Wafer pre-cleaning process suite

Abstract

The utility model provides a wafer pre-cleaning process suite which comprises a process base and a supporting structure, and the top of the process base is provided with a step groove; the supporting structure comprises a plurality of supporting assemblies, each supporting assembly comprises a lifting positioning pin and a positioning pin base, the positioning pin bases are arranged at the bottom in the process cavity, the lifting positioning pins penetrate through the process base from the upper portion of the process base to be connected with the positioning pin bases, and the top ends of the lifting positioning pins protrude out of the top face of the process base; the vacuum lifting table is connected with the process base to drive the process base to move in the vertical direction, when the process base is located on the lower portion, the top end of the lifting positioning pin extends out of the top face of the process base to support a wafer conveyed into the process cavity, and when the process base is located on the upper portion to conduct pre-cleaning, the lifting positioning pin extends out of the top face. The top end of the lifting positioning pin descends relative to the process base to be in contact with the top surface of the process base, the top end of the lifting positioning pin protrudes out of the top surface of the process base to support the wafer, a gap is formed between the back surface of the wafer and the top surface of the process base, and the edge of the wafer abuts against the step groove.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, and in particular relates to a wafer pre-cleaning process kit. Background Technology

[0002] In semiconductor technology, most existing wafer pre-cleaning equipment is designed for etching and coating processes on the upper surface of wafers. However, for special wafers requiring back-side processing, the back-side processing area cannot be touched. Support points are designed at the wafer edge, and the lifting positioning pin device is located at the edge. When the vacuum lifting platform moves upward to the pre-cleaning area, the lifting positioning pin separates from the product stage, resulting in a large area of ​​the back-side of the wafer being exposed. This allows a large influx of cleaning process gases, which can damage the back-side processing area during the cleaning process. Therefore, it is necessary to provide a wafer pre-cleaning process kit for the pre-cleaning of special wafers requiring back-side processing. Utility Model Content

[0003] This invention provides a wafer pre-cleaning process kit with an optimized structure that supports wafer sites while protecting the back side of the wafer and preventing contact with cleaning process gases.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A wafer pre-cleaning process kit includes a process base and a support structure. The top of the process base has a stepped groove that matches the wafer to support it. The support structure includes multiple support components, each including a lifting positioning pin and a positioning pin base. The positioning pin base is located at the bottom of a process cavity. The lifting positioning pin passes through the process base from above, connects to the positioning pin base, and protrudes from the top surface of the process base. A vacuum lifting platform connects to the process base and moves the process base vertically. When the process base is at the bottom, the tip of the lifting positioning pin protrudes from the top surface of the process base to support the wafer entering the process cavity. When the process base is at the top for pre-cleaning, the tip of the lifting positioning pin descends relative to the process base until it contacts the top surface of the process base. The tip of the lifting positioning pin protrudes from the top surface of the process base to support the wafer, creating a gap between the back side of the wafer and the top surface of the process base. The edge of the wafer abuts against the stepped groove.

[0006] Preferably, the process base includes an insulating base, an offset electrode plate, and a stage. The offset electrode plate is disposed in the middle of the insulating base, the stage is disposed above the insulating base and the offset electrode plate, and the stepped groove is disposed on the top of the stage.

[0007] Preferably, the process base is provided with a through hole that allows the lifting positioning pin to pass through, and the top of the lifting positioning pin is provided with a protrusion, the outer diameter of the protrusion being larger than the outer diameter of the through hole, and the height of the protrusion being smaller than the height of the stepped groove; the through hole is provided on the inner side of the stepped groove.

[0008] Preferably, the inner wall of the through hole is provided with a wear-resistant sleeve, and the lifting positioning pin passes through the wear-resistant sleeve.

[0009] Preferably, both the lifting positioning pin and the wear-resistant sleeve are made of ceramic.

[0010] Preferably, when the process base is located below, the bottom end of the lifting positioning pin abuts against the top surface of the positioning pin base; when the process base is located above for pre-cleaning, the bottom end of the lifting positioning pin disengages from the positioning pin base.

