Heat dissipation device and computer device
By immersing the heat dissipation fins in coolant in the heat dissipation device and using a liquid radiator and fan to further dissipate heat from the coolant, the problem of low heat dissipation efficiency of computer equipment is solved, achieving a highly efficient and economical heat dissipation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-16
- Publication Date
- 2026-03-24
AI Technical Summary
With the increasing demands for heat dissipation in existing computer equipment, optimizing the structure of the heat dissipation system to improve heat dissipation efficiency has become an urgent problem to be solved.
A heat dissipation device comprising a first heat dissipation component, a second heat dissipation component, and a heat exchange component is adopted. By immersing the heat dissipation fins in coolant and using a liquid radiator and a fan to further dissipate heat from the coolant, the heat dissipation efficiency is improved.
It effectively improves heat dissipation efficiency and achieves excellent heat dissipation effect, while having a simple structure, low cost, and is suitable for manufacturing.
Smart Images
Figure CN224035854U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of heat sinks, in particular to a heat dissipation device and a computer device. BACKGROUND
[0002] With the continuous improvement of the performance of computer equipment, the demand for heat dissipation is also increasing, and how to optimize the structure of the heat dissipation system and improve the heat dissipation efficiency has become a technical problem to be solved. SUMMARY
[0003] The present application provides a heat dissipation device and a computer device to solve the above technical problems.
[0004] Embodiments of the present application are implemented as follows:
[0005] A heat dissipation device includes a first heat dissipation component, a second heat dissipation component, and a heat exchange component. The first heat dissipation component includes a shell and a heat dissipation fin, the shell has an inner cavity, the inner cavity is filled with a cooling liquid, the heat dissipation fin is accommodated in the inner cavity, and the heat dissipation fin is infiltrated by the cooling liquid. The second heat dissipation component includes a liquid heat sink and a fan, the liquid heat sink is connected to the shell, and the fan is arranged on one side of the liquid heat sink. The heat exchange component is connected to the first heat dissipation component.
[0006] In this way, the heat dissipation device of the present application improves the heat dissipation efficiency of the heat dissipation fin by infiltrating the heat dissipation fin in the cooling liquid, and further dissipates heat from the cooling liquid through the liquid heat sink and the fan in the second heat dissipation component, thereby effectively improving the heat dissipation efficiency and achieving excellent heat dissipation effect. In addition, the heat dissipation device of the present application has a simple structure, is convenient to manufacture, and can reduce costs while ensuring heat dissipation effect.
[0007] In one possible implementation: the heat exchange component includes a mounting plate and a heat exchange plate, the heat exchange plate is arranged on the mounting plate, the inner cavity has an opening, the mounting plate is arranged at the opening and connected to the shell, and the heat dissipation fin is connected to the heat exchange plate.
[0008] In one possible implementation: the heat exchange component further includes a heat exchange column, the heat exchange column is connected to the heat exchange plate, and part of the heat exchange column is inserted into the heat dissipation fin.
[0009] In one possible implementation: the heat exchange column includes a connecting section and an extending section, the connecting section is partially embedded in the heat exchange plate, and the extending section is inserted into the heat dissipation fin.
[0010] In one possible implementation: one side of the heat exchange plate towards the shell protrudes from the surface of the mounting plate and is accommodated in the inner cavity.
[0011] In one possible implementation: the side of the heat exchange plate facing away from the housing is flush with the surface of the mounting plate.
[0012] In one possible implementation: the heat exchange assembly further includes a positioning element disposed on the mounting plate, and the positioning element is located outside the housing.
[0013] In one possible implementation: the housing has a first liquid inlet and a first liquid outlet, and the liquid radiator has a second liquid inlet and a second liquid outlet. The first liquid inlet is connected to the second liquid outlet, and the first liquid outlet is connected to the second liquid inlet. Along the direction of gravity, the first liquid inlet and the first liquid outlet are at different heights.
