RCA cleaning machine
By combining heating and ultrasonic devices in the RCA cleaning machine, the problems of high power consumption and poor temperature control of the heated cleaning fluid have been solved, achieving the effects of reducing costs and improving cleaning quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 通合新能源(金堂)有限公司
- Filing Date
- 2025-04-09
- Publication Date
- 2026-05-19
AI Technical Summary
Existing RCA cleaning machines consume a lot of power to heat the cleaning fluid, which increases cleaning costs, and the temperature control is poor, affecting the quality of silicon wafer cleaning.
The cleaning fluid is heated and agitated by a combination of heating and ultrasonic devices to avoid circulating the cleaning fluid. Ultrasonic agitation is used to achieve a similar flow effect, reducing heating power consumption. A shielding device is used to reduce heat loss and ensure temperature control.
It reduced cleaning costs, improved the cleaning quality and efficiency of silicon wafers, and achieved stable control of the cleaning solution temperature.
Smart Images
Figure CN224253672U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of cleaning equipment technology, and more specifically, to an RCA cleaning machine. Background Technology
[0002] RCA cleaning machines are typically used to remove contaminants such as particles, organic matter, and metal ions from the surface of wafers to ensure a high level of cleanliness.
[0003] The RCA cleaning machines provided by related technologies also have the problem of high power consumption for heating the cleaning fluid, which increases the cleaning cost; moreover, the temperature control of the cleaning fluid is poor, which reduces the cleaning quality of silicon wafers. Utility Model Content
[0004] The purpose of this invention is to provide an RCA cleaning machine that can reduce the power consumption of heating the cleaning fluid to reduce cleaning costs, and makes it easier to control the temperature of the cleaning fluid to improve the cleaning quality of silicon wafers.
[0005] The embodiments of this utility model can be implemented as follows:
[0006] This utility model provides an RCA cleaning machine, comprising:
[0007] The cleaning tank has a cleaning chamber and an inlet / outlet communicating with the cleaning chamber. The inlet / outlet is used to place or remove the material frame into the cleaning chamber, and the cleaning chamber is also used to hold the cleaning liquid.
[0008] The pick-and-place device is used to pick up and place the material frame into the cleaning chamber.
[0009] A heating device, installed in the cleaning tank, is used to heat the cleaning fluid within the cleaning chamber; and...
[0010] An ultrasonic device is installed in the cleaning tank and is used to cause the cleaning fluid in the cleaning chamber to vibrate ultrasonically.
[0011] In an optional embodiment, the RCA cleaner also includes a shielding device for shielding or opening the loading / unloading port.
[0012] In an optional embodiment, the RCA cleaning machine further includes a cover plate with a first opening, the cleaning tank is connected to the cover plate, and the loading and unloading port is connected to the first opening.
[0013] The shielding device includes a first driving assembly and a shielding member that is pulsatorically connected to the first driving assembly. A second opening is provided between the cleaning pool and the cover plate. The first driving assembly is used to drive the shielding member to slide within the second opening to shield or open the pick-up / drop-off port.
[0014] In an optional embodiment, a support frame is provided inside the cleaning tank to support the material frame. A receiving space is provided on the side of the support frame facing the bottom of the cleaning tank, and the ultrasonic device is located in the receiving space.
[0015] In an optional embodiment, the RCA cleaning machine includes at least two cleaning tanks, at least one of which is equipped with a heating device and an ultrasonic device; the pick-and-place device is also used to remove a material frame placed in the cleaning chamber of one of the cleaning tanks and move it to the cleaning chamber of the other cleaning tank.
[0016] In an optional embodiment, the pick-and-place device includes a moving mechanism and a picking mechanism that is tractively connected to the moving mechanism. The moving mechanism is used to drive the picking mechanism to move above at least two washing tanks, and the picking mechanism is used to pick up and place material boxes.
[0017] In an optional embodiment, the pick-and-place device includes at least two pick-up mechanisms, and a moving mechanism is used to drive the at least two pick-up mechanisms to move to correspond one-to-one with at least two cleaning pools.
