Display control mainboard with heat dissipation function

Abstract

The utility model relates to the technical field of control main boards, in particular to a display control main board with a heat dissipation function, which comprises an equipment shell, a main board body is mounted in the equipment shell, a main control chip, an image processor and a power management IC (integrated circuit) are sequentially welded on the surface of the main board body, and a heat dissipation component is arranged on the side surface of the main board body. The heat dissipation assembly comprises a heat dissipation box, a brushless fan, an air inlet groove, an air exhaust groove, a heat uniformizing plate, heat dissipation fins and a phase change heat storage unit. Heat generated by the main control chip, the image processor and the power management IC is conducted to the heat uniformizing plate through heat conduction silicone grease, the heat uniformizing plate diffuses the heat to the multiple sets of heat dissipation fins, the multiple sets of brushless fans blow out of the three-dimensional air channel along the inclined heat dissipation fins, heat on the surface of the heat uniformizing plate is quickly blown away, and when the instantaneous heating amount is large, the heat dissipation effect is good. And the phase change heat storage unit absorbs redundant heat and gradually releases the heat after the load is reduced, so that the heat dissipation performance of the mainboard body is effectively improved, and the use safety of the equipment is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to control mainboard technical field, concretely relates to a display control mainboard with heat dissipation function. BACKGROUND

[0002] The mainboard is also called host board, is the biggest circuit board in computer system, and the mainboard is divided into two kinds of commercial mainboard and industrial mainboard, generally rectangular circuit board, and the mainboard is installed with the main circuit system of computer, generally has BIOS chip, I / O control chip, key and panel control switch interface, indicating lamp plug connector, expansion slot, mainboard and DC power supply power supply connector and other elements, can provide a series of junctions, for processor, display card, sound effect card, hard disk, memory, external device and other equipment junction, and the type and grade of mainboard determine the type and grade of whole microcomputer system, and the performance of mainboard influences the performance of whole microcomputer system.

[0003] With the popularity of digital display equipment, the performance stability of the control mainboard as the core component directly affects the display effect, at present, the display control mainboard generally exists the heating problem when running under high load, and the performance is reduced even the hardware is damaged.

[0004] Therefore, it is necessary to provide a display control mainboard with heat dissipation function to solve the above problems. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a display control mainboard with heat dissipation function to solve the problem that the display control mainboard exists the heating problem when running under high load in the prior art, and the performance is reduced even the hardware is damaged.

[0006] In order to realize the above-mentioned purpose, the utility model provides the following technical scheme: a display control mainboard with heat dissipation function, including equipment shell, the inside installation of equipment shell has mainboard body, the surface of mainboard body is sequentially welded with main control chip, image processor and power management IC, the side of mainboard body is provided with heat dissipation assembly, and heat dissipation assembly includes heat dissipation box, brushless fan, air inlet slot, air outlet slot, heat spreading plate, heat dissipation fin and phase change heat storage unit, the upside of mainboard body is installed with heat spreading plate, and the surface of heat spreading plate is fixedly connected with multiple sets of inclined heat dissipation fins.

[0007] By adopting the technical scheme, the heat spreading plate is coated with 0.2mm TG-4600 heat-conducting silicone grease between the heat spreading plate and the main control chip, the image processor and the power management IC, heat generated by the main control chip, the image processor and the power management IC is conducted to the heat spreading plate through the heat-conducting silicone grease, the heat spreading plate diffuses the heat to the multiple groups of heat dissipation fins, the multiple groups of brushless fans blow out the three-dimensional air duct along the inclined heat dissipation fins, the heat on the surface of the heat spreading plate is quickly blown away, when the instantaneous heat is large, the phase change material absorbs the excess heat, and the heat is gradually released when the load is reduced, thereby effectively improving the heat dissipation performance of the main board body and improving the equipment use safety.

