Pressing device for chip packaging

By designing lifting components and protective sleeves, the problem of impurities entering during chip packaging was solved, resulting in better packaging effects and uniform compression.

CN224037813UActive Publication Date: 2026-03-24ZHIXINGZHE (SHENZHEN) COMPUTER COMMUNICATIONS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-02
Publication Date
2026-03-24

AI Technical Summary

Technical Problem

Existing chip packaging clamping components are not convenient for protecting the contact points during packaging. Impurities can easily enter the device during clamping, resulting in poor packaging performance.

Method used

A pressing device comprising a lifting assembly, a support assembly, and a pressing assembly is designed. The lifting plate and connecting spring are driven by a hydraulic push rod to move the protective sleeve to the outside of the sealing position. The protective sleeve is used to prevent impurities from entering, and together with the support plate and bolts, it provides stable support.

Benefits of technology

It effectively protects the packaging area, prevents impurities from entering, improves the packaging effect, and ensures uniformity and cleanliness during the pressing process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of chip packaging and pressing, in particular to a pressing device for chip packaging, which comprises a lifting assembly, a supporting assembly and a pressing assembly. The lifting assembly comprises a lifting plate, connecting springs, a connecting plate and a protective sleeve, a plurality of mounting holes and two positioning grooves are formed in the surface of the lifting plate, the connecting springs are fixedly connected with the lifting plate and located at the bottom of the lifting plate, and the connecting plate is fixedly connected with the connecting springs and located at the bottoms of the connecting springs. The protection sleeve is fixedly connected with the connecting plate and located between the connecting plate and the lifting plate, the supporting assembly is located on the outer side of the lifting plate, and the press-fitting assembly is located in the protection sleeve, so that the problems that when a pressing component for chip packaging is used, the contact position is inconvenient to protect during packaging, impurities enter the device during pressing, and the pressing efficiency is poor are solved. And the packaging effect is not good.
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Description

TECHNICAL FIELD

[0001] The utility model relates to chip packaging press technology field especially, a kind of pressing device for chip packaging. BACKGROUND

[0002] In actual chip packaging process, when packaging some special-shaped chips, the adopted packaging cover plate is also special-shaped, and the surface of the packaging cover plate is mostly uneven, when pressing this kind of packaging cover plate, uneven pressure and excessive extrusion force may cause partial area bruise.

[0003] The existing announcement No.CN222530385U discloses a kind of chip packaging is pressed and is pressed and is arranged, including mounting seat, one side of mounting seat is equipped with installation cross beam plate, the top of mounting seat is equipped with electric push rod, the telescopic end of electric push rod is equipped with downward pressure plate, the bottom end one side of installation cross beam plate is equipped with oil storage cylinder, the inside of oil storage cylinder is slidably provided with connecting pull rod, the top of connecting pull rod is equipped with injection piston, the bottom end one side of oil storage cylinder is communicated with the setting of delivery pipe, the bottom end inside of downward pressure plate is embedded with non-rigid pressure part, technical effect is that the liquid in filling and oil storage cylinder is injected into non-rigid pressure part, can be filled and extruded by the non-rigid pressure part after expansion to packaging cover plate, so that extrusion pressure is more sufficient and uniform, at the same time, non-rigid contact extrusion mode will not cause bruise condition.

[0004] However, the above-mentioned chip packaging is pressed and is arranged, when being used, the position contacted during packaging is not protected, impurities enter the inside of device during pressing, so that the problem of poor packaging effect is caused. INVENTION CONTENTS

[0005] The utility model aims at providing a kind of chip packaging is pressed and is arranged, solve the problem that chip packaging is pressed and is arranged, when being used, the position contacted during packaging is not protected, impurities enter the inside of device during pressing, so that the problem of poor packaging effect is caused.

[0006] To achieve the above-mentioned purpose, the utility model provides a kind of chip packaging is pressed and is arranged, including lifting assembly, support assembly and press fitting assembly;The lifting assembly includes lifting plate, connecting spring, connecting plate and protective sleeve, the surface of lifting plate is provided with multiple mounting holes and two positioning grooves, the number of connecting spring is multiple, multiple connecting spring is fixedly connected with lifting plate respectively, and located at the bottom of lifting plate, connecting plate is fixedly connected with connecting spring, and located at the bottom of connecting spring, protective sleeve is fixedly connected with connecting plate, and located between connecting plate and lifting plate, support assembly is located at the outside of lifting plate, press fitting assembly is located in the inside of protective sleeve.

[0007] The lifting assembly further comprises a hydraulic push rod and guide rods, the hydraulic push rod is fixedly connected with the lifting plate and located at the top of the lifting plate, and the two guide rods are fixedly connected with the lifting plate and respectively located at the top of the lifting plate.

[0008] The support assembly comprises a support plate, side frames and support bolts, the support plate is fixedly connected with the hydraulic push rod and located outside the hydraulic push rod and the guide rods, the two side frames are fixedly connected with the support plate and respectively located outside the support plate, and the plurality of support bolts are threadedly connected with the side frames and respectively pass through the side frames.