[0018] In an optional embodiment, the picking mechanism includes a second drive assembly, a third drive assembly, and two clamping members. The second drive assembly is driveably connected to the third drive assembly, and both clamping members are driveably connected to the third drive assembly. A moving mechanism is drively connected to the second drive assembly and is used to drive the second drive assembly to move the third drive assembly and the two clamping members synchronously. The second drive assembly is used to drive the third drive assembly to move the two clamping members closer to or away from the cleaning chamber. The third drive assembly is used to drive the two clamping members closer to or further away from each other, so that the two clamping members can be used together to pick up and place the material frame; and / or,
[0019] The moving mechanism includes a fourth drive component and a guide component. The guide component includes a slide rail and a slider. The slider slides in conjunction with the slide rail. At least two cleaning pools are distributed sequentially along the direction in which the slider slides relative to the slide rail. The picking mechanism is connected to the fourth drive component via the slider or the slide rail. The fourth drive component drives the slider or the slide rail to move the picking mechanism.
[0020] In an optional embodiment, the RCA cleaner further includes a solution tank connected to the cleaning pool for supplying cleaning fluid to the cleaning chamber; and / or,
[0021] The RCA cleaning machine also includes a collection tank, which is connected to the cleaning tank and is used to recover the cleaning fluid in the cleaning chamber.
[0022] In an optional embodiment, the RCA cleaning machine also includes a housing with a cleaning tank disposed inside the housing;
[0023] The enclosure is equipped with at least one of the following: an observation port, a maintenance port, and a controller.
[0024] The beneficial effects of the RCA cleaning machine provided in this embodiment of the present invention include: the RCA cleaning machine provided in this embodiment of the present invention can use a cleaning tank to hold cleaning fluid for cleaning silicon wafers, and can use a heating device to heat the cleaning fluid. At the same time, it can use an ultrasonic device to cause ultrasonic vibration in the cleaning fluid in the cleaning chamber of the cleaning tank. In this way, the cleaning effect of silicon wafers can be improved by using the vibrating cleaning fluid. Moreover, since it is not necessary to circulate the cleaning fluid, a similar flow situation can be achieved by using an ultrasonic device, which can reduce the heat loss caused by the flow of the cleaning fluid. This reduces the power consumption of the heating device for heating the cleaning fluid, which helps to reduce cleaning costs. At the same time, it is beneficial to control the temperature of the cleaning fluid to ensure stable and reliable cleaning quality of silicon wafers. Attached Figure Description
[0025] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 This is a schematic diagram of the RCA cleaning machine in an embodiment of this utility model;
[0027] Figure 2 This is a partial structural cross-sectional view of the RCA cleaning machine in an embodiment of this utility model;
[0028] Figure 3 This is a cross-sectional view of the RCA cleaning machine in an embodiment of this utility model;
[0029] Figure 4 This is a cross-sectional view of the pick-and-place device in an embodiment of the present invention.
[0030] Icons: 010-RCA cleaning machine; 100-Box body; 101-Observation port; 102-Maintenance port; 103-Controller; 110-Cover plate; 111-First opening; 112-Second opening; 200-Cleaning tank; 201-Cleaning chamber; 202-Loading / unloading port; 210-Support frame; 211-Accommodation space; 300-Loading / unloading device; 310-Moving mechanism; 311-Fourth drive assembly; 312-First motor; 313-First lead screw; 314-Guide assembly; 315 - Slider; 316 - Slide rail; 320 - Pick-up mechanism; 330 - Second drive assembly; 340 - Third drive assembly; 341 - Guide component; 342 - Guide groove; 343 - Second motor; 344 - Second lead screw; 350 - Clamping component; 410 - Heating device; 420 - Ultrasonic device; 500 - Material frame; 600 - Shielding device; 610 - First drive assembly; 620 - Shielding component; 710 - Solution tank; 711 - Inlet pipe; 720 - Collection tank; 721 - Outlet pipe. Detailed Implementation
[0031] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0032] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0033] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0034] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0035] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.
