Electronic device, external device, and contact contact system

Abstract

The utility model discloses electronic equipment, external equipment and a contact point contact system. The electronic device comprises a magnetic induction assembly used for inducing magnetism of an external device and generating an induction signal; the first contact module is used for being in contact with a second contact module of external equipment; the first end of the switch module is coupled with the first end of the first contact module, and the second end of the switch module is coupled with a wire on a mainboard of the electronic equipment; the control chip is arranged on the main board, is coupled with the magnetic induction component and is coupled with the control end of the switch module; and when the magnetic induction assembly does not induce the magnetism of the external equipment, the control chip controls the switch module to be in an open state. The electrostatic risk of the electronic equipment can be effectively reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of anti-static, in particular to an electronic device, an external device and a contact system. BACKGROUND

[0002] Static electricity can be released to an electronic device in a contact or non-contact manner. For example, a mobile phone of a tri-proof type is usually provided with communication and power supply detection metal contacts on the bottom or back thereof in order to meet the requirements of charging in a special environment (for example, the mobile phone is charged through the back contacts of the mobile phone and the bottom contacts of the mobile phone) and special earphones (for example, air pipe earphones and shoulder microphones) that are contacted through the back contacts of the mobile phone. The mobile phone of the tri-proof type is usually provided with communication and power supply detection metal contacts on the bottom or back thereof. The contacts are connected to the corresponding circuits of the mobile phone externally and connected to the corresponding circuits of the mobile phone internally. The function structure of the mobile phone is complex, and the wires of the mobile phone mainboard connected to the contacts need to avoid the complex wires of the mainboard in a limited space.

[0003] Taking the contacts as an example, when static electricity is released to the contacts, if the internal circuit of the mobile phone does not have a sufficient and suitable static electricity release path, the static electricity will usually be released to the internal circuit of the mobile phone through the contacts, causing a static electricity risk.

[0004] A common solution to such a problem is to add a static electricity protection device to the mainboard contact end of the circuit. When static electricity is released to the contacts, the static electricity is released to the ground through the static electricity protection device such as a TVS. In a compact structure space, if the grounding protection does not meet the release path condition, the static electricity cannot be released in time through the static electricity protection device, and the static electricity will be accumulated or released through the internal circuit of the mobile phone, causing damage to the circuit product. CONTENT OF THE INVENTION

[0005] The electronic device, the external device and the contact system provided by the present application can effectively reduce the static electricity risk of the electronic device.

[0006] In a first aspect, the present application provides an electronic device, which comprises: a magnetic induction assembly, configured to induce the magnetism of an external device and generate an induction signal; a first contact module, configured to contact a second contact module of the external device; a switch module, a first end of the switch module being coupled to a first end of the first contact module, and a second end of the switch module being coupled to a wire on a mainboard of the electronic device; a control chip, disposed on the mainboard, coupled to the magnetic induction assembly, and coupled to a control end of the switch module; and wherein when the magnetic induction assembly does not induce the magnetism of the external device, the control chip controls the switch module to be in an open state.

[0007] In some embodiments, the electronic device further comprises a shell, the first contact module is disposed on the shell, and the mainboard is disposed in the shell.

[0008] In some embodiments, the first contact module includes power supply contacts and / or communication contacts.

[0009] In some embodiments, the magnetic sensing assembly includes a Hall element.

[0010] In some embodiments, the number of switch units in the switch module is the same as the number of contacts in the first contact module.

[0011] In some embodiments, the magnetic sensing assembly includes a main magnetic sensing unit disposed away from the first contact module, and a plurality of slave magnetic sensing units disposed one-to-one corresponding to the contacts in the first contact module.

[0012] In some embodiments, the switch units in the switch module include at least one of a transistor and an analog switch.

[0013] In a second aspect, the present application provides an external device, which includes a magnetic assembly, and a second contact module for contacting a first contact module of an electronic device, wherein the electronic device is provided in the first aspect.