[0009] The pressing assembly comprises a mounting plate and a pressing block, the mounting plate is detachably connected with the lifting plate and located inside the protective sleeve, and the pressing block is fixedly connected with the mounting plate and located at the bottom of the mounting plate.

[0010] The pressing assembly further comprises mounting bolts and positioning blocks, the plurality of mounting bolts are threadedly connected with the mounting plate and respectively pass through the mounting holes, and the two positioning blocks are fixedly connected with the mounting plate and respectively located inside the positioning grooves.

[0011] The chip packaging pressing device of the first embodiment of the utility model, the lifting plate provides support for the lifting assembly, the connecting spring provides support for the connecting plate, the connecting plate provides support for the protective sleeve, and the protective sleeve is used for protecting the packaging position, in use, the lifting plate is pushed downward along the guide rod through the hydraulic push rod, the connecting spring and the connecting plate are driven to move downward at the same time, the protective sleeve is covered outside the packaging position, the packaging position is protected, impurities are prevented from entering the packaging position, the problem that the chip packaging pressing part is inconvenient to protect the position contacted during packaging in use and impurities enter the inside of the device during pressing and cause poor packaging effect is solved. BRIEF DESCRIPTION OF DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiment or prior art description will be briefly introduced.

[0013] Figure 1 is the overall structure schematic view of the chip packaging pressing device of the first embodiment of the utility model.

[0014] Figure 2It is the structure schematic view of the lifting assembly of the first embodiment of the utility model.

[0015] Figure 3 It is the structure schematic view of the support assembly of the first embodiment of the utility model.

[0016] Figure 4 It is the structure schematic view of the pressing assembly of the first embodiment of the utility model.

[0017] In the figure: 101-lifting plate, 102-mounting hole, 103-positioning slot, 104-connecting spring, 105-connecting plate, 106-protection sleeve, 107-hydraulic push rod, 108-guide rod, 109-supporting plate, 110-side frame, 111-supporting bolt, 112-mounting plate, 113-pressing block, 114-mounting bolt, 115-positioning block. DETAILED DESCRIPTION

[0018] The embodiments of the utility model are described in detail below, the examples of the embodiments are shown in the drawings, the embodiments described below by referring to the drawings are exemplary, and are intended to explain the utility model, and cannot be understood as the limitation of the utility model.

[0019] The first embodiment of the application is:

[0020] Please refer to Figures 1 to 4 Among them, Figure 1 It is the overall structure schematic view of the pressing device for chip packaging of the first embodiment of the utility model, Figure 2 It is the structure schematic view of the lifting assembly of the first embodiment of the utility model, Figure 3 It is the structure schematic view of the support assembly of the first embodiment of the utility model, Figure 4 It is the structure schematic view of the pressing assembly of the first embodiment of the utility model, the utility model provides a kind of pressing device for chip packaging, including lifting assembly, support assembly and pressing assembly, the lifting assembly includes lifting plate 101, connecting spring 104, connecting plate 105, protection sleeve 106, hydraulic push rod 107 and guide rod 108, the support assembly includes supporting plate 109, side frame 110 and supporting bolt 111, the pressing assembly includes mounting plate 112, pressing block 113, mounting bolt 114 and positioning block 115;The foregoing scheme solves the problem that the pressing part for chip packaging is not convenient for the position contacted during packaging to be protected when being used, impurities enter the inside of device when being pressed, resulting in poor packaging effect, it can be understood that the foregoing scheme can be used in the scene of protecting chip packaging position, and can also be used for solving the problem of packaging different chips.

[0021] For this specific embodiment, the surface of the lifting plate 101 is provided with a plurality of mounting holes 102 and two positioning grooves 103, the number of the connecting springs 104 is multiple, the multiple connecting springs 104 are respectively fixedly connected with the lifting plate 101 and are respectively located at the bottom of the lifting plate 101, the connecting plate 105 is fixedly connected with the connecting spring 104 and is located at the bottom of the connecting spring 104, the protective sleeve 106 is fixedly connected with the connecting plate 105 and is located between the connecting plate 105 and the lifting plate 101, the support assembly is located outside the lifting plate 101, the press-fitting assembly is located inside the protective sleeve 106, the lifting plate 101 provides support for the lifting assembly, the connecting spring 104 provides support for the connecting plate 105, the connecting plate 105 provides support for the protective sleeve 106, and the protective sleeve 106 is used for protecting the packaging position. In use, the lifting plate 101 is pushed downward along the guide rod 108 by the hydraulic push rod 107, which simultaneously drives the connecting spring 104 and the connecting plate 105 to move downward, and the protective sleeve 106 is covered outside the packaging position, thereby facilitating the protection of the packaging position and preventing impurities from entering the packaging position.

[0022] Among them, the hydraulic push rod 107 is fixedly connected with the lifting plate 101 and located at the top of the lifting plate 101, the number of the guide rods 108 is two, and the two guide rods 108 are respectively fixedly connected with the lifting plate 101 and respectively located at the top of the lifting plate 101, and the hydraulic push rod 107 provides power for the lifting assembly, and the guide rod 108 provides guiding and limiting action for the lifting plate 101.

