Coil support, coil assembly and semiconductor process equipment

Abstract

The utility model discloses a coil support, a coil assembly and semiconductor processing equipment, and belongs to the technical field of semiconductor processing. The coil support is used for semiconductor process equipment and comprises a bearing plate, and the bearing plate is provided with a plurality of connecting holes used for installing radio frequency coils. The bearing plate is also provided with at least one pair of ventilation openings at intervals, and the ventilation openings are used for controlling the temperature of the semiconductor process equipment. At least two measuring holes are formed in the bearing plate at intervals, the measuring holes are formed in the circumferential direction of the bearing plate at intervals, and at least one measuring hole is located between the ventilation opening and the edge of the bearing plate. According to the scheme, the problem that a coil support related to the related technology is single in function can be solved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor processing, and particularly relates to a coil support, a coil assembly and a semiconductor process equipment. BACKGROUND

[0002] In the semiconductor process equipment, the coil assembly of the semiconductor process equipment can be used for processing a wafer. Specifically, the coil assembly comprises a radio frequency coil. The radio frequency coil in an electrified state can excite a process gas passing into a process chamber of the semiconductor process equipment into a plasma state, so as to process the wafer. In order to ensure the processing effect on the wafer, the radio frequency coil needs to be kept in a specific shape at all times, and the coil support of the coil assembly fixes the radio frequency coil, so as to ensure that the radio frequency coil can keep the specific shape at all times.

[0003] However, the above coil support only has the function of mounting the radio frequency coil, and the function is relatively single, which cannot meet the performance requirements of the semiconductor process equipment.

[0004] In conclusion, the coil support related to the related art has the problem of relatively single function. INNOVATION CONTENT

[0005] The application discloses a coil support, a coil assembly and a semiconductor process equipment, to solve the problem of relatively single function of the coil support related to the related art.

[0006] In order to solve the above technical problem, the application adopts the following technical scheme:

[0007] A coil support for a semiconductor process equipment, comprising a bearing plate,

[0008] A plurality of connecting holes for mounting a radio frequency coil are formed on the bearing plate.

[0009] At least one pair of ventilation openings are also formed on the bearing plate in a spaced-apart manner, for temperature control of the semiconductor process equipment.

[0010] At least two measurement holes are also formed on the bearing plate in a spaced-apart manner, each measurement hole is arranged in a circumferential direction of the bearing plate, and at least one measurement hole is located between the ventilation opening and the edge of the bearing plate.

[0011] A coil assembly comprising a radio frequency coil and the coil support described above, the radio frequency coil is mounted on the lower side of the coil support.

[0012] A semiconductor process equipment comprising a dielectric window, a process chamber and the coil assembly described above, the dielectric window seals the top opening of the process chamber, and the coil assembly is mounted on the dielectric window.

[0013] The technical scheme adopted in the application can achieve the following beneficial effects:

[0014] In the application, since the radio frequency coil is mounted on the bearing plate, the radio frequency coil can excite the process gas into the process chamber of the semiconductor process equipment into a plasma state, so as to process the wafer, and since at least one pair of ventilation openings are also provided on the bearing plate, the ventilation openings can be used for temperature control of the semiconductor process equipment, so that the temperature of the semiconductor process equipment can be better controlled through the ventilation openings, so as to ensure the etching rate and etching effect of the wafer, that is, to avoid affecting the processing effect of the wafer. It can be seen that the coil support disclosed in the application not only has the function of mounting the radio frequency coil, but also can realize temperature control of the semiconductor process equipment. Therefore, the function of the coil support disclosed in the application is more diversified. In addition, the spacing between the bearing plate and the radio frequency coil can be measured through the plurality of measurement holes, and the plurality of measurement holes can improve the detection accuracy. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 A cross-sectional structure schematic view of a first semiconductor process equipment disclosed in an embodiment of the application is shown in FIG. 1.

[0016] Figure 2 A structure schematic view of a part of a first coil assembly disclosed in an embodiment of the application is shown in FIG. 2.

[0017] Figure 3 An exploded view of a part of the first coil assembly disclosed in an embodiment of the application is shown in FIG. 3.

[0018] Figures 4 to 6 Structure schematic views of a part of the first coil assembly from different perspectives disclosed in an embodiment of the application are shown in FIGS. 4 and 5.

[0019] Figure 7 A structure schematic view of a first bearing plate disclosed in an embodiment of the application is shown in FIG. 6.

[0020] Figures 8 to 10 A setting schematic view of a first radio frequency coil disclosed in an embodiment of the application is shown in FIG. 7.

[0021] Figure 11 A cross-sectional structure schematic view of a second semiconductor process equipment disclosed in an embodiment of the application is shown in FIG. 8.

[0022] Figure 12 A structure schematic view of a part of a second coil assembly disclosed in an embodiment of the application is shown in FIG. 9.

[0023] Figure 13 And Figure 14 Structure schematic views of a part of the second coil assembly from different perspectives disclosed in an embodiment of the application are shown in FIGS. 10 and 11.

[0024] Figure 15A second bearing plate structure disclosed in the embodiments of the present application is shown in the schematic view.

[0025] Figure 16 A second radio frequency coil arrangement disclosed in the embodiments of the present application is shown in the schematic view.

[0026] Legend of reference signs:

[0027] 100 - bearing plate, 110 - coil mounting space, 120 - measurement hole, 121 - first measurement hole, 122 - second measurement hole, 130 - weight-reducing hole, 140 - air inlet, 150 - air outlet, 160 - first through hole, 171 - mounting protrusion, 172 - mounting pad, 181 - first mounting gap, 182 - second mounting gap, 183 - first mounting hole, 184 - ventilation hole, 185 - first side plane, 186 - second side plane, 187 - first positioning groove, 188 - second positioning groove, 190 - connecting hole, 191 - first connecting hole, 192 - second connecting hole, 193 - third connecting hole, 194 - fourth connecting hole, 195 - fifth connecting hole, 196 - feed hole;

[0028] 200 - spacer, 210 - first spacer, 220 - second spacer, 221 - first connecting groove, 230 - third spacer, 231 - second connecting groove;

[0029] 300 - connecting piece, 310 - first connecting piece, 320 - second connecting piece, 330 - third connecting piece, 340 - fourth connecting piece, 350 - fifth connecting piece;

[0030] 400 - radio frequency coil, 410 - first coil, 411 - first sub-coil, 412 - second sub-coil, 413 - third sub-coil, 420 - second coil, 421 - fourth sub-coil, 422 - fifth sub-coil, 423 - sixth sub-coil;

[0031] 500 - dielectric window;

[0032] 600 - hot air device, 610 - air inlet pipeline, 611 - first air inlet pipeline, 612 - second air inlet pipeline, 620 - air outlet pipeline, 621 - first air outlet pipeline, 622 - second air outlet pipeline, 630 - limiting protrusion;

[0033] 710 - first fixing piece, 720 - second fixing piece, 730 - third fixing piece, 740 - fourth fixing piece, 750 - fifth fixing piece;

[0034] 810 - matching device, 820 - connecting strip box, 830 - copper column;

[0035] 910 - process chamber, 920 - wafer, 930 - electrostatic chuck, 940 - gas inlet pipe. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] The coil support disclosed in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0038] Please refer to Figures 1-16 This application discloses a coil support, which includes a support plate 100.

[0039] The coil support disclosed in this application is used in semiconductor process equipment, and the coil support is used to support an RF coil 400. Specifically, the support plate 100 of the coil support is used to support the RF coil 400, and the lower part of the support plate 100 has a coil mounting space 110 for mounting the RF coil 400. The support plate 100 has multiple connection holes 190 for mounting the RF coil 400, that is, the RF coil 400 is mounted on the support plate 100 through the multiple connection holes 190. For details, please refer to [reference needed]. Figure 6 , Figure 7 and Figures 13 to 16 .

