Wafer positioning pin jig

Abstract

The utility model provides a wafer positioning pin jig. The wafer positioning pin jig comprises a base and a clamping device. The base comprises a first end and a second end which are far away from each other in the first direction. The clamping device comprises a first clamping piece and a second clamping piece, the upper end of the first clamping piece is fixedly arranged at the first end of the base, the lower end of the first clamping piece is provided with a clamping part matched with a groove structure of a wafer positioning pin, and the second clamping piece is installed on the lower portion of the base in the mode that the second clamping piece can slide in the first direction. The side, facing the clamping part of the first clamping piece, of the second clamping piece is provided with a clamping face, and the clamping face is an arc-shaped concave face matched with the wafer positioning pin in appearance. According to the technical scheme, good shape matching with the wafer positioning pin can be formed, stable clamping of the wafer positioning pin in the dismounting and mounting process is ensured, the wafer positioning pin is effectively prevented from loosening or falling off, and the operation reliability is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing, and more specifically, to a wafer positioning pin fixture. Background Technology

[0002] In semiconductor manufacturing, after certain processes (such as polishing and chemical vapor deposition), wafers often retain contaminants or oxides on their surface. Therefore, after these processes, the wafer surface must be cleaned to ensure cleanliness and product quality, facilitating subsequent processes. Typically, during cleaning, the wafer is placed on a rotating stage, and multiple wafer locating pins are used to secure and support its edges to prevent accidental displacement and damage. The stage then rotates the wafer while cleaning fluid is sprayed onto its surface. This fluid, under centrifugal force, flows along the wafer surface, effectively cleaning impurities.

[0003] However, in existing technologies, due to the lack of dedicated tools for removing and installing wafer locating pins, technicians typically perform these operations manually. Because manual removal and installation is inefficient, this method can lead to prolonged production interruptions, potentially becoming a bottleneck in the entire semiconductor manufacturing process and significantly impacting production efficiency. Improper manual operation can also cause removed wafer locating pins to fall into the cleaning equipment. Such incidents not only require additional time and manpower for disassembly and cleaning but may also damage the cleaning equipment, further increasing labor and material costs. Furthermore, since wafer cleaning solutions are often corrosive or toxic, direct contact with wafer locating pins increases the threat to personnel's health. Utility Model Content

[0004] The purpose of this application is to provide a wafer positioning pin fixture that can form a good shape fit with the wafer positioning pin, ensuring stable clamping of the wafer positioning pin during disassembly and assembly, thereby effectively preventing the wafer positioning pin from loosening or falling off and improving the reliability of operation.

[0005] This application provides a wafer positioning pin fixture, including a base and a clamping device. The base includes a first end and a second end that are spaced apart from each other along a first direction. The clamping device includes a first clamping member and a second clamping member. The upper end of the first clamping member is fixedly disposed at the first end of the base, and its lower end has a clamping portion that mates with the groove structure of the wafer positioning pin. The second clamping member is slidably mounted on the lower part of the base. The side of the second clamping member facing the clamping portion of the first clamping member has a clamping surface, which is an arc-shaped concave surface adapted to the shape of the wafer positioning pin.

[0006] In use, the clamping part of the first clamping member engages with the groove structure on the upper part of the wafer positioning pin, and the clamping surface of the second clamping member is in contact with the cylindrical surface on the back side of the groove structure of the wafer positioning pin.

[0007] In one feasible solution, a linear guide structure is provided on the lower surface of the base along a first direction, and a slider structure that cooperates with the linear guide structure is provided on the second clamping member.

[0008] In one feasible solution, the slider structure of the second clamping member is provided with balls or rollers to reduce the friction between the linear guide structure and the second clamping member.

[0009] In one feasible embodiment, the wafer positioning pin fixture further includes an elastic element, a first end of which is connected to a second clamping member, and a second end of which is connected to a base. The elastic element provides an elastic force to the second clamping member to move toward the first clamping member.

[0010] In one feasible embodiment, the first clamp and / or the second clamp are detachably connected to the base.

[0011] In one feasible solution, a soft buffer layer that increases friction is provided on the clamping part and / or clamping surface.

[0012] In one feasible solution, the surface of the base is provided with a grip portion, which has a recessed portion that conforms to the fingers and a textured surface that has an anti-slip effect.

[0013] In one feasible embodiment, the wafer positioning pin fixture further includes a driver and a controller, the controller being signal-connected to the driver for controlling the driver to drive the base to a specified position and to drive the second clamping member away from or towards the first clamping member.

[0014] In one feasible solution, a pressure sensor is provided on the clamping surface of the second clamping member to detect whether the pressure applied by the wafer positioning pin fixture to the wafer positioning pin meets a preset standard.

