Carrying table compatible with wafers of multiple sizes

Abstract

The utility model discloses a compatible multi-size wafer carrying platform, which comprises a wafer carrying platform, a plurality of adsorption pipelines are uniformly arranged in the wafer carrying platform, adsorption pipes are arranged between the adsorption pipelines and the wafer carrying platform, the adsorption pipelines are connected with control valve pipes, the bottoms of the control valve pipes are provided with connecting pipes, and the connecting pipes are connected with the control valve pipes. A plurality of extension air pipes are uniformly connected to the adsorption pipeline, and telescopic columns are arranged between the end parts of the extension air pipes and the wafer carrying table. According to the utility model, through cooperative use of the adsorption pipeline, the adsorption pipe and other components, wafers of different sizes can be conveniently fixed, carrying tables of different sizes do not need to be customized, and the convenience of fixation is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer carrier technology field, specifically is a compatible multi -size wafer carrier. BACKGROUND

[0002] Wafer refers to the circular silicon wafer or substrate used in semiconductor technology, also called silicon wafer or wafer. It is the basic material for manufacturing integrated circuits, and the wafer is generally made of single crystal silicon material, and the surface is very flat. The process of manufacturing wafer or semiconductor manufacturing is called wafer manufacturing, which involves multiple process steps such as wafer growth, cutting, polishing and cleaning. On the wafer, various components and levels of integrated circuits can be manufactured through photolithography, thin film deposition, ion implantation, diffusion and metal deposition processes. A wafer can manufacture multiple chips, and each chip is used as an independent product through cutting and packaging. Wafer manufacturing is a crucial step in the semiconductor industry, which affects the quality, efficiency and cost of integrated circuits. After wafer manufacturing is completed, the wafer needs to be detected.

[0003] The existing compatible multi -size wafer carrier has the following defects:

[0004] The size of the existing wafer carrier is fixed, which cannot well adapt to the fixation of wafers of different sizes, and needs to be customized to fix wafers of different sizes, thereby causing the problem of insufficient adaptability.

[0005] Therefore, a solution is needed. UTILITY MODEL CONTENT

[0006] (I) Technical problem solved

[0007] In view of the deficiencies of the prior art, the utility model provides a compatible multi -size wafer carrier to solve the problems in the above background technology.

[0008] (II) Technical scheme

[0009] To achieve the above purpose, the utility model realizes the following technical scheme: a compatible multi -size wafer carrier, including wafer carrier, the inside of wafer carrier is evenly provided with a plurality of adsorption pipeline, the adsorption pipeline is provided with adsorption pipe between the adsorption pipeline and wafer carrier, the adsorption pipeline is connected with control valve pipe, the bottom of control valve pipe is provided with connecting pipe, the adsorption pipeline is evenly connected with a plurality of extension air pipe, the end of extension air pipe is provided with telescopic column between extension air pipe and wafer carrier.

[0010] Preferably, the outer edge of the wafer carrier is provided with a positioning notch, and the wafer carrier is provided with a plurality of jacking through holes near the center, and the surface of the wafer carrier has a plurality of anti-skid lines.

[0011] Preferably, the adsorption pipeline is in a whole annular structure, the adsorption pipe is communicated with the wafer carrier, and the control valve pipe is located outside the wafer carrier.

[0012] Preferably, one end of the control valve pipe is communicated with the adsorption pipeline, the connecting pipe comprises a pipe body and a pipeline interface, and the pipeline interface is located outside the wafer carrier.

[0013] Preferably, the extension air pipe is communicated with the adsorption pipeline, and the telescopic column is internally provided with a spring.

[0014] Preferably, the wafer carrier is uniformly provided with a plurality of through holes matched with the telescopic column, and the movable end of the telescopic column is flush with the surface of the wafer carrier.

