Optical fiber reflection memory modularized configurable board card
The modular design of the fiber optic reflective memory modular configurable board solves the problems of large size and limited functionality of traditional measurement and control systems, enabling flexible configuration and efficient data processing, and is suitable for industrial measurement and control applications in a wide temperature range.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-23
- Publication Date
- 2026-03-24
AI Technical Summary
Traditional measurement and control systems are bulky, complex to connect, have limited functionality and cannot be flexibly configured. Users need to purchase boards multiple times, and additional equipment needs to be purchased when there are not enough slots in the chassis.
It adopts a modular fiber optic reflective memory modular configurable board, including a carrier board and pluggable daughter card modules, integrating high-speed fiber optic interfaces and multi-functional input/output interfaces. Combined with Xilinx A7 FPGA processor and large-capacity storage, it supports flexible configuration of various daughter card modules.
It achieves a high degree of integration and flexible configuration of the measurement and control system, reduces system complexity and cost, improves the real-time performance and reliability of data processing, and is suitable for harsh environments with a wide temperature range of -40℃ to 55℃.
Smart Images
Figure CN224035896U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of measurement and control technology, specifically a modular configurable fiber optic reflection memory board. Background Technology
[0002] The field of measurement and control technology refers to the interdisciplinary field of measurement and control technology, which focuses on the real-time monitoring, data processing and automated control of physical quantities, signals or systems. Its core objective is to achieve high-precision and high-reliability data acquisition, transmission, analysis and execution control through the combination of hardware and software.
[0003] However, traditional measurement and control systems require a complex architecture of "chassis + controller + multiple single-function boards", resulting in bulky equipment and complex connections. The single-function boards need to be replaced as a whole when the system's functional requirements change, making it impossible to achieve flexible configuration and expansion of functions. Furthermore, users need to purchase multiple boards separately for different functions, and additional chassis and controllers need to be purchased when there are insufficient chassis slots. Utility Model Content
[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] A modular configurable fiber optic reflective memory board includes a carrier board and a sub-card module that is installed on one side of the carrier board via a slot.
[0007] The carrier board has a high-speed fiber optic interface at one end, compatible with the 5565 protocol, and a functional input / output interface at the other end.
[0008] The carrier board is provided with four slots for inserting the daughter card modules, and can simultaneously configure daughter board A, daughter board B, daughter board C and daughter board D;
[0009] The sub-card module adopts a pluggable design.
[0010] As a further improvement of this utility model, the carrier board also includes a processor, memory chips and a storage module, used to integrate the daughter card module, process data communication and manage power distribution.
[0011] As a further improvement of this utility model, the carrier board is provided with one RS232 interface and one optical port for communication with external devices.
[0012] As a further improvement of this utility model: the sub-card module includes one or more of the following: DA sub-card, AD sub-card, IO sub-card, RS232 / 422 / 485 sub-card, ARINC 429 sub-card, 1553B sub-card, CAN sub-card, LVDT sub-card, switch sub-card, and PT1000 sub-card, and the sub-boards A to D can be independently configured as any of the above sub-card types.
[0013] As a further improvement of this utility model: the carrier board is connected to the host via a QSFP / PCIE / PXIE interface for storing and forwarding the collected data.
[0014] As a further improvement of this utility model, the board composed of the carrier board and the sub-card module has a design size of 160mm x 100mm and a thickness of 20.32mm.
[0015] As a further improvement of this utility model, the power supply of the board includes a 5V system power supply and a 28V peripheral interface power supply, with a power consumption of 15W.
[0016] As a further improvement of this utility model, the operating temperature range of the circuit board is -40℃ to 55℃.
[0017] Compared with the prior art, the beneficial effects of this utility model are:
[0018] 1. This utility model achieves a high degree of integration and flexible configuration of the measurement and control system by setting up a modular carrier board and pluggable daughter card modules. Users can freely combine daughter card modules with different functions according to their needs, which greatly reduces the complexity and cost of traditional multi-board systems. At the same time, the high-speed fiber optic interface and multi-functional input / output interface integrated on the carrier board, together with the Xilinx A7 FPGA processor and large-capacity storage, significantly improve the real-time performance and reliability of data processing, enabling the board to work stably in a wide temperature range of -40℃ to 55℃, making it particularly suitable for harsh environments such as rapid troubleshooting in the field and industrial measurement and control. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of a modular configurable fiber optic reflective memory board.
