Die bonding mechanism

Abstract

The utility model relates to a die bonding mechanism. The die bonding mechanism comprises a moving assembly, a pickup assembly, a correction assembly and a controller. The pickup assembly is installed on the moving assembly and comprises an adsorption head used for adsorbing the wafer and a pressure control piece used for controlling the pressing force of the adsorption head. The correction assembly is installed on the moving assembly and comprises a detection part used for detecting the position of the wafer and an adjusting part used for adjusting the angle position of the wafer. Due to the arrangement of the adjusting part and the detection part, if the position of the wafer is deviated, the controller controls the adjusting part to adjust the angle position of the wafer so that the wafer can be straightened. Besides, due to the arrangement of the moving assembly and the pressure control piece, the pressure of the adsorption head is controlled through the pressure control piece, when the pressing force of the adsorption head on the wafer exceeds a preset pressure threshold value, the controller can control the moving assembly and the adsorption head to stop moving, and the problem that the surface of the wafer is damaged or broken due to the fact that the pressure is too large is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor production equipment, especially relates to a fixed crystal mechanism. BACKGROUND

[0002] The fixed crystal machine is a kind of fixed crystal, and the mechanical equipment of semiconductor packaging, it can transfer and adhere to the wafer on blue film to substrate, complete chip mounting, and is widely used in the production of LED direct display screen, semiconductor discrete device, DIP and SOP and other products.

[0003] The existing fixed crystal machine usually includes rack, feeding device, wafer supply device, glue dispensing device, fixed crystal device, transfer device and discharging device, the existing transfer device in the process of grabbing wafer, residual vibration is generated due to inertia when the transfer device moves fast, which can cause the change of wafer angle, or the viscosity of blue film used is too high, additional resistance is generated when wafer is sucked or released, resulting in deviation of wafer position, on the other hand, in order to make wafer and substrate adhere more closely in the process of fixed crystal, pressure is usually applied, however, since wafer is a brittle material, the size of pressure is not controlled in the process of applying pressure, resulting in wafer surface damage or even fragmentation. SUMMARY

[0004] The utility model aims at providing a kind of fixed crystal mechanism, it aims at solving the technical problems that the wafer angle position of existing fixed crystal machine is deviated in the process of fixed crystal, and wafer surface is easily damaged or even fragmented due to the size of pressure not being controlled.

[0005] To solve the above technical problems, a kind of fixed crystal mechanism is provided, comprising:

[0006] Moving assembly;

[0007] Pickup assembly, installed on the moving assembly, the pickup assembly includes suction head for adsorbing wafer and pressure control member for controlling the size of pressing force of the suction head;

[0008] Correction assembly, installed on the moving assembly, the correction assembly includes detection component for detecting wafer position and adjustment component for adjusting wafer angle position;

[0009] Controller, electrically connected with the moving assembly, pressure control member, detection component and adjustment component respectively.

[0010] Further, the pickup assembly further includes mounting bracket and flexible component, the flexible component and the pressure control member are connected with the mounting bracket, the suction head is connected with the flexible component, and the flexible component is configured to allow the suction head to produce deviation in Z-axis direction.

[0011] Further, the flexible component comprises an upper flexible piece and a lower flexible piece, one end of the upper flexible piece and the lower flexible piece is fixed to the mounting frame, and the other end is connected with opposite ends of the adsorption head respectively, and the upper flexible piece and the lower flexible piece are made of elastic material.

[0012] Further, the flexible component comprises an upper flexible piece and a lower flexible piece, one end of the upper flexible piece and the lower flexible piece is fixed to the mounting frame, and the other end is connected with opposite ends of the adsorption head respectively, and the upper flexible piece and the lower flexible piece are made of elastic material.

[0013] Further, the pickup assembly further comprises an elastic piece, and the elastic piece is arranged between the flexible component and the mounting frame.

[0014] Further, the flexible component comprises an upper flexible piece and a lower flexible piece, one end of the upper flexible piece and the lower flexible piece is fixed to the mounting frame, and the other end is connected with opposite ends of the adsorption head respectively, and the upper flexible piece and the lower flexible piece are made of elastic material.

[0015] Further, the adjustment component comprises a correction motor, a driving wheel, a driven wheel and a belt, the correction motor is connected with the mounting frame, the correction motor is connected with the driving wheel, the driven wheel is connected with the adsorption head, and the driving wheel and the driven wheel are coupled and connected through the belt.