[0014] In a third aspect, the present application provides a contact contact system, which includes an electronic device provided in the first aspect and an external device provided in the second aspect.

[0015] The present application has the following beneficial effects: Different from the prior art, the electronic device, the external device, and the contact contact system provided in the present application have the magnetic sensing assembly and the switch module disposed in the electronic device, and the control chip controls the switch module to open or close according to the sensing signal of the magnetic sensing assembly, so as to turn on or turn off the path between the first contact module and the mainboard, so that when the external device is connected to the electronic device through the first contact module, the control chip closes the switch module according to the sensing signal, so that the external device is connected between the first contact module and the mainboard of the electronic device, and works normally, and when the external device is not connected to the electronic device, the magnetic sensing assembly does not sense the magnetism of the external device, the control chip controls the switch module to be in an open state, and static electricity is released to the inside of the electronic device through the first contact module, so that the switch module is in an open state, and the static electricity has no release loop path, so that the circuit of the electronic device is safe, and the static electricity risk of the electronic device can be effectively reduced. The electronic device of the present application can also prevent the contact abnormality caused by the connection of the non-matching external device, and cause the risk of short circuit and burnout of large power and large current. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments description. Obviously, the drawings in the following description only represent some of the embodiments of the present application, and all other drawings obtained by those of ordinary skill in the art without any creative effort based on these drawings are within the protection scope of the present application. Among them:

[0017] Figure 1 is a flow schematic diagram of an embodiment of the electronic device provided by the present application;

[0018] Figure 2 is a flow schematic diagram of another embodiment of the electronic device provided by the present application;

[0019] Figure 3 is a flow schematic diagram of another embodiment of the electronic device provided by the present application;

[0020] Figure 4 is an application scenario schematic diagram of the electronic device provided by the present application;

[0021] Figure 5 is another application scenario schematic diagram of the electronic device provided by the present application;

[0022] Figure 6 is a flow schematic diagram of another embodiment of the external device provided by the present application;

[0023] Figure 7 is a flow schematic diagram of an embodiment of the contact contact system provided by the present application. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. It can be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only the parts related to the present application are shown in the drawings, but not all the structures. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without any creative effort are within the protection scope of the present application.

[0025] In this paper, the phrase "embodiment" means that the specific features, structures or characteristics described in combination with the embodiment can be contained in at least one embodiment of the present application. The phrase appears at various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment to other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0026] Reference is made to Figure 1 , Figure 1Figure 1 is a flowchart of an embodiment of an electronic device provided by the present application. The electronic device 100 includes a magnetic induction component 10, a first contact module 20, a switch module 30, and a control chip 40.

[0027] The magnetic induction component 10 is configured to induce the magnetism of an external device and generate an induction signal. The external device can have a corresponding contact module that contacts the first contact module 20 of the electronic device 100 to exchange data and / or provide power. For example, the external device can be a charging device, a voice device, a storage device, or the like, which can assist the electronic device 100. In other embodiments, the external device can be an external device.

[0028] In some embodiments, the magnetic induction component 10 can be a corresponding magnetic field induction sensor configured to induce the magnetic field of the external device and generate a corresponding induction signal. For example, when the magnetic induction component 10 induces the magnetism of the external device, a first induction signal is generated, and the first induction signal is a high-level signal. When the magnetic induction component 10 does not induce the magnetism of the external device, a second induction signal is generated, and the first induction signal is a low-level signal.

[0029] In some embodiments, the magnetic induction component 10 includes a Hall element configured to induce the magnetism of the external device and generate an induction signal.

[0030] In some embodiments, the magnetism of the external device can be obtained by arranging a magnet at a target position of the external device. When the external device contacts the electronic device 100, the magnetic induction component 10 is located within the magnetic field generated by the magnet at the target position, and thus the magnetic induction component 10 can generate a first induction signal. When the external device is separated from the electronic device 100, the magnetic induction component 10 is not located within the magnetic field generated by the magnet at the target position, and thus the magnetic induction component 10 can generate a second induction signal.

