Wafer metal plating pretreatment equipment

Abstract

The utility model discloses wafer metallization pretreatment equipment, which relates to the technical field of wafer cleaning and comprises an RCA cleaning machine, a basket assembly and a circulating assembly, the RCA cleaning machine is composed of an equipment body, a cleaning tank and a transfer mechanical arm, and the basket assembly comprises a placing unit and a rotating unit; the placing unit is used for providing placing support and limiting for the wafer; the rotating unit is used for driving the wafer placed on the inner side of the placing unit to rotate during operation, so that the wafer is in full contact with the cleaning liquid; and the circulating assembly is used for providing driving force for operation of the rotating unit. According to the wafer cleaning device, the basket assembly with the rotating unit and the circulating assembly are arranged, the circulating assembly is used for providing driving force for operation of the rotating unit, and the rotating unit which rotates and operates drives the wafer to rotate under the action of friction force, so that the surface of the wafer can be in comprehensive contact with cleaning liquid, and the condition of cleaning dead corners is effectively avoided; and the cleaning effect of the wafer is further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer cleaning technical field, concretely is a kind of wafer metal plating pretreatment equipment. BACKGROUND

[0002] Wafer is cleaned before electroplating, and its RCA cleaning machine is a kind of wet cleaning equipment of wafer, mainly used for removing organic and inorganic contaminants on the surface of wafer, RCA cleaning method is used in CA cleaning machine, SC1 cleaning solution composed of ammonia water of extremely high purity, hydrogen peroxide and water and SC2 cleaning solution composed of hydrochloric acid, hydrogen peroxide and water are used, SC1 cleaning solution is alkaline solution, removes particles, metal and organic matter by oxidation particles and electrochemical repulsive force;SC2 cleaning solution is acidic solution, mainly used for removing metal ions, its structure is usually composed of two quartz heating cylinders, two sets of temperature control systems, two quick spray drainage tanks (QDR), two sets of spray control systems, a hydrogen fluoride tank, a first-order overflow tank, a three-order overflow tank, two sets of acid suction dischargers etc., is also equipped with electrical control part, chemical process tank, pure water cleaning tank etc., and provides the interface matched with plant power supply, gas supply, water supply, waste water discharge, exhaust system, uses PLC automatic control, is equipped with multiple formula for customer to choose, meets different process requirements.

[0003] When wafer silicon chip is cleaned by RCA cleaning machine, silicon chip is placed into silicon chip basket, and silicon chip basket is transferred by mechanical arm, and the following problems still exist in cleaning process: the contact position of silicon chip and silicon chip basket cannot be fully contacted with cleaning solution, which affects the cleaning effect of silicon chip, based on this, a wafer metal plating pretreatment equipment is provided. UTILITY MODEL CONTENTS

[0004] The utility model aims at: in order to solve the problems in the above background, provide a kind of wafer metal plating pretreatment equipment.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of wafer metal plating pretreatment equipment, including RCA cleaning machine of equipment main body, cleaning tank, transfer mechanical arm and the basket assembly for providing the placement support of wafer, the cleaning tank is embeddedly installed in the inside of equipment main body workbench, the transfer mechanical arm is installed in the inside of equipment main body and is distributed in the upper region of cleaning tank by three-axis sliding table, the basket assembly includes placement unit, rotating unit;The placement unit is used to provide the placement support and limit for wafer;Rotating unit is used to drive the wafer placed in the inside of placement unit to rotate when operating, realizes the full contact of wafer and cleaning solution;The inside of equipment main body is also provided with the circulation component extending to the inside of cleaning tank, and the circulation component is used to provide driving force for the operation of rotating unit.

[0006] As a further scheme of the utility model: the placing unit includes concave frame, semicircle clamping groove, hanging bracket, the semicircle clamping groove is opened in the inside of concave frame, the semicircle clamping groove is evenly provided with multiple along the long side direction of concave frame, and the semicircle clamping groove is used to provide positioning placement for wafer;The hanging bracket is fixed to the both ends outside of concave frame and extends to the top of concave frame, and the hanging bracket is used to provide hanging position for transfer mechanical arm.