[0011] Preferably, the support components are in three groups, and the three groups of support components are arranged at circumferential intervals along the process base.

[0012] Preferably, it further includes a protective structure, the protective structure including a lower cover plate disposed below the process base; the lower cover plate has a lower protective edge extending upward from its edge, the lower protective edge covering the outer periphery of the process base.

[0013] Preferably, the protective structure further includes an upper cover plate disposed on the top of the process cavity, the inner edge of the upper cover plate extending downward to form an upper protective edge, and when the lower cover plate is located above the process base, the upper protective edge is located between the lower protective edge and the process base.

[0014] Preferably, the insulating base and the stage are made of quartz, and the offset electrode plate is made of titanium.

[0015] Compared with the prior art, the technical solution of this utility model has beneficial effects.

[0016] For example, a wafer pre-cleaning process kit includes a process base and a support structure. The top of the process base has a stepped groove that matches the wafer to support it. The support structure includes multiple support components, each including a lifting positioning pin and a positioning pin base. The positioning pin base is located at the bottom of the process cavity. The lifting positioning pin passes through the process base from above and connects to the positioning pin base, protruding from the top surface of the process base at its tip. A vacuum lifting platform connects to the process base and drives the process base to move vertically. When the process base is at the bottom, the tip of the lifting positioning pin extends from the top surface of the process base to support the wafer entering the process cavity. When the process base is at the top for pre-cleaning, the tip of the lifting positioning pin descends relative to the process base until it contacts the top surface of the process base. The tip of the lifting positioning pin protrudes from the top surface of the process base to support the wafer, creating a gap between the back of the wafer and the top surface of the process base. The edge of the wafer abuts against the stepped groove. The lifting positioning pin provides wafer support while the stepped groove design of the process base protects the back of the wafer from contact with the cleaning process gas. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the wafer pre-cleaning process kit structure in an embodiment of this utility model;

[0018] Figure 2 This is a schematic diagram of the protective structure in an embodiment of this utility model;

[0019] Figure 3 This is a schematic diagram of the wafer pre-cleaning process kit in use in this embodiment of the present invention, with the process base located at the lower wafer transfer position.

[0020] Figure 4 This is a schematic diagram of the wafer pre-cleaning process kit in use in this embodiment of the present invention, with the process base located at the upper process position.

[0021] Explanation of reference numerals in the attached figures:

[0022] 1-Support structure; 11-Lifting positioning pin; 111-Protrusion; 12-Positioning pin base; 13-Wear-resistant sleeve;

[0023] 2-Process base; 21-Stage; 211-Step groove; 22-Offset electrode plate; 23-Insulating base;

[0024] 3-Protective structure; 31-Lower cover plate; 311-Lower protective edge; 32-Upper cover plate; 321-Upper protective edge;

[0025] 100 - Process cavity;

[0026] 200-Vacuum Lifting Platform. Detailed Implementation

[0027] To make the objectives, features, and beneficial effects of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described below are merely for explaining this utility model and are not intended to limit it. Furthermore, the same or similar reference numerals may be used in the drawings to refer to the same or similar elements in different embodiments, and descriptions of the same or similar elements in different embodiments, as well as descriptions of prior art elements, features, effects, etc., may be omitted.

[0028] Figure 1 This is a schematic diagram of the wafer pre-cleaning process kit structure in an embodiment of this utility model; Figure 2 This is a schematic diagram of the protective structure in an embodiment of this utility model; Figure 3 This is a schematic diagram of the wafer pre-cleaning process kit in use in this embodiment of the present invention, with the process base located at the lower wafer transfer position.

[0029] Figure 4 This is a schematic diagram of the wafer pre-cleaning process kit in use in this embodiment of the present invention, with the process base located at the upper process position.

[0030] Reference Figures 1-4 This utility model provides a wafer pre-cleaning process kit.