[0008] Optionally, the inner bottom wall of the equipment shell is fixedly connected with four groups of mounting blocks, a threaded hole is formed in the upper end of the mounting block, and a fixing screw is screwedly connected in the threaded hole.

[0009] Optionally, the left and right ends of the main board body are fixedly connected with two groups of first connecting blocks, and a first clamping groove is formed in the surface of the first connecting block.

[0010] Optionally, the left and right ends of the heat spreading plate are fixedly connected with two groups of second connecting blocks, a second clamping groove is formed in the surface of the second connecting block, and the upper end of the mounting block is clamped in the first clamping groove and the second clamping groove.

[0011] By adopting the technical scheme, the first connecting block and the second connecting block are clamped on the surface of the mounting block through the first clamping groove and the second clamping groove, and the first connecting block and the second connecting block are locked and fixed through the fixing screw, so that the main board body and the heat spreading plate are locked and fixed.

[0012] Optionally, the equipment shell is provided with a mounting groove at the position of the rear side of the main board body, the heat dissipation box is fixedly installed in the mounting groove, and four groups of brushless fans are fixedly installed on the front wall of the heat dissipation box.

[0013] By adopting the technical scheme, the heat dissipation box is fixedly installed in the mounting groove, the brushless fan is a micro eddy current fan with a diameter of 15mm, and the inclination angle is 45°.

[0014] Optionally, a plurality of air inlet grooves are formed in the rear wall of the heat dissipation box, and a dust screen is fixedly connected to one end of the inner side of the air inlet groove.

[0015] By adopting the technical scheme, the air inlet groove is used for guiding external cold air into the equipment, and the dust screen is used for filtering dust in the air flow.

[0016] Optionally, a plurality of air outlet grooves are formed in the positions of the left and right sides of the heat dissipation box on the rear wall of the equipment shell.

[0017] Through adoption of the above technical scheme, the heat on the surface of the heat-distributing plate is discharged outward through the air exhaust grooves on two sides.

[0018] Optionally, the phase change heat storage unit is filled between the mainboard body and the inner bottom wall of the equipment shell.

[0019] Through adoption of the above technical scheme, the phase change heat storage unit contains paraffin-based phase change material.

[0020] In the above technical scheme, the technical effects and advantages provided by the utility model are as follows:

[0021] 1. The heat generated by the main control chip, the image processor and the power management IC is conducted to the heat-distributing plate through the heat-conducting silicone grease, the heat-distributing plate diffuses the heat to the multiple sets of heat dissipation fins, the multiple sets of brushless fans blow out the three-dimensional air ducts along the heat dissipation fins, the heat on the surface of the heat-distributing plate is quickly blown away, when the instantaneous heat is large, the phase change heat storage unit absorbs the redundant heat, and the heat is gradually released after the load is reduced, thereby effectively improving the heat dissipation performance of the mainboard body and improving the equipment use safety.

[0022] 2. The heat dissipation box is fixed in the installation groove by the screw, when the continuous use time is long, the heat dissipation box can be quickly taken out, the dust screen inside is replaced, when the brushless motor fails during long-time use, the brushless fan can also be quickly overhauled and replaced, thereby avoiding affecting the equipment use. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is a whole structure schematic view of the utility model;

[0024] Figure 2 It is a heat dissipation box structure schematic view of the utility model;

[0025] Figure 3 It is a heat-distributing plate structure schematic view of the utility model;

[0026] Figure 4 It is a mainboard body structure schematic view of the utility model.

[0027] BRIEF DESCRIPTION OF DRAWINGS

[0028] 1, equipment shell;11, heat dissipation box;12, brushless fan;13, air inlet groove;14, dust screen;15, air exhaust groove;16, mounting block;17, threaded hole;18, fixing screw;2, mainboard body;21, main control chip;22, image processor;23, power management IC;24, first connecting block;25, first clamping groove;3, heat-distributing plate;31, heat dissipation fin;32, second connecting block;33, second clamping groove;4, phase change heat storage unit. DETAILED DESCRIPTION

[0029] In order to make the technical personnel in the art better understand the technical scheme of the utility model, the utility model will be described in further detail below with reference to the drawings.