[0023] Secondly, the support plate 109 is fixedly connected with the hydraulic push rod 107 and located outside the hydraulic push rod 107 and the guide rod 108, the number of the side frames 110 is two, and the two side frames 110 are respectively fixedly connected with the support plate 109 and respectively located outside the support plate 109, the number of the support bolts 111 is multiple, and the multiple support bolts 111 are respectively threadedly connected with the side frames 110 and respectively pass through the side frames 110, and the support plate 109 and the side frames 110 provide support for the device. When installing, the side frames 110 are installed on the top of the rack through the support bolts 111, thereby facilitating the installation and fixation of the device.

[0024] Again, the mounting plate 112 is detachably connected with the lifting plate 101 and located inside the protective sleeve 106, the pressing block 113 is fixedly connected with the mounting plate 112 and located at the bottom of the mounting plate 112, the mounting plate 112 provides support for the pressing assembly, and the pressing block 113 is used to contact the chip packaging position, facilitating the packaging of the chip.

[0025] Finally, the mounting bolts 114 are provided in plurality, the mounting bolts 114 are respectively in threaded connection with the mounting plate 112 and respectively pass through the mounting holes 102, the positioning blocks 115 are provided in two, the positioning blocks 115 are respectively fixedly connected with the mounting plate 112 and respectively located inside the positioning grooves 103, the mounting bolts 114 are used to fix the mounting plate 112, and the positioning blocks 115 are used to position the mounting plate 112, when packaging different chips, the mounting bolts 114 are unscrewed, the mounting plate 112 and the pressing block 113 are detached, the corresponding mounting plate 112 is placed into the protective sleeve 106, the positioning blocks 115 are matched with the positioning grooves 103, the position of the mounting plate 112 is positioned, the mounting bolts 114 are used to fix the mounting plate 112 inside the protective sleeve 106, and different chips are packaged.

[0026] The chip packaging pressing device of the embodiment is used, the lifting plate 101 provides support for the lifting assembly, the connecting spring 104 provides support for the connecting plate 105, the connecting plate 105 provides support for the protective sleeve 106, the protective sleeve 106 is used to protect the packaging position, when in use, the lifting plate 101 is pushed downward along the guide rod 108 by the hydraulic push rod 107, the connecting spring 104 and the connecting plate 105 are also moved downward, the protective sleeve 106 is covered outside the packaging position, the packaging position is protected, impurities are prevented from entering the packaging position, and the problem that the chip packaging pressing part is not convenient to protect the position contacted during packaging and impurities enter the inside of the device during pressing, resulting in poor packaging effect is solved.

[0027] The above only discloses one or more preferred embodiments of the application, and cannot limit the scope of the application, and those skilled in the art can understand that all or part of the above-mentioned embodiments can be implemented, and equivalent changes made according to the claims of the application still belong to the scope of the application.

Claims

1. A pressing device for chip packaging, characterized in that, it comprises a lifting assembly, a supporting assembly and a pressing assembly; the lifting assembly comprises a lifting plate, connecting springs, a connecting plate and a protective sleeve, the surface of the lifting plate is provided with a plurality of mounting holes and two positioning grooves, the number of the connecting springs is multiple, the connecting springs are fixedly connected with the lifting plate respectively and are located at the bottom of the lifting plate, the connecting plate is fixedly connected with the connecting springs and is located at the bottom of the connecting springs, the protective sleeve is fixedly connected with the connecting plate and is located between the connecting plate and the lifting plate, the supporting assembly is located outside the lifting plate, and the pressing assembly is located inside the protective sleeve.

2. The pressing device for chip packaging according to claim 1, characterized in that, the lifting assembly further comprises a hydraulic push rod and guide rods, the hydraulic push rod is fixedly connected with the lifting plate and is located at the top of the lifting plate, and the number of the guide rods is two, the guide rods are fixedly connected with the lifting plate respectively and are located at the top of the lifting plate.

3. The pressing device for chip packaging according to claim 2, characterized in that, the supporting assembly comprises a supporting plate, side frames and supporting bolts, the supporting plate is fixedly connected with the hydraulic push rod and is located outside the hydraulic push rod and the guide rods, the number of the side frames is two, the side frames are fixedly connected with the supporting plate respectively and are located outside the supporting plate, and the number of the supporting bolts is multiple, the supporting bolts are threadedly connected with the side frames respectively and pass through the side frames.

4. The pressing device for chip packaging according to claim 1, characterized in that, the pressing assembly comprises a mounting plate and a pressing block, the mounting plate is detachably connected with the lifting plate and is located inside the protective sleeve, and the pressing block is fixedly connected with the mounting plate and is located at the bottom of the mounting plate.

5. The pressing device for chip packaging according to claim 4, characterized in that, the pressing assembly further comprises mounting bolts and positioning blocks, the number of the mounting bolts is multiple, the mounting bolts are threadedly connected with the mounting plate respectively and pass through the mounting holes, and the number of the positioning blocks is two, the positioning blocks are fixedly connected with the mounting plate respectively and are located inside the positioning grooves.

Citation Information

Patent Citations

  • Pressing component for chip packaging

    CN222530385U