Liquid-cooled heat dissipation system

Abstract

The utility model provides a liquid-cooled heat dissipation system which is suitable for heat dissipation of an electronic device. The liquid-cooled heat dissipation system comprises a liquid-cooled heat dissipation device, and the liquid-cooled heat dissipation device comprises a heat dissipation groove, a distribution module located in the heat dissipation groove and a pipeline module communicated with the distribution module. The pipeline module is provided with a first heat dissipation pipe unit and a second heat dissipation pipe unit. The distribution module is communicated with a water inlet pipe of the heat dissipation groove, so that liquid directly flows into the distribution module from the water inlet pipe and flows to the pipeline module, and a first high-heat electronic module and a second high-heat electronic module of the electronic device respectively correspond to the first heat dissipation pipe unit and the second heat dissipation pipe unit. Cold liquid directly flows into the heat dissipation groove from the water inlet pipe and synchronously flows into the distribution module to flow to the pipeline module, and the first heat dissipation pipe unit and the second heat dissipation pipe unit directly conduct heat dissipation on the first high-heat electronic module and the second high-heat electronic module respectively.

Description

TECHNICAL FIELD

[0001] The utility model relates to a radiator, in particular to a liquid cooling type radiator system. BACKGROUND

[0002] In recent years, with the increasing demand for heat dissipation of electronic products, the main board module or server is directly immersed in a non-conductive liquid to transfer the heat generated by the electronic device to the liquid for more effective heat dissipation. However, with the increasing demand for high-power of high-heat electronic components (such as CPU, GPU or DIMM) on the main board, high temperature is generated during operation. Although the electronic device is completely immersed in the liquid, it can absorb and remove heat through the liquid, but it cannot further dissipate heat for the high-heat electronic components on the main board, and the high-heat electronic components may overheat due to ineffective and timely heat dissipation, resulting in poor heat dissipation efficiency. It is indeed worth careful study and improvement by practitioners. SUMMARY

[0003] Therefore, the purpose of the utility model is to provide a liquid cooling type radiator system with good heat dissipation efficiency.

[0004] Therefore, the utility model of a liquid cooling type radiator system is suitable for an electronic device. The electronic device includes a main board, a first high-heat electronic module disposed on the main board, and a second high-heat electronic module disposed on the main board. The liquid cooling type radiator system includes a liquid cooling radiator for dissipating heat from the electronic device, a condenser module, and a heat dissipation module for dissipating heat from the condenser module.

[0005] The liquid cooling heat sink device includes a heat sink tank, a distribution module located in the heat sink tank, and a pipe module located in the heat sink tank and connected to the distribution module. The heat sink tank has a tank body and a water inlet pipe penetrating the tank body and allowing external non-conductive liquid to flow into the tank body. The tank body is divided into a liquid zone and a non-liquid zone above the liquid zone. The distribution module and the pipe module are located in the liquid zone of the tank body. The distribution module is connected to the water inlet pipe. The pipe module has a first heat dissipation pipe unit connected to the distribution module and a second heat dissipation pipe unit connected to the distribution module. The electronic device is placed in the liquid zone of the tank body such that the first high-heat electronic module corresponds to the first heat dissipation pipe unit and the second high-heat electronic module corresponds to the second heat dissipation pipe unit. Cold liquid flows directly from the water inlet pipe into the tank body and synchronously flows into the distribution module to the first heat dissipation pipe unit and the second heat dissipation pipe unit of the pipe module, and cold liquid is located in the liquid zone of the tank body and the first heat dissipation pipe unit of the pipe module directly dissipates heat to the first high-heat electronic module and the second heat dissipation pipe unit directly dissipates heat to the second high-heat electronic module.

[0006] The condenser module is located in the tank body of the heat sink tank and in the non-liquid zone of the tank body. The liquid in the liquid zone boils to produce steam that rises to the non-liquid zone and contacts the condenser module to dissipate heat, then cools and condenses into liquid and drips back into the liquid in the liquid zone. The heat dissipation module is located outside the heat sink tank and penetrates the tank body of the heat sink tank to connect the condenser module.

