Waterproof PCB circuit board

By installing a waterproof heat sink and desiccant box on the circuit board, the problem of poor heat dissipation of existing waterproof PCB circuit boards is solved, achieving an effective combination of waterproofing and heat dissipation, and improving the waterproof performance and heat dissipation efficiency of the circuit board.

CN224037640UActive Publication Date: 2026-03-24SUZHOU CITY HUILIHUA ELECTRON CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-13
Publication Date
2026-03-24

AI Technical Summary

Technical Problem

Existing waterproof PCB circuit boards have poor heat dissipation performance, as they can only conduct heat from the bottom and cannot quickly dissipate the upward-flowing heat, leading to heat accumulation.

Method used

A waterproof heat sink is installed on the circuit board, with chamfered beveled surfaces and a protective mesh cover to prevent moisture from entering. An internal desiccant box is provided to absorb moisture. Gas flow and heat dissipation are achieved through a flow cavity and a through-hole heat sink. The desiccant is easy to replace. A U-shaped assembly plate is inserted and fixed to the base, and a wiring cover facilitates wiring.

Benefits of technology

It improves the heat dissipation efficiency of the circuit board, prevents moisture from entering, enhances the waterproof effect, and facilitates desiccant replacement, further assisting in heat dissipation.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN224037640U_ABST
    Figure CN224037640U_ABST
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Abstract

The utility model discloses a waterproof PCB (printed circuit board), which relates to the technical field of circuit boards and comprises a base, a circuit board is mounted in an upper slot of the base, an assembly frame is mounted above the circuit board, a heat dissipation component is mounted above the assembly frame and comprises a waterproof heat dissipation cover, and the waterproof heat dissipation cover is mounted on the base. Chamfered inclined plane parts are arranged on the two sides of the waterproof heat dissipation cover, protective net covers are installed on the outer walls of the chamfered inclined plane parts, waterproof assemblies are installed on the two sides of the interior of the waterproof heat dissipation cover and are divided into an upper group and a lower group, and a channel allowing gas to flow is formed between the two groups of waterproof assemblies. The waterproof assembly comprises a drying agent placing box. The problems that an existing circuit board is waterproof through a cover body, so that the heat dissipation effect is poor, heat can only be conducted from the bottom, heat flowing upwards is difficult to discharge quickly, and heat in the circuit board is prone to being gathered are solved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field, concretely is a waterproof type PCB circuit board. BACKGROUND

[0002] Circuit board is also called ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board and the like, circuit board makes circuit miniaturization, intuition, plays an important role to the batch production and optimization of fixed circuit and electric appliance layout, so the main advantages of adopting circuit board are that wiring and assembly errors are greatly reduced, and automation level and production labor rate are improved;

[0003] Publication number: CN219499811U, named "a waterproof type PCB circuit board", including PCB circuit board, the left end and right end of PCB circuit board are equipped with mounting device, the lower end of mounting device is equipped with mounting seat, the lower end of mounting seat is equipped with mounting frame body, the lower part of left end and the lower part of right end of mounting frame body are equipped with fixing device, the left part of upper end and the right part of upper end of mounting frame body are equipped with protection device. The PCB circuit board in the mounting frame body is protected by the waterproof shell on the upper end of the protection device, which not only avoids being scratched by external sharp objects, but also prevents external water droplets from splashing on the PCB circuit board, thereby improving the use effect and service life of the PCB circuit board. The graphite heat sink at the lower end of the PCB circuit board has a unique grain orientation and uniformly conducts heat in two directions, thereby improving the heat dissipation performance of the PCB circuit board.

[0004] The above-mentioned existing waterproof circuit board is waterproof through the cover body, which results in poor heat dissipation effect, can only conduct from the bottom, and the upward flowing heat is difficult to quickly discharge, which easily causes heat accumulation inside the circuit board. Therefore, it does not meet the existing needs, and a waterproof type PCB circuit board is proposed. SUMMARY

[0005] The utility model aims at providing a waterproof type PCB circuit board to solve the problem of poor heat dissipation effect of the existing circuit board through the cover body, which results in poor heat dissipation effect, can only conduct from the bottom, and the upward flowing heat is difficult to quickly discharge, which easily causes heat accumulation inside the circuit board.

[0006] To achieve the above object, the utility model provides the following technical scheme: A waterproof PCB circuit board, include: base, the upper groove of base installs the circuit board, the upper portion of circuit board installs assembly frame, the upper portion of assembly frame installs heat dissipation component, heat dissipation component includes waterproof heat dissipation cover, both sides of waterproof heat dissipation cover are provided with chamfered inclined surface part, install the protective screen cover on the outer wall of chamfered inclined surface part, both sides in waterproof heat dissipation cover are installed waterproof component, waterproof component is divided into two groups, and the channel for gas flow is set up between two waterproof components, waterproof component includes drying agent placing box.