[0036] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.
[0037] The RCA cleaning machine provided by the related technology uses a method of circulating the cleaning fluid in the cleaning tank to help improve the cleaning effect. Although this method is simple and easy to operate, it has the problem of not being able to maintain the temperature of the cleaning fluid. That is, after the related technology makes the cleaning fluid flow, the heat of the cleaning fluid is lost too quickly. On the one hand, this will increase the power consumption of the heating device used to heat the cleaning fluid, increasing the cleaning cost. On the other hand, it will also reduce the quality of silicon wafer cleaning due to poor temperature control of the cleaning fluid.
[0038] To improve the above issues, please refer to Figure 1 This embodiment provides an RCA cleaning machine 010, which can reduce the power consumption of heating the cleaning fluid to reduce cleaning costs, and makes it easier to control the temperature of the cleaning fluid to improve the cleaning quality of silicon wafers. The RCA cleaning machine 010 of this embodiment will be described in detail below with reference to the accompanying drawings.
[0039] Please refer to Figure 1 and Figure 2 The RCA cleaning machine 010 of this embodiment includes a cleaning tank 200, a pick-and-place device 300, a heating device 410, and an ultrasonic device 420. The cleaning tank 200 has a cleaning chamber 201 and a pick-and-place port 202 communicating with the cleaning chamber 201. The pick-and-place port 202 is used to pick up and place the material frame 500 into the cleaning chamber 201, and the cleaning chamber 201 is also used to hold the cleaning liquid. The pick-and-place device 300 is used to pick up and place the material frame 500 into the cleaning chamber 201. The heating device 410 is disposed in the cleaning tank 200 and is used to heat the cleaning liquid in the cleaning chamber 201. The ultrasonic device 420 is disposed in the cleaning tank 200 and is used to cause the cleaning liquid in the cleaning chamber 201 to vibrate ultrasonically.
[0040] When cleaning silicon wafers using the RCA cleaning machine 010, the silicon wafers to be cleaned can be placed in a perforated material frame 500. Then, the material frame 500 containing the silicon wafers is placed into the cleaning chamber 201 using the pick-and-place device 300, thereby immersing the silicon wafers in the cleaning solution grown in the cleaning chamber 201. The cleaning solution is heated using the heating device 410. At the same time, the cleaning solution in the cleaning chamber 201 of the cleaning tank 200 can be ultrasonically vibrated using the ultrasonic device 420. In this way, the cleaning effect of the silicon wafers can be improved by using the vibrating cleaning solution. Moreover, since the cleaning solution does not need to be circulated, a similar flow can be achieved using the ultrasonic device 420, which can reduce the heat loss caused by the flow of the cleaning solution. This reduces the power consumption of the heating device 410 in heating the cleaning solution, which helps to reduce cleaning costs. At the same time, it is beneficial to control the temperature of the cleaning solution to ensure stable and reliable cleaning quality of the silicon wafers.
[0041] Optionally, the housing 100, the cleaning pool 200, and the loading and unloading device 300 are all housed inside the housing 100; thus, an integrated structure can be achieved.
[0042] Furthermore, the housing 100 is provided with at least one of the following: an observation port 101, a maintenance port 102, and a controller 103. The loading / unloading port 202 and at least a portion of the loading / unloading device 300 protrude from the observation port 101 to allow workers to inspect the cleaning process. The maintenance port 102 is located opposite the cleaning tank 200 to facilitate maintenance of other components assembled in the cleaning tank 200, such as the heating device 410 and the ultrasonic device 420. The controller 103 is located above or below the observation port 101 and is electrically connected to the loading / unloading device 300, the heating device 410, and the ultrasonic device 420 to control them.
[0043] Optionally, the controller 103 may include, but is not limited to, an interactive screen.
[0044] Optionally, the enclosure 100 is also connected to a transparent door panel and a maintenance door, with the transparent door panel located at the observation port 101 and the maintenance door located at the maintenance port 102.