[0007] Preferably, the condenser module includes a cooling coil unit, the heat dissipation module includes a cold water pipe penetrating the tank body of the heat sink tank and connected to the cooling coil unit, a hot water pipe penetrating the tank body and connected to the cooling coil unit, and a heat dissipation unit connected to the cold water pipe and the hot water pipe, cold water flows from the cold water pipe into the cooling coil unit to absorb heat, and hot water generated by flowing through the cooling coil unit flows back to the heat dissipation unit to cool and become cold water and then flows into the cooling coil unit.

[0008] Preferably, cold liquid flows directly from the water inlet pipe of the heat sink tank into the distribution module and to the pipe module, and cold liquid of the first heat dissipation pipe unit of the pipe module flows directly out to dissipate heat to the corresponding first high-heat electronic module and cold liquid in the second heat dissipation pipe unit flows directly out to dissipate heat to the corresponding second high-heat electronic module.

[0009] Preferably, the liquid cooling heat dissipation device further comprises a cooling module connected to the inlet pipe of the heat sink, the heat sink further has an outlet pipe penetrating the tank body and connecting the tank body and the cooling module, the inlet pipe of the heat sink connects the tank body and the cooling module, the hot liquid produced by the liquid in the tank body absorbing the heat energy of the electronic device flows out of the outlet pipe to the cooling module to be cooled into cold liquid, and the cooling module causes the cold liquid to flow into the tank body from the inlet pipe.

[0010] Preferably, the first high-heat electronic module of the electronic device has a first high-heat electronic unit arranged on the mainboard, the second high-heat electronic module has a plurality of second high-heat electronic units arranged on the mainboard, wherein the first heat pipe unit of the pipe module of the liquid cooling heat dissipation device has a first heat pipe extending from the distribution module to the first high-heat electronic module and corresponding to the first high-heat electronic unit, the first heat pipe has a first port aligned with the first high-heat electronic module, and the second heat pipe unit has a plurality of second heat pipes respectively extending from the distribution module to the second high-heat electronic units and respectively corresponding to the second high-heat electronic units, each second heat pipe has a second port aligned with the corresponding second high-heat electronic module, the cold liquid directly flows into the tank body from the inlet pipe and simultaneously flows into the distribution module to the first heat pipe and the second heat pipes of the pipe module, the cold liquid in the first heat pipe directly flows from the first port to the corresponding first high-heat electronic module to directly dissipate heat for the first high-heat electronic unit, and the cold liquid in the second heat pipes respectively directly flows from the corresponding second ports to the corresponding second high-heat electronic modules to directly dissipate heat for the corresponding second high-heat electronic modules.

[0011] Preferably, the inlet pipe of the heat sink has a first inlet connected to the tank body and a second inlet connected to the distribution module, the cold liquid directly flows into the tank body from the first inlet of the inlet pipe and simultaneously directly flows into the distribution module from the second inlet to the first heat pipe and the second heat pipes of the pipe module.

[0012] Preferably, the distribution module of the liquid cooling heat dissipation device has a liquid collecting tank connected to the second inlet of the inlet pipe of the heat sink, the first heat pipe of the first heat pipe unit of the pipe module is arranged on and connected to the liquid collecting tank and extends from the liquid collecting tank to the first high-heat electronic unit, and each second heat pipe of the second heat pipe unit is arranged on and connected to the liquid collecting tank and extends from the liquid collecting tank to the second high-heat electronic unit.

[0013] Preferably, the first port of the first heat pipe of the first heat pipe unit of the liquid cooling heat dissipation device is close to the corresponding first high heat electronic unit and the cold liquid flowing out of the first port directly flows to the first high heat electronic unit, and the second port of each second heat pipe of the second heat pipe unit is close to the corresponding second high heat electronic unit and the cold liquid flowing out of the second port directly flows to the second high heat electronic unit.

