Feeding mechanism for chip packaging test

Abstract

The utility model discloses a feeding mechanism for chip packaging test, which belongs to the technical field of chip packaging and comprises a protective shell and an air cylinder, an ion fan body is mounted on the top surface of the inner wall of the protective shell, an adjusting assembly is arranged outside the ion fan body and comprises a mounting frame, a rotating rod is arranged on one side of the bottom end of the mounting frame, and the rotating rod is connected with the air cylinder. The other side of the bottom end of the mounting frame is provided with an insertion hole, the inner wall of the insertion hole is connected with a spring, the bottom end of the spring is connected with an insertion rod, a mounting hole is formed in the top face of the protective shell in a penetrating mode, and the top end of the air cylinder penetrates through the mounting hole to be connected with a mounting base; limiting rods are connected to two sides of the top end of the mounting seat. According to the utility model, the flow direction and coverage range of ion air can be flexibly changed as required through the adjusting assembly, the ion air accurately acts on each part of the chip, no cleaning dead angle is ensured, and the dust and static electricity removing effect is further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip packaging technical field, concretely is a kind of feeding mechanism for chip packaging test. BACKGROUND

[0002] In the vigorous development of chip manufacturing industry, chip packaging test as key link, precision, cleanliness and efficiency requirement is extremely high, when carrying out chip packaging work needs to use feeding mechanism to carry out conveying work.

[0003] The air direction of the ion fan of the existing feeding mechanism cannot be flexibly adjusted, the airflow cannot be accurately directed to each part of the chip, there may be dead angles that cannot be cleaned, dust may accumulate on the surface of the chip, and static electricity cannot be effectively eliminated, resulting in that in some chip areas that are sensitive to static electricity and dust, static electricity and dust cannot be effectively removed, thereby increasing the risk of short circuit, performance degradation and other adverse phenomena of the chip due to static electricity adsorbing dust impurities. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of feeding mechanism for chip packaging test, by adjusting assembly, ion wind direction and coverage range can be flexibly changed as needed, accurately act on each part of chip, ensure that there is no cleaning dead angle, further improve dust and static electricity removal effect.

[0005] The utility model is realized by the following technical solutions:

[0006] The utility model is a kind of feeding mechanism for chip packaging test, including protective shell and air cylinder, the inner wall top surface of protective shell is installed with ion fan body, adjusting assembly is set on the outside of ion fan body, adjusting assembly includes installation frame, installation frame bottom end one side is provided with swivel bar, swivel bar one side is connected with baffle, installation frame bottom surface both sides are connected with folding baffle, plug hole is set in the other side of installation frame bottom end, spring is connected in the inner wall of plug hole, plug rod is connected in the bottom end of spring;

[0007] The top surface of protective shell is set through installation hole, the top end of air cylinder is connected with mounting seat through installation hole, limit roller is rotatably connected on mounting seat, limit rod is connected on the both sides of the top end of mounting seat.

[0008] Further, the protective shell is a rectangular box-shaped with two open ends, four corners of the bottom end of the protective shell are provided with support legs, respectively, and a conveyor belt is installed on the inner bottom surface of the support leg.

[0009] Further, the top surface of the ion fan body is vertically arranged on one side of the inner wall top surface of the protective shell, the installation frame is a semi-enclosed "C" shaped frame, and the inner wall of the installation frame is in contact with the outer wall of the ion fan body.

[0010] Further, the mounting frame is connected with the baffle through a rotating rod, and the spring is connected with the baffle through two inserting rods.

[0011] Further, the limiting roller is located above the conveying belt, the limiting roller is connected with the limiting rod through the mounting seat, and the through holes are arranged on both sides of the mounting hole in the top surface of the protective shell.

[0012] The utility model has the following beneficial effects:

[0013] The utility model discloses a ion fan body and adjusting assembly cooperate, can real -time regulation and control ion balance, satisfy super -clean requirement, accurate control ion wind, dust -removing and electrostatic effect are good, ensure that chip clean maintains ideal ion balance, greatly reduce the incidence of short circuit, performance degradation and other bad phenomenon of chip because of electrostatic adsorption dust impurity, through adjusting assembly can change ion wind direction and coverage range as needed, accurate effect in each part of chip, ensure that there is no cleaning dead angle, further improve dust -removing and electrostatic effect.

[0014] Of course, implementing any product of the utility model does not necessarily need to achieve all the advantages described above. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a structure schematic view of the feeding mechanism;

[0016] Figure 2 It is a structure schematic view of the feeding mechanism;

[0017] Figure 3 It is a structure schematic view of the ion fan body and adjusting assembly;

[0018] Figure 4 It is an explosion structure schematic view of the adjusting assembly.