[0045] Optionally, the transparent door panel is rotatably or slidably connected to the housing 100 to facilitate opening or closing the observation port 101; and / or, the maintenance door is rotatably or slidably connected to facilitate opening or closing the maintenance port 102.
[0046] The number of cleaning tanks 200 in the RCA cleaning machine 010 can be set as needed. In some embodiments, the number of cleaning tanks 200 is one; in other embodiments, the number of cleaning tanks 200 can be two, three, etc., and no specific limitation is made here.
[0047] In embodiments where there are two or more cleaning tanks 200, at least one cleaning tank 200 is equipped with a heating device 410 and an ultrasonic device 420; the pick-and-place device 300 is also used to remove the material frame 500 placed in the cleaning chamber 201 of one of the cleaning tanks 200 and move it to the cleaning chamber 201 of the other cleaning tank 200. This improves the cleaning efficiency of silicon wafers and enables an automated cleaning process.
[0048] For example, there are seven cleaning tanks 200, and all cleaning tanks 200 are equipped with heating devices 410. SPM, DHF, APM, and HPM cleaning solutions are injected into the odd-numbered cleaning tanks 200 from left to right, respectively. The heating devices 410 heat the corresponding solutions in the cleaning tanks 200. Specifically, the SPM solution is heated to 120-150°C to remove organic matter and some metal from the material surface; the DHF solution is heated to 20-25°C to remove the natural oxide film and metal adhering to the oxide film on the material surface; the APM solution is heated to 65-80°C to remove particles and some organic matter from the material surface; and the HPM solution... Solution M is heated to 65-85℃ and used to remove metal contaminants from the surface of materials. Ultrapure water is injected into the even-numbered cleaning tanks 200 from left to right. The material to be cleaned (e.g., silicon wafers) is placed in the material frame 500, and then the material frame 500 and the material are placed together into the cleaning chamber 201 of the first cleaning tank 200 on the left using the pick-and-place device 300. After cleaning, the material frame 500 and the material are removed together using the pick-and-place device 300, and then moved to the cleaning chamber 201 of the next cleaning tank 200 for cleaning, until they are moved to the cleaning chamber 201 of the rightmost cleaning tank 200 for cleaning, thus completing the cleaning process. This achieves a cyclical cleaning effect, requiring only one pick-and-place operation of the material frame 500. This ensures ease of operation and eliminates the need to export the solution from the cleaning tank 200 and import another solution at each cleaning step, improving the quality and efficiency of material cleaning.
[0049] It should be understood that in other embodiments, the heating device 410 and the ultrasonic device 420 may be selectively installed only in a portion of the cleaning tank 200.
[0050] Alternatively, please refer to Figure 2The heating device 410 and the ultrasonic device 420 are both installed in the cleaning tank 200. The structures of the heating device 410 and the ultrasonic device 420 are similar to those in related technologies. For example, the ultrasonic device 420 causes the cleaning liquid to oscillate and mix strongly through the action of ultrasonic waves. The ultrasonic device 420 includes an oscillator and a transducer. The oscillator is used to convert electrical energy into mechanical energy to generate high-frequency vibration. The transducer is used to convert mechanical vibration into ultrasonic waves, thereby causing the liquid in the cleaning chamber 201 to generate high-frequency, large-amplitude vibration and eddy current motion, so as to achieve the oscillation effect on the solution.
[0051] Furthermore, a support frame 210 is provided inside the cleaning tank 200 to support the material frame 500. A receiving space 211 is provided on the side of the support frame 210 facing the bottom of the cleaning tank 200, and the ultrasonic device 420 is disposed within the receiving space 211. This arrangement ensures a good ultrasonic vibration effect, thereby ensuring the cleaning quality.
[0052] The structure of the support frame 210 can be configured as needed; for example, the support frame 210 can be in the shape of an inverted U.
[0053] Furthermore, the heating devices 410 can be distributed on the side of the support frame 210 and spaced apart from the support frame 210.
[0054] It should be understood that in other embodiments, at least one of the heating device 410 and the ultrasonic device 420 may also be connected to the inner or outer wall of the cleaning pool 200, without specific limitation.