[0014] In one possible implementation: the heat dissipation device further includes a drive pump connected between the first heat dissipation component and the second heat dissipation component for driving the flow of the coolant.
[0015] Embodiments of this application also provide a computer device, including a computing unit and a heat dissipation device as described in the above embodiments, wherein the computing unit is connected to a heat exchange component of the heat dissipation device. Attached Figure Description
[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the structure of a heat dissipation device according to an embodiment of this application.
[0018] Figure 2 for Figure 1 The diagram shows the structure of the first heat dissipation component and the heat exchange component.
[0019] Figure 3 for Figure 2 The diagram shows the exploded structure.
[0020] Figure 4 for Figure 3 A schematic diagram of the shell structure shown.
[0021] Figure 5 for Figure 3 The diagram shows the structure of the heat dissipation fins and heat exchange components.
[0022] Figure 6 This is a schematic diagram of the heat exchange component.
[0023] Figure 7 Fig. 2 shows a structure schematic view of the second heat dissipation component in the heat dissipation device shown in Fig. 1. Figure 1
[0024] Figure 8 Fig. 3 shows a structure schematic view of the second heat dissipation component in another direction shown in Fig. 2. Figure 7
[0025] Figure 9 Fig. 4 shows a simplified schematic view of a computer device according to an embodiment of the present application.
[0026] Main element symbol explanation:
[0027] Heat dissipation device 100
[0028] First heat dissipation component 10
[0029] Housing 11
[0030] Inner cavity 111
[0031] First liquid inlet 112
[0032] First liquid outlet 113
[0033] Opening 114
[0034] Heat dissipation fin 12
[0035] Second heat dissipation component 20
[0036] Liquid heat sink 21
[0037] Second liquid inlet 211
[0038] Second liquid outlet 212
[0039] Fin structure 213
[0040] Fan 22
[0041] Heat exchange component 30
[0042] Mounting plate 31
[0043] Heat exchange plate 32
[0044] Heat exchange column 33
[0045] Connecting section 331
[0046] Extension section 332
[0047] Positioning member 34
[0048] Drive pump 40
[0049] First pipeline 51
[0050] Second pipe 52
[0051] Third pipe 53
[0052] Computer device 200
[0053] Computing unit 201
[0054] The following detailed description will further describe the present application with reference to the above-mentioned drawings. DETAILED DESCRIPTION
[0055] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application.
[0056] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be intervening elements. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be intervening elements. When an element is referred to as being "disposed on" another element, it can be directly on the other element or there can be intervening elements. The terms "vertical", "horizontal", "left", "right", and similar terms as used herein are for purposes of description and are not meant to be limiting.
[0057] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.
[0058] Some embodiments of the present application are described in detail. The following embodiments and features of the embodiments can be combined with each other in the case of no conflict.
[0059] Reference is made to Figure 1 , Figure 2 and Figure 3The embodiment of the present application provides a heat dissipation device 100, which comprises a first heat dissipation assembly 10, a second heat dissipation assembly 20 and a heat exchange assembly 30. The first heat dissipation assembly 10 comprises a shell 11 and a heat dissipation fin 12, the shell 11 has an inner cavity 111 filled with cooling liquid, and the heat dissipation fin 12 is accommodated in the inner cavity 111 and is immersed in the cooling liquid. The second heat dissipation assembly 20 comprises a liquid heat sink 21 and a fan 22, the liquid heat sink 21 is communicated with the shell 11, and the cooling liquid can flow between the liquid heat sink 21 and the shell 11. The fan 22 is arranged on one side of the liquid heat sink 21 and is used for cooling the liquid heat sink 21 and improving the heat dissipation efficiency. The heat exchange assembly 30 is connected with the first heat dissipation assembly 10 and is used for transferring heat to the first heat dissipation assembly 10, so that the temperature of a heating unit is reduced and the computer device 200 is cooled.
