation fins helps to disperse the heat on the shell 10 and prevent local overheating. By increasing the heat dissipation area and the heat dissipation path, the heat can be more evenly distributed on the entire shell 10, reducing local temperature and improving the stability of the heat dissipation system. The heat dissipation fins, as part of the shell 10, can make rational use of the space inside the mainframe 200. This layout not only improves the heat dissipation efficiency, but also makes the mainframe 200 more compact and efficient.

[0060] More preferably, the mainframe 200 further comprises a processor 70 and a power supply 80.

[0061] The processor 70 is fixedly connected to the mainboard 20 and located on the side of the mainboard 20 away from the shell 10. The power supply 80 is fixedly connected to the shell 10 and located on the side of the shell 10 connected with the mainboard 20. The power supply 80 is electrically connected with the mainboard 20 and the water pump 50.

[0062] The processor 70 is one of the most critical components in the server and also the part with the largest heat generation. By fixing it to the side of the mainboard 20 away from the shell 10, it is easier to design a dedicated cooling system for it, such as a cooling fan 51 or cooling fins, to ensure that the processor 70 can be effectively cooled when running under high load. The power supply 80 is also a component with a relatively large heat generation. By fixing it to the side of the shell 10, it is convenient to design a cooling channel for the power supply 80, such as a cooling hole or a cooling fan 51, to ensure that the power supply 80 can maintain an appropriate temperature when working. Through reasonable layout and cooling design, the heat distribution inside the mainframe 200 can be more uniform, reducing the risk of local overheating, thereby improving the stability and reliability of the server. The processor 70 and the power supply 80 are both critical components in the server, and their stability and reliability directly affect the performance of the entire system. By fixing them to specific locations on the mainboard 20 and the shell 10 respectively, the electromagnetic interference and physical interference between them can be reduced, thereby improving the stability of the system. Such a layout makes it more convenient to maintain or replace the processor 70 and the power supply 80. Users can easily access these components to perform necessary cleaning, inspection or replacement work. The power supply 80 not only provides power for the processor 70, but also provides power for other components in the mainframe 200, such as memory, hard drives, etc. By fixing it to the side of the shell 10 and designing it to be electrically connected to the mainboard 20 and the water pump 50, it is more convenient to distribute and protect the power supply 80, ensuring that each component can receive stable and reliable power supply.

[0063] More preferably, the mainframe 200 further comprises a control board 90 and a cover plate 100.

[0064] The control board 90 is connected to the shell 10 and is located on the side of the mainboard 20 away from the power supply 80 when viewed in a direction perpendicular to the mainboard 20. The cover plate 100 is connected to the shell 10 and is located on the side of the first cooling fin 30 away from the mainboard 20. The control board 90 is provided with a power supply port 91, which is electrically connected to the power supply 80 to supply power to the power supply 80.

[0065] The control board 90 is connected to the shell 10 and located on the side of the main board 20 away from the power supply 80. This layout can make full use of the space inside the mainframe 200, avoiding interference and conflict between components. At the same time, placing the control board 90 on the back of the main board 20 can more effectively utilize the heat dissipation channels on the back of the main board 20, reducing the working temperature of the control board 90 and improving its stability and reliability. The cover plate 100 is connected to the shell 10 and located on the side of the first heat sink 30 away from the main board 20. This design can protect the heat sink from external interference and damage, and also helps the heat sink to effectively dissipate heat to the air. The cover plate 100 also has the functions of dustproof and moisture-proof, keeping the inside of the mainframe 200 clean and dry, and prolonging the service life of the components. The control board 90 is provided with a power supply port 91 and is electrically connected to the power supply 80. This design can facilitate the connection and management of the power supply 80. The location of the power supply port 91 also takes into account safety and ease of use, ensuring that users can easily connect the power supply 80, while avoiding the pulling and damage of the power supply 80 line. Connecting the power supply 80 to the control board 90, main board 20 and other components can achieve more precise management of the power supply 80.

[0066] More preferably, the mainframe 200 further comprises a memory stick 110. The memory stick 110 is fixedly connected to the main board 20 and located on the side of the main board 20 away from the shell 10. The memory stick 110 is in data connection with the processor 70 and in electrical connection with the power supply 80.

[0067] The memory stick 110 is directly fixedly connected to the main board 20 and in data connection with the processor 70, which can ensure high-speed transmission of data between the processor 70 and the memory. This design reduces the delay and loss of data transmission, improving the overall performance of the server. The memory stick 110 serves as a temporary storage space for the server, responsible for storing and reading data being processed by the processor 70. By being fixedly connected to the main board 20, the memory stick 110 can maintain stability and reliability during high-speed reading and writing, thereby improving data processing capabilities. By being fixedly connected to the side of the main board 20 away from the shell 10, the memory stick 110 can reduce interference from the external environment and the shell 10, reducing the risk of system failure due to electromagnetic interference and other reasons. Such a layout design also helps with the heat dissipation of the memory stick 110. Since the memory stick 110 is directly connected to the main board 20, it can make full use of the heat dissipation channels and heat dissipation systems on the main board 20, ensuring that the memory stick 110 maintains an appropriate temperature during operation, avoiding performance degradation or failure due to overheating. The memory stick 110 is electrically connected to the power supply 80, ensuring that it receives stable power supply during operation. This design helps to avoid memory stick 110 failure or performance degradation due to unstable power supply 80.