[0055] Optionally, the number of material boxes 500 can be greater than, equal to or less than the number of washing tanks 200, without specific limitation.
[0056] To further reduce heat loss of the cleaning fluid in the cleaning chamber 201, please refer to... Figure 2 The RCA cleaning machine 010 also includes a shielding device 600, which is used to shield or open the loading / unloading port 202. After the material frame 500 containing the material is placed into the cleaning chamber 201, the shielding device 600 can be used to shield the loading / unloading port 202 to reduce the heat loss of the cleaning fluid in the cleaning chamber 201.
[0057] Further, please refer to Figure 1 , Figure 2 and Figure 3The RCA cleaning machine 010 also includes a cover plate 110, which is connected to and located inside the housing 100, dividing the housing 100 into upper and lower spaces. The cover plate 110 has a first opening 111. The cleaning tank 200 is connected to the cover plate 110 and is located below the cover plate 110, that is, in the space below the interior of the housing 100. The loading / unloading port 202 communicates with the first opening 111. The shielding device 600 includes a first drive assembly 610 and a shielding member 620 that is pulsatorically connected to the first drive assembly 610. A second opening 112 is provided between the cleaning tank 200 and the cover plate 110. The first drive assembly 610 is used to drive the shielding member 620 to slide within the second opening 112 to shield or open the loading / unloading port 202. This configuration ensures the compactness of the RCA cleaning machine 010 structure.
[0058] It should be noted that the shielding component 620 can be a shielding plate. The shielding component 620 shielding the opening 202 can mean that the shielding component 620 completely closes the opening 202, or partially shields the opening 202.
[0059] Optionally, two second openings 112 are provided between the cleaning tank 200 and the cover plate 110, and the two second openings 112 are distributed opposite to each other on both sides of the cleaning tank 200; the RCA cleaning machine 010 includes two shielding devices 600, which are respectively provided on both sides of the cleaning tank 200. The shielding parts 620 of the two shielding devices 600 are provided in a one-to-one correspondence with the two second openings 112. The first driving components 610 of the two shielding devices 600 respectively drive their respective shielding parts 620 to shield or open the loading and unloading port 202.
[0060] In other embodiments, the number of shielding devices 600 and the second opening 112 may be one, three, four, etc., and no specific limitation is made here.
[0061] Optionally, the first drive component 610 may refer to a telescopic component, such as a lead screw component, a push rod component, etc., without being specifically limited here.
[0062] Optionally, the cover plate 110 and the housing 100 may be connected by means including but not limited to fasteners such as bolts, adhesive, or snap-fit.
[0063] Please refer to Figure 3 and Figure 4 The picking and placing device 300 in this embodiment includes a moving mechanism 310 and a picking mechanism 320 that is pulsatorically connected to the moving mechanism 310. The moving mechanism 310 drives the picking mechanism 320 to move above at least two washing tanks 200, and the picking mechanism 320 picks and places the material box 500. This configuration enables automated movement of the material box 500, thereby reducing the labor intensity of manual labor.
[0064] Furthermore, the pick-and-place device 300 includes at least two pick-up mechanisms 320, and the moving mechanism 310 is used to drive the at least two pick-up mechanisms 320 to move to correspond one-to-one with the at least two cleaning pools 200.
[0065] It should be noted that the number of picking mechanisms 320 can be equal to the number of cleaning pools 200. In this way, multiple material boxes 500 can be moved and placed into the corresponding cleaning pools 200 simultaneously. For example, the picking and placing device 300 includes 7 picking mechanisms 320. The 7 picking mechanisms 320 can simultaneously pick up and place material boxes 500 into 7 cleaning pools 200. When the material box 500 is taken out of the cleaning pool 200, the moving mechanism 310 drives the 7 picking mechanisms 320 to move synchronously, so that the material box 500 picked up by the picking mechanism 320 moves to be opposite to another cleaning pool 200. At this time, the material box 500 picked up by at least one of the picking mechanisms 320 does not correspond to any cleaning pool 200. Only the picking mechanism 320 corresponding to the cleaning pool 200 can put the material box 500 into the new cleaning pool 200.