[0060] Therefore, the heat dissipation device 100 of the present application can improve the heat dissipation efficiency of the heat dissipation fin 12 by immersing the heat dissipation fin 12 in the cooling liquid, so that the cooling liquid can absorb the heat of the heat dissipation fin 12, the contact area and the contact time between the cooling liquid and the heat dissipation fin 12 are ensured during the flow process, the heat of the heat dissipation fin 12 is taken away, and the heat dissipation efficiency of the heat dissipation fin 12 is improved. The heat dissipation efficiency is effectively improved by connecting the second heat dissipation assembly 20 outside the shell 11, so that the liquid heat sink 21 and the fan 22 in the second heat dissipation assembly 20 further dissipate heat of the cooling liquid, and excellent heat dissipation effect is achieved. In addition, the heat dissipation device 100 of the present application has simple structure and is convenient to manufacture, and can reduce the cost while ensuring the heat dissipation effect.
[0061] Please refer to Figure 3 , Figure 4 , Figure 5 and Figure 6 In a possible implementation, the heat exchange assembly 30 comprises a mounting plate 31 and a heat exchange plate 32, the heat exchange plate 32 is arranged on the mounting plate 31, the inner cavity 111 has an opening 114, the mounting plate 31 is arranged at the opening 114 and connected with the shell 11, and the heat dissipation fin 12 is connected with the heat exchange plate 32. The mounting plate 31 is sealingly connected with the shell 11, so that the cooling liquid is prevented from leaking. In some embodiments, the mounting plate 31 is provided with a mounting groove, and the heat exchange plate 32 is fixed in the mounting groove. The heat exchange plate 32 can also be sealingly connected with the mounting plate 31, so that the problem of leakage of the cooling liquid from the connection position of the heat exchange plate 32 and the mounting plate 31 is reduced. In other embodiments, the heat exchange plate 32 and the mounting plate 31 can also be connected as a whole and can be prepared by integral molding. The heat exchange plate 32 exchanges heat with the heat dissipation fin 12 at the opening 114 of the inner cavity 111, and the heat is dissipated into the cooling liquid through the heat dissipation fin 12.
[0062] Please refer to Figures 2 to 6In some embodiments, the heat exchange plates 32 protrude from the surface of the mounting plate 31 towards one side of the shell 11 and are received in the inner cavity 111. The cooling liquid in the shell 11 can also contact the portion of the heat exchange plates 32 protruding from the mounting plate 31, allowing the heat exchange plates 32 to directly transfer a portion of the heat to the cooling liquid. The portion of the heat exchange plates 32 protruding from the mounting plate 31 can also serve as a positioning element for the shell 11 when the shell 11 is connected to the mounting plate 31, which can improve the assembly efficiency.
[0063] In some embodiments, the side of the heat exchange plates 32 facing away from the shell 11 is flush with the surface of the mounting plate 31. In this way, when the heat exchange assembly 30 is assembled with the heat generating unit, the heat exchange plates 32 can be in sufficient contact with the heat generating unit, allowing effective heat exchange with the heat generating unit.
[0064] In some embodiments, the heat exchange assembly 30 further comprises positioning elements 34 disposed on the mounting plate 31 and located outside the shell 11. Specifically, the surface area of the mounting plate 31 is larger than the opening 114 of the shell 11, and the side edges of the mounting plate 31 protrude beyond the side edges of the shell 11 when the mounting plate 31 is assembled with the shell 11. The positioning elements 34 are disposed on the portion of the mounting plate 31 protruding beyond the shell 11. In one embodiment, the number of positioning elements 34 is four, which are disposed at the four corners of the mounting plate 31 and used to connect external heat generating units or fix the heat dissipation device 100 at a desired position. In other embodiments, the number of positioning elements 34 can be more or less than four, which is not limited in the present application.