[0014] Preferably, the cooling module of the liquid cooling heat dissipation device has a pump connected to the water inlet, and the pump is used to deliver cold liquid to the water inlet pipe to flow into the tank.

[0015] Preferably, the first water inlet of the water inlet pipe of the heat dissipation tank is larger than the second water inlet, the first high heat electronic unit of the first high heat electronic module of the electronic device is a high-efficiency processing unit, and each second high heat electronic unit of the second high heat electronic module is a memory unit.

[0016] The utility model discloses the efficacy is in: the design that liquid directly flows into the distribution module from the water inlet pipe and flows to the pipeline module by the distribution module communication the water inlet pipe of this, and cooperate the first heat pipe unit of the first high heat electronic module of the electronic device with the second heat pipe unit of the second high heat electronic module, and the ingenuity is that the cold liquid directly flows into the tank and synchronously flows into the distribution module from the water inlet pipe and flows to the pipeline module, and the liquid area of cold liquid in the tank and the first heat pipe unit of the pipeline module directly aiming at the first high heat electronic module and the second heat pipe unit directly aiming at the second high heat electronic module for heat dissipation, effectively achieve increasing the cold liquid directly aiming at the first high heat electronic module and the second high heat electronic module for heat dissipation from the water inlet pipe, and the overall heat dissipation efficiency is greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] The other features and effects of the utility model will be clearly presented in the embodiments with reference to the drawings, wherein:

[0018] Figure 1 It is a block diagram, and the embodiment of the liquid cooling heat dissipation system of the utility model is explained. DETAILED DESCRIPTION

[0019] Before the utility model is described in detail, it should be noted that in the following description, similar elements are indicated by the same number.

[0020] Reference Figure 1The utility model discloses a liquid cooling heat dissipation system, suitable for an electronic device 90. The electronic device 90 includes a mainboard 91, a first high-heat electronic module 92 disposed on the mainboard 91, and a second high-heat electronic module 93 disposed on the mainboard 91. The liquid cooling heat dissipation system includes a liquid cooling heat dissipation device 1 for dissipating heat from the electronic device 90, a condenser module 5, and a heat dissipation fin module 6 for dissipating heat from the condenser module 5.

[0021] The liquid cooling heat dissipation device 1 includes a heat dissipation groove 2, a distribution module 3 located in the heat dissipation groove 2, and a pipeline module 4 located in the heat dissipation groove 2 and connected to the distribution module 3. The heat dissipation groove 2 has a groove body 21 and a water inlet pipe 22 passing through the groove body 21 and allowing external non-conductive liquid to flow into the groove body 21. The groove body 21 is divided into a liquid area 211 and a non-liquid area 212 located above the liquid area 211. The distribution module 3 and the pipeline module 4 are located in the liquid area 211 of the groove body 21. The distribution module 3 is connected to the water inlet pipe 22. The pipeline module 4 has a first heat dissipation pipe unit 41 connected to the distribution module 3 and a second heat dissipation pipe unit 42 connected to the distribution module 3. The electronic device 90 is placed in the liquid area 211 of the groove body 21 such that the first high-heat electronic module 92 corresponds to the first heat dissipation pipe unit 41 and the second high-heat electronic module 93 corresponds to the second heat dissipation pipe unit 42. Cold liquid flows directly from the water inlet pipe 22 into the groove body 21 and synchronously flows into the distribution module 3 to the first heat dissipation pipe unit 41 and the second heat dissipation pipe unit 42 of the pipeline module 4, and the cold liquid is located in the liquid area 211 of the groove body 21 and the first heat dissipation pipe unit 41 of the pipeline module 4 directly dissipates heat to the first high-heat electronic module 92 and the second heat dissipation pipe unit 42 directly dissipates heat to the second high-heat electronic module 93.