[0066] The structure of the picking mechanism 320 can be configured as needed. In this embodiment, the picking mechanism 320 includes a second driving component 330, a third driving component 340, and two clamping members 350. The second driving component 330 is drivenly connected to the third driving component 340, and both clamping members 350 are drivenly connected to the third driving component 340. The moving mechanism 310 is drivenly connected to the second driving component 330 and is used to drive the second driving component 330 to move the third driving component 340 and the two clamping members 350 synchronously. The second driving component 330 is used to drive the third driving component 340 to move the two clamping members 350 closer to or further away from the cleaning chamber 201. The third driving component 340 is used to drive the two clamping members 350 closer to or further away from each other so that the two clamping members 350 can be used together to pick up and place the material frame 500. In this way, the moving mechanism 310 can be used to drive the second driving component 330, the third driving component 340 and the two clamping members 350 to move synchronously to be opposite to the corresponding cleaning tank 200. The second driving component 330 can be used to drive the third driving component 340 and the two clamping members 350 to rise and fall, so that the clamping members 350 can move into or out of the cleaning chamber 201 of the corresponding cleaning tank 200. Then, the third driving component 340 can drive the two clamping members 350 to move closer to each other to clamp the material frame 500 in the cleaning chamber 201, or to move away from each other to place the material frame 500 in the cleaning chamber 201.
[0067] Furthermore, the moving mechanism 310 includes a fourth drive assembly 311 and a guide assembly 314. The guide assembly 314 includes a slide rail 316 and a slider 315. The slider 315 slides in conjunction with the slide rail 316. At least two cleaning pools 200 are sequentially distributed along the sliding direction of the slider 315 relative to the slide rail 316. The picking mechanism 320 is connected to the fourth drive assembly 311 via the slider 315. The fourth drive assembly 311 drives the slider 315 to move the picking mechanism 320 along the slide rail 316. The guide assembly 314 improves the stability of the moving path of the picking mechanism 320.
[0068] Of course, in other embodiments, the picking mechanism 320 can also be connected to the fourth drive component 311 via the slide rail 316, and the fourth drive component 311 drives the slide rail 316 to move the picking mechanism 320.
[0069] Optionally, the slide rail 316 is fixedly connected to the top wall of the housing 100, and the slide rail 316 is opposite to and spaced apart from the cover plate 110; the second drive assembly 330 of the pickup mechanism 320 is fixedly connected to the slider 315 so that the pickup mechanism 320 is located between the slide rail 316 and the cover plate 110.
[0070] The fourth drive component 311 can be selected as needed; in this embodiment, the fourth drive component 311 is a lead screw drive component, which includes a first motor 312 and a first lead screw 313 that is connected to the first motor 312 in a transmission manner. The first motor 312 is disposed in the housing 100, and the first lead screw 313 is threadedly connected to the slider 315. When the first motor 312 drives the first lead screw 313 to rotate, the slider 315 drives the picking mechanism 320 to slide along the slide rail 316.
[0071] Optionally, the number of sliders 315 can be one or more. In an embodiment where there is one slider 315, multiple picking mechanisms 320 are connected to the same slider 315. In an embodiment where there are multiple sliders 315, the number of sliders 315 can correspond to the number of picking mechanisms 320, that is, the sliders 315 and picking mechanisms 320 are connected one-to-one, and multiple sliders 315 can be slidably mounted on the slide rail 316 and threadedly connected to the first lead screw 313.
[0072] Of course, in other embodiments, the fourth drive assembly 311 may also include an electric actuator, a gear and rack assembly, etc.
[0073] Optionally, the second drive assembly 330 is a lifting assembly, which includes, but is not limited to, a cylinder, an electric push rod, or a lead screw assembly, without specific limitations.