[0007] As a further scheme of the utility model: the rotating unit includes rotating groove, rotating roller, stress vane, the rotating groove is symmetrically opened on both sides of the outer wall of concave frame and is communicated with semicircle clamping groove, the rotating roller is distributed to the inside of rotating groove and is rotatably connected with concave frame at both ends, and the side of rotating roller protrudes to the inside of semicircle clamping groove, the stress vane is distributed to the outside of one end of concave frame and is fixedly connected with the rotating shaft of rotating roller, when wafer is placed to the inside of semicircle clamping groove, the side edge of wafer is in contact with the side of rotating roller, and the stress vane drives rotating roller to rotate when driving wafer to rotate, for realizing the full contact of wafer and cleaning liquid.

[0008] As a further scheme of the utility model: the circulating assembly includes circulating pump, suction pipe and water jet pipe, the circulating pump is installed to the inside bottom of equipment main body, the suction pipe and water jet pipe are connected to the input and output end of circulating pump respectively, and the suction pipe extends through the bottom of the inner wall of cleaning tank and is communicated with the inner cavity of cleaning tank, and the water jet pipe extends through the side of the inner wall of cleaning tank and is aligned with the side of stress vane, the cleaning liquid in the inside of cleaning tank is sucked by the operation of circulating pump and is sprayed out through water jet pipe, and the sprayed cleaning liquid impacts stress vane to provide deflection power for stress vane.

[0009] As a further scheme of the utility model: the rotating unit is provided with two groups, and the vane direction of two stress vanes on the two rotating units is same, the water jet pipe has two output heads, and the two output heads extend through the two sides of cleaning tank respectively, and the two output heads are distributed in staggered position along vertical direction and are respectively directed to the upper half and lower half position of two stress vanes.

[0010] Compared with the prior art, the utility model has the advantages that:

[0011] By setting the flower basket assembly with rotating unit and circulating assembly, the circulating assembly is used to provide driving force for the operation of rotating unit, the rotating unit under the action of friction drives wafer to rotate, so that the wafer surface can be fully contacted with cleaning liquid, effectively avoids the situation of cleaning dead angle, and further improves the cleaning effect of wafer. BRIEF DESCRIPTION OF DRAWINGS

[0012] Fig. 1 It is the structural schematic diagram of the utility model;

[0013] Fig. 2The utility model discloses a cleaning tank internal structure sectional view.

[0014] Fig. 3 The utility model discloses a flower basket subassembly and circulation subassembly's structure distribution diagram.

[0015] Fig. 4 The utility model discloses a wafer and rotating roller's structure distribution diagram.

[0016] Fig. 5 The utility model discloses a flower basket subassembly's sectional split diagram.

[0017] In the drawing: 1, RCA cleaning machine;101, equipment main body;102, cleaning tank;103, transfer mechanical arm;2, flower basket subassembly;201, concave frame;202, semicircle clamping groove;203, hanging bracket;204, rotating groove;205, rotating roller;206, stress vane;3, circulation subassembly;301, circulating pump;302, suction pipe;303, water jet pipe;4, wafer. DETAILED DESCRIPTION

[0018] The technical scheme in the embodiments of the utility model will be apparently and completely described below with the drawings in the embodiments of the utility model, and apparently, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor belong to the range of the utility model protection.

[0019] Please refer to Figs. 1-5 In the embodiments of the utility model, a wafer metal plating pretreatment equipment includes RCA cleaning machine 1 that is composed of equipment main body 101, cleaning tank 102 and transfer mechanical arm 103 and flower basket subassembly 2 that provides the placement support for wafer 4, and cleaning tank 102 is embeddedly installed in the workbench inside equipment main body 101, and transfer mechanical arm 103 is installed in the inside of equipment main body 101 through three-axis sliding table and is distributed in the area above cleaning tank 102, and flower basket subassembly 2 includes placement unit and rotating unit, and placement unit is used to provide the placement support and limit for wafer 4, and rotating unit is used to drive wafer 4 placed in the inside of placement unit to rotate when operating, and the full contact of wafer 4 and cleaning liquid is realized.

[0020] The interior of the device body 101 is further provided with a circulating assembly 3 extending to the interior of the cleaning tank 102, which is used to provide driving force for the operation of the rotating unit; the placing unit comprises a concave frame 201, a semicircular clamping groove 202 and a hanging frame 203; the semicircular clamping groove 202 is opened in the inner side of the concave frame 201, a plurality of semicircular clamping grooves 202 are uniformly arranged along the long edge direction of the concave frame 201, and the semicircular clamping groove 202 is used to provide positioning and placing for the wafer 4; the hanging frame 203 is fixed to the outer sides of both ends of the concave frame 201 and extends to the upper side of the concave frame 201, and the hanging frame 203 is used to provide a hanging position for the transfer mechanical arm 103.