[0065] In some embodiments, referring again to Figure 5 and Figure 6 , the heat exchange assembly 30 further comprises heat exchange columns 33 connected to the heat exchange plates 32, and some of the heat exchange columns 33 are inserted into the heat dissipation fins 12. Specifically, a plurality of heat dissipation fins 12 are stacked, and the heat exchange columns 33 are inserted into and fixed to the heat dissipation fins 12 along the stacking direction of the heat dissipation fins 12. The lowermost heat dissipation fin 12 can be in contact with or connected to the heat exchange plates 32 to increase the heat conduction area between the heat dissipation fins 12 and the heat exchange plates 32. In other embodiments, the heat dissipation fins 12 can be spaced apart from the heat exchange plates 32, and the connection relationship between the heat dissipation fins 12 and the heat exchange plates 32 is achieved through the heat exchange columns 33.
[0066] In one possible embodiment, the heat exchange columns 33 can be solid columns made of heat-conducting materials. In another embodiment, the heat exchange columns 33 can also be pipe structures made of heat-conducting materials. One end of the heat exchange columns 33 penetrating the heat dissipation fins 12 has an opening 114, and the cooling liquid can also flow into the lumen of the heat exchange columns 33 to increase the contact area between the heat exchange columns 33 and the cooling liquid, further improving the heat dissipation efficiency.
[0067] In some embodiments, the heat exchange column 33 comprises a connecting section 331 partially embedded in the heat exchange plate 32 and an extending section 332 inserted into the heat dissipation fin 12. Specifically, the heat exchange column 33 can have a U-shaped structure, with the connecting section 331 located between two extending sections 332, and the two extending sections 332 arranged side by side and fixed to the heat dissipation fin 12 to transfer heat to the heat dissipation fin 12. Further, the heat exchange column 33 can also be in plurality, with each heat exchange column 33 connected to the heat exchange plate 32 and arranged side by side and spaced apart. Each heat exchange column 33 is inserted into the heat dissipation fin 12 to increase the contact area with the heat dissipation fin 12 and improve the heat dissipation efficiency.
[0068] Please refer to Figures 1 to 3 , Figure 7 and Figure 8 In a possible embodiment, the housing 11 of the first heat dissipation assembly 10 is provided with a first liquid inlet 112 and a first liquid outlet 113, and the liquid heat sink 21 is provided with a second liquid inlet 211 and a second liquid outlet 212. The first liquid inlet 112 is connected to the second liquid outlet 212, and the first liquid outlet 113 is connected to the second liquid inlet 211, so as to realize the circulation of the cooling liquid between the liquid heat sink 21 and the housing 11. In the direction of gravity, the height positions of the first liquid inlet 112 and the first liquid outlet 113 are different, so that the cooling liquid can flow fully in the housing 11, fully contact the heat dissipation fin 12 and absorb heat. In some embodiments, the first liquid inlet 112 and the second liquid inlet 211 can also be arranged on different sides of the housing 11, respectively, to further improve the flowability of the cooling liquid in the housing 11, increase the contact area and contact time of the cooling liquid with the heat dissipation fin 12.
[0069] The structural size of the housing 11 and the heat dissipation fin 12 can also be designed according to the heat dissipation requirement, so as to have a larger flow space in the housing 11, increase the contact area of the cooling liquid with the heat dissipation fin 12, increase the fluid flow path, prolong the contact time of the fluid with the heat dissipation fin 12, and effectively improve the heat dissipation effect.
[0070] In a possible implementation, the heat dissipation device 100 further comprises a driving pump 40 connected between the first heat dissipation assembly 10 and the second heat dissipation assembly 20 for driving the flow of the cooling liquid. Specifically, the first liquid inlet 112 of the housing 11 is connected with the driving pump 40 through the first pipeline 51, the driving pump 40 is connected with the second liquid outlet 212 of the liquid heat sink 21 through the second pipeline 52, and the first liquid outlet 113 of the housing 11 is connected with the second liquid inlet 211 of the liquid heat sink 21 through the third pipeline 53. In this way, a fluid loop is formed among the housing 11, the liquid heat sink 21 and the driving pump 40, in which the cooling liquid circulates and flows. Specifically, the cooling liquid absorbs heat in the housing 11, flows into the liquid heat sink 21 for cooling, and is then sent into the housing 11 by the driving pump 40 for achieving the heat dissipation effect and realizing the recycling of the cooling liquid.
