Lead bonding device of ultrasonic gold wire ball bonding machine

Abstract

The utility model relates to a lead bonding device of an ultrasonic gold wire ball bonder, which comprises a wire feeding mechanism and a welding mechanism, the wire feeding mechanism is arranged above the welding mechanism, the welding mechanism comprises a gold wire clamping device and a welding head assembly, the gold wire clamping device is arranged above the welding head assembly, and the welding head assembly is arranged above the gold wire clamping device. The gold wire clamping device comprises a wire leading device, a wire clamp and a wire clamp driver, the wire clamp is installed on the wire clamp driver, the wire clamp driver drives the wire clamp to conduct opening and closing movement, the wire leading device is arranged above the wire clamp, a wire penetrating hole is formed in the wire leading device, and the wire penetrating hole is perpendicular to the wire clamp. According to the lead bonding device of the ultrasonic gold wire ball bonding machine, shaking of the gold wire in the conveying and welding process is reduced, the accuracy of the welding position of the gold wire is improved, therefore, the problem of poor welding is avoided, and the welding precision and quality are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to ultrasonic welding technical field especially relates to a lead bonding device of ultrasonic gold wire ball welding machine. BACKGROUND

[0002] The gold wire ball welding machine forms the spherical shape through heating one end of the gold wire, and then utilizes the pressure and ultrasonic energy to weld the gold ball with the pin on the pad of wafer or substrate, to realize the reliable electrical connection. It is widely used in the manufacturing field of integrated circuits, semiconductor devices, optoelectronic devices, etc., and is one of the important devices for realizing wafer packaging. The lead bonding device of the gold wire ball welding machine is mainly responsible for completing the connection between the gold wire and the wafer and the substrate, and as a key component for realizing the electrical connection between the wafer and the substrate, its performance directly affects the quality and reliability of electronic products.

[0003] The existing lead bonding device of the gold wire ball welding machine lacks consideration of stability in the design process, and the gold wire is prone to shaking or deviation in position during the conveying and welding process, thereby causing poor welding problem and affecting the welding precision and quality. UTILITY MODEL CONTENT

[0004] The technical problem to be solved by the utility model is to provide a lead bonding device of ultrasonic gold wire ball welding machine, which can reduce the shaking of the gold wire during the conveying and welding process, improve the accuracy of the welding position, thereby avoiding the problem of poor welding, and improving the welding precision and quality.

[0005] In order to solve the above technical problem, the technical scheme provided by the utility model is as follows:

[0006] A lead bonding device of ultrasonic gold wire ball welding machine, comprising a wire feeding mechanism and a welding mechanism, the wire feeding mechanism is arranged above the welding mechanism, the welding mechanism comprises a gold wire clamping device and a welding head assembly, the gold wire clamping device is located above the welding head assembly, the gold wire clamping device comprises a lead device, a wire clamp and a wire clamp driver, the wire clamp is installed on the wire clamp driver, the wire clamp driver drives the wire clamp to open and close, the lead device is arranged above the wire clamp, the lead device is provided with a threading hole, and the threading hole is perpendicular to the wire clamp.

[0007] The gold wire is prone to shaking during high-speed welding due to its small diameter, which may result in poor welding precision, even false welding or discontinuous welding. In the scheme, a special gold wire clamping device is designed. During the welding process, the wire feeding mechanism first performs a wire feeding motion, at which time the gold wire clamping device is loosened. Then the gold wire is released by the cooperation of the welding head assembly and the wire feeding mechanism to a suitable length. At this time, the gold wire clamping device clamps the gold wire again, and then the welding head assembly performs wire bonding between the wafer and the substrate. The wire clamp moves horizontally under the drive of the wire clamp driver, which enables the wire clamp to accurately clamp the gold wire and flexibly adjust the clamping position of the gold wire according to actual needs, ensuring the stability of the gold wire during welding, greatly reducing the problem of poor welding caused by gold wire shaking or position deviation, and improving the precision and quality of welding. The wire guide device is arranged above the wire clamp, and the threading hole is perpendicular to the wire clamp. This design facilitates the operator to quickly and accurately thread the gold wire through the threading hole and be stably clamped by the wire clamp, optimizes the operation process, reduces the operation difficulty, and improves the work efficiency.