[0022] The condenser module 5 is disposed in the groove body 21 of the heat dissipation groove 2 and located in the non-liquid area 212 of the groove body 21. The liquid in the liquid area 211 boils due to heat absorption, and the generated vapor rises to the non-liquid area 212 and contacts the condenser module 5 to dissipate heat, then cools and condenses into liquid and drips back into the liquid area 211. The heat dissipation fin module 6 is located outside the heat dissipation groove 2 and connects the condenser module 5 by passing through the groove body 21 of the heat dissipation groove 2.

[0023] When in use, the cold liquid flows from the inlet pipe 22 into the tank 21 and simultaneously flows into the distribution module 3 to reach the pipeline module 4, and the cold liquid in the liquid area 211 of the tank 21 is used to directly cool the first high-heat electronic module 92 through the first heat dissipation pipe unit 41 of the pipeline module 4 and the second high-heat electronic module 93 through the second heat dissipation pipe unit 42. That is, in the present embodiment, the cold liquid flows from the inlet pipe 22 of the heat dissipation tank 2 into the distribution module 3 to reach the pipeline module 4, and the cold liquid in the first heat dissipation pipe unit 41 of the pipeline module 4 is directly used to cool the corresponding first high-heat electronic module 92 and the cold liquid in the second heat dissipation pipe unit 42 is directly used to cool the corresponding second high-heat electronic module 93, so that the cold liquid flowing from the inlet pipe 22 can be directly used to cool the first high-heat electronic module 92 and the second high-heat electronic module 93 which need to be cooled, thereby effectively cooling the first high-heat electronic module 92 and the second high-heat electronic module 93 and greatly improving the cooling efficiency of the first high-heat electronic module 92 and the second high-heat electronic module 93. Furthermore, the liquid flowing out of the first heat dissipation pipe unit 41 of the pipeline module 4 and the liquid flowing out of the second heat dissipation pipe unit 42 will disturb the fluid in the liquid area 211 of the tank 21, increase the heat convection coefficient, improve the overall cooling efficiency and optimize the flow field.

[0024] Further, in the present embodiment, the liquid cooling heat dissipation device 1 further comprises a cooling module 7 located outside the heat dissipation tank 2 and connected to the inlet pipe 22 of the heat dissipation tank 2. The heat dissipation tank 2 further has an outlet pipe 23 passing through the tank 21 and communicating the tank 21 with the cooling module 7. The inlet pipe 22 of the heat dissipation tank 2 communicates the tank 21 with the cooling module 7. The hot liquid produced by the liquid in the tank 21 absorbing the heat energy of the electronic device 90 will flow out of the outlet pipe 23 to the cooling module 7 to be cooled into cold liquid, and the cooling module 7 makes the cold liquid flow from the inlet pipe 22 into the tank 21, but not limited thereto.

[0025] The design of the distribution module 3 being connected to the water inlet pipe 22 so that liquid flows from the water inlet pipe 22 directly into the distribution module 3 and then to the pipeline module 4, and the clever design of the first high-heat electronic module 92 of the electronic device 90 corresponding to the first heat dissipation pipe unit 41 of the pipeline module 4 and the second high-heat electronic module 93 corresponding to the second heat dissipation pipe unit 42, so that cold liquid flows from the water inlet pipe 22 directly into the tank 21 and synchronously flows into the distribution module 3 and then to the pipeline module 4, and the cold liquid in the liquid area 211 in the tank 21 and the first heat dissipation pipe unit 41 of the pipeline module 4 directly dissipating heat to the first high-heat electronic module 92 and the second heat dissipation pipe unit 42 directly dissipating heat to the second high-heat electronic module 93, effectively achieve increasing the cold liquid flowing from the water inlet pipe 22 directly dissipating heat to the first high-heat electronic module 92 and the second high-heat electronic module 93, greatly improving the overall heat dissipation efficiency.

