Wafer separating and combining mechanism

Abstract

The utility model relates to the technical field of semiconductors, in particular to a wafer separating and combining mechanism, which comprises a first supporting piece, a second supporting piece and a separating and combining driving unit in driving connection with the first supporting piece and the second supporting piece, the first supporting piece is provided with a plurality of first positioning grooves for placing wafers, and the second supporting piece is provided with a plurality of second positioning grooves for placing wafers. The second supporting piece is provided with a plurality of second positioning grooves used for placing wafers, the first positioning grooves are parallel to the second positioning grooves, and the opening and closing driving unit is used for enabling the first supporting piece and the second supporting piece to be close to each other or away from each other; according to the utility model, batch transfer of wafers can be automatically realized, the defects of low efficiency, strong subjectivity, high error rate and the like of manual operation are improved, batch combination and separation of wafers are satisfied, and the wafer transmission efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technical field especially is a wafer divides and combines mechanism. BACKGROUND

[0002] In the semiconductor industry, wafer transmission process is a key step in semiconductor manufacturing, according to international standard wafer piece body every box 25 pieces, in order to improve wafer transmission efficiency, need to combine 25 wafers in two piece boxes into 50 pieces, adopt the method of mechanical to transfer wafer piece from one piece box to another piece box to meet the needs of subsequent processing or testing.

[0003] However, the traditional wafer piece transmission adopts manual transfer, which leads to low efficiency, strong subjectivity and high error rate of manual operation, affecting wafer transmission efficiency. UTILITY MODEL CONTENT

[0004] The utility model provides a wafer divides and combines mechanism in view of prior art's insufficient, can realize the batch transfer of wafer automatically, improves the low efficiency, strong subjectivity and high error rate of manual operation, meets the batch combination and separation between wafers, improves wafer transmission efficiency.

[0005] In order to solve the above technical problems, the utility model adopts the following technical scheme:

[0006] The utility model provides a wafer divides and combines mechanism, including first support piece, second support piece and with the drive connection of first support piece and second support piece divides and combines drive unit, first support piece is provided with a plurality of first positioning slot for placing wafer, second support piece is provided with a plurality of second positioning slot for placing wafer, first positioning slot and second positioning slot are parallel, divides and combines drive unit is used to make first support piece and second support piece close to each other or away from each other;

[0007] When needing to combine the wafer in first positioning slot and second positioning slot, divides and combines drive unit drives first support piece and second support piece to move, makes first support piece and second support piece close, makes first positioning slot and second positioning slot combine;

[0008] When needing to split the wafer in the close first positioning slot and second positioning slot, divides and combines drive unit drives first support piece and second support piece to move, makes first positioning slot and second positioning slot separate.

[0009] Wherein, first support piece is provided with two first support parts symmetrically, first positioning slot is arranged at first support part, and first positioning slot is matched with wafer.

[0010] The second support part is provided with a second positioning groove, and the second positioning groove is matched with a wafer.

[0011] The first support part is provided with a first lifting space, and the second support part is provided with a second lifting space.

[0012] The first lifting space and the second lifting space are connected when the first support part and the second support part are close to each other.

[0013] The first positioning groove is in an arc structure, and the centers of every two first positioning grooves matched with the same wafer are coincident.

[0014] The first positioning groove is provided with a first guide part on at least one side of the opening end, and the gap between the first guide part and the first positioning groove gradually decreases from the opening end to the inside.

[0015] The first support part is provided with a plug-in groove on the side close to the second support part, the second support part is provided with a plug-in part on the side close to the first support part, and the plug-in part is matched with the plug-in groove.

[0016] The plug-in part is matched and inserted into the plug-in groove when the first support part and the second support part are close to each other.

[0017] The distance between two adjacent first positioning grooves is L1, the distance between two adjacent second positioning grooves is L2, the minimum distance between the adjacent first positioning groove and the second positioning groove is L3 when the first support part and the second support part are close to each other, and L1, L2 and L3 satisfy L1=L2=L3.

[0018] The split and combination driving unit is provided with a reverse synchronous double sliding seat module, and the two output ends of the split and combination driving unit are connected with the first support part and the second support part respectively.

[0019] The wafer split and combination mechanism has the following beneficial effects:

[0020] The wafer split and combination mechanism can ensure the transmission stability of the wafer, automatically realize the batch transfer of the wafer, improve the low efficiency, strong subjectivity and high error rate of manual operation, meet the batch combination and separation of the wafers, and improve the wafer transmission efficiency. DRAWINGS

[0021] Figure 1 It is a front view of the wafer split and combination mechanism.

[0022] Figure 2 It is a structure schematic view when the first support part and the second support part are close to each other.

[0023] Figure 3A perspective view of the first support with a wafer placed thereon.