[0015] Compared with the prior art, the beneficial effects of this application include at least the following:

[0016] This application provides a wafer positioning pin fixture, wherein the first clamping member and the second clamping member are respectively designed with a clamping part that mates with the groove structure of the wafer positioning pin and a clamping surface with an arc-shaped concave structure, which can form a good shape fit with the wafer positioning pin, ensuring stable clamping of the wafer positioning pin during disassembly and assembly, thereby effectively preventing the wafer positioning pin from loosening or falling off and improving the reliability of operation. Furthermore, by setting an elastic element, a stable clamping force can be provided to the second clamping member, which can automatically adapt to different clamping requirements during clamping, while absorbing the impact force generated during operation, reducing damage to the wafer positioning pin, extending its service life, thereby achieving a firm clamping of the wafer positioning pin and smoothly carrying out subsequent wafer positioning pin disassembly and assembly operations.

[0017] The wafer positioning pin fixture provided in this application has a simple structure, low manufacturing and maintenance costs, and is easy to operate, which helps improve work efficiency and reduce reliance on the skill level of operators, thereby reducing labor costs. Furthermore, using the wafer positioning pin fixture provided in this application eliminates the need for operators to directly contact the wafer positioning pins, thus helping to protect the health and safety of operators. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of a wafer positioning pin fixture according to an embodiment of this application;

[0020] Figure 2 An exploded view of a wafer positioning pin fixture;

[0021] Figure 3 Side view of the wafer positioning pin fixture;

[0022] Figure 4 A bottom view of the wafer positioning pin fixture;

[0023] Figure 5 This is a schematic diagram of a wafer positioning pin fixture in its working state.

[0024] In the figure: 1. Base; 2. Clamping device; 3. Elastic element; 4. Wafer positioning pin; 5. Driver; 6. Controller; 101. Linear guide structure; 102. Sealing block; 103. First fixing screw; 201. First clamping member; 202. Second clamping member; 203. Second fixing screw; 211. Clamping part; 212. Clamping surface; L1. First direction. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0027] like Figures 1-5 As shown, this application provides a wafer positioning pin fixture for clamping wafer positioning pins and performing assembly / disassembly operations on wafer positioning pins with a grooved structure on one side and a cylindrical surface on the other. The wafer positioning pin fixture includes a base 1 and a clamping device 2. The base 1 includes a first end and a second end that are far apart from each other along a first direction L1. The clamping device 2 includes a first clamping member 201 and a second clamping member 202. The upper end of the first clamping member 201 is fixedly disposed on the first end of the base 1, and its lower end is provided with a clamping portion 211 that cooperates with the grooved structure of the wafer positioning pin. The second clamping member 202 is mounted on the lower part of the base 1 in a manner that allows it to slide along the first direction L1. The second clamping member 202 has a clamping surface 212 on the side facing the clamping portion 211 of the first clamping member 201. The clamping surface 212 is an arc-shaped concave surface adapted to the shape of the wafer positioning pin.

[0028] like Figure 1As shown, one side of the upper part of the wafer positioning pin has a groove structure for locking the wafer edge, and the other side is a cylindrical surface. In use, the clamping part 211 of the first clamping member 201 matches the shape of the groove structure on the upper part of the wafer positioning pin, and the clamping surface 212 of the second clamping member 202 fits against the cylindrical surface on the back side of the groove structure of the wafer positioning pin, forming a firm connection between the clamping device 2 and the wafer positioning pin. Then, the wafer positioning pin fixture can be used to perform subsequent operations such as assembling and disassembling the wafer positioning pin. The first clamping member 201 and the second clamping member 202 can form a good shape fit with the wafer positioning pin, ensuring stable clamping of the wafer positioning pin during assembly and disassembly, thereby effectively preventing the wafer positioning pin from loosening or falling off and improving the reliability of the operation.

[0029] The base 1 and clamping device 2 can be made of corrosion-resistant polymer materials, preferably polyetheretherketone (PEEK). This is because during wafer cleaning, the cleaning solution used may be corrosive and could damage the wafer positioning pin fixture. PEEK has excellent corrosion resistance and can withstand the erosion of most chemical reagents, including strong acids, strong alkalis, and organic solvents, helping to maintain the stability of the base 1 and clamping device 2 and extend their service life. In addition, PEEK material has good strength, fatigue resistance, and wear resistance, which can reduce the risk of wear and fatigue fracture of the base 1 and clamping device 2.

[0030] The wafer positioning pin fixture provided in this application has a simple structure, low manufacturing and maintenance costs, and is easy to operate, which helps improve work efficiency and reduce reliance on the skill level of operators, thereby reducing labor costs. Furthermore, using the wafer positioning pin fixture provided in this application eliminates the need for operators to directly contact the wafer positioning pins, thus helping to protect the health and safety of operators.