[0040] Please refer to Figures 2 to 4 , Figure 6 , Figure 7 and Figures 13 to 15 The carrier plate 100 is also provided with at least one pair of ventilation openings 184 spaced apart. These ventilation openings 184 are used to control the temperature of the semiconductor process equipment. Specifically, the temperature of the dielectric window 500 of the semiconductor process equipment (described later) is controlled by the hot air device 600 of the semiconductor process equipment. That is, both ventilation openings 184 are directed towards the dielectric window 500 to facilitate temperature control of the dielectric window 500, thereby ensuring the etching rate and etching effect of the wafer 920. Specifically, one of the ventilation openings 184 is used to deliver temperature-controlled gas to the area where the dielectric window 500 is located for heat exchange with the dielectric window 500 to achieve temperature control. The other ventilation opening 184 is used to deliver the gas after heat exchange out of the area where the dielectric window 500 is located.

[0041] Please refer to Figures 2 to 7 and Figures 12 to 15The at least two measurement holes 120 are arranged on the carrier plate 100 at intervals, and each measurement hole 120 can be arranged at an interval along the circumference of the carrier plate 100, and at least one measurement hole 120 is located between the vent 184 and the edge of the carrier plate 100. Each measurement hole 120 is a spacing measurement hole, that is, the spacing between the carrier plate 100 and the radio frequency coil 400 can be measured through each measurement hole 120, so as to determine the flatness of each part of the radio frequency coil 400, so as to determine whether the radio frequency coil 400 deforms in use, that is, this arrangement can avoid the process result from deviating due to deformation of the radio frequency coil 400, and multiple measurement holes 120 can improve detection accuracy, and at the same time, multiple measurement holes 120 can reduce the weight of the carrier plate 100 to a certain extent.

[0042] In the present application, since the radio frequency coil 400 is mounted on the carrier plate 100, the radio frequency coil 400 can excite the process gas into the process chamber 910 of the semiconductor process equipment into a plasma state, so as to process the wafer 920, and since the carrier plate 100 is further provided with at least one pair of vents 184 arranged at intervals, the vent 184 can be used for temperature control of the semiconductor process equipment, so that the temperature of the semiconductor process equipment can be better controlled through the vent 184, so as to ensure the etching rate and etching effect of the wafer 920, that is, to avoid affecting the processing effect of the wafer 920. It can be seen that the coil support disclosed in the present application not only has the function of mounting the radio frequency coil 400, but also can realize temperature control of the semiconductor process equipment. Therefore, the function of the coil support disclosed in the present application is more diversified. In addition, the spacing between the carrier plate 100 and the radio frequency coil 400 can be measured through multiple measurement holes 120, and the detection accuracy can be improved.

[0043] Optionally, the radio frequency coil 400 can include a first coil 410 and a second coil 420, and the second coil 420 surrounds the first coil 410. In the thickness direction of the carrier plate 100, at least part of the projection of the vent 184 is located between the projection of the first coil 410 and the projection of the second coil 420. At this time, the space between the first coil 410 and the second coil 420 can be fully utilized to arrange the hot air device 600, so that the arrangement of the hot air device 600 is more convenient.

[0044] In one embodiment, please refer to Figure 6, a part of the orthographic projection of the vent 184 is located between the orthographic projection of the first coil 410 and the orthographic projection of the second coil 420, and another part of the orthographic projection of the vent 184 is located within the orthographic projection of the first coil 410 or the orthographic projection of the second coil 420, at this time, the vent 184 can serve as the above-mentioned measurement hole 120, so as to further improve the detection accuracy of the distance between the carrier plate 100 and the radio frequency coil 400. Further, in the thickness direction of the carrier plate 100, a part of the orthographic projection of the first coil 410 is located within the orthographic projection of at least one vent 184, and a part of the orthographic projection of the second coil 420 is located within the orthographic projection of at least one measurement hole 120, such arrangement can realize the measurement of the distance between the carrier plate 100 and the first coil 410 through the vent 184, and realize the measurement of the distance between the carrier plate 100 and the second coil 420 through the measurement hole 120, without the need to set the vent 184 too large to simultaneously realize the measurement of the distance between the carrier plate 100 and the first coil 410 and the second coil 420, so such arrangement can reduce the weakening of the structural strength of the carrier plate 100 by the vent 184, so that the structural strength of the carrier plate 100 is higher. Of course, in other embodiments, a part of the orthographic projection of the first coil 410 and a part of the orthographic projection of the second coil 420 can be located within the orthographic projection of at least one vent 184 or within the orthographic projection of at least one measurement hole 120.

[0045] In another embodiment, please refer to Figure 13 , the entire orthographic projection of the vent 184 is located between the orthographic projection of the first coil 410 and the orthographic projection of the second coil 420, at this time, there is no other components such as the first coil 410 and the second coil 420 between the vent 184 and the dielectric window 500, which can facilitate the arrangement of the hot air device 600. Of course, in other embodiments, the entire orthographic projection of the vent 184 can be located within the orthographic projection of the first coil 410 or the orthographic projection of the second coil 420.

[0046] Optionally, please refer to Figure 13 , the above-mentioned at least two measurement holes 120 can include at least one first measurement hole 121 and at least one second measurement hole 122, the first measurement hole 121 can be located between the vent 184 and the central region of the carrier plate 100, and the second measurement hole 122 can be located between the vent 184 and the edge of the carrier plate 100, so that the first measurement hole 121, the vent 184 and the second measurement hole 122 are sequentially arranged in the direction extending from the central region of the carrier plate 100 to the edge of the carrier plate 100.

[0047] In this embodiment, in the thickness direction of the bearing plate 100, the partial orthographic projection of the first coil 410 is located within the orthographic projection of the first measurement hole 121, and the partial orthographic projection of the second coil 420 is located within the orthographic projection of the second measurement hole 122, so that both the first coil 410 and the second coil 420 can be detected through the measurement hole 120, thereby improving the detection accuracy of the spacing between the bearing plate 100 and the entire radio frequency coil 400. At the same time, the spacing between the first coil 410 and the second coil 420 and the bearing plate 100 is measured through different measurement holes 120, so the size of the measurement hole 120 can be set smaller to improve the structural strength of the bearing plate 100. Of course, in other embodiments, the above-mentioned at least two measurement holes 120 can only include a plurality of first measurement holes 121 or a plurality of second measurement holes 122, or the spacing between the first coil 410 and the second coil 420 and the bearing plate 100 is measured through the same measurement hole 120.

[0048] Optionally, referring to Figure 7 , the edge of the above-mentioned at least one ventilation opening 184 can be provided with a first mounting gap 181; and / or, referring to Figures 13 to 15 , the edge of the bearing plate 100 is provided with a second mounting gap 182; and / or, the bearing plate 100 is further provided with a first mounting hole 183, which is located between the central region of the bearing plate 100 and the edge of the bearing plate 100; wherein the first mounting gap 181, the second mounting gap 182 and the first mounting hole 183 are all used for mounting temperature detection members.