[0008] Further, the wire clamp is provided with two rubber blocks, which are symmetrically arranged on the inner side of the wire clamp head, and the threading hole is located above the rubber blocks. The rubber blocks are soft in texture and have a large surface friction. When the two wire clamps are closed, the rubber blocks contact the gold wire, providing greater friction than ordinary metal wire clamps, thereby clamping the gold wire more firmly and ensuring that the gold wire does not slide or shift during welding due to external forces. At the same time, the elasticity of the rubber blocks can avoid hard extrusion of the wire clamp on the gold wire, preventing the gold wire surface from being scratched or deformed, ensuring that the physical and electrical properties of the gold wire are not affected, thereby improving the welding quality.

[0009] As a preferred embodiment, a tension adjusting mechanism is further included, which is arranged between the wire feeding mechanism and the welding mechanism. The tension adjusting mechanism includes a wire guide, a drive wheel and a tensioning wheel. The wire guide is fixedly arranged on one side of the drive wheel, and the tensioning wheel is arranged on the other side of the drive wheel. The tension adjusting mechanism can adjust the tension of the gold wire in real time during the conveying process, ensuring the stability of the tension of the gold wire during the conveying process, which avoids the problems of gold wire breakage or poor wire feeding caused by excessive tension fluctuation, and improves the stability and reliability of the welding process. The drive wheel and the tensioning wheel can be arranged on the same horizontal line, because the heights of the drive wheel and the tensioning wheel are kept as consistent as possible, which can ensure that the gold wire does not produce additional tension changes during operation due to height difference.

[0010] As preferred, the clamping groove is fixed on the tensioning wheel, and a lead portion is fixed outside the clamping groove, and a lead hole is arranged on the lead portion and coaxially arranged with the threading hole. The clamping groove provides a specific running track for the gold wire, so that the gold wire is more stable and smooth in conveying on the tensioning wheel. Even in the case of high-speed wire feeding, the gold wire can also move orderly along the clamping groove, reducing the tension fluctuation caused by unstable conveying, and further ensuring the stability of the welding quality. Through the synergistic effect of the clamping groove, the lead hole and the threading hole, the gold wire can maintain a consistent posture and tension when conveying to the welding mechanism. This makes the contact state of the gold wire with the welding point basically the same each time, thereby reducing the occurrence of welding defects.

[0011] As preferred, the welding head assembly comprises a capillary wedge, an ultrasonic device and a gold wire melting device, the capillary wedge is fixed below one end of the ultrasonic device with the wedge head downward, and the gold wire melting device is arranged on one side of the wedge. The capillary wedge, the ultrasonic device and the gold wire melting device cooperate with each other to form an efficient welding unit. The ultrasonic device provides the energy required for bonding, the capillary wedge realizes the positioning and placement of the gold wire, and the gold wire melting device timely completes the melting of the gold wire. The synergistic work of each part optimizes the welding process and avoids complex operation steps and additional equipment adjustment time.

[0012] As preferred, the gold wire melting device comprises a heating assembly and a heating wire, the heating wire is installed on the heating assembly and arranged on one side of the capillary wedge. The heating assembly is a common electric heating device on the market, which can provide stable and sufficient heat for the heating wire. When the gold wire needs to be melted, the heating wire can reach a high temperature in a short time to quickly melt the gold wire. The heating wire is arranged on one side of the capillary wedge, so that the heating wire can accurately act on the position of the gold wire that needs to be melted. During the welding process, the gold wire is accurately placed on the welding point through the capillary wedge, and the heating wire on one side can accurately heat the gold wire locally to achieve precise melting, avoiding the influence on the surrounding other parts or the completed welding point.

[0013] As preferred, the wire feeding mechanism comprises a wire disc and a wire disc driving device, and the wire disc is installed on the rotating shaft of the wire disc driving device. During the wire feeding process, the wire disc driving device directly drives the wire disc to rotate. This way can transmit power to the wire disc without loss, reducing the energy loss and transmission error in the power transmission process. The wire disc driving device can provide stable driving force for the wire disc, thereby ensuring the stability of the gold wire during the conveying process and avoiding the situation that the wire feeding speed is fast or slow, which is conducive to improving the consistency of the welding quality.