[0026] Here, it is to be noted that in the present embodiment, the condenser module 5 includes a cooling coil unit 51. The heat dissipation row module 6 includes a cold water pipe 61 passing through the tank 21 of the heat dissipation groove 2 and connected to the cooling coil unit 51, a hot water pipe 62 passing through the tank 21 and connected to the cooling coil unit 51, and a heat dissipation row unit 63 connected to the cold water pipe 61 and the hot water pipe 62. Cold water flows from the cold water pipe 61 into the cooling coil unit 51 to absorb heat, and the hot water generated by flowing through the cooling coil unit 51 flows back to the heat dissipation row unit 63 to be cooled into cold water and then flows into the cooling coil unit 51. That is, the cooling coil unit 51 of the condenser module 5 in the non-liquid area 212 absorbs the heat energy of the vapor generated by the liquid in the liquid area 211 boiling due to heat absorption, so that the hot water in the cooling coil unit 51 flows from the hot water pipe 62 to the heat dissipation row unit 63 to be cooled into cold water and then flows into the cooling coil unit 51 to be recycled for heat dissipation, but not limited thereto.

[0027] In this embodiment, the first high heat electronic module 92 of the electronic device 90 has a first high heat electronic unit 921 disposed on the mainboard 91, and the second high heat electronic module 93 has a plurality of second high heat electronic units 931 disposed on the mainboard 91. The first heat dissipation pipe unit 41 of the pipe module 4 of the liquid cooling heat dissipation device 1 has a first heat dissipation pipe 411 extending from the distribution module 3 to the first high heat electronic module 92 and corresponding to the first high heat electronic unit 921. The first heat dissipation pipe 411 has a first port 412 aligned with the first high heat electronic module 92. The second heat dissipation pipe unit 42 has a plurality of second heat dissipation pipes 421 extending from the distribution module 3 to the second high heat electronic units 931 and corresponding to the second high heat electronic units 931, respectively. Each second heat dissipation pipe 421 has a second port 422 aligned with the corresponding second high heat electronic module 93. The cold liquid flows directly from the water inlet pipe 22 into the tank 21 and simultaneously flows into the distribution module 3 to the first heat dissipation pipe 411 and the second heat dissipation pipes 421 of the pipe module 4, and the cold liquid in the first heat dissipation pipe 411 directly flows from the first port 412 to the corresponding first high heat electronic module 92 to directly dissipate heat to the first high heat electronic unit 921, and the cold liquid in the second heat dissipation pipes 421 directly flows from the corresponding second ports 422 to the corresponding second high heat electronic modules 93 to directly dissipate heat to the corresponding second high heat electronic modules 93, respectively, so as to dissipate heat to the first high heat electronic unit 921 by the first heat dissipation pipe 411 and to the second high heat electronic units 931 by the second heat dissipation pipes 421, respectively. In short, the cold liquid flows directly from the water inlet pipe 22 into the tank 21 and simultaneously flows into the distribution module 3 to the first heat dissipation pipe 411 and the second heat dissipation pipes 421 of the pipe module 4, and the cold liquid in the first heat dissipation pipe 411 directly flows from the first port 412 to the corresponding first high heat electronic unit 921 to greatly reduce the temperature of the liquid near the first high heat electronic unit 921 to effectively directly cool the first high heat electronic unit 921, and the cold liquid in the second heat dissipation pipes 421 directly flows from the corresponding second ports 422 to the corresponding second high heat electronic units 931 to greatly reduce the temperature of the liquid near the second high heat electronic units 931 to effectively directly cool the second high heat electronic units 931, respectively, but not limited thereto. Furthermore, the cold liquid flowing from the first port 412 of the first heat dissipation pipe 411 and the second ports 422 of the second heat dissipation pipes 421 mixes with the liquid in the tank 21 to generate disturbance to the liquid in the tank 21, thereby improving the overall heat dissipation efficiency and optimizing the flow field.