[0020] In the diagram: 101, carrier board; 102, daughter card module. Detailed Implementation
[0021] To make the above-mentioned objectives, features and advantages of this utility model more readily understood, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.
[0022] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0023] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single embodiment or an embodiment selectively excluded from other embodiments.
[0024] Example 1
[0025] Please see Figure 1 This is an embodiment of the present utility model, which provides a modular configurable fiber optic reflective memory board, including a carrier board 101 and a sub-card module 102 that is installed on one side of the carrier board 101 via a slot.
[0026] One end of the carrier board 101 is equipped with a high-speed fiber optic interface, compatible with the 5565 protocol, and the other end is equipped with a function input / output interface.
[0027] The carrier board 101 is provided with four slots for inserting daughter card modules 102, and can simultaneously configure daughter board A, daughter board B, daughter board C and daughter board D;
[0028] The daughter card module 102 adopts a pluggable design.
[0029] Specifically, the carrier board 101 also includes a processor, memory chips, and a storage module for integrating the daughter card module 102, processing data communication, and managing power distribution; the processor is a Xilinx A7 series FPGA, the memory chips are 1GB DDR3, and the storage module includes 8MB SPI Flash and 16MB QSPI Flash, of which 8MB SPI Flash is used to store data and 16MB QSPI Flash is used to store the executable program.
[0030] Furthermore, this hardware configuration enables efficient data processing and storage. The Xilinx A7 FPGA provides powerful real-time computing capabilities, 1GB DDR3 memory ensures high-speed data caching, and the dual-Flash design achieves physical isolation between the program and the data, which not only ensures system stability but also improves data access efficiency, making it particularly suitable for measurement and control scenarios that require rapid response.
[0031] Specifically, the carrier board 101 is equipped with one RS232 interface and one optical port for communication with external devices.
[0032] Furthermore, the dual-interface design enhances system compatibility. The RS232 interface can connect to traditional industrial equipment, while the optical port supports long-distance, interference-resistant communication. Together, these two features enable the board to adapt to diverse industrial field communication needs and simplify system integration complexity.
[0033] Specifically, the sub-card module 102 includes one or more of the following: DA sub-card, AD sub-card, IO sub-card, RS232 / 422 / 485 sub-card, ARINC429 sub-card, 1553B sub-card, CAN sub-card, LVDT sub-card, switch sub-card, and PT1000 sub-card. Sub-boards A to D can be independently configured as any of the above sub-card types.
[0034] Furthermore, the modular daughter card design significantly improves system flexibility. Users can freely combine different functional daughter cards such as analog input / output (AD / DA), digital IO, and avionics bus (ARINC 429) according to test requirements. This allows for rapid adaptation to various test scenarios without replacing the entire board, greatly reducing equipment procurement and maintenance costs.
[0035] Specifically, carrier board 101 is connected to the host via a QSFP / PCIE / PXIE interface for storing and forwarding the collected data.
[0036] Furthermore, the high-speed standardized interfaces (QSFP / PCIE / PXIE) support high-bandwidth data transmission, meeting the stringent real-time requirements of measurement and control, while also being compatible with mainstream industrial host equipment, facilitating system expansion and integration.
[0037] Specifically, the board consisting of carrier board 101 and daughter card module 102 has a design size of 160mm x 100mm and a thickness of 20.32mm.
[0038] Furthermore, the compact design with a thickness of 20.32mm saves chassis space, allowing a single board to replace traditional multi-board systems, making it suitable for portable field equipment or high-density chassis applications.
[0039] Specifically, the power supply of the board includes a 5V system power supply and a 28V external interface power supply, with a power consumption of 15W; the operating temperature range of the board is -40℃ to 55℃.