[0021] The rotating unit comprises a rotating groove 204, a rotating roller 205 and a force receiving blade 206; the rotating groove 204 is symmetrically opened on both sides of the outer wall of the concave frame 201 and is in communication with the semicircular clamping groove 202; the rotating roller 205 is distributed on the inner side of the rotating groove 204, and both ends of the rotating roller 205 are rotationally connected with the concave frame 201, and the side surface of the rotating roller 205 protrudes to the inner side of the semicircular clamping groove 202; the force receiving blade 206 is distributed on the outer side of one end of the concave frame 201 and is fixedly connected with the rotating shaft of the rotating roller 205; when the wafer 4 is placed in the semicircular clamping groove 202, the side edge of the wafer 4 is in contact with the side surface of the rotating roller 205, and when the force receiving blade 206 drives the rotating roller 205 to rotate, the wafer 4 is also driven to rotate, so as to realize the full contact of the wafer 4 with the cleaning liquid.

[0022] The circulating assembly 3 comprises a circulating pump 301, a suction pipe 302 and a water spraying pipe 303; the circulating pump 301 is installed on the inner bottom of the device body 101, the suction pipe 302 and the water spraying pipe 303 are respectively connected to the input and output ends of the circulating pump 301, the suction pipe 302 extends through the inner wall bottom of the cleaning tank 102 and is in communication with the inner cavity of the cleaning tank 102, and the water spraying pipe 303 extends through the inner wall side of the cleaning tank 102 and is aligned with the side surface of the force receiving blade 206; the cleaning liquid in the cleaning tank 102 is sucked by the operation of the circulating pump 301 and sprayed out through the water spraying pipe 303, and the sprayed cleaning liquid impacts the force receiving blade 206 to provide a deflection driving force for the force receiving blade 206.

[0023] In the embodiment, it is necessary to supplement that the transfer mechanical arm 103 can realize horizontal transverse, longitudinal and vertical movement in three directions through the three-axis sliding table, and the flower basket assembly 2 can be transferred as a whole by being hung outside the hanging frame 203 through the transfer mechanical arm 103, so that the flower basket assembly 2 can be conveniently transferred between the cleaning tanks 102.

[0024] When the wafer 4 is cleaned, the plurality of wafers 4 are placed in the plurality of semicircular slots 202 in sequence, and the side of the wafer is in contact with the side of the rotating roller 205, and then the basket assembly 2 is lifted by the transfer mechanical arm 103 into the cleaning tank 102 for cleaning operation (it should be pointed out that the RCA cleaning machine 1 is a common type RCA cleaning machine on the market, and the cleaning principle is completely the same, which will not be described here).

[0025] During the cleaning process, the circulating pump can be started synchronously, the circulating pump 301 runs through the suction pipe 302 to suck the cleaning liquid in the cleaning tank 102, and then is delivered into the cleaning tank 102 through the water jet pipe 303. The water jet from the water jet pipe 303 is just aimed at the force receiving blade 206, so that the force receiving blade 206 is deflected under force, the rotating force receiving blade 206 drives the rotating roller 205 to rotate, and the rotating roller 205 drives the wafer 4 to rotate under the action of friction, so that the surface of the wafer 4 can be fully contacted with the cleaning liquid, effectively avoiding the occurrence of cleaning dead angle, and further improving the cleaning effect of the wafer 4.

[0026] Please refer to Figs. 2-3 , the rotating unit is provided with two groups, and the blade directions of the two force receiving blades 206 on the two groups are the same; the water jet pipe 303 has two output ends, and the two output ends penetrate through the two sides of the cleaning tank 102 respectively, and the two output ends are distributed in a staggered manner along the vertical direction and respectively face the upper half and the lower half of the two force receiving blades 206.

[0027] In the embodiment: through the above structure, the water jet from the two output ends of the water jet pipe 303 exerts opposite impact force on the two force receiving blades 206, and the deflection directions of the two force receiving blades 206 are the same, that is, the rotating directions of the two force receiving blades 206 and the rotating roller 205 are the same, and the two rotating rollers 205 with the same rotating direction can provide sufficient rotating force for the wafer 4, so as to ensure the stable rotation of the wafer 4.