[0049] In this embodiment, since the temperature detection member mounted in the first mounting gap 181 is close to the ventilation opening 184, the temperature of the medium window 500 can be obtained by obtaining the temperature of the ventilation opening 184, thereby facilitating temperature control of the medium window 500; the temperature detection members mounted in the second mounting gap 182 and the first mounting hole 183, respectively, can facilitate the acquisition of the temperature of the edge region and the central region of the medium window 500. When the bearing plate 100 is simultaneously provided with the first mounting gap 181, the second mounting gap 182 and the first mounting hole 183, the temperature values detected by the temperature detection members arranged at the three positions can more directly reflect whether the temperatures at different positions of the medium window 500 are consistent, thereby facilitating temperature control of the medium window 500.

[0050] At the same time, the temperature detection members mounted in the second mounting gap 182 and the first mounting hole 183 have a certain gap with the ventilation opening 184, which can avoid interference of the temperature detection members mounted in the second mounting gap 182 and the first mounting hole 183, that is, the temperature of the medium window 500 measured by this arrangement is more accurate. Of course, in other embodiments, the bearing plate 100 can also not be provided with the first mounting gap 181, the second mounting gap 182 and the first mounting hole 183.

[0051] Optionally, the first mounting notch 181 can be circular in shape, or the side surface of the first mounting notch 181 can include at least two sequentially connected planes, which can be smoothly connected, and the present application does not make a specific limitation in this regard.

[0052] Optionally, the medium window 500 can be provided with a detection groove on the side facing the carrier plate 100, and the detection end of the temperature detection member can be located in the detection groove. By detecting the temperature of the middle region of the medium window 500 in the thickness direction, i.e., the actual temperature of the medium window 500, the temperature of the entire medium window 500 can be more accurately reflected, so as to better control the temperature of the medium window 500. Of course, the detection end of the temperature detection member can also not be located in the detection groove.

[0053] Optionally, the carrier plate 100 can be provided with at least two pairs of ventilation openings 184, and each ventilation opening 184 can be arranged along the circumference of the carrier plate 100. The present application can further improve the temperature control rate of the medium window 500 by using more pairs of ventilation openings 184. Of course, in other embodiments, the carrier plate 100 can be provided with only one pair of ventilation openings 184.

[0054] Optionally, please refer to Figure 3 , Figure 4 , Figure 6 , Figure 7 , Figures 13 to 15 The carrier plate 100 can also be provided with a plurality of feed holes 196, which are used to arrange a plurality of copper columns 830 described below, so as to feed the radio frequency coil 400 through the feed hole 196, and each feed hole 196 can be arranged along the first straight line.

[0055] In this embodiment, the carrier plate 100 can be provided with two pairs of ventilation openings 184, and the two ventilation openings 184 in each pair of ventilation openings 184 can be distributed on both sides of the first straight line, so that the two ventilation openings 184 in each pair of ventilation openings 184 can be distributed on both sides of the carrier plate 100, and the vertical distance between the center of the four ventilation openings 184 and the first straight line is equal. This arrangement can facilitate the relative uniform arrangement of the four ventilation openings 184 on the carrier plate 100, so that the overall structure of the carrier plate 100 is more simple, beautiful and regular. Of course, in other embodiments, the vertical distance between the center of the four ventilation openings 184 and the first straight line can also be unequal.

[0056] Optionally, the two air vents 184 on one side of the first straight line among the two pairs of air vents 184 can be symmetrical about a second straight line, and the two air vents 184 on the other side of the first straight line among the two pairs of air vents 184 can be symmetrical about a third straight line, the second straight line and the third straight line are both perpendicular to the first straight line, and the second straight line and the third straight line are not collinear, so as to better adapt to the layout of the hot air device 600. Of course, in other embodiments, the second straight line and the third straight line can be collinear, that is, the second straight line and the third straight line can be the same straight line, at this time, the two air vents 184 in each pair of air vents 184 are symmetrical about the first straight line.

[0057] Optionally, the above-mentioned temperature detection piece at the first mounting gap 181 is detachably arranged at the first mounting gap 181. Specifically, according to the above-mentioned content, two pairs of air vents 184 can be arranged on the bearing plate 100 with a certain interval, which are the first pair of air vents 184 and the second pair of air vents 184. According to the foregoing content, since the edge of at least one air vent 184 in a pair of air vents 184 is provided with a first mounting gap 181, it means that the edge of at least one air vent 184 in each pair of air vents 184 among the two pairs of air vents 184 is provided with a first mounting gap 181. For details, please refer to Figure 6 .

[0058] In this embodiment, the edge of at least one air vent 184 in the first pair of air vents 184 is provided with a first mounting gap 181, the edge of at least one air vent 184 in the second pair of air vents 184 is provided with a first mounting gap 181, and the temperature detection piece at the first mounting gap 181 provided on the edge of the first pair of air vents 184 can be detachably installed at the first mounting gap 181 by the second fixing piece 720. The temperature detection piece at the first mounting gap 181 provided on the edge of the second pair of air vents 184 can be detachably installed at the first mounting gap 181 by the third fixing piece 730, which can facilitate the operator to maintain or replace the above-mentioned temperature detection piece at the first mounting gap 181. Of course, in other embodiments, the above-mentioned temperature detection piece at the first mounting gap 181 can also be arranged at the first mounting gap 181.

[0059] Optionally, the above-mentioned temperature detection pieces at the second mounting gap 182 and the first mounting hole 183 are detachably arranged at the second mounting gap 182 and the first mounting hole 183. For details, please refer to Figure 13The temperature detecting member at the second mounting gap 182 can be detachably mounted at the second mounting gap 182 by the fourth fixing member 740, and the temperature detecting member at the first mounting hole 183 can be detachably mounted at the first mounting hole 183 by the fifth fixing member 750, which can facilitate the operator to maintain or replace the above-mentioned temperature detecting members at the second mounting gap 182 and the first mounting hole 183. Of course, in other embodiments, the above-mentioned temperature detecting members at the second mounting gap 182 and the first mounting hole 183 can also be non-detachably arranged at the second mounting gap 182 and the first mounting hole 183.

[0060] Optionally, referring to Figures 3 to 7 The carrying plate 100 has a first side plane 185 and a second side plane 186 arranged opposite to each other and parallel to each other, the first side plane 185 can be used for mounting a corresponding hot air device 600 of one of the pair of air vents 184, the hot air device 600 can be used for conveying temperature-controlled gas to the one, so that the one conveys the temperature-controlled gas to the area where the medium window 500 is located, so as to exchange heat with the medium window 500 to realize temperature control, and the second side plane 186 is used for mounting a corresponding hot air device 600 of the other of the pair of air vents 184, the hot air device 600 can be used for outputting temperature-controlled gas through the other, that is, the other is used for conveying the exchanged gas out of the area where the medium window 500 is located.

[0061] In this embodiment, the first side plane 185 and the second side plane 186 can facilitate the arrangement of different hot air devices 600, and can have a larger contact area with the different hot air devices 600, which can ensure the stability of the arrangement of the different hot air devices 600. Of course, in other embodiments, the carrying plate 100 can also not have the first side plane 185 and the second side plane 186 arranged opposite to each other and parallel to each other, for example, the side of the carrying plate 100 can be a cylindrical surface.

[0062] Optionally, referring to Figures 13 to 15 The edge of the carrying plate 100 can be provided with at least two positioning grooves, including a first positioning groove 187 and a second positioning groove 188, the first positioning groove 187 is used for positioning and cooperating with a corresponding hot air device 600 of one of the pair of air vents 184, the hot air device 600 can be used for conveying temperature-controlled gas to the one, so that the one conveys the temperature-controlled gas to the area where the medium window 500 is located, so as to exchange heat with the medium window 500 to realize temperature control, and the second positioning groove 188 is used for positioning and cooperating with a corresponding hot air device 600 of the other of the pair of air vents 184, the hot air device 600 can be used for outputting temperature-controlled gas through the other, that is, the other is used for conveying the exchanged gas out of the area where the medium window 500 is located.