[0031] The first contact module 20 is configured to contact a second contact module of the external device. The contacts in the first contact module 20 can be metal contacts, such as gold, silver, copper, iron, aluminum, and alloy contacts, which are configured to transmit electrical signals.

[0032] In some embodiments, the first contact module 20 includes a power supply contact. When the first contact module 20 contacts a corresponding contact in the second contact module of the external device through the power supply contact, the external device can supply power to the electronic device 100 through the power supply contact. In some embodiments, the power supply contact includes a first power supply contact and a second power supply contact. The first power supply contact can correspond to a positive electrode, and the second power supply contact can correspond to a negative electrode, and thus when the first contact module 20 contacts a corresponding contact in the second contact module of the external device through the power supply contact, a power supply loop is formed.

[0033] In some embodiments, the first contact module 20 includes communication contacts. When the first contact module 20 is in contact with the corresponding contacts in the second contact module of the external device through the communication contacts, the external device can communicate with the electronic device 100 through the communication contacts. In some embodiments, the number of the communication contacts can be set according to the actual communication protocol of the electronic device 100. For example, the communication protocol can be USAT, I IC, SPI, 485 or CAN, etc.

[0034] In some embodiments, the first contact module 20 includes power supply contacts and communication contacts. When the first contact module 20 is in contact with the corresponding contacts in the second contact module of the external device through the power supply contacts and the communication contacts, the external device can communicate with the electronic device 100 through the communication contacts and supply power to the electronic device 100 through the power supply contacts.

[0035] The first end of the switch module 30 is coupled to the first end of the first contact module 20, and the second end of the switch module 30 is coupled to the traces on the mainboard 50 of the electronic device 100. In some embodiments, the switch units in the switch module 30 include at least one of a transistor and an analog switch. The transistor can be a MOS transistor, a triode, and other switching devices. The analog switch can be an audio analog switch such as SGM3718, and the analog switch can be a data transmission analog switch SGM3228. In some embodiments, the number of switch units in the switch module 30 is the same as the number of contacts in the first contact module 20, so that each switch unit can correspond to a contact setting for controlling the pass of the contact.

[0036] The control chip 40 is disposed on the mainboard 50, coupled to the magnetic induction assembly 10, and coupled to the control end of the switch module 30.

[0037] In some embodiments, when the magnetic induction assembly 10 does not sense the magnetism of the external device, the control chip 40 controls the switch module 30 to be in an open state, cutting off the pass of the contacts and the internal circuit of the mainboard 50.

[0038] In some embodiments, when the magnetic induction assembly 10 senses the magnetism of the external device, a first induction signal is generated, and the control chip 40 controls the switch module 30 to be in a closed state according to the first induction signal, conducting the pass of the contacts and the internal circuit of the mainboard 50, so that the electronic device 100 communicates with and / or powers on the external device.

[0039] In the embodiment, the magnetic induction assembly 10 and the switch module 30 are arranged in the electronic device 100, and the control chip 40 controls the switch module 30 to open or close according to the induction signal of the magnetic induction assembly 10, to control the conduction or interruption of the path between the first contact module 20 and the mainboard 50. When the external device is connected to the electronic device 100 through the first contact module, the control chip 40 controls the switch module 30 to close according to the induction signal, to connect the external device through the first contact module and the mainboard 50 of the electronic device 100, and to work normally. When the external device is not connected to the electronic device 100, the magnetic induction assembly 10 does not induce the magnetism of the external device, the control chip 40 controls the switch module 30 to be in an open state, and the static electricity is released to the inside of the electronic device 100 through the first contact module 20. At this time, the switch module 30 is in an open state, and the static electricity has no release loop path. At this time, the circuit of the electronic device 100 is safe, and the risk of static electricity of the electronic device 100 can be effectively reduced. The electronic device 100 provided by the application can also prevent the abnormal contact caused by the connection of the non-matching external device, to cause the risk of short circuit and burnout of the large power and large current.