[0007] Preferably, the waterproof component further includes a sliding frame, and the drying agent placing box is slidingly connected to the sliding frame, one end of the drying agent placing box is provided with a pull block, and a plurality of holes are formed in the outer wall of the drying agent placing box.

[0008] Preferably, a flow-through cavity is formed in the lower bottom of the waterproof heat dissipation cover.

[0009] Preferably, the assembly frame includes a U-shaped assembly plate, and a through-hole heat dissipation plate is installed on the upper surface of the U-shaped assembly plate.

[0010] Preferably, a sliding plate is slidingly installed at the opening of the front end of the U-shaped assembly plate, and a handle is installed at one end of the sliding plate.

[0011] Preferably, a plurality of positioning clamping blocks are installed on the lower surface of the U-shaped assembly plate, a U-shaped assembly groove is formed in the periphery of the circuit board, and a positioning clamping groove matched with the positioning clamping blocks is formed in the interior of the U-shaped assembly groove.

[0012] Preferably, a wiring cover plate is installed at the rear end of the U-shaped assembly plate through bolts.

[0013] Compared with the prior art, the utility model has the advantages that:

[0014] (1) In the utility model, the waterproof heat dissipation cover is installed on the circuit board to achieve waterproof and heat dissipation. When heat dissipation, hot air enters the waterproof heat dissipation cover through the flow-through cavity and flows to both sides, and is discharged from the protective screen cover. The protective screen cover is installed on the chamfered inclined surface part, so that it is difficult for external water vapor to enter the interior. The drying agent placing box contains active carbon drying agent, silica gel drying agent and other hygroscopic drying materials. The water vapor in the gas is further adsorbed and reduced through the plurality of holes, thereby achieving the effect of waterproof. The drying agent placing box is located at the upper and lower ends, so that the gas needs to pass through the channel when entering and exiting, thereby improving the adsorption efficiency and effect.

[0015] (2) In the utility model, when it is necessary to replace the drying agent placing box, the pull block is pulled outward, so that the drying agent placing box slides outward on the sliding frame, thereby enabling the user to quickly replace the internal drying agent.

[0016] (3), the utility model discloses, U type assembly board is through the way of inserting and fitting and is installed into U type assembly groove, and when inserting, the position of positioning clamping block and positioning clamping groove is aligned, and the combination of U type assembly board and base between fixed is realized through the way of inserting and fitting clamping, when subsequent dismounting, it can be just through the way of pulling out upwards, and it is convenient for user to use, when needing further heat dissipation, can slide outwards to the outside through the slide of pull handle, and the side is provided with the heat dissipation opening, and the effect of further auxiliary heat dissipation is played. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is the whole structure schematic diagram of the utility model;

[0018] Figure 2 It is the base structure schematic diagram of the utility model;

[0019] Figure 3 It is the assembly frame structure schematic diagram of the utility model;

[0020] Figure 4 It is the heat dissipation subassembly structure schematic diagram of the utility model;

[0021] Figure 5 It is the waterproof subassembly structure schematic diagram of the utility model;

[0022] In the drawing: 1, base;101, circuit board;102, U type assembly groove;103, positioning clamping groove;2, assembly frame;201, U type assembly board;202, slide plate;203, handle;204, through-hole heat dissipation plate;205, positioning clamping block;206, wiring cover plate;3, heat dissipation subassembly;301, waterproof heat dissipation cover;302, flow-through cavity;303, chamfered inclined surface portion;304, protective net cover;4, waterproof subassembly;401, slide frame;402, desiccant placing box;403, hole;404, pull block. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0024] Please refer to Figures 1-5The utility model provides an embodiment: a waterproof type PCB circuit board, include: base 1, install circuit board 101 in the upper groove of base 1, install assembly frame 2 on the top of circuit board 101, install heat dissipation assembly 3 on the top of assembly frame 2, heat dissipation assembly 3 includes waterproof heat dissipation cover 301, both sides of waterproof heat dissipation cover 301 are provided with chamfered inclined surface part 303, install protective screen 304 on the outer wall of chamfered inclined surface part 303, the lower bottom of waterproof heat dissipation cover 301 is provided with flow cavity 302,

[0025] It is waterproof and radiates heat by installing waterproof heat dissipation cover 301 on circuit board 101, when radiating heat, hot air enters waterproof heat dissipation cover 301 through flow cavity 302 upwards and flows to both sides, and is discharged from protective screen 304, and protective screen 304 is installed on chamfered inclined surface part 303, so that external water vapor is difficult to enter the inside,

[0026] Among them, both sides of waterproof heat dissipation cover 301 inside are installed waterproof assembly 4, waterproof assembly 4 is divided into two groups, and a channel for gas flow is formed between the two groups of waterproof assembly 4, waterproof assembly 4 includes desiccant placing box 402, waterproof assembly 4 further includes sliding frame 401, and the desiccant placing box 402 is slidably connected to the sliding frame 401, one end of the desiccant placing box 402 is provided with a pull block 404, and a plurality of holes 403 are formed in the outer wall of the desiccant placing box 402.