[0016] Further, the die bonding mechanism further comprises a rack, the rack comprises a wafer loading position, a die bonding position and a detection position, the detection position is arranged beside the die bonding position, the moving assembly is connected with the rack, and the moving assembly is used for driving the pickup assembly to move to the wafer loading position, the detection position and the die bonding position in sequence.

[0017] Further, the moving assembly comprises an X-axis moving component, a Y-axis moving component and a Z-axis moving component, the Y-axis moving component is mounted on the rack, the X-axis moving component is connected with the Y-axis moving component, the Z-axis moving component is connected with the X-axis moving component, and the pickup assembly is connected with the Z-axis moving component.

[0018] Further, the die bonding mechanism further comprises a feeding assembly for providing a wafer, and the feeding assembly is arranged at the wafer loading position.

[0019] The embodiment of the present application has the following beneficial effects:

[0020] The pick-up assembly and the correction assembly of the embodiment are combined. BRIEF DESCRIPTION OF DRAWINGS BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0022] Figure 1 The structure diagram of the die bonding mechanism of the embodiment of the present application is shown in the figure.

[0023] Figure 2 The top view of the die bonding mechanism of the embodiment of the present application is shown in the figure.

[0024] Figure 3 The partial structure diagram of the die bonding mechanism of the embodiment of the present application is shown in the figure.

[0025] Figure 4 The structure diagram of the pick-up assembly and the correction assembly combination of the embodiment of the present application is shown in the figure.

[0026] Figure 5 The front view of the pick-up assembly and the correction assembly combination of the embodiment of the present application is shown in the figure.

[0027] Figure 6 The structure diagram of the pick-up assembly of the embodiment of the present application is shown in the figure.

[0028] Figure 7 The control principle diagram of the die bonding mechanism of the embodiment of the present application is shown in the figure.

[0029] Figure 8 The front view of the pick-up assembly of the embodiment of the present application is shown in the figure. Figure 1 ;

[0030] Figure 9 The front view of the pick-up assembly of the embodiment of the present application is shown in the figure.Figure 2 .

[0031] 100, a die bonding mechanism; 110, a moving assembly; 111, an X-axis moving part; 112, a Y-axis moving part; 113, a Z-axis moving part; 120, a picking-up assembly; 121, a suction head; 122, a pressure control piece; 123, a mounting frame; 124, a flexible part; 1241, an upper flexible piece; 1242, a lower flexible piece; 1243, an upper connecting rod; 1244, a lower connecting rod; 125, an elastic piece; 126, a first fixing block; 127, a second fixing block; 128, a third fixing block; 130, a correcting assembly; 131, a detecting part; 132, an adjusting part; 1321, a correcting motor; 1322, a driving wheel; 1323, a driven wheel; 1324, a belt; 140, a controller; 150, a machine frame; 151, a wafer feeding position; 152, a die bonding position; 153, a detecting position; 160, a feeding assembly. DETAILED DESCRIPTION

[0032] For the purpose of facilitating the understanding of the present application, a more comprehensive description of the present application will be given below with reference to the relevant drawings. The drawings show the preferred embodiments of the present application. However, the present application can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0033] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. The terms "vertical", "horizontal", "left", "right", and similar expressions used herein are for the purpose of illustration only.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application herein only for the purpose of describing specific embodiments and is not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more of the associated listed items.

[0035] Embodiment One:

[0036] Please refer to Figures 1-7The utility model embodiment provides a kind of fixed crystal mechanism 100, fixed crystal mechanism 100 includes moving assembly 110, pickup component 120, correction component 130 and controller 140.Pickup component 120 is installed on moving assembly 110, and pickup component 120 includes the adsorption head 121 for adsorbing wafer and the pressure control member 122 for controlling the pressing force size of adsorption head 121.Correction component 130 is installed on moving assembly 110, and correction component 130 includes the detection component 131 for detecting wafer position and the adjustment component 132 for adjusting wafer angular position.Controller 140 is electrically connected with moving assembly 110, pressure control member 122, detection component 131 and adjustment component 132 respectively.Exemplarily, controller 140 is configured to: when the real-time pressure value obtained by pressure control member 122 exceeds preset pressure threshold, control moving assembly 110 and adsorption head 121 to stop moving;When the wafer position on adsorption head 121 obtained by detection component 131 exceeds first preset position range, control adjustment component 132 to drive adsorption head 121 to rotate to adjust the position of wafer.First preset position range is also the angular deviation range allowed for wafer, and the specific numerical range of preset pressure threshold and first preset position range can be set by user according to actual needs, which is not limited too much here.Detection component 131 uses CCD vision camera, on the one hand, detection component 131 can detect the position and placement angle of wafer sucked by adsorption head 121, and when the position of wafer is deviated, the position of wafer is adjusted by adjustment component 132.On the other hand, detection component 131 can also check whether the wafer sucked by adsorption head 121 is damaged.The finished product in the above refers to the product formed after wafer is fixed on substrate.Moving assembly 110 can drive pickup component 120 to move along X-axis direction, Y-axis direction and Z-axis direction.