[0040] Referring to Figure 2 , Figure 2 is a flowchart of another embodiment of the electronic device 100 provided by the application. The electronic device 100 comprises a magnetic induction assembly 10, a first contact module 20, a switch module 30, a control chip 40 and a shell 60.

[0041] The electronic device 100 further comprises the shell 60, the first contact module 20 is arranged on the shell 60, and the mainboard 50 is arranged in the shell 60.

[0042] The remaining connection relationship and working logic can refer to other embodiments, which will not be described here.

[0043] In other embodiments, the magnetic induction assembly 10 can be arranged on the shell 60.

[0044] In other embodiments, the magnetic induction assembly 10 can be attached to the inside of the shell 60. The thickness of the shell 60 is less than the magnetic field induction diameter of the magnetic induction assembly 10. Therefore, even if the magnetic induction assembly 10 is attached to the inside of the shell 60, the magnetic field induction can be performed.

[0045] Referring to Figure 3 , Figure 3 is a flowchart of another embodiment of the electronic device 100 provided by the application. The electronic device 100 comprises a magnetic induction assembly 10, a first contact module 20, a switch module 30 and a control chip 40.

[0046] The magnetic induction assembly 10 is used to induce the magnetism of the external device to generate an induction signal. The magnetic induction assembly 10 comprises a Hall element.

[0047] The first contact module 20 is used to contact the second contact module of the external device.

[0048] In some embodiments, the magnetic induction assembly 10 comprises a main magnetic induction unit 11 and a plurality of slave magnetic induction units 12.

[0049] The main magnetic induction unit 11 is arranged away from the first contact module 20. The plurality of slave magnetic induction units 12 are arranged one-to-one corresponding to the contacts in the first contact module 20.

[0050] The first end of the switch module 30 is coupled to the first end of the first contact module 20, and the second end of the switch module 30 is coupled to the wiring on the mainboard 50 of the electronic device 100.

[0051] The control chip 40 is arranged on the mainboard 50, coupled to the magnetic induction assembly 10, and coupled to the control end of the switch module 30. That is, the control chip 40 is coupled to the main magnetic induction unit 11 and the plurality of slave magnetic induction units 12 respectively.

[0052] Wherein, when the main magnetic induction unit 11 and the plurality of slave magnetic induction units 12 do not sense the magnetism of the external device, the control chip 40 controls the switch module 30 to be in an open state.

[0053] When the main magnetic induction unit 11 senses the magnetism of the external device, the control chip 40 controls the switch module 30 to be in a closed state. That is, when the main magnetic induction unit 11 senses the magnetism of the external device, a main induction signal is generated, and the control chip 40 controls all switch units in the switch module 30 to be in a closed state according to the main induction signal. At this time, it can be indicated that the second contact module of the external device in contact with the electronic device 100 can perfectly adapt to the first contact module 20 of the electronic device 100, that is, the number of contacts in the second contact module of the external device is greater than or equal to the number of contacts in the first contact module 20 of the electronic device 100, and the positional relationship of the contacts can be one-to-one corresponding.

[0054] In combination with Figure 4 The following is described:

[0055] As Figure 4As shown, the first contact module 20 includes a first contact 21, a second contact 22, a third contact 23 and a fourth contact 24. The switch module 30 includes a first switch unit 31, a second switch unit 32, a third switch unit 33 and a fourth switch unit 34. The magnetic induction assembly 10 includes a main magnetic induction unit 11, a first slave magnetic induction unit 12a, a second slave magnetic induction unit 12b, a third slave magnetic induction unit 12c and a fourth slave magnetic induction unit 12d. The first slave magnetic induction unit 12a is arranged corresponding to the first contact 21, the second slave magnetic induction unit 12b is arranged corresponding to the second contact 22, the third slave magnetic induction unit 12c is arranged corresponding to the third contact 23, and the fourth slave magnetic induction unit 12d is arranged corresponding to the fourth contact 24. The main magnetic induction unit 11 is arranged away from the first contact module 20.