[0063] In this embodiment, since the first positioning groove 187 and the second positioning groove 188 can be positioned and matched with different hot air devices 600, this can ensure the setting stability of different hot air devices 600 on the carrier plate 100, and further ensure the communication stability of different hot air devices 600 with the two air vents in each pair of air vents 184. Of course, in other embodiments, the edge of the carrier plate 100 can also not be provided with the above-mentioned at least two positioning grooves.

[0064] Optionally, please refer to Figures 2 to 7 and Figures 12 to 15 The edge of the carrier plate 100 can be protrusively provided with a mounting protrusion 171, and the coil support can further include a mounting pad 172 having a certain height, which can facilitate the mounting protrusion 171 to be mounted on the mounting seat of the semiconductor process equipment through the mounting pad 172, and further facilitate the coil support to maintain a certain distance from the dielectric window 500, thereby facilitating the setting of the radio frequency coil 400. Of course, in other embodiments, the edge of the carrier plate 100 can also not be protrusively provided with the mounting protrusion 171.

[0065] Optionally, the carrier plate 100 can be a ring-shaped carrier plate, thereby reducing the weight of the coil support. In the thickness direction of the carrier plate 100, the orthographic projection contour line of the carrier plate 100 is located outside the orthographic projection contour line of the radio frequency coil 400, that is, the overlapping area of the orthographic projection of the carrier plate 100 and the orthographic projection of the radio frequency coil 400 is large, and further the area of the carrier plate 100 that can be used to mount the radio frequency coil 400 is large, which makes the carrier plate 100 have more areas that can be connected with the same radio frequency coil 400, thereby ensuring that the radio frequency coil 400 can always be kept in a specific shape, and at the same time, the area of the carrier plate 100 that can be used to measure the distance between the carrier plate 100 and the radio frequency coil 400 is relatively large, which can improve the accuracy and precision of measuring the distance between the carrier plate 100 and the radio frequency coil 400, thereby avoiding affecting the processing effect of the wafer. Of course, in other embodiments, in the thickness direction of the carrier plate 100, the orthographic projection contour line of the carrier plate 100 can also be located within the orthographic projection contour line of the radio frequency coil 400.

[0066] Optionally, the connection holes 190, the ventilation openings 184 and the measurement holes 120 are arranged at intervals, and the ventilation openings 184 are arranged between the central region of the bearing plate 100 and the edges of the bearing plate 100. The at least one measurement hole 120 can be an arc-shaped hole, and the center of the arc of the arc-shaped hole coincides with the center of the bearing plate 100. This makes the normal projection area of the measurement hole 120 in the thickness direction of the bearing plate 100 larger, and the measurement hole 120 of this shape can have more areas for the operator to detect the distance between the bearing plate 100 and the radio frequency coil 400, and the weight loss effect of the bearing plate 100 is better. Of course, in other embodiments, each of the measurement holes 120 can be a circular hole.

[0067] Optionally, as shown in Figures 13 to 15 , the side surface of the ventilation opening 184 can be a smooth transition curved surface, for example, the shape of the ventilation opening 184 can be circular or elliptical, and the ventilation opening 184 of this shape can be convenient for processing; or, as shown in Figures 3 to 7 , the side surface of the ventilation opening 184 can include at least two sequentially connected planes, which can be smoothly connected or vertically connected, so that the ventilation opening 184 of different shapes can be adapted to more different shapes of the above-mentioned hot air device 600, of course, the embodiments of the present application do not make specific limitations in this regard.

[0068] Optionally, at least two weight loss holes 130 are further arranged at intervals on the bearing plate 100. In the thickness direction of the bearing plate 100, the normal projection of the radio frequency coil 400 is staggered with the normal projection of the weight loss hole 130, and the weight loss hole 130 can be arranged in other regions of the bearing plate 100 that are not arranged with the above-mentioned measurement holes 120, the first mounting gap 181, the second mounting gap 182, the first mounting hole 183, the ventilation opening 184 and the connection hole 190. The weight loss hole 130 can further reduce the weight of the bearing plate 100, and multiple weight loss holes 130 can further reduce the weight of the bearing plate 100. Of course, in other embodiments, the bearing plate 100 can also not be provided with a weight loss hole 130.

[0069] Optionally, the material of the bearing plate 100 can be ceramic, quartz or resin, etc. Of course, the embodiments of the present application do not make specific limitations in this regard. The ceramic bearing plate 100 has high rigidity and is not easy to deform, so the flatness of the upper and lower surfaces of the bearing plate 100 can be ensured by processing, so as to serve as a reference for judging whether the radio frequency coil 400 is horizontally arranged.

[0070] Optionally, the present application also discloses a coil assembly, which comprises a radio frequency coil 400 and a coil support as described above, and the radio frequency coil 400 is mounted on the lower side of the coil support.

[0071] Optionally, for the convenience of installing the radio frequency coil 400 on the lower side of the coil support, please refer to Figure 16 The coil assembly can further include at least two isolation pieces 200 and at least two connecting pieces 300. Each of the isolation pieces 200 is arranged on the side of the bearing plate 100 facing the radio frequency coil 400, and each of the isolation pieces 200 abuts against the bearing plate 100 and the radio frequency coil 400, i.e. the isolation piece 200 is used to separate the bearing plate 100 and the radio frequency coil 400, which can ensure that the radio frequency coil 400 does not contact the bearing plate 100, thereby avoiding wear of the metal surface of the radio frequency coil 400 when it contacts the bearing plate 100. Optionally, the isolation piece 200 can be made of resin.

[0072] In this embodiment, one end of the connecting piece 300 can pass through the connecting hole 190 and the isolation piece 200, and be connected to the radio frequency coil 400, i.e. the connecting piece 300 can simultaneously connect the bearing plate 100, the isolation piece 200 and the radio frequency coil 400, and the same radio frequency coil 400 is connected to the bearing plate 100 through at least two connecting pieces 300, which makes the stress of the radio frequency coil 400 more balanced, and thus the radio frequency coil 400 can be more stably installed on the bearing plate 100, while ensuring the levelness of the radio frequency coil 400. Of course, in other embodiments, the same radio frequency coil 400 can be connected to the bearing plate 100 through only one connecting piece 300.

[0073] In the optional embodiment, when the orthographic projection contour line of the bearing plate 100 in the thickness direction of the bearing plate 100 is located outside the orthographic projection contour line of the radio frequency coil 400 in the thickness direction of the bearing plate 100, according to the foregoing, since the overlapping part of the orthographic projection of the bearing plate 100 and the orthographic projection of the radio frequency coil 400 is large, the area of the bearing plate 100 that can be used to install the radio frequency coil 400 is large, i.e. the bearing plate 100 can be connected to the same radio frequency coil 400 through more isolation pieces 200 and more connecting pieces 300, thereby ensuring that the radio frequency coil 400 can always be kept in a specific shape, and thus affecting the processing effect of the wafer 920 can be avoided.

[0074] Optionally, please refer to Figure 11 The radio frequency coil 400 can include at least two connected sub-coils, and the distance between the at least two sub-coils and the bearing plate 100 can be the same, i.e. the radio frequency coil 400 can be a planar coil, which makes the specifications of each isolation piece 200 used to install the radio frequency coil 400 on the bearing plate 100 the same, and correspondingly, the specifications of each connecting piece 300 are also the same. As can be seen, this arrangement can facilitate the molding of each isolation piece 200 and each connecting piece 300, and the molding cost is relatively low.