[0027] Desiccant placing box 402 is placed with active carbon desiccant, silica gel desiccant and other hygroscopic drying materials, the water vapor in the gas is further adsorbed and reduced through a plurality of holes 403, and the effect of waterproof is achieved, the desiccant placing box 402 is located at the upper and lower ends, so that the gas needs to pass through the channel when entering and exiting, thereby improving the adsorption efficiency and effect; when replacing, the pull block 404 can be pulled outward, so that the desiccant placing box 402 slides outward on the sliding frame 401, thereby enabling the user to quickly replace the internal desiccant.

[0028] Please refer to Figure 2 、 Figure 3 , assembly frame 2 includes U-shaped assembly plate 201, the upper surface of U-shaped assembly plate 201 is provided with through-hole heat dissipation plate 204, the opening of the front end of U-shaped assembly plate 201 is slidably provided with sliding plate 202, one end of sliding plate 202 is provided with handle 203, the lower surface of U-shaped assembly plate 201 is provided with a plurality of positioning clamping blocks 205, the periphery of circuit board 101 is provided with U-shaped assembly groove 102, the inside of U-shaped assembly groove 102 is provided with positioning clamping groove 103 matched with positioning clamping block 205, and the rear end of U-shaped assembly plate 201 is provided with wiring cover plate 206 through bolts;

[0029] Through the setting of the through-hole heat dissipation plate 204, large impurities can be blocked, and the through-hole heat dissipation plate 204 is in communication with the flow cavity 302, so that the gas can enter and exit; the U-shaped assembly plate 201 is inserted into the U-shaped assembly groove 102 in a plug-in manner, and when the U-shaped assembly plate 201 is inserted, the positioning clamping block 205 is aligned with the position of the positioning clamping groove 103, the combination and fixation between the U-shaped assembly plate 201 and the base 1 are realized in a plug-in clamping manner, and when the U-shaped assembly plate 201 is subsequently disassembled, the U-shaped assembly plate 201 can be pulled out upward, so that the user can use conveniently; the setting of the wiring cover plate 206 is convenient for wiring operation between the circuit board 101 and other components.

[0030] When further heat dissipation is needed, the slide plate 202 can be pulled outwards by the handle 203, so that the side is provided with a heat dissipation opening, and the effect of further auxiliary heat dissipation is achieved.

[0031] It is obvious for those skilled in the art that the utility model is not limited to the details of the above-mentioned exemplary embodiments, and the utility model can be realized in other specific forms without departing from the spirit or basic characteristics of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-limiting, the scope of the utility model is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the utility model. Any reference signs in the claims should not be regarded as limiting the claims.

Claims

1. A waterproof PCB circuit board, comprising a base (1), a circuit board (101) is installed in the upper slot of the base (1), characterized in that: The circuit board (101) is installed above the assembly frame (2), the assembly frame (2) is installed above the heat dissipation assembly (3), the heat dissipation assembly (3) comprises a waterproof heat dissipation cover (301), both sides of the waterproof heat dissipation cover (301) are provided with chamfered inclined parts (303), the outer wall of the chamfered inclined parts (303) is installed with a protective mesh cover (304), both sides of the waterproof heat dissipation cover (301) are installed with waterproof assemblies (4), the waterproof assemblies (4) are divided into two groups, a channel for gas flow is formed between the two groups of waterproof assemblies (4), and the waterproof assemblies (4) comprise desiccant placing boxes (402).

2. The waterproof PCB circuit board according to claim 1, wherein: The waterproof assembly (4) further comprises a sliding frame (401), and the desiccant placing box (402) is slidably connected to the sliding frame (401), one end of the desiccant placing box (402) is installed with a pull block (404), and a plurality of holes (403) are formed in the outer wall of the desiccant placing box (402).

3. The waterproof PCB circuit board of claim 1, wherein: A flow-through cavity (302) is formed in the lower bottom of the waterproof heat dissipation cover (301).

4. The waterproof PCB circuit board of claim 1, wherein: The assembly frame (2) comprises a U-shaped assembly plate (201), and a through-hole heat dissipation plate (204) is installed on the upper surface of the U-shaped assembly plate (201).

5. The waterproof PCB circuit board of claim 4, wherein: A sliding plate (202) is slidably installed at the opening of the front end of the U-shaped assembly plate (201), and a handle (203) is installed at one end of the sliding plate (202).

6. The waterproof PCB circuit board of claim 4, wherein: A plurality of positioning clamping blocks (205) are installed on the lower surface of the U-shaped assembly plate (201), a U-shaped assembly groove (102) is formed in the periphery of the circuit board (101), and a positioning clamping groove (103) matched with the positioning clamping blocks (205) is formed in the U-shaped assembly groove (102).

7. The waterproof PCB circuit board of claim 4, wherein: A wiring cover plate (206) is installed at the rear end of the U-shaped assembly plate (201) through bolts.

Citation Information

Patent Citations

  • Waterproof PCB circuit board

    CN219499811U