[0024] Figure 4 A perspective view of the second support with a wafer placed thereon.

[0025] 1. first support; 101. first positioning slot; 1011. first guide portion;

[0026] 11. first supporting portion; 12. first lifting space; 13. insertion slot;

[0027] 2. second support; 201. second positioning slot;

[0028] 21. second supporting portion; 22. second lifting space; 23. insertion member;

[0029] 3. split and combination driving unit. DETAILED DESCRIPTION

[0030] For the convenience of the understanding of those skilled in the art, the present application will be further described below in conjunction with the embodiments and the accompanying drawings. The specific embodiments of the present application will be described below, and it should be noted that, in the specific description of these embodiments, the present specification cannot possibly describe all the features of the actual embodiments in detail for the sake of concise and brief description.

[0031] Reference Figures 1 to 4As shown, the utility model provides a wafer divides and combines mechanism, including first support piece 1, second support piece 2 and with the drive connection of first support piece 1 and second support piece 2 divides and combines drive unit 3, first support piece 1 is provided with a plurality of first locating groove 101 for placing wafer, second support piece 2 is provided with a plurality of second locating groove 201 for placing wafer, first locating groove 101 and second locating groove 201 are parallel, and divides and combines drive unit 3 is used to make first support piece 1 and second support piece 2 approach each other or away from each other;When practical, divides and combines drive unit 3 adopts reverse synchronous double slide base module, and the two output ends of divides and combines drive unit 3 are connected with first support piece 1 and second support piece 2 respectively, when needing to merge the wafer in first locating groove 101 and second locating groove 201, divides and combines drive unit 3 drives first support piece 1 and second support piece 2 to move, so that first support piece 1 and second support piece 2 approach, so that first locating groove 101 and second locating groove 201 merge, and it is convenient for mechanical hand to smoothly clamp wafer;Similarly, when needing to place wafer into first support piece 1 and second support piece 2, first support piece 1 and second support piece 2 are approached first, and wafer is inserted into corresponding first locating groove 101 and second locating groove 201, so that mechanical hand smoothly places wafer in first support piece 1 and second support piece 2;When needing to split the wafer in the first locating groove 101 and second locating groove 201 that approach, divides and combines drive unit 3 drives first support piece 1 and second support piece 2 to move, so that first locating groove 101 and second locating groove 201 are separated;Specifically, corresponding visual detector can be installed, so as to detect whether wafer is effectively placed in first support piece 1 or second support piece 2, corresponding distance sensor or limit switch can also be arranged to detect whether first support piece 1 and second support piece 2 approach, guarantee the transmission stability of wafer, can automatically realize the batch transfer of wafer, improve the low efficiency, strong subjectivity and high error rate of artificial operation, meet the batch combination and separation between wafers, improve wafer transmission efficiency.

[0032] Reference Figure 1 、 2 As shown, in the embodiment, the first support piece 1 is symmetrically provided with two first support parts 11, the first locating groove 101 is arranged on the first support part 11, the first locating groove 101 cooperates with the wafer, and the two first support parts 11 support the two ends of the bottom of the wafer respectively, so as to guarantee the positioning stability of the wafer.

[0033] Reference Figure 3As shown, in the embodiment, a first lifting space 12 is arranged between two first support parts 11, and a second lifting space 22 is arranged between two second support parts 21; in actual application, when the first support part 1 and the second support part 2 are close to each other, the first lifting space 12 and the second lifting space 22 are connected, the mechanical hand is convenient to extend into the first lifting space 12 and the second lifting space 22, so as to stably support the bottom of the wafer and ensure the stable transfer of the wafer.

[0034] In the embodiment, the first positioning groove 101 is in an arc structure, the centers of every two first positioning grooves 101 adapted to the same wafer coincide, so as to improve the plug-in stability of the wafer; specifically, the first positioning groove 101 and the second positioning groove 201 have the same structure, so as to improve the plug-in stability of the wafer, and the wafer can be stably and smoothly loaded into the second support part 2.

[0035] Reference Figure 3 As shown, in the embodiment, at least one side of the opening end of the first positioning groove 101 is provided with a first guide part 1011, the gap between the first guide part 1011 and the first positioning groove 101 gradually decreases inward from the opening end of the first positioning groove 101, the first guide part 1011 guides the plug-in and pull-out between the wafer and the first positioning groove 101, and the positioning speed of the wafer is improved; similarly, the first positioning groove 101 and the second positioning groove 201 have the same structure, the wafer can smoothly and quickly realize the plug-in and pull-out between the second positioning groove 201, and the positioning speed of the wafer is improved.