[0037] In the embodiment, pressure control member 122 uses voice coil motor, which can realize micron-level accurate position control and millisecond-level fast response.This fast response capability enables voice coil motor to quickly adjust the size of pressing force to adapt to different fixed crystal requirements.Voice coil motor can adjust the size of output pressure by changing the size of current, so that it can provide appropriate pressing force according to different wafer materials and thicknesses, avoiding wafer damage caused by excessive pressure.Voice coil motor has precise position control capability and can realize accurate pick-and-place position control, which helps to ensure the stability of wafer during fixed crystal process and reduce the risk of fragmentation.

[0038] Please refer to Figure 3 ,Figure 4 And Figure 5 In the embodiment, the crystal pickup mechanism 100 is provided with the adjusting component 132 and the detecting component 131. After the suction head 121 sucks the wafer from the wafer supply module, the wafer is moved to the top of the detecting component 131. The wafer is checked to see if it is damaged and if the wafer is properly positioned. If the wafer is found to be misaligned, the controller 140 controls the adjusting component 132 to adjust the angle of the wafer to make it properly positioned. In addition, the wafer pickup mechanism 110 and the pressure control component 122 are provided. When the suction head 121 presses the wafer, the pressure of the suction head 121 is controlled by the pressure control component 122. When the pressing force of the suction head 121 on the wafer exceeds the preset pressure threshold, the controller 140 controls the wafer pickup mechanism 110 and the suction head 121 to stop moving, so as to ensure that the pressure of the suction head 121 on the wafer is not too large, and to avoid the problem that the wafer surface is damaged or broken due to excessive pressure.

[0039] Please refer to Figure 5 And Figure 6 In a possible implementation, the pickup assembly 120 further includes a mounting frame 123 and a flexible component 124. The flexible component 124 and the pressure control component 122 are connected with the mounting frame 123, and the suction head 121 is connected with the flexible component 124. The flexible component 124 is configured to allow the suction head 121 to be offset in the Z-axis direction.

[0040] Please refer to Figure 5 And Figure 6In one possible implementation, the flexible component 124 includes an upper flexible component 1241 and a lower flexible component 1242. One end of the upper flexible component 1241 and the lower flexible component 1242 are fixed to the mounting frame 123, and the other end is connected to the opposite ends of the adsorption head 121, respectively. Both the upper flexible component 1241 and the lower flexible component 1242 are made of elastic material. For example, in this embodiment, the pickup component 120 further includes a first fixing block 126. The upper flexible member 1241 and the lower flexible member 1242 are both flexible materials that can produce elastic deformation. The first fixing block 126 fixes the upper flexible member 1241 and the lower flexible member 1242 to the mounting bracket 123, and fixes the two flexible members to the upper and lower sides of the adsorption head 121. The lengths of the upper flexible member 1241 and the lower flexible member 1242 are set to be the same. That is, the distance between the adsorption head 121 and the first fixing block 126 that fixes the upper flexible member 1241 is equal to the distance between the adsorption head 121 and the first fixing block 126 that fixes the lower flexible member 1242. When the adsorption head 121 presses down on the wafer, the adsorption head 121 undergoes a slight deformation. The upper flexible member 1241 and the lower flexible member 1242 of the same length ensure that the deformation of the flexible members is the same. Therefore, it can be ensured that the adsorption head 121 is always in a vertical state, avoiding the adsorption head 121 from shifting in the horizontal direction. This ensures that the pressure applied by the adsorption head 121 to the wafer is always uniform, which helps to avoid damage or cracking of the wafer surface.

[0041] Please refer to Figure 5 and Figure 6 In one possible implementation, the pickup assembly 120 further includes an elastic element 125, which is disposed abutting between the flexible component 124 and the mounting bracket 123. Exemplarily, the elastic element 125 is a compression spring. When the adsorption head 121 applies pressure to the wafer, the upper flexible component 1241, the lower flexible component 1242, and the elastic element 125 work together to buffer the impact of the adsorption head 121 on the wafer, preventing damage or breakage to the wafer surface.