[0056] When the main magnetic induction unit 11 senses the magnetism of the external device, a main induction signal is generated, and the control chip 40 controls all the switch units in the switch module 30 to be in a closed state according to the main induction signal, and as shown, the first switch unit 31, the second switch unit 32, the third switch unit 33 and the fourth switch unit 34 are all in a closed state. Figure 4

[0057] When any slave magnetic induction unit 12 senses the magnetism of the external device, the control chip 40 controls the switch unit in the switch module 30 corresponding to the slave magnetic induction unit 12 to be in a closed state, so that the electronic device 100 can adapt to more external devices, and there is no need to close the switch units corresponding to the non-contact contacts, reducing the risk of static electricity caused by the non-contact contacts. That is, when any slave magnetic induction unit 12 senses the magnetism of the external device, a slave induction signal is generated, and the control chip 40 controls the corresponding switch unit in the switch module 30 to be in a closed state according to the slave induction signal. At this time, it can be indicated that the contact of the second contact 22 module of the external device in contact with the electronic device 100 is in contact with part of the first contact module 20 of the electronic device 100.

[0058] The above is described in combination with the following figures: Figure 5

[0059] As shown, the first contact module 20 includes a first contact 21, a second contact 22, a third contact 23 and a fourth contact 24. The switch module 30 includes a first switch unit 31, a second switch unit 32, a third switch unit 33 and a fourth switch unit 34. The magnetic induction assembly 10 includes a main magnetic induction unit 11, a first slave magnetic induction unit 12a, a second slave magnetic induction unit 12b, a third slave magnetic induction unit 12c and a fourth slave magnetic induction unit 12d. The first slave magnetic induction unit 12a is arranged corresponding to the first contact 21, the second slave magnetic induction unit 12b is arranged corresponding to the second contact 22, the third slave magnetic induction unit 12c is arranged corresponding to the third contact 23, and the fourth slave magnetic induction unit 12d is arranged corresponding to the fourth contact 24. The main magnetic induction unit 11 is arranged away from the first contact module 20. Figure 5 ​​As shown, the first contact module 20 includes a first contact 21, a second contact 22, a third contact 23 and a fourth contact 24. The switch module 30 includes a first switch unit 31, a second switch unit 32, a third switch unit 33 and a fourth switch unit 34. The magnetic induction assembly 10 includes a main magnetic induction unit 11, a first slave magnetic induction unit 12a, a second slave magnetic induction unit 12b, a third slave magnetic induction unit 12c and a fourth slave magnetic induction unit 12d. The first slave magnetic induction unit 12a is arranged corresponding to the first contact 21, the second slave magnetic induction unit 12b is arranged corresponding to the second contact 22, the third slave magnetic induction unit 12c is arranged corresponding to the third contact 23, and the fourth slave magnetic induction unit 12d is arranged corresponding to the fourth contact 24. The main magnetic induction unit 11 is arranged away from the first contact module 20.

[0060] When the first slave magnetic induction unit 12a senses the magnetism of the external device, a first slave induction signal is generated, and the control chip 40 controls the first switch unit 31 to be in a closed state according to the first slave induction signal. As shown, Figure 5 The first switch unit 31 is in a closed state, and the second switch unit 32, the third switch unit 33 and the fourth switch unit 34 are all in an open state.

[0061] The remaining connection relationship and working logic can refer to other embodiments, which will not be described here.

[0062] Referring to Figure 6 , Figure 6 is a flowchart of another embodiment of the external device provided by the present application. The external device 200 includes a magnetic assembly 201 and a second contact module 202. The second contact module 202 is used to contact the first contact module 20 of the electronic device 100. The magnetic assembly 201 is used to generate a magnetic field.

[0063] Among them, the electronic device 100 is the electronic device 100 of any one of the above embodiments.

[0064] Referring to Figure 7 , Figure 7 is a flowchart of an embodiment of the contact contact system provided by the present application. The contact contact system 1000 includes an electronic device 100 and an external device 200.