[0031] like Figure 2 and Figure 4As shown, a linear guide structure 101 can be provided on the lower surface of the base 1, and a slider structure that cooperates with the linear guide structure 101 can be provided on the second clamping member 202. Through the cooperation of the linear guide structure 101 and the slider structure, the second clamping member 202 can move smoothly along a predetermined straight path, achieving precise guidance of the second clamping member 202 and reducing clamping errors caused by the shaking or offset of the second clamping member 202. Furthermore, ball bearings or rollers can be provided on the slider structure to reduce the friction between the linear guide structure 101 and the second clamping member 202, making it easier for operators to pull the second clamping member 202 to clamp the wafer positioning pin, while minimizing the risk of jamming between the second clamping member 202 and the base 1 due to excessive friction. If jamming occurs, the wafer positioning pin fixture may not have sufficient clamping force on the wafer positioning pin, potentially causing production accidents such as the wafer positioning pin falling off.

[0032] In use, slide the second clamping member 202 along the first direction L1 away from the first clamping member 201, place the wafer positioning pin between the first clamping member 201 and the second clamping member 202, and then slide the second clamping member 202 along the first direction L1 again to approach the first clamping member 201 and fix it in an appropriate position (it can be fixed by snap-fit ​​or tenon joint, and there are no restrictions here), so that the clamping device 2 and the wafer positioning pin are firmly connected. Then the wafer positioning pin fixture can be used to perform subsequent operations such as disassembly and assembly of the wafer positioning pin.

[0033] In one embodiment, the wafer positioning pin fixture further includes an elastic element 3, with a first end connected to a second clamping member 202 and a second end connected to a base 1. The second clamping member 202 is mounted on the base 1 in a manner that allows it to slide along a first direction L1, and the elastic element 3 provides an elastic force to the second clamping member 202 to move closer to the first clamping member 201.

[0034] Preferably, the elastic element 3 can be located inside the linear guide structure 101. In use, the elastic element 3 can provide a stable clamping force for the second clamping element 202, enabling the second clamping element 202 to automatically adapt to the clamping requirements of wafer positioning pins of different sizes. At the same time, it absorbs the impact force generated during operation, reduces damage to the wafer positioning pins, and extends their service life, thereby achieving a firm clamping of the wafer positioning pins and smoothly carrying out subsequent wafer positioning pin assembly and disassembly operations.

[0035] The surface of the elastic element 3 can be coated with a corrosion-resistant polymer material, preferably a polytetrafluoroethylene (PTFE) coating. PTFE has excellent corrosion resistance, effectively preventing the internal elastic element 3 from being corroded. Furthermore, the PTFE coating has a smooth surface, which helps reduce wear on the elastic element 3 during use and makes its expansion and contraction smoother. In addition, because it adheres minimally to other substances, the cleaning process for the PTFE coating is simple and convenient, helping to reduce maintenance time and costs.

[0036] In one embodiment, the first clamping member 201 and / or the second clamping member 202 are detachably connected to the base 1, and the specific connection methods include, but are not limited to, threaded connection, snap-fit ​​connection, and tenon and mortise connection. Specifically, as shown... Figure 1 As shown, the first clamping member 201 can be mounted on the first end of the base 1 by the second fixing screw 203, and the first clamping member 201 can be removed by removing the second fixing screw 203. Figure 4 As shown, the first end and the second end of the linear guide structure 101 are close to the first end and the second end of the base 1, respectively. A detachable sealing block 102 can be provided at the second end of the linear guide structure 101, and one end of the elastic member 3 can be connected to the sealing block 102. The sealing block 102 can be connected to the base 1 by the first fixing screw 103. If the second clamping member 202 needs to be removed, the first fixing screw 103 can be removed first to take out the sealing block 102, and then the elastic member 3 and the second clamping member 202 can be removed in sequence.

[0037] like Figure 2 and Figure 4 As shown, when using a spring as the elastic element 3, spring guide rods can be respectively set on the second clamping member 202 and the sealing block 102, and the two ends of the elastic element 3 can be respectively sleeved on the two spring guide rods, so that the elastic element 3 can extend and retract more smoothly along the first direction L1, reducing the possibility of accidental displacement of the elastic element 3 during the extension and retraction process. In addition, an elastic sheet can also be used as the elastic element 3, and no further restrictions are imposed here.

[0038] In one embodiment, a soft buffer layer (not shown) is provided on the clamping portion 211 and / or the clamping surface 212 to increase friction. The soft buffer layer significantly increases the friction between the clamping portion 211 and / or the clamping surface 212 and the wafer positioning pin, effectively preventing the wafer positioning pin from slipping during clamping. Furthermore, the soft buffer layer helps to better adapt to irregularities and minor defects on the surface of the wafer positioning pin, providing more uniform contact pressure, further enhancing clamping stability and reducing damage to the wafer positioning pin. In addition, the soft buffer layer has a certain degree of elasticity, which can absorb some of the impact and pressure during clamping, reducing scratches or damage to the surface of the wafer positioning pin. This is crucial for extending the service life of the wafer positioning pin and maintaining its accuracy. Preferably, the soft buffer layer can be made of corrosion-resistant polymer materials such as polytetrafluoroethylene (PTFE), but specific limitations are not specified here.