[0074] Optionally, the third drive assembly 340 includes a guide member 341, a second motor 343, and a second lead screw 344. The guide member 341 is provided with a guide groove 342. The second drive assembly 330 is connected to the guide member 341. The second motor 343 is mounted on the guide member 341 and is located outside the guide groove 342. The second motor 343 is drively connected to the second lead screw 344. The second lead screw 344 passes through the guide member 341 and extends into the guide groove 342. Both clamping members 350 are threadedly connected to the second lead screw 344. In this way, when the second motor 343 drives the second lead screw 344 to rotate, it can drive the two clamping members 350 to move closer or further apart.
[0075] Furthermore, the second lead screw 344 includes a first lead screw 313 segment and a second lead screw 344 segment coaxially connected. The first lead screw 313 segment is drivenly connected to the output shaft of the second motor 343. Two clamping members 350 are threadedly connected to the first lead screw 313 segment and the second lead screw 344 segment respectively. The threads (tooth directions) of the first lead screw 313 segment and the second lead screw 344 segment are opposite.
[0076] Optionally, the clamping element 350 can be a straight rod, a hook, or an L-shaped clamping plate, without specific limitations.
[0077] Of course, in other embodiments, the third drive assembly 340 includes two drive members, both of which are mounted on the second drive assembly 330. The two drive members are connected to the two clamping members 350 in a one-to-one transmission connection, so as to drive the two clamping members 350 to move closer or further away from each other through the two drive members. The drive members include, but are not limited to, telescopic mechanisms such as electric push rods.
[0078] Optionally, the RCA cleaner 010 also includes a solution tank 710, which is connected to the cleaning tank 200 (e.g., the solution tank 710 is connected to the cleaning tank 200 via an inlet pipe 711) for supplying cleaning fluid to the cleaning chamber 201. The solution tank 710 can be used to supply new cleaning fluid into the cleaning chamber 201.
[0079] Furthermore, a water pump is provided inside the solution tank 710 or a water pump is provided in the inlet pipe 711, so that the cleaning solution in the solution tank 710 can be sent into the cleaning chamber 201 by the water pump.
[0080] Optionally, the RCA cleaner 010 also includes a collection tank 720 connected to the cleaning tank 200 (e.g., the collection tank 720 is connected to the cleaning tank 200 via an outlet pipe 721) for recovering the cleaning fluid in the cleaning chamber 201. This allows the used cleaning fluid in the cleaning chamber 201 to be drained, facilitating the injection of new cleaning fluid into the cleaning chamber 201.
[0081] Furthermore, the outlet pipe 721 is connected to the bottom wall of the cleaning tank 200 so that the cleaning fluid in the cleaning chamber 201 flows into the collection box 720 under its own weight.
[0082] Of course, in other embodiments, the collection box 720 is equipped with a drain pump or the outlet pipe 721 is equipped with a drain pump, so as to use the drain pump to provide power to discharge the cleaning fluid in the cleaning chamber 201.
[0083] In summary, the RCA cleaning machine 010 of this invention can be used to clean silicon wafers, and the RCA cleaning machine can reduce the power consumption of heating the cleaning fluid to reduce cleaning costs. Moreover, it is easier to control the temperature of the cleaning fluid to improve the cleaning quality of silicon wafers.
[0084] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.
Claims
1. An RCA cleaning machine, characterized in that, include: A cleaning tank (200) has a cleaning chamber (201) and a pick-up / place-out port (202) communicating with the cleaning chamber (201). The pick-up / place-out port (202) is used to pick up / place a material frame (500) into the cleaning chamber (201), and the cleaning chamber (201) is also used to hold cleaning liquid. A pick-and-place device (300) is used to pick up and place the material frame (500) into the cleaning chamber (201); A heating device (410) is disposed in the cleaning tank (200) and is used to heat the cleaning fluid in the cleaning chamber (201); and, An ultrasonic device (420) is disposed in the cleaning tank (200) and is used to cause the cleaning fluid in the cleaning chamber (201) to vibrate ultrasonically.
2. The RCA cleaning machine according to claim 1, characterized in that, The RCA cleaning machine also includes a shielding device (600) for shielding or opening the loading / unloading port (202).