[0075] In another embodiment, please refer to Figure 1The radio frequency coil 400 can include at least two sub-coils connected to each other, and the distance between the at least two sub-coils and the carrier plate 100 is different, that is, the radio frequency coil 400 can be a three-dimensional coil, which can reduce the capacitive coupling effect, thereby avoiding sputtering of the dielectric window 500, and further avoiding affecting the processing effect of the wafer 920.

[0076] In this embodiment, since the radio frequency coil 400 can be a three-dimensional coil, the specifications of the respective connectors 300 used to mount the radio frequency coil 400 to the carrier plate 100 are different, and the specifications of the respective spacers 200 are also different, that is, the lengths of the at least two connectors 300 are different, and the thicknesses of the at least two spacers 200 are different, so that the carrier plate 100 can abut against the sub-coils with different distances from the carrier plate 100 through the spacers 200 with different thicknesses, thereby ensuring the setting stability of the sub-coils with different distances from the carrier plate 100, and further ensuring the setting stability of the entire radio frequency coil 400.

[0077] Optionally, referring to Figure 1 , Figure 3 and Figure 5 , the radio frequency coil 400 can include a first coil 410 and a second coil 420, the second coil 420 surrounds the first coil 410, and at least one of the first coil 410 and the second coil 420 can include at least two sub-coils connected to each other. Since the second coil 420 surrounds the first coil 410, the space occupied by the entire radio frequency coil 400 is larger, and the magnetic field range generated is wider, which is beneficial to uniform processing of the wafer 920 by the semiconductor process equipment. Of course, in other embodiments, the radio frequency coil 400 can only include the first coil 410.

[0078] In this embodiment, the first end of the first coil 410 can be used to receive a radio frequency input, that is, the first end of the first coil 410 can be a radio frequency input end, so that the voltage of the first end of the first coil 410 is higher, the second end of the first coil 410 is used to be grounded, that is, the second end of the first coil 410 can be a grounding end, so that the voltage of the second end of the first coil 410 is lower, and the distance between the first coil 410 and the carrier plate 100 gradually increases in the direction extending from the first end of the first coil 410 to the second end of the first coil 410, which makes the high-voltage end of the first coil 410 close to the carrier plate 100, and the low-voltage end of the first coil 410 away from the carrier plate 100. Correspondingly, the high-voltage end of the first coil 410 is away from the dielectric window 500, and the low-voltage end of the first coil 410 is close to the dielectric window 500, which can effectively reduce the capacitive coupling effect.

[0079] The first end of the second coil 420 is used for connecting the radio frequency input, that is, the first end of the second coil 420 can be a radio frequency input end, so that the voltage of the first end of the second coil 420 is high, the second end of the second coil 420 is used for connecting the ground in series with the capacitor, that is, the second end of the second coil 420 can be a ground end, and the second end of the second coil 420 is used for connecting in series with the capacitor, so that the voltage of the second end of the second coil 420 is high, and in the direction extending from the first end of the second coil 420 to the second end of the second coil 420, the distance between the second coil 420 and the bearing plate 100 first increases and then decreases, which makes the two high-voltage ends of the second coil 420 close to the bearing plate 100, and correspondingly, the two high-voltage ends of the second coil 420 are away from the dielectric window 500, which can further effectively reduce the capacitive coupling effect.

[0080] Alternatively, the first end of the first coil 410 is used for connecting the radio frequency input, that is, the first end of the first coil 410 can be a radio frequency input end, so that the voltage of the first end of the first coil 410 is high, the second end of the first coil 410 is used for connecting the ground in series with the capacitor, that is, the second end of the first coil 410 can be a ground end, and the second end of the first coil 410 is used for connecting in series with the capacitor, so that the voltage of the second end of the first coil 410 is high, and in the direction extending from the first end of the first coil 410 to the second end of the first coil 410, the distance between the first coil 410 and the bearing plate 100 first increases and then decreases, which makes the two high-voltage ends of the first coil 410 close to the bearing plate 100, and correspondingly, the two high-voltage ends of the first coil 410 are away from the dielectric window 500, which can effectively reduce the capacitive coupling effect.

[0081] The first end of the second coil 420 is used for connecting the radio frequency input, that is, the first end of the second coil 420 can be a radio frequency input end, so that the voltage of the first end of the second coil 420 is high, the second end of the second coil 420 is used for connecting the ground, that is, the second end of the second coil 420 can be a ground end, so that the voltage of the second end of the second coil 420 is low, and in the direction extending from the first end of the second coil 420 to the second end of the second coil 420, the distance between the second coil 420 and the bearing plate 100 gradually increases, which makes the high-voltage end of the second coil 420 close to the bearing plate 100, and the low-voltage end of the second coil 420 away from the bearing plate 100, correspondingly, the high-voltage end of the second coil 420 is away from the dielectric window 500, and the low-voltage end of the second coil 420 is close to the dielectric window 500, which can further effectively reduce the capacitive coupling effect.

[0082] Optionally, please refer to Figure 1 , Figure 3 and Figure 5, the first coil 410 can sequentially include the first sub-coil 411, the second sub-coil 412 and the third sub-coil 413 in sequence along the winding direction of the first coil 410, which makes the length of the first coil 410 relatively long, and thus the magnetic field generated is relatively strong, which can ensure the processing effect on the wafer 920. Of course, in other embodiments, the first coil 410 can only sequentially include the first sub-coil 411 and the second sub-coil 412 along the winding direction of the first coil 410.

[0083] In this embodiment, the distance between the first sub-coil 411 and the carrier plate 100 is less than the distance between the second sub-coil 412 and the carrier plate 100, and the distance between the second sub-coil 412 and the carrier plate 100 is less than the distance between the third sub-coil 413 and the carrier plate 100, that is, the first sub-coil 411 is closer to the carrier plate 100 than the second sub-coil 412 and the third sub-coil 413, and the third sub-coil 413 is farther away from the carrier plate 100 than the second sub-coil 412 and the first sub-coil 411, and thus the first sub-coil 411 is farther away from the dielectric window 500, and the third sub-coil 413 is closer to the dielectric window 500, wherein the end of the first sub-coil 411 away from the second sub-coil 412 is used to receive the radio frequency input, so that the end of the first sub-coil 411 away from the second sub-coil 412 is a high-voltage end, and the end of the third sub-coil 413 away from the second sub-coil 412 is used to ground, so that the end of the third sub-coil 413 away from the second sub-coil 412 is a low-voltage end, thereby facilitating effective reduction of the capacitive coupling effect.

[0084] In this embodiment, the second coil 420 can sequentially include the fourth sub-coil 421, the fifth sub-coil 422 and the sixth sub-coil 423 in sequence along the winding direction of the second coil 420, the distance between the fourth sub-coil 421 and the carrier plate 100 is less than the distance between the fifth sub-coil 422 and the carrier plate 100, and the distance between the sixth sub-coil 423 and the carrier plate 100 is equal to the distance between the fourth sub-coil 421 and the carrier plate 100, that is, the fourth sub-coil 421 and the sixth sub-coil 423 are closer to the carrier plate 100 than the fifth sub-coil 422, and the fifth sub-coil 422 is farther away from the carrier plate 100 than the fourth sub-coil 421 and the sixth sub-coil 423, and thus the fourth sub-coil 421 and the sixth sub-coil 423 are farther away from the dielectric window 500, and the fifth sub-coil 422 is closer to the dielectric window 500, wherein the end of the fourth sub-coil 421 away from the fifth sub-coil 422 is used to receive the radio frequency input, so that the end of the fourth sub-coil 421 away from the fifth sub-coil 422 is a high-voltage end, and the end of the sixth sub-coil 423 away from the fifth sub-coil 422 is used to ground in series with the capacitor, so that the end of the sixth sub-coil 423 away from the fifth sub-coil 422 is also a high-voltage end, thereby facilitating effective reduction of the capacitive coupling effect.