[0071] As shown in Figure 7 and Figure 8 , in some embodiments, the outer shell of the liquid heat sink 21 is further provided with a fin structure 213 for increasing the heat dissipation area of the liquid heat sink 21. The fan 22 is fixedly arranged on one side of the liquid heat sink 21 for blowing air to the fin structure 213 to increase the air flow speed at the fin structure 213 and quickly dissipate heat to the surrounding environment.
[0072] Please refer to Figure 1 and Figure 9 , the embodiment of the present application further provides a computer device 200 comprising a computing unit 201 and the heat dissipation device 100 described in the above embodiment, and the computing unit 201 is connected with the heat exchange assembly 30 of the heat dissipation device 100. Specifically, the computing unit 201 can be in contact with the heat exchange assembly 30, and the heat transferred by the heat exchange assembly 30 is dissipated through the first heat dissipation assembly 10 and the second heat dissipation assembly 20 to realize the cooling of the computing unit 201 and maintain the stable operation of the computing unit 201.
[0073] The above embodiments are only used to illustrate the technical solutions of the present application but not limit the present application. Although the present application is described in detail with reference to the above preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced by equivalents without departing from the spirit and scope of the present application.
Claims
1. A heat dissipating device, characterized by, The heat dissipation device comprises: a first heat dissipation assembly, comprising a housing and a heat dissipation fin, the housing has an inner cavity filled with cooling liquid, and the heat dissipation fin is accommodated in the inner cavity and is infiltrated by the cooling liquid; a second heat dissipation assembly, comprising a liquid heat sink and a fan, the liquid heat sink is connected to the housing, and the fan is arranged on one side of the liquid heat sink; a heat exchange assembly connected to the first heat dissipation assembly.
2. The heat dissipation device according to claim 1, wherein: the heat exchange assembly comprises a mounting plate and a heat exchange plate, the heat exchange plate is arranged on the mounting plate, the inner cavity has an opening, the mounting plate is arranged at the opening and connected to the housing, and the heat dissipation fin is connected to the heat exchange plate.
3. The heat dissipation device according to claim 2, wherein: the heat exchange assembly further comprises a heat exchange column, the heat exchange column is connected to the heat exchange plate, and part of the heat exchange column is inserted into the heat dissipation fin.
4. The heat dissipation device according to claim 3, wherein: the heat exchange column comprises a connecting section and an extending section, the connecting section is partially embedded in the heat exchange plate, and the extending section is inserted into the heat dissipation fin.
5. The heat dissipation device according to claim 2, wherein: one side of the heat exchange plate facing the housing protrudes from the surface of the mounting plate and is accommodated in the inner cavity.
6. The heat dissipation device according to claim 5, wherein: one side of the heat exchange plate away from the housing is flush with the surface of the mounting plate.
7. The heat dissipation device according to claim 2, wherein: the heat exchange assembly further comprises a positioning member arranged on the mounting plate, and the positioning member is located outside the housing.
8. The heat dissipation device according to claim 1, wherein: the housing is provided with a first liquid inlet and a first liquid outlet, the liquid heat sink is provided with a second liquid inlet and a second liquid outlet, the first liquid inlet is connected to the second liquid outlet, and the first liquid outlet is connected to the second liquid inlet; in the direction of gravity, the height positions of the first liquid inlet and the first liquid outlet are different.
9. The heat dissipation device according to claim 1, wherein: the heat dissipation device further comprises a driving pump connected between the first heat dissipation assembly and the second heat dissipation assembly for driving the flow of cooling liquid.
10. A computer apparatus, comprising: The heat dissipation device according to any one of claims 1-9, further comprising a computing unit connected to the heat exchange assembly of the heat dissipation device.