[0030] The utility model provides a display control mainboard with heat dissipation function Figures 1 to 4 As shown in a kind of show control mainboard with heat dissipation function, including equipment shell 1, the inside installation of equipment shell 1 has mainboard body 2, the surface of mainboard body 2 is sequentially welded with main control chip 21, image processor 22 and power management IC 23, the side of mainboard body 2 is provided with heat dissipation assembly, heat dissipation assembly includes heat dissipation box 11, brushless fan 12, air inlet groove 13, air outlet groove 15, heat spreading plate 3, heat dissipation fin 31 and phase change heat storage unit 4, heat spreading plate 3 is installed on the upside of mainboard body 2, the surface of heat spreading plate 3 is fixedly connected with multiple groups of inclined heat dissipation fin 31.

[0031] Among them, main control chip 21, image processor 22 and power management IC 23 are all heat generating elements, during installation, first the surface of mainboard body 2 is cleaned, then the surface of heat generating element is evenly coated with 0.2mm thick heat-conducting silicone grease, then heat spreading plate 3 is aligned with heat generating element position and is pressed, and the wiring of brushless fan 12 is connected to mainboard PWM control interface.

[0032] During use, brushless fan 12, heat spreading plate 3, heat dissipation fin 31 and phase change heat storage unit 4 cooperate to dissipate heat from mainboard body 2, effectively improving the heat dissipation effect.

[0033] Referring to Figure 1 And Figure 2 Equipment shell 1 is provided with a mounting groove at the rear side of mainboard body 2, heat dissipation box 11 is fixedly installed in the mounting groove, four groups of brushless fans 12 are fixedly installed on the front wall of heat dissipation box 11, a plurality of air inlet grooves 13 are formed on the rear wall of heat dissipation box 11, a dust screen 14 is fixedly connected to the inner side of one end of air inlet groove 13, a plurality of air outlet grooves 15 are formed on the rear wall of equipment shell 1 at the left and right sides of heat dissipation box 11, and phase change heat storage unit 4 is filled between mainboard body 2 and the inner bottom wall of equipment shell 1.

[0034] Specifically, during use, the heat generated by the heat generating elements on the surface of mainboard body 2 is conducted to the surface of heat spreading plate 3 through heat-conducting silicone, and heat spreading plate 3 quickly disperses the heat to the inside of multiple heat dissipation fins 31, at which time multiple brushless fans 12 blow out the three-dimensional air duct to quickly disperse the heat on the surface of heat dissipation fin 31.

[0035] In addition, when the device is used in a dusty environment, the dustproof net 14 in the heat dissipation box 11 can be replaced by disassembling the screws and pulling out the heat dissipation box 11 after a period of use. When the brushless fan 12 fails, the brushless fan 12 can be quickly replaced, so that the device can be quickly put into use, and the impact on product display is avoided.

[0036] Referring to Figures 2 to 4 The inner bottom wall of the device shell 1 is fixedly connected with four groups of mounting blocks 16, the upper end of the mounting block 16 is provided with a threaded hole 17, the threaded hole 17 is threadedly connected with a fixing screw 18, the left and right ends of the mainboard body 2 are fixedly connected with two groups of first connecting blocks 24, the surface of the first connecting block 24 is provided with a first clamping groove 25, the left and right ends of the heat plate 3 are fixedly connected with two groups of second connecting blocks 32, the surface of the second connecting block 32 is provided with a second clamping groove 33, and the upper end of the mounting block 16 is clamped in the first clamping groove 25 and the second clamping groove 33.