[0085] Optionally, the distance between the first sub-coil 411 and the carrier plate 100 can be equal to the distance between the fourth sub-coil 421 and the carrier plate 100, that is, the distance between the first sub-coil 411, the fourth sub-coil 421 and the sixth sub-coil 423 and the carrier plate 100 is equal, and the distance between the third sub-coil 413 and the carrier plate 100 can be equal to the distance between the fifth sub-coil 422 and the carrier plate 100, which makes the space occupied by the first coil 410 and the space occupied by the second coil 420 in the height direction of the coil assembly equal, so that the space occupied by the radio frequency coil 400 as a whole is relatively small. Of course, in other embodiments, the distance between the first sub-coil 411 and the carrier plate 100 can also be not equal to the distance between the fourth sub-coil 421 and the carrier plate 100, and the distance between the third sub-coil 413 and the carrier plate 100 can also be not equal to the distance between the fifth sub-coil 422 and the carrier plate 100.

[0086] Optionally, in order to facilitate the stable installation of the first sub-coil 411, the second sub-coil 412, the third sub-coil 413, the fourth sub-coil 421, the fifth sub-coil 422 and the sixth sub-coil 423 on the carrier plate 100, please refer to Figures 6 to 10 The above-mentioned each spacer 200 can include a plurality of first spacers 210, a plurality of second spacers 220 and a plurality of third spacers 230, and the size of the first spacer 210 in the height direction of the coil assembly is smaller than the size of the second spacer 220, and the size of the second spacer 220 is smaller than the size of the third spacer 230, which can be the thickness of the first spacer 210, the thickness of the second spacer 220 and the thickness of the third spacer 230; each connecting piece 300 can include a plurality of first connecting pieces 310, a plurality of second connecting pieces 320, a plurality of third connecting pieces 330, a plurality of fourth connecting pieces 340 and a plurality of fifth connecting pieces 350; each connecting hole 190 can include a plurality of first connecting holes 191, a plurality of second connecting holes 192, a plurality of third connecting holes 193, a plurality of fourth connecting holes 194 and a plurality of fifth connecting holes 195.

[0087] In the process of connecting the carrier plate 100 and the first coil 410, please refer to Figure 8 One end of the first connecting piece 310 can pass through the first connecting hole 191 and the first spacer 210 and be connected with the first sub-coil 411; please refer to Figure 9 The second spacer 220 is provided with a first connecting groove 221, one end of the second connecting piece 320 passes through the fourth connecting hole 194 and is connected with the side wall of the first connecting groove 221, and one end of the third connecting piece 330 passes through the fifth connecting hole 195 and the bottom wall of the first connecting groove 221 in turn and is connected with the second sub-coil 412; please refer to Figure 10The third spacer 230 is provided with a second connecting groove 231, one end of the fourth connecting member 340 passes through the second connecting hole 192 and is connected with the sidewall of the second connecting groove 231, and one end of the fifth connecting member 350 passes through the third connecting hole 193 and the bottom wall of the second connecting groove 231 in sequence and is connected with the fifth sub-coil 422.

[0088] In the process of connecting the bearing plate 100 and the second coil 420, since the distance between the first sub-coil 411 and the bearing plate 100, the distance between the fourth sub-coil 421 and the bearing plate 100, and the distance between the sixth sub-coil 423 and the bearing plate 100 are all equal, the fourth sub-coil 421 and the sixth sub-coil 423 can also be connected with the bearing plate 100 through different first spacers 210 and different first connecting members 310. Specifically, please refer to Figure 8 One end of the different first connecting member 310 can pass through the different first connecting hole 191 and the different first spacer 210 and be connected with the fourth sub-coil 421 and the sixth sub-coil 423 respectively; since the distance between the third sub-coil 413 and the bearing plate 100 is equal to the distance between the fifth sub-coil 422 and the bearing plate 100, the fifth sub-coil 422 can also be connected with the bearing plate 100 through different third spacers 230, different fourth connecting members 340 and different fifth connecting members 350. Specifically, please refer to Figure 10 The third spacer 230 is provided with a second connecting groove 231, one end of the fourth connecting member 340 passes through the second connecting hole 192 and is connected with the sidewall of the second connecting groove 231, and one end of the fifth connecting member 350 passes through the third connecting hole 193 and the bottom wall of the second connecting groove 231 in sequence and is connected with the fifth sub-coil 422.

[0089] In this embodiment, the sub-coils with different distances from the bearing plate 100 can be stably installed on the bearing plate 100 through the spacers 200 with different thicknesses, and since the first connecting groove 221 is provided on the second spacer 220 and the second connecting groove 231 is provided on the third spacer 230, it can avoid using a too long connecting member 300 to connect the sub-coil with a larger distance from the bearing plate 100 and the bearing plate 100, that is, the same specification of different connecting members 300 can be used to connect the bearing plate 100 and the sub-coil with different distances from the bearing plate 100, so as to reduce the processing cost. Of course, in other embodiments, the second spacer 220 can also not be provided with the first connecting groove 221, and the third spacer 230 can also not be provided with the second connecting groove 231.

[0090] Optionally, the application also discloses a semiconductor process equipment, which comprises a medium window 500, a process chamber 910 and the coil assembly described above, the medium window 500 seals a top opening of the process chamber 910, and the coil assembly is installed on the medium window 500.

[0091] Optionally, referring to Figure 1 and Figure 11 , the semiconductor process equipment can further comprise a connected matching device 810, a connecting strip box 820 and a plurality of copper columns 830, the plurality of copper columns 830 are used to be connected with the end of the radio frequency coil 400, a part of the plurality of copper columns 830 can be electrically connected with the matching device 810 through the connecting strip box 820, so that one end of the radio frequency coil 400 can be electrically connected with the radio frequency source through the matching device 810, and another part of the plurality of copper columns 830 can be in contact with the shell of the connecting strip box 820, so that the other end of the radio frequency coil 400 can be grounded.

[0092] Optionally, the semiconductor process equipment can further comprise an electrostatic chuck 930 and an air inlet pipe 940, the electrostatic chuck 930 is arranged in the process chamber 910, and the wafer 920 can be placed on the electrostatic chuck 930, the electrostatic chuck 930 has a certain adsorption effect on the wafer 920, referring to Figure 3 、 Figure 4 、 Figure 6 、 Figure 7 、 Figures 13 to 15 , the first through hole 160 is further arranged on the bearing plate 100, the second through hole is arranged on the medium window 500, one end of the air inlet pipe 940 is connected with an external gas source, and the other end of the air inlet pipe 940 sequentially passes through the first through hole 160 and the second through hole and then enters the process chamber 910, so that the air inlet pipe 940 can transport a process gas into the process chamber 910, and the process gas is excited to be in a plasma state under the action of the radio frequency coil 400, so as to process the wafer 920.

[0093] Optionally, at least two pairs of ventilation openings 184 are arranged on the bearing plate 100 in a spaced manner, and the semiconductor process equipment can further comprise at least two pairs of hot air devices 600, each ventilation opening 184 corresponds to each hot air device 600 in a one-to-one manner and is connected therewith, and the application embodiment can quickly control the temperature of the medium window 500 through the plurality of ventilation openings 184 and the plurality of hot air devices 600, that is, the temperature control efficiency is high. Of course, in other embodiments, only one pair of ventilation openings 184 can be arranged on the bearing plate 100, and the semiconductor process equipment can only comprise one pair of hot air devices 600.