3. The RCA cleaning machine according to claim 2, characterized in that, The RCA cleaning machine also includes a cover plate (110), the cover plate (110) is provided with a first opening (111), the cleaning tank (200) is connected to the cover plate (110), and the loading and unloading port (202) is connected to the first opening (111). The shielding device (600) includes a first driving assembly (610) and a shielding member (620) pulverically connected to the first driving assembly (610). A second opening (112) is provided between the cleaning pool (200) and the cover plate (110). The first driving assembly (610) is used to drive the shielding member (620) to slide within the second opening (112) to shield or open the pick-up and drop-off port (202).
4. The RCA cleaning machine according to claim 1, characterized in that, A support frame (210) is provided inside the cleaning tank (200). The support frame (210) is used to support the material frame (500). A receiving space (211) is provided on the side of the support frame (210) facing the bottom of the cleaning tank (200). The ultrasonic device (420) is located in the receiving space (211).
5. The RCA cleaning machine according to any one of claims 1-4, characterized in that, The RCA cleaning machine includes at least two cleaning tanks (200), at least one of the cleaning tanks (200) is provided with the heating device (410) and the ultrasonic device (420); the pick-and-place device (300) is also used to remove the material frame (500) placed in the cleaning chamber (201) of one of the cleaning tanks (200) and move it to the cleaning chamber (201) of the other cleaning tank (200).
6. The RCA cleaning machine according to claim 5, characterized in that, The pick-and-place device (300) includes a moving mechanism (310) and a picking mechanism (320) pulsatorically connected to the moving mechanism (310). The moving mechanism (310) is used to drive the picking mechanism (320) to move above at least two of the washing pools (200). The picking mechanism (320) is used to pick up and place the material frame (500).
7. The RCA cleaning machine according to claim 6, characterized in that, The pick-and-place device (300) includes at least two of the pick-up mechanisms (320), and the moving mechanism (310) is used to drive at least two of the pick-up mechanisms (320) to move to correspond one-to-one with at least two of the cleaning pools (200).
8. The RCA cleaning machine according to claim 6, characterized in that, The picking mechanism (320) includes a second drive assembly (330), a third drive assembly (340), and two clamping members (350). The second drive assembly (330) is drivenly connected to the third drive assembly (340), and both clamping members (350) are drivenly connected to the third drive assembly (340). The moving mechanism (310) is drivenly connected to the second drive assembly (330) and is used to drive the second drive assembly (330) to move the third drive assembly (340) and the two clamping members (350) synchronously. The second drive assembly (330) is used to drive the third drive assembly (340) to move the two clamping members (350) closer to or away from the cleaning chamber (201). The third drive assembly (340) is used to drive the two clamping members (350) closer to or away from each other, so that the two clamping members (350) are used together to pick up and place the material frame (500); and / or, The moving mechanism (310) includes a fourth driving component (311) and a guiding component (314). The guiding component (314) includes a slide rail (316) and a slider (315). The slider (315) is slidably engaged with the slide rail (316). At least two of the cleaning pools (200) are sequentially distributed along the sliding direction of the slider (315) relative to the slide rail (316). The picking mechanism (320) is connected to the fourth driving component (311) via the slider (315) or the slide rail (316). The fourth driving component (311) drives the slider (315) or the slide rail (316) to move the picking mechanism (320).
9. The RCA cleaning machine according to any one of claims 1-4, characterized in that, The RCA cleaning machine further includes a solution tank (710) connected to the cleaning pool (200) for supplying cleaning fluid to the cleaning chamber (201); and / or, The RCA cleaning machine also includes a collection tank (720), which is connected to the cleaning tank (200) and is used to recover the cleaning fluid in the cleaning chamber (201).
10. The RCA cleaning machine according to any one of claims 1-4, characterized in that, The RCA cleaning machine also includes a housing (100), and the cleaning tank (200) is disposed inside the housing (100); The enclosure (100) is provided with at least one of the following: an observation port (101), a maintenance port (102), and a controller (103).