[0039] In one embodiment, the surface of the base 1 may be provided with a grip portion (not shown in the figure), which may have a recessed portion that conforms to the fingers and a textured surface with an anti-slip effect. This design can provide the operator with a more natural and comfortable grip, further improve the stability of operation and reduce fatigue caused by long-term operation, thereby reducing the probability of operational errors.

[0040] In one embodiment, such as Figure 4 As shown, the wafer positioning pin fixture also includes a driver 5 and a controller 6. The controller 6 is signal-connected to the driver 5 and is used to control the driver 5 to drive the base 1 to a designated position and to drive the second clamping member 202 away from or towards the first clamping member 201. Furthermore, a pressure sensor can be installed on the clamping surface 212 to detect whether the pressure applied by the wafer positioning pin fixture to the wafer positioning pin meets a preset standard. When the clamping device 2 clamps the wafer positioning pin, if the pressure sensor reading is lower than the preset standard, it indicates that the clamping force of the clamping device 2 on the wafer positioning pin is insufficient, which may easily lead to the wafer positioning pin falling off. In this case, the disassembly and assembly process should be stopped and the wafer positioning pin fixture should be inspected. If the pressure sensor reading is higher than the preset standard, it indicates that the clamping force of the clamping device 2 on the wafer positioning pin is too large, which may damage the wafer positioning pin. The pressure sensor can be signal-connected to the controller 6, so that the controller 6 can perform corresponding control operations based on the real-time monitoring results of the pressure sensor.

[0041] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer positioning pin fixture for clamping wafer positioning pins and for assembling and disassembling wafer positioning pins with a groove structure on one side and a cylindrical surface on the other side, characterized in that... The utility model relates to a wafer positioning jig, including: a base (1) comprising a first end and a second end away from each other along a first direction; a clamping device (2) comprising a first clamping piece (201) and a second clamping piece (202); the upper end of the first clamping piece (201) is fixedly arranged at the first end of the base (1), and the lower end is provided with a clamping part (211) matched with the groove structure of a wafer positioning pin; the second clamping piece (202) is slidably installed at the lower part of the base (1); the clamping surface (212) of the second clamping piece (202) is arranged on one side of the clamping part (211) of the first clamping piece (201), and the clamping surface (212) is a circular arc concave surface matched with the shape of the wafer positioning pin; in use, the clamping part (211) of the first clamping piece (201) is matched with the groove structure on the upper part of the wafer positioning pin, and the clamping surface (212) of the second clamping piece (202) is matched with the cylindrical surface on the back side of the groove structure of the wafer positioning pin.

2. The wafer positioning pin jig of claim 1, wherein, A linear guide structure (101) is arranged on the lower surface of the base (1) along the first direction, and a sliding block structure matched with the linear guide structure (101) is arranged on the second clamping piece (202).

3. The wafer positioning pin jig of claim 2, wherein, A ball or a roller is arranged on the sliding block structure of the second clamping piece (202) to reduce the friction between the linear guide structure (101) and the second clamping piece (202).

4. The wafer positioning pin jig of claim 1, wherein, An elastic member (3) is further included, the first end of the elastic member (3) is connected with the second clamping piece (202), the second end of the elastic member (3) is connected with the base (1), and the elastic member (3) provides an elastic force for the second clamping piece (202) to approach the first clamping piece (201).

5. The wafer positioning pin jig of claim 1, wherein, The first clamping piece (201) and / or the second clamping piece (202) are detachably connected with the base (1).

6. The wafer positioning pin jig of claim 1, wherein, A soft buffer layer is arranged on the clamping part (211) and / or the clamping surface (212) to increase the friction.

7. The wafer positioning pin jig of claim 1, wherein, A holding part is arranged on the surface of the base (1), and a recess matched with a finger and a pattern with an anti-skid effect are arranged on the holding part.

8. The wafer positioning pin jig of claim 1, wherein, A driver (5) and a controller (6) are further included, the controller (6) is signal-connected with the driver (5) to control the driver (5) to drive the base (1) to move to a specified position and drive the second clamping piece (202) to move away from or approach the first clamping piece (201).

9. The wafer positioning pin jig of claim 8, wherein, A pressure sensor is arranged on the clamping surface (212) of the second clamping piece (202) to detect whether the pressure applied by the wafer positioning pin jig on the wafer positioning pin meets a preset standard.

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