[0065] The electronic device 100 is the electronic device 100 of any one of the above embodiments, and the external device 200 is the external device 200 of any one of the above embodiments. The electronic device 100 and the external device 200 can be contacted through the corresponding contact module to realize power supply and data interaction.

[0066] In summary, the electronic device 100, the external device 200 and the contact system provided by the application are provided. The magnetic induction assembly 10 and the switch module 30 are arranged in the electronic device 100. The control chip 40 controls the switch module 30 to open or close according to the induction signal of the magnetic induction assembly 10, and controls the conduction or cut-off of the path between the first contact module 20 and the mainboard 50. When the external device 200 is connected to the electronic device 100 through the first contact module 20, the control chip 40 controls the switch module 30 to close according to the induction signal, so that the external device 200 is connected between the first contact 21 and the mainboard 50 of the electronic device 100, and normal work is performed. When the external device 200 is not connected to the electronic device 100, the magnetic induction assembly 10 does not induce the magnetism of the external device 200, the control chip 40 controls the switch module 30 to be in an open state, and the static electricity is released to the inside of the electronic device 100 through the first contact module 20. At this time, the switch module 30 is in an open state, and the static electricity has no release loop path. At this time, the circuit of the electronic device 100 is safe, and the static electricity risk of the electronic device 100 can be effectively reduced. The electronic device 100 of the application can also prevent the contact abnormality caused by the non-matching external device 200, and cause the risk of large power and large current short circuit and burnout.

[0067] In several embodiments provided in the application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of the modules or units is only a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0068] The integrated units in the above other embodiments, if realized in the form of software function units and sold or used as independent products, can be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the application essentially or the parts that make contributions to the prior art or the whole or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium, and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) or a processing circuit component (processor) to execute all or part of the steps of the methods described in the embodiments of the application. The foregoing storage medium includes a U disk, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk or an optical disk and various program code storage media.

[0069] The above merely describes the embodiments of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields, which is made according to the content of the present application specification and drawings, is also included in the patent protection scope of the present application.

Claims

1. An electronic device, characterized in that, The electronic device includes: Magnetic sensing component, used to sense the magnetism of external devices; The first contact module is used to contact the second contact module of the external device; A switch module, wherein a first end of the switch module is coupled to a first end of the first contact module, and a second end of the switch module is coupled to a trace on the motherboard of the electronic device; A control chip is mounted on the motherboard and coupled to the magnetic sensing component, as well as the control terminal coupled to the switch module; When the magnetic sensing component does not sense the magnetism of the external device, the control chip controls the switch module to be in the open state.

2. The electronic device according to claim 1, characterized in that, The electronic device also includes a housing, the first contact module is disposed on the housing, and the motherboard is disposed inside the housing.

3. The electronic device according to claim 1, characterized in that, The first contact module includes power supply contacts and / or communication contacts.

4. The electronic device according to claim 1, characterized in that, The magnetic sensing component includes a Hall element.

5. The electronic device according to claim 1, characterized in that, The number of switch units in the switch module is the same as the number of contacts in the first contact module.

6. The electronic device according to claim 5, characterized in that, The magnetic sensing component includes: The main magnetic sensing unit is positioned away from the first contact module; A plurality of magnetic sensing units are provided, and each of the plurality of magnetic sensing units is configured to correspond one-to-one with a contact in the first contact module.

7. The electronic device according to any one of claims 1-6, characterized in that, The switching unit in the switching module includes at least one of transistors and analog switches.

8. An external device, characterized in that, The external device includes: Magnetic components; The second contact module is used to contact the first contact module of the electronic device; wherein the electronic device is the electronic device as described in any one of claims 1-7.

9. A contact system, characterized in that, The contact system includes: an electronic device and an external device, wherein the electronic device is the electronic device as claimed in any one of claims 1-7, and the external device is the external device as claimed in claim 8.

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