[0028] It should be further pointed out that: the moving position of the transfer mechanical arm 103 can be accurately controlled by the three-axis sliding table, so that when the basket assembly 2 is placed in the cleaning tank 102, the position of the force receiving blade 206 can be accurately aligned with the end of the water jet pipe 303.

[0029] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A wafer metal plating pretreatment equipment, comprising an RCA cleaning machine (1) composed of an equipment body (101), a cleaning tank (102) and a transfer mechanical arm (103), and a basket assembly (2) for providing a placing support for a wafer (4), the cleaning tank (102) is embeddedly installed inside a workbench of the equipment body (101), and the transfer mechanical arm (103) is installed inside the equipment body (101) through a three-axis sliding table and is distributed in an area above the cleaning tank (102), characterized in that, The flower basket assembly (2) comprises a placing unit and a rotating unit; the placing unit is used for providing placement support and limiting for the wafer (4); the rotating unit is used for driving the wafer (4) placed in the placing unit to rotate when operating, so as to realize sufficient contact of the wafer (4) with the cleaning liquid; the inside of the equipment main body (101) is further provided with a circulating assembly (3) extending into the inside of the cleaning tank (102), and the circulating assembly (3) is used for providing driving force for the operation of the rotating unit.

2. The wafer metal plating pretreatment apparatus according to claim 1, wherein The placing unit comprises a concave frame (201), a semicircular clamping groove (202) and a hanging bracket (203); the semicircular clamping groove (202) is arranged on the inside of the concave frame (201), a plurality of semicircular clamping grooves (202) are evenly arranged along the long edge direction of the concave frame (201), and the semicircular clamping groove (202) is used for providing positioning and placement for the wafer (4); the hanging bracket (203) is fixed to the outside of both ends of the concave frame (201) and extends above the concave frame (201), and the hanging bracket (203) is used for providing a hanging position for the transfer mechanical arm (103).

3. The wafer metal plating pretreatment apparatus according to claim 2, wherein The rotating unit comprises a rotating groove (204), a rotating roller (205) and a force receiving blade (206); the rotating groove (204) is symmetrically arranged on both sides of the outer wall of the concave frame (201) and is in communication with the semicircular clamping groove (202); the rotating roller (205) is arranged on the inside of the rotating groove (204), and both ends of the rotating roller (205) are rotatably connected with the concave frame (201), and the side surface of the rotating roller (205) protrudes into the semicircular clamping groove (202); the force receiving blade (206) is arranged on the outside of one end of the concave frame (201) and is fixedly connected with the rotating shaft of the rotating roller (205); when the wafer (4) is placed in the semicircular clamping groove (202), the side edge of the wafer (4) is in contact with the side surface of the rotating roller (205), and when the force receiving blade (206) drives the rotating roller (205) to rotate, the wafer (4) is driven to rotate, so as to realize sufficient contact of the wafer (4) with the cleaning liquid.

4. The wafer pre-treatment apparatus for metal plating according to claim 3, wherein The circulating assembly (3) comprises a circulating pump (301), a suction pipe (302) and a water spraying pipe (303); the circulating pump (301) is installed on the inside bottom of the equipment main body (101), the suction pipe (302) and the water spraying pipe (303) are connected to the input and output ends of the circulating pump (301) respectively, the suction pipe (302) extends through the inner wall bottom of the cleaning tank (102) and is in communication with the inner cavity of the cleaning tank (102), and the water spraying pipe (303) extends through the inner wall side of the cleaning tank (102) and is aligned with the side surface of the force receiving blade (206); the cleaning liquid in the cleaning tank (102) is sucked by the operation of the circulating pump (301) and sprayed out through the water spraying pipe (303), and the sprayed cleaning liquid impacts the force receiving blade (206) to provide deflection power for the force receiving blade (206).

5. The wafer pre-treatment apparatus for metal plating according to claim 4, wherein The rotating units are provided in two groups, the two force blades (206) on the two groups of rotating units have the same blade direction; the water spraying pipes (303) have two output ends, the two output ends respectively penetrate through two sides of the cleaning tank (102), and the two output ends are distributed in a staggered manner along the vertical direction and respectively face the upper half and lower half positions of the two force blades (206).

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