[0031] Specifically, the wafer pre-cleaning process kit includes a process base 2 and a support structure 1. The top of the process base 2 is provided with a stepped groove 211 that matches the wafer to support it. The support structure 1 includes multiple sets of support components, each including a lifting positioning pin 11 and a positioning pin base 12. The positioning pin base 12 is located at the bottom of the process cavity 100. The lifting positioning pin 11 passes through the process base 2 from above, connects to the positioning pin base 12, and protrudes from the top surface of the process base 2. A vacuum lifting platform 200 connects to the process base 2 and drives the process base 2 to move vertically. The process base 2 is located at the bottom. When the process base 2 is in the process chamber 100, the top of the lifting positioning pin 11 extends out of the top surface of the process base 2 to support the wafer. When the process base 2 is in the upper position for pre-cleaning, the top of the lifting positioning pin 11 descends relative to the process base 2 until it contacts the top surface of the process base 2. The top of the lifting positioning pin 11 protrudes from the top surface of the process base 2 to support the wafer, so that the back side of the wafer forms a gap with the top surface of the process base 2, and the edge of the wafer abuts against the stepped groove 211. While the lifting positioning pin 11 supports the wafer position, the design of the stepped groove 211 of the process base 2 protects the back side of the wafer and avoids contact with the cleaning process gas.

[0032] In some embodiments, the process base 2 includes an insulating base 23, an offset electrode plate 22, and a stage 21. The offset electrode plate 22 is disposed in the middle of the insulating base 23, the stage 21 is disposed above the insulating base 23 and the offset electrode plate 22, and a stepped groove 211 is disposed on the top of the stage 21.

[0033] In some embodiments, the insulating base 23 and the stage 21 are made of quartz, and the offset electrode plate 22 is made of titanium.

[0034] In some embodiments, the process base 2 is provided with a through hole that allows the lifting positioning pin 11 to pass through. The top of the lifting positioning pin 11 is provided with a protrusion 111. The outer diameter of the protrusion 111 is larger than the outer diameter of the through hole, and the height of the protrusion 111 is smaller than the height of the stepped groove 211. The through hole is provided inside the stepped groove 211.

[0035] In some embodiments, a wear-resistant sleeve 13 is provided on the inner wall of the through hole, and the lifting positioning pin 11 passes through the wear-resistant sleeve 13 to avoid wear on the process base 2 during use.

[0036] In some embodiments, the lifting positioning pin 11 and the wear-resistant sleeve 13 are both made of ceramic.

[0037] In some embodiments, when the process base 2 is located in the lower transfer position, the bottom end of the lifting positioning pin 11 abuts against the top surface of the positioning pin base 12; when the process base 2 is located in the upper pre-cleaning process position, the bottom end of the lifting positioning pin 11 disengages from the positioning pin base 12.

[0038] In some embodiments, the support components are in three groups, and the three groups of support components are arranged at circumferential intervals along the process base 2.

[0039] In some embodiments, a protective structure 3 is also included, which includes a lower cover plate 31 disposed below the process base 2; the lower cover plate 31 has a lower protective edge 311 extending upward from its edge, and the lower protective edge 311 covers the outer periphery of the process base 2.

[0040] In some embodiments, the protective structure 3 further includes an upper cover plate 32 disposed on the top of the process cavity 100, with an upper protective edge 321 extending downward from the inner edge of the upper cover plate 32. When the lower cover plate 31 is positioned above the process base 2, the upper protective edge 321 is located between the lower protective edge 311 and the process base 2.

[0041] In summary, the wafer pre-cleaning process kit provided by this utility model includes a process base 2 and a support structure 1. The top of the process base 2 is provided with a stepped groove 211 that matches the wafer to support it. The support structure 1 includes multiple sets of support components, each including a lifting positioning pin 11 and a positioning pin base 12. The positioning pin base 12 is located at the bottom of the process cavity 100. The lifting positioning pin 11 passes through the process base 2 from above and connects to the positioning pin base 12, protruding from the top surface of the process base 2. The vacuum lifting platform 200 connects to the process base 2 and drives the process base 2 to move vertically. When the process base 2 is positioned below, the tip of the lifting positioning pin 11 extends out of the top surface of the process base 2 to support the wafer entering the process cavity 100. When the process base 2 is positioned above for pre-cleaning, the tip of the lifting positioning pin 11 descends relative to the process base 2 until it contacts the top surface of the process base 2. The tip of the lifting positioning pin 11 protrudes from the top surface of the process base 2 to support the wafer, so that a gap is formed between the back side of the wafer and the top surface of the process base 2, and the edge of the wafer abuts against the stepped groove 211. While the lifting positioning pin 11 provides wafer support, the design of the stepped groove 211 of the process base 2 protects the back side of the wafer and prevents it from contacting the cleaning process gas.