[0068] More preferably, the material of the shell 10 is any one or a combination of aluminum alloy, steel, and plastic.

[0069] The aluminum alloy has low density but high strength, which can effectively reduce the overall weight of the mainframe 200, facilitating transportation and installation. The aluminum alloy has good thermal conductivity, which helps to quickly dissipate heat inside the server, ensuring stable operation of the server. Steel has high strength and strong load-bearing capacity, which can effectively protect the internal hardware of the server from external impact and damage, and steel has certain electromagnetic shielding performance, which helps to protect the internal electronic components of the server from electromagnetic interference. Compared with aluminum alloy, steel has a lower price, which is conducive to reducing the manufacturing cost of the mainframe 200. Plastic has low cost and is easy to process, which is suitable for manufacturing auxiliary components of the mainframe 200. Plastic has good insulation performance, and using plastic in certain positions can help protect the internal electronic components of the server from risks such as electric shock and short circuit. Aluminum alloy, steel, and plastic have their own advantages and disadvantages in performance, and by combining their use, their respective advantages can be fully utilized to achieve performance complementation. In actual application, the material selection of the shell 10 of the mainframe 200 can be comprehensively considered according to specific use scenarios, performance requirements, and budget, etc. For example, in situations requiring high heat dissipation performance, aluminum alloy or a combination of aluminum alloy and steel can be selected; in situations requiring high strength and load-bearing capacity, steel or a combination of steel and aluminum alloy can be selected; in situations requiring cost and weight reduction, plastic or a combination of plastic and other materials can be selected.

[0070] In this way, by connecting the first heat sink 30 on the mainboard 20 and the second heat sink 40 on the shell 10 through the water pump 50 located on the shell 10, the mainframe 200 can transfer heat from the mainboard 20 to the shell 10, so that the mainframe 200 can effectively dissipate heat, and the water can be circulated between the first heat sink 30, the second heat sink 40, and the water pump 50 through the pipeline connection, effectively improving the efficiency of heat dissipation.

[0071] The above-described embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it should not be understood as limiting the scope of the patent of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, several modifications and improvements can be made, which are within the scope of protection of the present application.

Claims

1. A cloud server host, characterized by, The host comprises: a shell, a mainboard fixedly connected to the shell; a first heat sink fixedly connected to the mainboard and located on a side of the mainboard away from the shell; a second heat sink fixedly connected to the shell and located on a side of the shell provided with the mainboard, and in pipeline connection with the first heat sink; a water pump fixedly connected to the shell and in pipeline connection with the first heat sink and the second heat sink respectively.

2. The cloud server host of claim 1, wherein, The water pump comprises: a fan fixedly connected to the water pump and rotating in a first direction as viewed in a direction perpendicular to the mainboard; a bracket fixedly connected to the water pump and located between the shell and the fan.

3. The cloud server host of claim 1, wherein, The water pump is further integrally formed with a first fin portion and a second fin portion, the first fin portion is located on a surface of the water pump and on a side of the water pump away from the first heat sink; the second fin portion is located on a surface of the water pump and on a side of the water pump away from the second heat sink.

4. The cloud server host of claim 1, wherein, The host further comprises: a water cooling block located between the mainboard and the shell as viewed in a direction parallel to the mainboard, the water cooling block being in pipeline connection with the first heat sink, in pipeline connection with the second heat sink, and in pipeline connection with the water pump; wherein the water cooling block contains cooling liquid to flow between the first heat sink and the water pump and between the second heat sink and the water pump.

5. The cloud server host of claim 1, wherein, The shell is further integrally formed with a first heat dissipation portion and a second heat dissipation portion as viewed in a direction perpendicular to the mainboard, the first heat dissipation portion is composed of a plurality of heat dissipation fins and is located on a side of the first heat sink away from the water pump; the second heat dissipation portion is composed of a plurality of heat dissipation fins and is located on a side of the water pump away from the first heat sink.

6. The cloud server host of claim 1, wherein, The host further comprises: a processor fixedly connected to the mainboard and in electrical connection with the mainboard and located on a side of the mainboard away from the shell; a power supply fixedly connected to the shell and located on a side of the shell provided with the mainboard; wherein the power supply is in electrical connection with the mainboard and in electrical connection with the water pump.

7. The cloud server host of claim 6, wherein, The host further comprises: a control board connected to the shell and located on a side of the mainboard away from the power supply as viewed in a direction perpendicular to the mainboard; a cover plate connected to the shell and located on a side of the first heat sink away from the mainboard; wherein the control board is provided with a power supply port in electrical connection with the power supply to supply power to the power supply.

8. The cloud server host of claim 7, wherein, The host further comprises: a memory bank fixedly connected to the mainboard and located on a side of the mainboard away from the shell; wherein the memory bank is in data connection with the processor and in electrical connection with the power supply.

9. The cloud server host of claim 1, wherein, The shell is made of any one or a combination of aluminum alloy, steel, and plastic.

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