[0094] Optionally, the at least two pairs of air vents 184 can include at least two air inlets 140 and at least two air outlets 150, and one air inlet 140 and one air outlet 150 form a pair, and the at least two pairs of hot air devices 600 can include at least two air inlet ducts 610 and at least two air outlet ducts 620, the at least two air inlet ducts 610 can include a first air inlet duct 611 and a second air inlet duct 612, the at least two air outlet ducts 620 can include a first air outlet duct 621 and a second air outlet duct 622, and the first air inlet duct 611 and the first air outlet duct 621 form a pair, and the second air inlet duct 612 and the second air outlet duct 622 form a pair.

[0095] In this embodiment, please refer to Figure 2 , Figure 3 and Figure 12 , the first air inlet duct 611, the second air inlet duct 612, the first air outlet duct 621 and the second air outlet duct 622 are uniformly and spaced arranged along the circumference of the carrier plate 100, the first air inlet duct 611 is arranged close to the second air outlet duct 622, the second air inlet duct 612 is arranged close to the first air outlet duct 621, one end of the first air inlet duct 611 passes through one of the at least two air inlets 140 and faces the media window 500, and one end of the first air outlet duct 621 passes through one of the at least two air outlets 150 and faces the media window 500; one end of the second air inlet duct 612 passes through the other of the at least two air inlets 140 and faces the media window 500, and one end of the second air outlet duct 622 passes through the other of the at least two air outlets 150 and faces the media window 500, and the first air inlet duct 611, the first air outlet duct 621, the second air inlet duct 612 and the second air outlet duct 622 can make the temperature control gas flow between the carrier plate 100 and the media window 500, so as to control the temperature of the media window 500, thereby ensuring the processing effect of the wafer 920.

[0096] Optionally, the semiconductor process equipment can further include a first hot air cover and a second hot air cover, the first hot air cover and the second hot air cover are arranged between the media window 500 and the carrier plate 100, one end of the first air inlet duct 611 and one end of the first air outlet duct 621 are in communication with the first hot air cover, one end of the second air inlet duct 612 and one end of the second air outlet duct 622 are in communication with the second hot air cover, and the opening of the first hot air cover and the opening of the second hot air cover both face the media window 500.

[0097] In this embodiment, since the first air inlet pipe 611 and the first air outlet pipe 621 are distributed on both sides of the carrier plate 100, the temperature control gas entering from the first air inlet pipe 611 can pass through the first hot air cover and then enter the first air outlet pipe 621. Since the opening of the first hot air cover faces the medium window 500, the temperature control gas flows through a larger area of the medium window 500 each time, and the temperature control effect on the medium window 500 is more obvious. Similarly, since the second air inlet pipe 612 and the second air outlet pipe 622 are distributed on both sides of the carrier plate 100, the temperature control gas entering from the second air inlet pipe 612 can pass through the second hot air cover and then enter the second air outlet pipe 622. Since the opening of the second hot air cover faces the medium window 500, the temperature control gas flows through a larger area of the medium window 500 each time, and the temperature control effect on the medium window 500 is more obvious. Of course, in other embodiments, the semiconductor process equipment can not include the first hot air cover and the second hot air cover.

[0098] Optionally, the semiconductor process equipment can further include at least two connecting pipes. One of the at least two connecting pipes is connected between the first air inlet pipe 611 and the second air outlet pipe 622, and is arranged at an end of the first air inlet pipe 611 and the second air outlet pipe 622 away from the medium window 500. Another of the at least two connecting pipes is connected between the second air inlet pipe 612 and the first air outlet pipe 621, and is arranged at an end of the second air inlet pipe 612 and the first air outlet pipe 621 away from the medium window 500.

[0099] In this embodiment, the connecting pipe is provided with a temperature control member, which can be a heater. The temperature control member can control the temperature of the gas flowing to the medium window 500, thereby controlling the temperature of the medium window 500. As can be seen, the temperature control device composed of the air inlet pipe 610, the air outlet pipe 620, the connecting pipe and the temperature control member can recycle the gas for temperature control of the medium window 500, i.e., the temperature control device is not connected to the external environment, which makes the temperature control device have the advantages of smaller occupied space, simpler structure and simpler setting mode. Of course, in other embodiments, the semiconductor process equipment can not include the connecting pipe.

[0100] Optionally, at least one of the air inlet pipe 610 and the air outlet pipe 620 can be adhesively connected to the carrier plate 100.

[0101] In another embodiment, referring to Figure 12 , the semiconductor process equipment can further include a first fixing member 710. At least one of the air inlet pipe 610 and the air outlet pipe 620 can be detachably connected to the carrier plate 100 through the first fixing member 710, which can facilitate maintenance or replacement of at least one of the air inlet pipe 610 and the air outlet pipe 620.

[0102] Optionally, please refer to Figure 2 and Figure 3 The at least one of the air inlet pipe 610 and the air outlet pipe 620 is provided with a limiting protrusion 630 protruding upward, the limiting protrusion 630 is connected with and limitedly matched with the edge of the bearing plate 100, which can be the first side plane 185 and the second side plane 186, and the at least one of the air inlet pipe 610 and the air outlet pipe 620 can be limited on the bearing plate 100 by the limiting protrusion 630, so as to be connected with the bearing plate 100. Of course, in other embodiments, the at least one of the air inlet pipe 610 and the air outlet pipe 620 can not be provided with the limiting protrusion 630.

[0103] The above embodiments mainly describe the differences between the various embodiments, and the different optimization features between the various embodiments can be combined to form a better embodiment without contradiction. Considering the brevity of the text, it will not be repeated here.

[0104] The above only describes the embodiments of the present application and is not intended to limit the present application. Those skilled in the art can make various changes and modifications to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the scope of the claims of the present application.

Claims

1. A coil holder for use in semiconductor process equipment, characterized in that, The coil support includes a support plate (100). The carrier plate (100) has multiple connection holes (190) for mounting the radio frequency coil (400). The support plate (100) is also provided with at least one pair of ventilation openings (184) spaced apart for temperature control of the semiconductor process equipment; At least two measuring holes (120) are also provided on the support plate (100) at intervals. Each measuring hole (120) is arranged at intervals along the circumference of the support plate (100), and at least one measuring hole (120) is located between the vent (184) and the edge of the support plate (100).

2. The coil support according to claim 1, characterized in that, The radio frequency coil (400) includes a first coil (410) and a second coil (420), the second coil (420) surrounding the first coil (410), and at least a portion of the orthographic projection of the vent (184) is located between the orthographic projection of the first coil (410) and the orthographic projection of the second coil (420) in the thickness direction of the carrier plate (100).

3. The coil support according to claim 2, characterized in that, In the thickness direction of the support plate (100), a portion of the orthographic projection of the first coil (410) lies within the orthographic projection of at least one of the vents (184), and a portion of the orthographic projection of the second coil (420) lies within the orthographic projection of at least one of the measuring holes (120).

4. The coil support according to claim 2, characterized in that, The at least two measuring holes (120) include at least one first measuring hole (121) and at least one second measuring hole (122). The first measuring hole (121) is located between the vent (184) and the central region of the support plate (100), and the second measuring hole (122) is located between the vent (184) and the edge of the support plate (100). In the thickness direction of the support plate (100), a portion of the orthographic projection of the first coil (410) is located within the orthographic projection of the first measuring hole (121), and a portion of the orthographic projection of the second coil (420) is located within the orthographic projection of the second measuring hole (122).