[0015] (Three) beneficial effects

[0016] The utility model provides a compatible multi -size wafer carrier. Have the following beneficial effects:

[0017] The compatible multi -size wafer carrier can conveniently adsorb and fix wafers of different sizes, and the wafers of different sizes are adsorbed and fixed through adsorption pipelines and adsorption pipes of different sizes, so that the corresponding size of the wafer can be marked, the wafer is placed quickly, and the convenience of fixing is improved. DRAWINGS

[0018] Fig. 1 It is the whole structure schematic view of the utility model;

[0019] Fig. 2 It is the adsorption pipeline schematic view of the utility model;

[0020] Fig. 3 It is the extension air pipe schematic view of the utility model.

[0021] In the drawing: positioning gap-1, jacking through hole-2, wafer carrier-3, adsorption pipe-4, telescopic column-5, control valve pipe-6, adsorption pipeline-7, connecting pipe-8, extension air pipe-9. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Apparently, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0023] Referring to Figs. 1-3 The embodiment of the utility model provides a technical scheme:

[0024] Embodiment 1

[0025] For the above-mentioned problem 1 to be solved: the size of the existing wafer carrier is fixed, and it cannot be well adapted to the fixing of wafers of different sizes, and it is necessary to customize the carrier of different sizes for fixing, thereby leading to the problem of insufficient adaptability in use.

[0026] The solution is as follows: a compatible multi-size wafer carrier, comprising a wafer carrier 3, a plurality of suction pipes 7 are uniformly arranged in the interior of the wafer carrier 3, a suction pipe 4 is arranged between the suction pipe 7 and the wafer carrier 3, a control valve pipe 6 is connected to the suction pipe 7, a connecting pipe 8 is arranged on the bottom of the control valve pipe 6, a plurality of extension air pipes 9 are uniformly connected to the suction pipe 7, a telescopic column 5 is arranged between the end of the extension air pipe 9 and the wafer carrier 3, specifically, before fixing the wafer, the telescopic column 5 is inflated by the gas supply equipment to realize the extension of the telescopic column 5 and the marking of the size, and after the wafer is placed, the gas supply equipment is used for suction fixing through the suction pipe 4.

[0027] Further, a positioning notch 1 is arranged on the outer edge of the wafer carrier 3, a plurality of jacking through holes 2 are arranged on the wafer carrier 3 close to the center, and the surface of the wafer carrier 3 has a plurality of anti-skid lines.

[0028] Further, the suction pipe 7 is in a whole circular ring structure, the pipe opening of the suction pipe 4 is connected with the wafer carrier 3, and the control valve pipe 6 is located outside the wafer carrier 1.

[0029] Further, one end of the control valve pipe 6 is connected with the suction pipe 7, the connecting pipe 8 comprises a pipe body and a pipe interface, specifically, the connecting pipe 8 is connected to the gas supply equipment, the gas supply equipment adopts a conventional equipment in the market, the control mode is determined according to the actual use requirement, and the pipe interface is outside the wafer carrier 3.

[0030] Further, the extension air pipe 9 is connected with the suction pipe 7, and a spring is installed in the interior of the telescopic column 5, specifically, the telescopic column 5 is inflated by the gas supply equipment to realize the extension of the telescopic column 5 and the marking of the corresponding size of the wafer, and the subsequent rapid placement and suction fixing are facilitated.

[0031] Further, the wafer carrier 3 is uniformly arranged with a plurality of through holes matched with the telescopic column 5, and the movable end of the telescopic column 5 is flush with the surface of the wafer carrier 3.

[0032] Embodiment 2

[0033] The solution is as follows: according to different sizes of wafers, the corresponding size position of the adsorption pipeline 7 is supplied with gas through the air cylinder and other devices, and the telescopic column 5 is extended through the extension gas pipe 9, so that the corresponding size is realized, and the wafer is conveniently and quickly placed, and the convenience of adsorption fixation is improved.