[0040] Furthermore, the dual power supply design takes into account the power supply needs of both the core system and peripheral devices, the 15W low power consumption reduces heat dissipation pressure, and the wide temperature range of -40℃ to 55℃ ensures stable operation of the board in extreme industrial environments.
[0041] In use, the user first selects the corresponding daughter card module 102 (such as AD daughter card, CAN daughter card, etc.) according to the test requirements and inserts it into the corresponding slot (daughter board AD) of the carrier board 101. Through the automatic identification function of the carrier board 101, the system automatically configures the driver and communication protocol of the daughter card module. Then, the high-speed fiber optic interface of the carrier board 101 is connected to the host, and the function input / output interface is connected to the device under test. After power-on, the FPGA processor automatically loads the executable program in the QSPI Flash, coordinates each daughter card module to perform data acquisition, processing or control, and transmits the results to the host in real time through the fiber optic interface, or interacts with external devices through RS232 / optical port to complete the measurement and control task.
[0042] In summary, by setting up a modular carrier board 101 and pluggable daughter card modules 102, a high degree of integration and flexible configuration of the measurement and control system is achieved. Users can freely combine daughter card modules with different functions according to their needs, which greatly reduces the complexity and cost of traditional multi-board systems. At the same time, the high-speed fiber optic interface and multi-functional input / output interface integrated in the carrier board 101, together with the Xilinx A7 FPGA processor and large-capacity storage, significantly improve the real-time performance and reliability of data processing, enabling the board to work stably in a wide temperature range of -40℃ to 55℃, making it particularly suitable for harsh environments such as rapid troubleshooting in the field and industrial measurement and control.
[0043] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values (e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.
[0044] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to implementing the present invention) may be omitted.
[0045] It should be understood that numerous specific implementation decisions can be made during the development of any actual implementation method, and in any engineering or design project. Such development efforts may be complex and time-consuming, but for those of ordinary skill in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.
[0046] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.
Claims
1. A modular configurable fiber optic reflective memory board, characterized in that: include: A carrier board (101) and a sub-card module (102) that is mounted on one side of the carrier board (101) via a slot; The carrier board (101) has a high-speed fiber optic interface at one end, compatible with the 5565 protocol, and a functional input / output interface at the other end. The carrier board (101) is provided with four slots for inserting the sub-card module (102), and can simultaneously configure sub-board A, sub-board B, sub-board C and sub-board D; The sub-card module (102) adopts a pluggable design.
2. The modular configurable fiber optic reflective memory board according to claim 1, characterized in that: The carrier board (101) also includes a processor, memory chips and a storage module for integrating the daughter card module (102), processing data communication and managing power distribution.
3. The modular configurable fiber optic reflective memory board according to claim 1, characterized in that: The carrier board (101) is equipped with one RS232 interface and one optical port for communication with external devices.
4. The modular configurable fiber optic reflective memory board according to claim 1, characterized in that: The sub-card module (102) includes one or more of the following: DA sub-card, AD sub-card, IO sub-card, RS232 / 422 / 485 sub-card, ARINC 429 sub-card, 1553B sub-card, CAN sub-card, LVDT sub-card, switch sub-card, and PT1000 sub-card. Sub-boards A to D can be independently configured as any of the above sub-card types.
5. The modular configurable fiber optic reflective memory board according to claim 1, characterized in that: The carrier board (101) is connected to the host via a QSFP / PCIE / PXIE interface and is used to store and forward the collected data.
6. The modular configurable fiber optic reflective memory board according to claim 1, characterized in that: The board consisting of the carrier board (101) and the sub-card module (102) has a design size of 160mm x 100mm and a thickness of 20.32mm.
7. The modular configurable fiber optic reflective memory board according to claim 1, characterized in that: The power supply for the board includes a 5V system power supply and a 28V external interface power supply, with a power consumption of 15W.
8. The modular configurable fiber optic reflective memory board according to claim 1, characterized in that: The operating temperature range of the board is -40℃ to 55℃.