[0014] In summary, the lead bonding device of the ultrasonic gold wire ball bonding machine reduces the shaking of the gold wire during conveying and welding, improves the accuracy of the welding position, thereby avoiding the problem of poor welding and improving the welding precision and quality. BRIEF DESCRIPTION OF DRAWINGS

[0015] The utility model will be further described below in combination with the drawings and specific embodiments:

[0016] Figure 1 It is the general assembly structure schematic view of the utility model;

[0017] Figure 2 It is the front view of the utility model;

[0018] Figure 3 It is Figure 1 The enlarged view of B shown in the figure;

[0019] Figure 4 It is Figure 1 The enlarged view of A shown in the figure;

[0020] Wherein: wire feeding mechanism-1, wire reel-11, wire reel driving device-12, welding mechanism-2, gold wire clamping device-21, lead device-211, threading hole-2111, wire clamp-212, wire clamp driver-213, rubber block-214, welding head assembly-22, capillary wedge-221, ultrasonic device-222, gold wire fusing device-223, heating assembly-2231, heating wire-2232, tension adjusting mechanism-3, lead wire device-31, driving wheel-32, tensioning wheel-33, wire clamping groove-331, lead wire part-332, lead wire hole-3321. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical scheme and advantages of the utility model more clear and obvious, the following in combination with the drawings and examples, the utility model is further described in detail.It should be understood that the specific embodiments described herein are only used to explain the utility model, and are not used to limit the utility model.

[0022] In the description of the utility model, it should be understood that the orientation and position relationship indicated by "up", "down", "left", "right", "front", "back", "vertical", "bottom", "inner", "outer" and the like are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and are not used to indicate or imply that the indicated device or element must have a particular orientation, a particular orientation and operation, therefore it can not be understood as the limitation of the utility model.

[0023] As Figures 1 to 4As shown, a lead bonding device of an ultrasonic gold wire ball bonding machine includes a wire feeding mechanism 1 and a welding mechanism 2, the wire feeding mechanism 1 is arranged above the welding mechanism 2, the welding mechanism 2 includes a gold wire clamping device 21 and a welding head assembly 22, the gold wire clamping device 21 is located above the welding head assembly 22, the gold wire clamping device 21 includes a lead device 211, a wire clamp 212 and a wire clamp driver 213, the wire clamp 212 is installed on the wire clamp driver 213, the wire clamp driver 213 drives the wire clamp 212 to open and close, and the lead device 211 is arranged above the wire clamp 212, and a wire hole 2111 is arranged on the lead device 211, and the wire hole 2111 is perpendicular to the wire clamp 212.

[0024] The gold wire ball bonding technology is used to connect the wafer and the substrate, which has high requirements for the speed and accuracy of the equipment operation. However, during high-speed welding, the gold wire used for welding is prone to shaking due to its small diameter, which may result in poor welding accuracy, even false welding or discontinuous welding. In this scheme, a special gold wire clamping device 21 is designed. During the welding process, the wire feeding mechanism 1 first performs a wire feeding motion, at which time the gold wire clamping device 21 is loosened, then the gold wire is released by the cooperation of the welding head assembly 22 and the wire feeding mechanism 1, at this time the gold wire clamping device 21 clamps the gold wire, and then the lead bonding between the wafer and the substrate is performed by the welding head assembly 22. The wire clamp 212 moves horizontally under the drive of the wire clamp driver 213, which enables the wire clamp 212 to accurately clamp the gold wire and flexibly adjust the clamping position of the gold wire according to actual needs, ensuring the stability of the gold wire during welding, greatly reducing the problem of poor welding caused by shaking or position deviation of the gold wire, and improving the precision and quality of welding. The lead device 211 is arranged above the wire clamp 212, and the wire hole 2111 is arranged vertically to the wire clamp 212. This design facilitates the operator to quickly and accurately pass the gold wire through the wire hole 2111 and be stably clamped by the wire clamp 212, optimizes the operation process, reduces the operation difficulty, and improves the work efficiency.