5. The coil support according to claim 1, characterized in that, At least one of the vents (184) has a first mounting notch (181) on its edge; and / or, The edge of the support plate (100) is provided with a second mounting notch (182); and / or, The support plate (100) is also provided with a first mounting hole (183), which is located between the central area of ​​the support plate (100) and the edge of the support plate (100); The first mounting notch (181), the second mounting notch (182), and the first mounting hole (183) are all used to install temperature sensing elements.

6. The coil support according to claim 1, characterized in that, At least two pairs of ventilation openings (184) are spaced apart on the support plate (100), and each ventilation opening (184) is spaced apart along the circumference of the support plate (100).

7. The coil support according to claim 6, characterized in that, The support plate (100) is also provided with a plurality of power feeding holes (196) spaced apart, for feeding power to the radio frequency coil (400) through the power feeding holes (196), and each power feeding hole (196) is arranged along a first straight line; The support plate (100) is provided with two pairs of ventilation openings (184) spaced apart. Two of the ventilation openings (184) in each pair are distributed on both sides of the first straight line, and the vertical distance between the center of the four ventilation openings (184) and the first straight line is equal.

8. The coil support according to claim 7, characterized in that, Two of the two pairs of vents (184) located on one side of the first straight line are symmetrical about the second straight line, and two of the two pairs of vents (184) located on the other side of the first straight line are symmetrical about the third straight line. The second straight line and the third straight line are both perpendicular to the first straight line, and the second straight line and the third straight line are not collinear.

9. The coil support according to claim 1, characterized in that, The support plate (100) has a first side plane (185) and a second side plane (186) that are arranged opposite to each other and parallel to each other. The first side plane (185) is used to install a hot air device (600) corresponding to one of the pair of vents (184), and the second side plane (186) is used to install a hot air device (600) corresponding to the other of the pair of vents (184); or, The edge of the support plate (100) is provided with at least two positioning grooves, including a first positioning groove (187) and a second positioning groove (188). The first positioning groove (187) is used to position and cooperate with the hot air device (600) corresponding to one of the pair of vents (184), and the second positioning groove (188) is used to position and cooperate with the hot air device (600) corresponding to the other of the pair of vents (184).

10. The coil support according to claim 1, characterized in that, The edge of the carrier plate (100) is provided with a mounting protrusion (171), which is used for mounting on the mounting base of the semiconductor process equipment; and / or, In the thickness direction of the carrier plate (100), the orthographic projection outline of the carrier plate (100) is located outside the orthographic projection outline of the radio frequency coil (400).

11. The coil support according to claim 1, characterized in that, The connecting hole (190), the vent (184) and the measuring hole (120) are spaced apart from each other. The vent (184) is located between the central area of ​​the support plate (100) and the edge of the support plate (100). At least one of the measuring holes (120) is an arc-shaped hole, and the center of the arc-shaped hole coincides with the center of the support plate (100).

12. The coil support according to claim 1, characterized in that, The side surface of the vent (184) is a smoothly transitioned curved surface; or, The side surface of the vent (184) includes at least two planes connected in sequence.

13. A coil assembly, characterized in that, It includes a radio frequency coil (400) and a coil holder according to any one of claims 1-12, wherein the radio frequency coil (400) is mounted on the underside of the coil holder.

14. The coil assembly according to claim 13, characterized in that, The coil assembly further includes at least two isolators (200) and at least two connectors (300). Each isolator (200) is spaced apart on the side of the carrier plate (100) facing the radio frequency coil (400). Each isolator (200) abuts against the carrier plate (100) and the radio frequency coil (400) respectively. One end of each connector (300) passes through the connection hole (190) and the isolator (200) and is connected to the radio frequency coil (400). The same radio frequency coil (400) is connected to the carrier plate (100) through at least two connectors (300).

15. The coil assembly according to claim 14, characterized in that, The radio frequency coil (400) includes at least two connected sub-coils, and the distances between the at least two sub-coils and the carrier plate (100) are different; At least two of the isolation members (200) have different thicknesses, so that the carrier plate (100) abuts against the sub-coil at different distances from the carrier plate (100) through the isolation members (200) of different thicknesses.

16. The coil assembly according to claim 15, characterized in that, The radio frequency coil (400) includes a first coil (410) and a second coil (420), the second coil (420) surrounding the first coil (410), and at least one of the first coil (410) and the second coil (420) includes at least two connected sub-coils; The first end of the first coil (410) is used to connect to the radio frequency input, and the second end of the first coil (410) is used to ground. The distance between the first coil (410) and the carrier plate (100) gradually increases in the direction extending from the first end to the second end of the first coil (410). The first end of the second coil (420) is used to connect to the radio frequency input, and the second end of the second coil (420) is used to connect to ground after being connected in series with a capacitor. The distance between the second coil (420) and the carrier plate (100) first increases and then decreases in the direction extending from the first end to the second end of the second coil (420). Alternatively, The first end of the first coil (410) is used to connect to the radio frequency input, and the second end of the first coil (410) is used to connect to the ground in series with a capacitor. In the direction extending from the first end of the first coil (410) to the second end of the first coil (410), the distance between the first coil (410) and the carrier plate (100) first increases and then decreases. The first end of the second coil (420) is used to connect to the radio frequency input, and the second end of the second coil (420) is used to ground. In the direction extending from the first end of the second coil (420) to the second end of the second coil (420), the distance between the second coil (420) and the carrier plate (100) gradually increases.

17. The coil assembly according to claim 16, characterized in that, The first coil (410) includes, in sequence along its winding direction, a first sub-coil (411), a second sub-coil (412), and a third sub-coil (413). The distance between the first sub-coil (411) and the carrier plate (100) is less than the distance between the second sub-coil (412) and the carrier plate (100), and the distance between the second sub-coil (412) and the carrier plate (100) is less than the distance between the third sub-coil (413) and the carrier plate (100). The end of the first sub-coil (411) away from the second sub-coil (412) is used to connect to the radio frequency input, and the end of the third sub-coil (413) away from the second sub-coil (412) is used to ground. The second coil (420) includes, in sequence along its winding direction, a fourth sub-coil (421), a fifth sub-coil (422), and a sixth sub-coil (423). The distance between the fourth sub-coil (421) and the carrier plate (100) is less than the distance between the fifth sub-coil (422) and the carrier plate (100). The distance between the sixth sub-coil (423) and the carrier plate (100) is equal to the distance between the fourth sub-coil (421) and the carrier plate (100). The end of the fourth sub-coil (421) away from the fifth sub-coil (422) is used to connect to the radio frequency input, and the end of the sixth sub-coil (423) away from the fifth sub-coil (422) is used to connect to the ground after being connected in series with a capacitor.

18. The coil assembly according to claim 17, characterized in that, The distance between the first sub-coil (411) and the carrier plate (100) is equal to the distance between the fourth sub-coil (421) and the carrier plate (100), and the distance between the third sub-coil (413) and the carrier plate (100) is equal to the distance between the fifth sub-coil (422) and the carrier plate (100).

19. A semiconductor process apparatus, characterized in that, The device includes a dielectric window (500), a process chamber (910), and a coil assembly according to any one of claims 13-18, wherein the dielectric window (500) seals the top opening of the process chamber (910), and the coil assembly is mounted on the dielectric window (500).

20. The semiconductor process equipment according to claim 19, characterized in that, At least two pairs of ventilation openings (184) are spaced apart on the carrier plate (100), and the semiconductor process equipment also includes at least two pairs of hot air devices (600). Each ventilation opening (184) corresponds to each hot air device (600) and they are connected to each other.

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