[0036] Reference Figure 3 , 4 As shown, in the embodiment, the side of the first support part 1 close to the second support part 2 is provided with a plug-in groove 13, the side of the second support part 2 close to the first support part 1 is provided with a plug-in part 23, and the plug-in part 23 is matched with the plug-in groove 13; in actual application, when the first support part 1 and the second support part 2 are close to each other, the plug-in part 23 is matched and inserted into the plug-in groove 13, so as to accurately position the first support part 1 and the second support part 2, improve the positioning precision between the first support part 1 and the second support part 2, and ensure the positioning accuracy of the wafer.

[0037] Reference Figure 2 As shown, in the embodiment, the distance between two adjacent first positioning grooves 101 is L1, the distance between two adjacent second positioning grooves 201 is L2, and the minimum distance between the adjacent first positioning groove 101 and the second positioning groove 201 is L3 when the first support part 1 and the second support part 2 are close to each other; L1, L2 and L3 satisfy L1=L2=L3, so that the interval between every two adjacent wafers is the same when the first support part 1 and the second support part 2 are close to each other, the wafer is stably transferred, the mechanical hand is quickly positioned and grasped, and the wafer transfer efficiency is improved.

[0038] The above is only the preferred embodiment of the present application, and does not limit the present application in any form. Although the present application is disclosed as above with the preferred embodiment, it is not intended to limit the present application. Any skilled person in the art can make some changes or modifications to the disclosed technical content without departing from the technical solution of the present application, and any equivalent embodiment with equivalent changes is equivalent to the above embodiment. Any simple modification, equivalent change and modification of the above embodiment according to the present application are within the scope of the technical solution of the present application.

Claims

1. A wafer dividing and combining mechanism characterized by comprising: The utility model relates to a wafer placing device, including first support (1), second support (2) and with first support (1) and second support (2) drive connection's split and combination drive unit (3), first support (1) is provided with a plurality of first positioning groove (101) for placing wafer, second support (2) is provided with a plurality of second positioning groove (201) for placing wafer, first positioning groove (101) and second positioning groove (201) are parallel, split and combination drive unit (3) is used for making first support (1) and second support (2) approach each other or away from each other, when needing to combine wafer in first positioning groove (101) and second positioning groove (201), split and combination drive unit (3) drives first support (1) and second support (2) to move, so that first support (1) and second support (2) approach, so that first positioning groove (101) and second positioning groove (201) are combined, when needing to split wafer in the first positioning groove (101) and the second positioning groove (201) that approach, split and combination drive unit (3) drives first support (1) and second support (2) to move, so that first positioning groove (101) and second positioning groove (201) are separated.

2. The wafer dividing and combining mechanism according to claim 1, wherein The first support (1) is symmetrically provided with two first support parts (11), the first positioning groove (101) is arranged in the first support part (11), and the first positioning groove (101) is matched with the wafer. The second support (2) is symmetrically provided with two second support parts (21), the second positioning groove (201) is arranged in the second support part (21), and the second positioning groove (201) is matched with the wafer.

3. The wafer dividing and combining mechanism according to claim 2, wherein Two first support parts (11) are provided with a first lifting space (12) therebetween, and two second support parts (21) are provided with a second lifting space (22) therebetween. When the first support (1) and the second support (2) approach, the first lifting space (12) and the second lifting space (22) are butted.

4. The wafer dividing and combining mechanism according to claim 2, wherein The first positioning groove (101) is in an arc shape structure, and the centers of every two first positioning grooves (101) matched with the same wafer coincide.

5. The wafer dividing and combining mechanism according to claim 4, wherein At least one side of the opening end of the first positioning groove (101) is provided with a first guide part (1011), and the gap between the first guide part (1011) and the first positioning groove (101) gradually decreases inward from the opening end of the first positioning groove (101).

6. The wafer dividing and combining mechanism according to claim 1, wherein The side of the first support (1) close to the second support (2) is provided with a plug-in groove (13), the side of the second support (2) close to the first support (1) is provided with a plug-in part (23), and the plug-in part (23) is matched with the plug-in groove (13). When the first support (1) and the second support (2) approach, the plug-in part (23) is matched and inserted into the plug-in groove (13).

7. The wafer dividing and combining mechanism according to claim 1, wherein The distance between two adjacent first positioning grooves (101) is L1, the distance between two adjacent second positioning grooves (201) is L2, and the minimum distance between adjacent first positioning grooves (101) and second positioning grooves (201) when the first support (1) and the second support (2) are close together is L3; L1, L2 and L3 satisfy L1=L2=L3.

8. The wafer dividing and assembling mechanism according to claim 1, wherein The split and combination driving unit (3) adopts a reverse synchronous double slide module, and two output ends of the split and combination driving unit (3) are connected with the first support (1) and the second support (2) respectively.

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