[0042] Please refer to Figure 6 and Figure 9In a possible implementation, the flexible component 124 has an offset angle a in the range of [0°, 5°]. It can be understood that the upper flexible component 1241 and the lower flexible component 1242 are defined as 0° when they are horizontal, and the upper flexible component 1241 and the lower flexible component 1242 are rotated in the range of [0°, 5°], and the rotation angles of the upper flexible component 1241 and the lower flexible component 1242 are always the same. For example, the rotation angles can be 1°, 2°, 3°, or 4°. The flexible component 124 allows the adsorption head 121 to be offset in the Z-axis direction, so that when the wafer surface is uneven or the contact is poor due to other factors, the uniform and appropriate adsorption pressure can be maintained through the slight adjustment of the flexible component 124. Limiting the offset angle a can ensure that the adjustment is within a controllable range, and avoid excessive pressure that can damage the wafer. Limiting the offset angle a of the flexible component 124 helps to maintain the stable position of the wafer in the adsorption head 121, and reduces the positioning error caused by excessive offset.

[0043] Please refer to Figure 3 , Figure 4 and Figure 5 In a possible implementation, the adjusting component 132 includes a correction motor 1321, a driving wheel 1322, a driven wheel 1323, and a belt 1324. The correction motor 1321 is connected to the mounting frame 123, the correction motor 1321 is connected to the driving wheel 1322, the driven wheel 1323 is connected to the adsorption head 121, and the driving wheel 1322 and the driven wheel 1323 are coupled by the belt 1324. For example, specifically, the controller 140 is electrically connected to the correction motor 1321. In this embodiment, the adjusting component 132 uses a belt 1324 transmission mechanism. From a first aspect, the belt 1324 transmission mechanism can provide higher control accuracy, which is beneficial to improve the positioning accuracy of the wafer. From a second aspect, the belt 1324 transmission mechanism has the characteristics of smooth transmission, which can reduce the wafer position deviation caused by mechanical vibration or impact, and is beneficial to further improve the accuracy of adjusting the angular position of the wafer. From a third aspect, using the belt 1324 transmission mechanism can place the correction motor 1321 beside the adsorption head 121. The pickup assembly 120 can deform flexibly, which not only does not affect the work of the adjusting component 132, but also saves the installation space of the adjusting component 132.

[0044] Please refer to Figure 1 and Figure 2In a possible implementation, the die bonding mechanism 100 further comprises a rack 150, the rack 150 comprising a wafer loading position 151, a die bonding position 152, and a detection position 153, the detection position 153 being arranged beside the die bonding position 152, and the moving assembly 110 being connected with the rack 150, for driving the pickup assembly 120 to move to the wafer loading position 151, the detection position 153, and the die bonding position 152 in sequence. For example, the detection position 153 is located between the wafer loading position 151 and the die bonding position 152.

[0045] For example, Figure 1 , Figure 2 and Figure 3 In a possible implementation, the moving assembly 110 comprises an X-axis moving component 111, a Y-axis moving component 112, and a Z-axis moving component 113, the Y-axis moving component 112 being mounted on the rack 150, the X-axis moving component 111 being connected with the Y-axis moving component 112, the Z-axis moving component 113 being connected with the X-axis moving component 111, and the pickup assembly 120 being connected with the Z-axis moving component 113. For example, the Y-axis moving component 112 is configured to drive the X-axis moving component 111, the Z-axis moving component 113, and the pickup assembly 120 to move along the Y-axis direction, the X-axis moving component 111 is configured to drive the Z-axis moving component 113 and the pickup assembly 120 to move along the X-axis direction, and the Z-axis moving component 113 is configured to drive the pickup assembly 120 to move along the Z-axis direction. Specifically, the controller 140 is electrically connected with the X-axis moving component 111, the Y-axis moving component 112, and the Z-axis moving component 113 respectively.

[0046] For example, Figure 1 , Figure 2 and Figure 3 In a possible implementation, the die bonding mechanism 100 further comprises a feeding assembly 160 for providing the wafer, the feeding assembly 160 being arranged at the wafer loading position 151. For example, the feeding assembly 160 is configured to provide the wafer, the wafer being arranged in an array manner on a blue film, and the suction head 121 being capable of sucking the wafer on the blue film.