[0037] It should be noted that during the installation of the mainboard body 2 and the heat plate 3, the first connecting blocks 24 at both ends of the mainboard body 2 are clamped in the upper end of the mounting block 16 through the first clamping groove 25, then the second connecting blocks 32 at both ends of the heat plate 3 are clamped in the upper end of the mounting block 16 through the second clamping groove 33, and the second connecting blocks 32 are pressed on the upper side of the first connecting blocks 24, then the fixing screw 18 is threadedly connected with the threaded hole 17, the first connecting blocks 24 and the second connecting blocks 32 are pressed and fixed, thereby locking and fixing the mainboard body 2 and the heat plate 3, and then the phase change heat storage unit 4 is filled in the gap between the mainboard body 2 and the device shell 1.

[0038] The working principle of the utility model is as follows: the heat generated by the main control chip 21, the image processor 22 and the power management IC 23 is conducted to the heat plate 3 through the heat-conducting silicone grease, the heat plate 3 diffuses the heat to the plurality of heat dissipation fins 31, the plurality of brushless fans 12 blow out the three-dimensional air ducts along the heat dissipation fins 31, the heat on the surface of the heat plate 3 is quickly blown away, when the instantaneous heat is large, the phase change heat storage unit 4 absorbs the excess heat, and gradually releases the heat when the load is reduced, thereby effectively improving the heat dissipation performance of the mainboard body 2 and improving the safety of the device in use.

[0039] The basic principle, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only preferred examples of the present application and are not intended to limit the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application.

Claims

1. A display control motherboard with heat dissipation function, comprising a device housing (1), characterized in that: The device housing (1) is equipped with a motherboard body (2). The surface of the motherboard body (2) is sequentially welded with a main control chip (21), an image processor (22) and a power management IC (23). The side of the motherboard body (2) is provided with a heat dissipation assembly, which includes a heat dissipation box (11), a brushless fan (12), an air inlet slot (13), an air outlet slot (15), a heat dissipation plate (3), heat dissipation fins (31) and a phase change heat storage unit (4). The heat dissipation plate (3) is installed on the upper side of the motherboard body (2), and multiple sets of inclined heat dissipation fins (31) are fixedly connected to the surface of the heat dissipation plate (3).

2. The display control motherboard with heat dissipation function according to claim 1, characterized in that: The inner bottom wall of the equipment housing (1) is fixedly connected with four sets of mounting blocks (16). The upper end of the mounting block (16) is provided with a threaded hole (17), and the threaded hole (17) is internally connected with a fixing screw (18).

3. A display control motherboard with heat dissipation function according to claim 2, characterized in that: Two sets of first connecting blocks (24) are fixedly connected to both the left and right ends of the motherboard body (2), and the surface of the first connecting block (24) is provided with a first snap-fit ​​groove (25).

4. A display control motherboard with heat dissipation function according to claim 3, characterized in that: Two sets of second connecting blocks (32) are fixedly connected to both the left and right ends of the heat-dissipating plate (3). The surface of the second connecting block (32) is provided with a second snap-fit ​​groove (33). The upper end of the mounting block (16) is respectively snapped into the inside of the first snap-fit ​​groove (25) and the second snap-fit ​​groove (33).

5. A display control motherboard with heat dissipation function according to claim 1, characterized in that: The device housing (1) has an installation slot at the rear of the motherboard body (2). The heat sink (11) is fixedly installed inside the installation slot. Four sets of inclined brushless fans (12) are fixedly installed on the front wall of the heat sink (11).

6. A display control motherboard with heat dissipation function according to claim 5, characterized in that: The rear wall of the heat sink (11) has multiple sets of air inlet slots (13), and a dustproof net (14) is fixedly connected to one end of the inner side of the air inlet slot (13).

7. A display control motherboard with heat dissipation function according to claim 1, characterized in that: Multiple sets of exhaust ducts (15) are provided on the rear wall of the device housing (1) on both the left and right sides of the heat sink box (11).

8. A display control motherboard with heat dissipation function according to claim 1, characterized in that: The phase change thermal storage unit (4) is filled between the main body (2) and the inner bottom wall of the device housing (1).

Images