[0034] Working principle: during operation, first, the connecting pipe 8 on the adsorption pipeline 7 at each position is connected with the gas supply device, then, according to the size of the placed wafer, the corresponding size position of the gas supply device is preliminarily supplied with gas, the telescopic column 5 is supplied with gas through the extension gas pipe 9, the telescopic column 5 is extended, the fixed size is marked, the wafer is conveniently and quickly placed, then, the wafer is placed on the wafer carrier 3, then, the gas supply device is supplied with gas, the wafer is adsorbed and fixed through the adsorption pipe 4, and the wafer is fixed.

[0035] The positioning gap-1, the jacking through hole-2, the wafer carrier-3, the adsorption pipe-4, the telescopic column-5, the control valve pipe-6, the adsorption pipeline-7, the connecting pipe-8, the extension gas pipe-9, and the components are all general standard components or components known by those skilled in the art, the structure and principle thereof can be known by technical personnel through a technical manual or through a conventional experimental method, the problem solved by the utility model is that, through mutual combination of the above components, the wafer of different sizes can be adsorbed and fixed through the adsorption pipe at each position and the adsorption pipe, meanwhile, the telescopic column can be extended through the telescopic column, before fixation, the adsorption pipeline and the extension gas pipe are supplied with gas through the gas supply device, the telescopic column is extended, the size is marked, the wafer can be conveniently and quickly placed, when fixed, the adsorption pipe is supplied with gas through the gas supply device, the wafer is adsorbed and fixed, and the convenience of fixation of wafers of different sizes is improved.

[0036] The basic principle and main features of the utility model and the advantages of the utility model are shown and described above, for those skilled in the art, obviously, the utility model is not limited to the details of the above exemplary embodiments, and the utility model can be realized in other specific forms without departing from the spirit or basic characteristics of the utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, the scope of the utility model is defined by the appended claims rather than the above description, therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the utility model. Any figure mark in the claims should not be regarded as limiting the involved claims.

[0037] Furthermore, it should be understood that although the specification is described in terms of embodiments, not every embodiment includes every feature described. The specification can include implicit combinations of explicitly mentioned features and / or explicit combinations of implicitely mentioned features. Each embodiment depends on the explicit combinations of features and / or the implicit combinations of features made specifically within that embodiment, and each such embodiment can be combined with every other such embodiment to create further embodiments.

Claims

1. A multi-size wafer stage, characterized in that: The device includes a wafer stage (3), and a plurality of adsorption channels (7) are uniformly arranged inside the wafer stage (3). An adsorption tube (4) is arranged between the adsorption channel (7) and the wafer stage (3). A control valve tube (6) is connected to the adsorption channel (7). A connecting tube (8) is arranged at the bottom of the control valve tube (6). A plurality of extension gas tubes (9) are uniformly connected to the adsorption channel (7). A telescopic column (5) is arranged between the end of the extension gas tube (9) and the wafer stage (3).

2. The multi-size compatible wafer stage according to claim 1, characterized in that: The wafer stage (3) has a positioning notch (1) on its outer edge, and the wafer stage (3) has several lifting through holes (2) near the center. The surface of the wafer stage (3) has several anti-slip textures.

3. The multi-size compatible wafer stage according to claim 1, characterized in that: The adsorption pipe (7) is in the shape of a ring. The outlet of the adsorption pipe (4) is connected to the wafer stage (3). The control valve pipe (6) is located outside the wafer stage (3).

4. The multi-size compatible wafer stage according to claim 1, characterized in that: One end of the control valve tube (6) is connected to the adsorption pipe (7), and the connecting pipe (8) includes a pipe body and a pipe interface, with the pipe interface located outside the wafer stage (3).

5. A multi-size compatible wafer stage according to claim 1, characterized in that: The extended air tube (9) is connected to the adsorption pipe (7), and a spring is installed inside the telescopic column (5).

6. A multi-size compatible wafer stage according to claim 1, characterized in that: The wafer stage (3) has a number of through holes evenly arranged to cooperate with the telescopic pillar (5), and the movable end of the telescopic pillar (5) is flush with the surface of the wafer stage (3).

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