[0028] Further, it is further explained that, in the present embodiment, the water inlet pipe 22 of the heat sink 2 has a first water inlet opening 221 communicating with the tank body 21, and a second water inlet opening 222 communicating with the distribution module 3. The cold liquid directly flows into the tank body 21 from the first water inlet opening 221 of the water inlet pipe 22, and simultaneously directly flows into the distribution module 3 from the second water inlet opening 222, and then flows to the first heat pipe 411 and the second heat pipe 421 of the pipeline module 4. In short, through the design of the first water inlet opening 221 and the second water inlet opening 222 of the water inlet pipe 22 of the heat sink 2, the cold liquid directly flows into the tank body 21 from the first water inlet opening 221 of the water inlet pipe 22, and simultaneously directly flows into the distribution module 3 from the second water inlet opening 222, and then flows to the first heat pipe 411 and the second heat pipe 421 of the pipeline module 4, but not limited thereto. It is particularly pointed out that, in the present embodiment, the first water inlet opening 221 of the water inlet pipe 22 of the heat sink 2 is larger than the second water inlet opening 222, the first high-heat electronic unit 921 of the first high-heat electronic module 92 of the electronic device 90 is in the form of a high-efficiency processing unit, and each second high-heat electronic unit 931 of the second high-heat electronic module 93 is in the form of a memory unit, but not limited thereto.

[0029] In addition, in the present embodiment, the distribution module 3 of the liquid cooling heat dissipation device 1 has a sump 31 connected to the second water inlet 222 of the water inlet pipe 22 of the heat dissipation tank 2. The first heat dissipation pipe 411 of the first heat dissipation pipe unit 41 of the pipe module 4 is disposed on and connected to the sump 31 and extends from the sump 31 to the first high heat electronic unit 921. Each second heat dissipation pipe 421 of the second heat dissipation pipe unit 42 is disposed on and connected to the sump 31 and extends from the sump 31 to the second high heat electronic unit 931, but not limited thereto. In addition, in the present embodiment, the cooling module 7 of the liquid cooling heat dissipation device 1 has a pump 71 connected to the water inlet. The pump 71 is used to deliver cold liquid to the water inlet pipe 22 and flow into the tank body 21, and through the cold liquid flowing directly from the water inlet pipe 22 into the tank body 21 and synchronously flowing into the distribution module 3 to the first heat dissipation pipe 411 and the second heat dissipation pipe 421 of the pipe module 4, and the cold liquid in the first heat dissipation pipe 411 directly flows out from the first port 412 to the corresponding first high heat electronic module 92, greatly reducing the liquid temperature near the first high heat electronic module 92 and effectively directly cooling the first high heat electronic module 92, and the cold liquid in the second heat dissipation pipe 421 directly flows from the corresponding second port 422 to the corresponding second high heat electronic module 93, greatly reducing the liquid temperature near the corresponding second high heat electronic module 93 and effectively directly cooling the corresponding second high heat electronic module 93, greatly improving the overall heat dissipation efficiency, and the cold liquid flowing out from the first port 412 of the first heat dissipation pipe 411 and the second port 422 of the second heat dissipation pipe 421 mixes with the liquid in the tank body 21 and causes disturbance to the liquid in the tank body 21, improving the overall heat dissipation efficiency and optimizing the flow field, so that the pump 71 can be reduced to appropriate power and the use power of the pump 71 is reduced, effectively improving the problem that the pump 71 needs to be maintained at high power and continuously output cold liquid with high energy to cope with the problem that the electronic device 90 is simply completely immersed in liquid and cannot further effectively dissipate heat from the high heat electronic element.