[0025] Further, two rubber blocks 214 are arranged on the wire clamp 212, the two rubber blocks 214 are symmetrically arranged on the inner side of the wire clamp 212, and the wire hole 2111 is located above the rubber blocks 214. The rubber block 214 is soft in texture and has a large surface friction. When the two wire clamps 212 are closed, the rubber block 214 contacts the gold wire, which can provide greater friction than the ordinary metal wire clamp 212, so as to more firmly clamp the gold wire and ensure that the gold wire will not slide or shift due to external force during welding. At the same time, the elasticity of the rubber block 214 can avoid the hard extrusion of the wire clamp 212 on the gold wire, prevent the gold wire surface from being scratched or deformed, ensure that the physical and electrical properties of the gold wire are not affected, and thus improve the welding quality.

[0026] As preferred, the tension adjusting mechanism 3 is further included, which is arranged between the wire feeding mechanism 1 and the welding mechanism 2, and includes a wire guide 31, a driving wheel 32 and a tension wheel 33. The wire guide 31 is fixedly arranged on one side of the driving wheel 32, and the tension wheel 33 is arranged on the other side of the driving wheel 32. The tension adjusting mechanism 3 can adjust the tension of the gold wire in real time during the conveying process, so as to ensure the stability of the tension of the gold wire during the conveying process. This avoids the problems of gold wire breakage or poor wire feeding caused by excessive tension fluctuation, and improves the stability and reliability of the welding process. The driving wheel 32 and the tension wheel 33 can be arranged on the same horizontal line, because the heights of the driving wheel 32 and the tension wheel 33 are kept consistent as much as possible, so as to ensure that the gold wire will not generate additional tension change due to the height difference during the running process.

[0027] As preferred, the tension wheel 33 is fixedly provided with a wire clamping groove 331, and the wire clamping groove 331 is fixedly provided with a wire guide portion 332 on the outer side. The wire guide portion 332 is provided with a wire guide hole 3321, and the wire guide hole 3321 is coaxially arranged with the wire passing hole 2111. The wire clamping groove 331 provides a specific running track for the gold wire, so that the conveying of the gold wire on the tension wheel 33 is more stable and smooth. Even in the case of high-speed wire feeding, the gold wire can also move in an orderly manner along the wire clamping groove 331, which reduces the tension fluctuation caused by unstable conveying, and further ensures the stability of the welding quality. Through the synergistic effect of the wire clamping groove 331, the wire guide hole 3321 and the wire passing hole 2111, the gold wire can maintain a consistent posture and tension when conveyed to the welding mechanism 2. This makes the contact state of the gold wire with the welding point basically the same each time, thereby reducing the generation of welding defects.

[0028] As preferred, the welding head assembly 22 includes a capillary wedge 221, an ultrasonic device 222 and a gold wire melting device 223. The capillary wedge 221 is fixed below one end of the ultrasonic device 222 with the knife head downward, and the gold wire melting device 223 is arranged on one side of the wedge. The capillary wedge 221, the ultrasonic device 222 and the gold wire melting device 223 cooperate with each other to form an efficient welding unit. The ultrasonic device 222 provides the energy required for bonding, the capillary wedge 221 realizes the positioning and placement of the gold wire, and the gold wire melting device 223 timely completes the melting of the gold wire. The synergistic work of each part optimizes the welding process flow and avoids complex operation steps and additional equipment adjustment time.