[0019] In the drawing: 1, support leg;2, protective shell;3, conveying belt;4, ion fan body;5, adjusting assembly;501, mounting frame;502, rotating rod;503, baffle;504, folding baffle;505, spring;506, inserting rod;6, air cylinder;7, mounting seat;8, limiting roller;9, limiting rod. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be described clearly and completely below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0021] Please refer to Figures 1-4 The utility model provides a kind of technical scheme: a feeding mechanism for chip package test, including protective shell 2 and further including air cylinder 6, protective shell 2 is the long cuboid box of two ends opening, four corners of the bottom end of protective shell 2 is respectively provided with support leg 1, support leg 1 inside bottom surface is equipped with conveyor belt 3, conveyor belt 3 can stably and continuously transport chip to be packaged test, ensure the high efficiency of material flow, the inner wall top surface of protective shell 2 is equipped with ion fan body 4, guarantee the key of chip cleanliness, the model of ion fan body 4 is KF-19PL ion fan, with high-precision self feedback system, can real-time monitoring and adjustment ion balance, satisfy the high standard requirement of super-clean workshop to production environment, ion fan body 4 is provided with adjusting assembly 5 outside, adjusting assembly 5 includes mounting frame 501, ion fan body 4 top surface is vertically provided in the inner wall top surface of protective shell 2 one side, mounting frame 501 is half-enclosed "C" shape frame shape, mounting frame 501 inner wall is in contact with the outer wall of ion fan body 4, mounting frame 501 bottom end one side is provided with rotating rod 502, rotating rod 502 one side is connected with baffle 503, mounting frame 501 bottom surface two sides are connected with folding baffle 504, folding baffle 504 can be unfolded or folded according to actual working condition, optimize the distribution of ion wind on conveyor belt 3, mounting frame 501 bottom end other side is provided with insertion hole, insertion hole inner wall is connected with spring 505, spring 505 bottom end is connected with insertion rod 506, mounting frame 501 is connected baffle 503 by rotating rod 502, spring 505 is connected baffle 503 by insertion rod 506, both can guarantee the fixed position of baffle 503 under normal state, and can easily overcome elastic force to operate when needing adjustment, ensure that the whole adjusting process is convenient, reliable, the number of insertion rod 506 is two, two insertion rods 506 are between two folding baffles 504, when needing to adjust the flow direction or coverage range of ion wind, insertion rod 506 is pushed down, changes the angle of baffle 503 by rotating rod 502 and baffle 503 cooperation, accurately controls ion wind output direction, satisfies the demand of different area chip to static electricity elimination and dust removal, protective shell 2 top surface is provided with mounting hole, air cylinder 6 top end is connected mounting seat 7 by mounting hole, mounting seat 7 is rotatably connected with limit roller 8, mounting seat 7 top end two sides are connected with limit rod 9, limit roller 8 is located above conveyor belt 3, with the telescoping of air cylinder 6, limit roller 8 can accurately lift, the height of chip on conveyor belt 3 is limited, prevent chip from displacement, stacking due to jolt, vibration in transport process, ensure that chip orderly advances, limit roller 8 is connected with limit rod 9 by mounting seat 7, protective shell 2 top surface mounting hole two sides are provided with through hole, limit rod 9 one end is connected in mounting seat 7 top surface by through hole, limit rod 9 provides reliable guide for the lifting action of limit roller 8, so that the whole feeding mechanism can stably, accurately convey chip to each station in chip package test process, greatly improve package test efficiency, guarantee chip product quality.

[0022] The preferred embodiments disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details and do not limit the utility model to the specific embodiments described. Obviously, according to the content of the description, many modifications and changes can be made. The description selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that the skilled in the art can well understand and utilize the utility model. The utility model is limited by the claims and the entire scope and equivalents thereof.

Claims

1. A feeding mechanism for chip packaging testing, comprising a protective shell (2), characterized in that: The protective shell (2) has an ion fan body (4) installed on the top surface of its inner wall. An adjustment component (5) is provided on the outside of the ion fan body (4). The adjustment component (5) includes a mounting frame (501). A rotating rod (502) is provided on one side of the bottom end of the mounting frame (501). A baffle (503) is connected to one side of the rotating rod (502). Folding baffles (504) are connected to both sides of the bottom surface of the mounting frame (501). An insertion hole is opened on the other side of the bottom end of the mounting frame (501). A spring (505) is connected to the inner wall of the insertion hole. A insertion rod (506) is connected to the bottom end of the spring (505). It also includes a cylinder (6), the top surface of the protective shell (2) is provided with a through mounting hole, the top of the cylinder (6) is connected to the mounting seat (7) through the mounting hole, the mounting seat (7) is rotatably connected to a limit roller (8), and the top two sides of the mounting seat (7) are connected to limit rods (9).

2. The feeding mechanism for chip packaging testing according to claim 1, characterized in that, The protective shell (2) is a rectangular box with openings at both ends. Support legs (1) are provided at the four corners of the bottom of the protective shell (2). A conveyor belt (3) is installed on the bottom surface inside the support legs (1).

3. The feeding mechanism for chip packaging testing according to claim 1, characterized in that, The top surface of the ion fan body (4) is vertically disposed on one side of the top surface of the inner wall of the protective shell (2). The mounting frame (501) is a semi-enclosed "C" shaped frame. The inner wall of the mounting frame (501) is abutted against the outer wall of the ion fan body (4).

4. The feeding mechanism for chip packaging testing according to claim 3, characterized in that, The mounting frame (501) is connected to the baffle (503) via a rotating rod (502), and the spring (505) is connected to the baffle (503) via a plug rod (506). There are two plug rods (506), and the two plug rods (506) are located between the two folding baffles (504).

5. The feeding mechanism for chip packaging testing according to claim 1, characterized in that, The limiting roller (8) is located above the conveyor belt (3). The limiting roller (8) is connected to the limiting rod (9) through the mounting base (7). The protective shell (2) has through holes on both sides of the mounting hole on the top surface. One end of the limiting rod (9) passes through the through hole and is connected to the top surface of the mounting base (7).

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