[0030] In summary, the liquid cooling heat dissipation system, by the distribution module 3 communication inlet pipe 22 and make liquid from the inlet pipe 22 directly into the distribution module 3 and flow to the pipeline module 4 design, and cooperate with the first high heat electronic module 92 of the electronic device 90 corresponding to the first heat dissipation pipe unit 41 of the pipeline module 4 and the second high heat electronic module 93 corresponding to the second heat dissipation pipe unit 42, the ingenious idea of, make cold liquid from the inlet pipe 22 directly into the groove 21 and synchronous flow into the distribution module 3 and flow to the pipeline module 4, and make the liquid zone 211 in the groove 21 of cold liquid and make the first heat dissipation pipe unit 41 of the pipeline module 4 directly for the first high heat electronic module 92 heat dissipation and make the second heat dissipation pipe unit 42 directly for the second high heat electronic module 93 heat dissipation, effectively achieve increase from the inlet pipe 22 flow into the cold liquid directly for the first high heat electronic module 92 and the second high heat electronic module 93 heat dissipation, greatly improve the overall heat dissipation efficiency. But the above, only for the embodiment of the utility model, when cannot be limited by this to limit the scope of the utility model, any simple equivalent change and modification according to the utility model patent application scope and patent specification content, still belong to the scope of the utility model patent covered.

Claims

1. A liquid-cooled heat dissipation system suitable for an electronic device, the electronic device comprising a motherboard, a first high-heat electronic module disposed on the motherboard, and a second high-heat electronic module disposed on the motherboard, characterized in that, The liquid cooling system comprises: A liquid cooling device for cooling the electronic device, comprising a cooling tank, a distribution module in the cooling tank, and a pipeline module in the cooling tank and connected to the distribution module, the cooling tank has a tank body, and a water inlet pipe penetrating the tank body and allowing external non-conductive liquid to enter the tank body, the tank body has a liquid area and a non-liquid area above the liquid area, the distribution module and the pipeline module are located in the liquid area of the tank body, the distribution module is connected to the water inlet pipe, the pipeline module has a first cooling pipe unit connected to the distribution module and a second cooling pipe unit connected to the distribution module, the electronic device is placed in the liquid area of the tank body, the first high-heat electronic module corresponds to the first cooling pipe unit, and the second high-heat electronic module corresponds to the second cooling pipe unit, cold liquid directly flows from the water inlet pipe into the tank body and synchronously flows into the distribution module to the first cooling pipe unit and the second cooling pipe unit of the pipeline module, and cold liquid is located in the liquid area of the tank body and the first cooling pipe unit of the pipeline module directly cools the first high-heat electronic module and the second cooling pipe unit directly cools the second high-heat electronic module; A condenser module arranged in the tank body of the cooling tank and located in the non-liquid area of the tank body, the liquid in the liquid area absorbs heat to produce steam that rises to the non-liquid area and contacts the condenser module to dissipate heat, and then condenses into liquid and drips back into the liquid area; and A heat dissipation module located outside the cooling tank and penetrating the tank body of the cooling tank to connect the condenser module, the heat dissipation module is used to dissipate heat from the condenser module.

2. The liquid-cooled heat dissipation system of claim 1, wherein, The condenser module includes a cooling coil unit, the heat dissipation module includes a cold water pipe penetrating the tank body of the cooling tank and connected to the cooling coil unit, a hot water pipe penetrating the tank body and connected to the cooling coil unit, and a heat dissipation unit connected to the cold water pipe and the hot water pipe, cold water flows from the cold water pipe into the cooling coil unit to absorb heat, and hot water generated by flowing through the cooling coil unit flows back to the heat dissipation unit to be cooled into cold water and then flows into the cooling coil unit.

3. The liquid-cooled heat dissipation system of claim 1, wherein, Cold liquid directly flows from the water inlet pipe of the cooling tank into the distribution module and to the pipeline module, and the cold liquid of the first cooling pipe unit of the pipeline module directly flows out to the corresponding first high-heat electronic module for cooling, and the cold liquid in the second cooling pipe unit directly flows out to the corresponding second high-heat electronic module for cooling.