[0029] As preferred, the gold wire fusing device 223 comprises a heating assembly 2231 and a heating wire 2232, the heating wire 2232 is installed on the heating assembly 2231 and arranged at one side of the capillary wedge 221. The heating assembly 2231 is a common electric heating device on the market, which can provide stable and sufficient heat for the heating wire 2232, when the gold wire needs to be fused, the heating wire 2232 can reach a high temperature in a short time, and the gold wire is fused rapidly. The heating wire 2232 is arranged at one side of the capillary wedge 221, so that the heating wire 2232 can accurately act on the position of the gold wire that needs to be fused. In the welding process, the gold wire is accurately placed at the welding point through the capillary wedge 221, and the heating wire 2232 arranged at one side can accurately heat the gold wire locally, realize accurate fusing, and avoid affecting other surrounding parts or the completed welding point,

[0030] As preferred, the wire feeding mechanism 1 comprises a wire reel 11 and a wire reel driving device 12, the wire reel 11 is installed on the rotating shaft of the wire reel driving device 12. In the wire feeding process, the wire reel driving device 12 directly drives the wire reel 11 to rotate, which can transmit power to the wire reel without loss, reducing energy loss and transmission error in the power transmission process. So that the wire reel driving device 12 can provide stable driving force for the wire reel, thereby ensuring the stability of the gold wire in the conveying process, avoiding the situation that the wire feeding speed is fast and slow, and being beneficial to improve the consistency of the welding quality.

[0031] In summary, the lead bonding device of the ultrasonic gold wire ball bonding machine reduces the shaking of the gold wire in the conveying and welding process, improves the accuracy of the welding position, thereby avoiding the problem of poor welding, and improves the welding precision and quality.

[0032] In summary, the above only describes the preferred embodiments of the present application, and does not limit the present application. Any modification, equivalent replacement and improvement within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wire bonding device for an ultrasonic gold wire ball welding machine, comprising a wire feeding mechanism (1) and a welding mechanism (2), wherein the wire feeding mechanism (1) is disposed above the welding mechanism (2), characterized in that, The welding mechanism (2) includes a wire clamping device (21) and a welding head assembly (22). The wire clamping device (21) is located above the welding head assembly (22). The wire clamping device (21) includes a lead wire device (211), a wire clamp (212), and a wire clamp driver (213). The wire clamp (212) is mounted on the wire clamp driver (213). The wire clamp driver (213) drives the wire clamp (212) to open and close. The lead wire device (211) is located above the wire clamp (212). The lead wire device (211) is provided with a wire hole (2111). The wire hole (2111) is perpendicular to the wire clamp (212).

2. The wire bonding device of the ultrasonic gold wire ball welding machine according to claim 1, characterized in that, The wire clamp (212) is provided with two rubber blocks (214), which are symmetrically arranged on the inner side of the clamp head of the wire clamp (212), and the wire hole (2111) is located above the rubber blocks (214).

3. The wire bonding device of the ultrasonic gold wire ball welding machine according to claim 1, characterized in that, It also includes a tension adjustment mechanism (3), which is located between the wire feeding mechanism (1) and the welding mechanism (2). The tension adjustment mechanism (3) includes a wire guide (31), a drive wheel (32) and a tension wheel (33). The wire guide (31) is fixedly located on one side of the drive wheel (32), and the tension wheel (33) is located on the other side of the drive wheel (32).

4. The wire bonding device of the ultrasonic gold wire ball welding machine according to claim 3, characterized in that, The tensioning wheel (33) has a wire-locking groove (331), and a wire guide (332) is fixedly provided on the outside of the wire-locking groove (331). The wire guide (332) has a wire hole (3321), and the wire hole (3321) is coaxially arranged with the wire threading hole (2111).

5. The wire bonding device of the ultrasonic gold wire ball welding machine according to claim 1, characterized in that, The welding head assembly (22) includes a capillary chopper (221), an ultrasonic device (222), and a gold wire fusion device (223). The capillary chopper (221) is fixed below one end of the ultrasonic device (222) with the blade pointing downwards. The gold wire fusion device (223) is located on one side of the capillary chopper (221).

6. The wire bonding device of the ultrasonic gold wire ball welding machine according to claim 5, characterized in that, The gold wire melting device (223) includes a heating component (2231) and a heating wire (2232), wherein the heating wire (2232) is installed on the heating component (2231) and disposed on one side of the capillary cutter (221).

7. The wire bonding device for the ultrasonic gold wire ball welding machine according to claim 1, characterized in that, The wire feeding mechanism (1) includes a wire spool (11) and a wire spool drive device (12), wherein the wire spool (11) is mounted on the rotating shaft of the wire spool drive device (12).

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