[0047] Embodiment Two:

[0048] For example, Figure 8 and Figure 9 Compared with the embodiment one, the difference between the embodiment one and the embodiment two lies in the structure of the flexible component 124, which is embodied in that:

[0049] For example, Figure 8 and Figure 9In a possible implementation, the flexible component 124 includes an upper link 1243 and a lower link 1244, both of which are hingedly connected to the mounting frame 123 at one end and hingedly connected to opposite ends of the suction head 121 at the other end. In this embodiment, the upper link 1243 and the lower link 1244 are also made of rigid material, and the upper link 1243 is rotatably connected to the second fixed block 127 at one end and rotatably connected to the suction head at the other end, and the lower link 1244 is rotatably connected to the third fixed block 128 at one end and rotatably connected to the suction head at the other end. It can be understood that the upper link 1243, the lower link 1244, the two fixed blocks and the suction head form a deformable parallelogram, wherein the second fixed block 127 and the third fixed block 128 are fixed, and the suction head is moved up and down, so that the suction head always maintains a vertical state, avoids the suction head 121 from being offset in the horizontal direction, and makes the pressure exerted by the suction head 121 on the wafer always uniform, which is beneficial to avoid damage or breakage of the wafer surface. It can be understood that the upper link 1243 and the lower link 1244 are defined as 0° when they are in the horizontal state, and the upper link 1243 and the lower link 1244 are rotated within the range of [0°, 5°], and the rotation angles of the upper link 1243 and the lower link 1244 always remain the same. For example, the rotation angles can be 1°, 2°, 3° or 4°.

[0050] In addition to the above-mentioned differences, the die bonding mechanism 100 and its components in this embodiment are the same as those in Embodiment 1, and will not be described in detail here.

[0051] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent application scope. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the present application patent should be subject to the appended claims.

Claims

1. A die-bonding mechanism, characterized in that, include: Mobile components; A pickup assembly is mounted on the moving assembly, the pickup assembly including an adsorption head for adsorbing wafers and a pressure control element for controlling the pressure applied to the adsorption head; A calibration component is mounted on the moving component, the calibration component including a detection component for detecting the wafer position and an adjustment component for adjusting the wafer angle position; The controller is electrically connected to the moving component, pressure control component, detection component, and adjustment component, respectively.

2. The die-bonding mechanism according to claim 1, characterized in that, The pickup assembly also includes a mounting bracket and a flexible component, both of which are connected to the mounting bracket. The suction head is connected to the flexible component, which is configured to allow the suction head to deflect in the Z-axis direction.

3. The die-bonding mechanism according to claim 2, characterized in that, The flexible component includes an upper flexible component and a lower flexible component. One end of the upper flexible component and the lower flexible component are fixed to the mounting frame, and the other end is connected to the opposite ends of the adsorption head. Both the upper flexible component and the lower flexible component are made of elastic material.

4. The die-bonding mechanism according to claim 2, characterized in that, The flexible component includes an upper connecting rod and a lower connecting rod. One end of the upper connecting rod and the lower connecting rod are hinged to the mounting frame, and the other end is respectively hinged to the opposite ends of the adsorption head.

5. The die-bonding mechanism according to claim 2, characterized in that, The pickup assembly also includes an elastic element, which is disposed between the flexible component and the mounting bracket.

6. The die-bonding mechanism according to claim 2, characterized in that, The offset angle of the flexible component is in the range of [0°, 5°].

7. The die-bonding mechanism according to claim 2, characterized in that, The adjustment component includes a calibration motor, a drive wheel, a driven wheel, and a belt. The calibration motor is connected to the mounting bracket and the drive wheel. The driven wheel is connected to the adsorption head. The drive wheel and the driven wheel are coupled together by the belt.

8. The die-bonding mechanism according to claim 1, characterized in that, The die bonding mechanism further includes a frame, which includes a wafer loading position, a die bonding position, and a detection position. The detection position is located next to the die bonding position. The moving component is connected to the frame and is used to drive the picking component to move sequentially to the wafer loading position, the detection position, and the die bonding position.

9. The die-bonding mechanism according to claim 8, characterized in that, The moving component includes an X-axis moving component, a Y-axis moving component, and a Z-axis moving component. The Y-axis moving component is mounted on the frame. The X-axis moving component is connected to the Y-axis moving component. The Z-axis moving component is connected to the X-axis moving component. The pickup component is connected to the Z-axis moving component.

10. The die-bonding mechanism according to claim 8, characterized in that, The die bonding mechanism further includes a feeding component for providing wafers, the feeding component being disposed at the wafer loading position.

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