4. The liquid-cooled heat dissipation system of claim 3, wherein, The liquid cooling heat dissipation device further comprises a cooling module connected to the water inlet pipe of the heat dissipation groove, the heat dissipation groove further has a water outlet pipe penetrating the groove body and connecting the groove body and the cooling module, the water inlet pipe of the heat dissipation groove connects the groove body and the cooling module, the hot liquid generated by the liquid in the groove body absorbing the heat energy of the electronic device flows out from the water outlet pipe to the cooling module to be cooled into cold liquid, and the cooling module makes the cold liquid flow into the groove body from the water inlet pipe.

5. The liquid-cooled heat dissipation system of claim 3, wherein, The first high-heat electronic module of the electronic device has a first high-heat electronic unit arranged on the mainboard, and the second high-heat electronic module has a plurality of second high-heat electronic units arranged on the mainboard, wherein the first heat dissipation pipe unit of the pipe module of the liquid cooling heat dissipation device has a first heat dissipation pipe extending from the distribution module to the direction of the first high-heat electronic module and corresponding to the first high-heat electronic unit, the first heat dissipation pipe has a first port aligned with the first high-heat electronic module, and the second heat dissipation pipe unit has a plurality of second heat dissipation pipes respectively extending from the distribution module to the direction of the second high-heat electronic units and respectively corresponding to the second high-heat electronic units, each second heat dissipation pipe has a second port aligned with the corresponding second high-heat electronic module, cold liquid directly flows into the groove body from the water inlet pipe and simultaneously flows into the distribution module to flow to the first heat dissipation pipe and the second heat dissipation pipe of the pipe module, and the cold liquid in the first heat dissipation pipe directly flows from the first port to the corresponding first high-heat electronic module to directly dissipate heat for the first high-heat electronic unit, and the cold liquid in the second heat dissipation pipe directly flows from the corresponding second port to the corresponding second high-heat electronic module to directly dissipate heat for the corresponding second high-heat electronic module.

6. The liquid-cooled heat dissipation system of claim 5, wherein, The water inlet pipe of the heat dissipation groove has a first water inlet port connected to the groove body, and a second water inlet port connected to the distribution module, cold liquid directly flows into the groove body from the first water inlet port of the water inlet pipe and simultaneously directly flows into the distribution module from the second water inlet port to flow to the first heat dissipation pipe and the second heat dissipation pipe of the pipe module.

7. The liquid-cooled heat dissipation system of claim 6, wherein, The distribution module of the liquid cooling heat dissipation device has a liquid collecting tank connected to the second water inlet port of the water inlet pipe of the heat dissipation groove, the first heat dissipation pipe of the first heat dissipation pipe unit of the pipe module is arranged on and connected to the liquid collecting tank and extends from the liquid collecting tank to the direction of the first high-heat electronic unit, and the second heat dissipation pipe of the second heat dissipation pipe unit is arranged on and connected to the liquid collecting tank and extends from the liquid collecting tank to the direction of the second high-heat electronic unit.

8. The liquid-cooled heat dissipation system of claim 5, wherein, The first port of the first heat dissipation pipe of the first heat dissipation pipe unit of the liquid cooling heat dissipation device is close to the corresponding first high-heat electronic unit, and the cold liquid flowing out of the first port directly flows to the first high-heat electronic unit, and the second port of each second heat dissipation pipe of the second heat dissipation pipe unit is close to the corresponding second high-heat electronic unit, and the cold liquid flowing out of the second port directly flows to the second high-heat electronic unit.

9. The liquid-cooled heat dissipation system of claim 4, wherein, The cooling module of the liquid cooling heat dissipation device has a pump connected to the water inlet pipe, which is used to deliver cold liquid to the water inlet pipe to flow into the tank.

10. The liquid-cooled heat dissipation system of claim 6, wherein, The first water inlet of the water inlet pipe of the heat dissipation tank is larger than the second water inlet, the first high-heat electronic unit of the first high-heat electronic module of the electronic device is a high-efficiency processing unit, and each second high-heat electronic unit of the second high-heat electronic module is a memory unit.

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