[0042] Although specific embodiments have been described above, these embodiments are not intended to limit the scope of this utility model disclosure, even when only a single embodiment is described with respect to a particular feature. The feature examples provided in this utility model disclosure are intended to be illustrative and not limiting, unless otherwise stated. In practice, one or more technical features of the dependent claims may be combined with the technical features of the independent claims as needed and where technically feasible, and may be derived from the technical features of the respective independent claims in any suitable manner rather than solely by the specific combinations listed in the claims.

[0043] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A wafer pre-cleaning process kit, characterized by, The process base is provided with a stepped groove on the top for matching with a wafer to support the wafer; the support structure comprises a plurality of support assemblies, each of which comprises a lifting positioning needle and a positioning needle base, the positioning needle base being arranged at the bottom of the process cavity, and the lifting positioning needle connecting the positioning needle base from above the process base and protruding from the top surface of the process base at the top end; A vacuum lifting platform is connected to the process base to drive the process base to move vertically, when the process base is located below, the top end of the lifting positioning needle protrudes from the top surface of the process base to support the wafer entering the process cavity, when the process base is located above for pre-cleaning, the top end of the lifting positioning needle is lowered to be in contact with the top surface of the process base, the top end of the lifting positioning needle protrudes from the top surface of the process base to support the wafer, so that the back surface of the wafer forms a gap with the top surface of the process base, and the edge of the wafer abuts against the stepped groove.

2. The wafer pre-clean process kit of claim 1, wherein, The process base comprises an insulating base, an offset electrode plate and a carrier, the offset electrode plate is arranged in the middle of the insulating base, and the carrier is arranged above the insulating base and the offset electrode plate, and the stepped groove is arranged on the top of the carrier.

3. The wafer pre-clean process kit of claim 1, wherein, The process base is provided with a through hole allowing the lifting positioning needle to pass through, the top of the lifting positioning needle is provided with a protruding portion, the outer diameter of the protruding portion is greater than the outer diameter of the through hole, and the height of the protruding portion is less than the height of the stepped groove; the through hole is arranged on the inner side of the stepped groove.

4. The wafer pre-clean process kit of claim 3, wherein, The inner wall of the through hole is provided with a wear-resistant sleeve, and the lifting positioning needle passes through the wear-resistant sleeve.

5. The wafer pre-clean process kit of claim 3, wherein, The materials of the lifting positioning needle and the wear-resistant sleeve are both ceramic.

6. The wafer pre-clean process kit of claim 1, wherein, When the process base is located below, the bottom end of the lifting positioning needle abuts against the top surface of the positioning needle base, and when the process base is located above for pre-cleaning, the bottom end of the lifting positioning needle is separated from the positioning needle base.

7. The wafer pre-clean process kit of claim 1, wherein, The support assemblies are three groups, and the three groups of support assemblies are arranged at intervals along the circumference of the process base.

8. The wafer pre-clean process kit of claim 1, wherein, The protection structure comprises a lower cover plate arranged below the process base, and the edge of the lower cover plate extends upward to form a lower protection edge, and the lower protection edge covers the outer periphery of the process base.

9. The wafer pre-clean process kit of claim 8, wherein, The protection structure further comprises an upper cover plate arranged on the top of the process cavity, and the inner side edge of the upper cover plate extends downward to form an upper protection edge, and when the process base is located above, the upper protection edge is located between the lower protection edge and the process base.

10. The wafer pre-clean process kit of claim 2, wherein, The materials of the insulating base and the carrier are quartz, and the material of the offset electrode plate is metal titanium.

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