Power device module
By setting positioning structures on the insulating frame and sub-assemblies, the problem of sub-assembly alignment in power device module assembly was solved, achieving tight tolerances and high yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-10
- Publication Date
- 2026-03-24
AI Technical Summary
In the production process of power device modules, how to effectively achieve the alignment and assembly of multiple sub-components to achieve tight tolerances and high yield?
By setting multiple positioning structures, such as positioning parts and positioning pins, on the opposite sides of the insulating frame, and setting corresponding positioning holes or positioning parts on the sub-assemblies, the alignment and assembly between the insulating frame and the sub-assemblies can be achieved by combining the relative positional relationship of these structures.
This enables tight-tolerance assembly of power device modules, improving the yield rate during the production process.
Smart Images
Figure CN224037826U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to power electronic device technical field especially relates to a kind of power device module. BACKGROUND
[0002] Power device module is usually composed of multiple subassemblies such as plastic cover, plastic frame and base plate, etc., which need to be assembled together in the module production process. When the module is shipped, the modules that do not meet the specific geometric specifications are removed through detection such as automatic optical detection. Therefore, it is very important to align these subassemblies, which can achieve tight tolerance in the assembly process, which is necessary for high outgoing yield in the production process. In addition, the module may be connected with other subassemblies when assembled at the end customer site, which also requires mechanical and geometric tolerance check. Therefore, how to effectively realize the alignment assembly between multiple subassemblies is a technical problem to be solved at present. SUMMARY
[0003] Therefore, in view of the above, the utility model embodiment provides a kind of power device module, and the alignment assembly between each subassembly can be realized by structural design, so that tight tolerance can be realized in the assembly process of each subassembly of module, and then high outgoing yield in the module production process is realized.
[0004] Specifically, the utility model embodiment provides a kind of power device module, for example, including: insulating frame, first side subassembly and second side subassembly, the insulating frame has opposite first side and second side in first direction, the first side subassembly and the second side subassembly are respectively installed on the first side and the second side of the insulating frame, the insulating frame is configured with accommodating space, and the accommodating space is used to accommodate at least one power device;Wherein: the side of the first side subassembly facing the insulating frame is provided with a plurality of first positioning parts, the first side of the insulating frame is provided with a plurality of second positioning parts, and the second side of the insulating frame is provided with a plurality of positioning pins, and the second side subassembly is provided with a plurality of positioning through holes;The plurality of second positioning parts and the plurality of first positioning parts are connected one by one in hole-pin cooperation mode;In the second direction perpendicular to the first direction, each second positioning part is arranged at intervals with the most adjacent positioning pin in the plurality of positioning pins;The plurality of positioning pins and the plurality of positioning through holes are connected one by one.
[0005] Further, another power device module provided by the embodiment of the utility model, for example, includes: insulating frame body, first side subassembly and second side subassembly, the insulating frame body has opposite first side and second side in first direction, the first side subassembly and the second side subassembly are installed on the first side and the second side of the insulating frame body respectively, the insulating frame body is configured with accommodating space, and the accommodating space is used to accommodate at least one power device;Wherein: the side of the first side subassembly facing the insulating frame body is equipped with a plurality of first positioning parts, the first side of the insulating frame body is equipped with a plurality of second positioning parts, and the second side of the insulating frame body is equipped with a plurality of positioning pins, and the second side subassembly is equipped with a plurality of positioning through holes;The plurality of second positioning parts and the plurality of first positioning parts are connected one by one in hole-pin cooperation mode, and the plurality of second positioning parts and the plurality of positioning pins are one by one, and each second positioning part is a positioning hole extending from the surface of the first side of the insulating frame body to the corresponding positioning pin in the first direction;The plurality of positioning pins and the plurality of positioning through holes are connected one by one.
[0006] The above embodiment of the utility model can have the following beneficial effects: by arranging a plurality of positioning structures such as the plurality of second positioning parts and the plurality of positioning pins on the opposite two sides (i.e. the first side and the second side) of the insulating frame body configured with the accommodating space for accommodating the power device, and arranging a plurality of positioning structures such as the plurality of first positioning parts and the plurality of positioning through holes on the first side subassembly and the second side subassembly respectively, and combining the structural design and relative position relationship of the plurality of second positioning parts and the plurality of positioning pins, the alignment assembly between the insulating frame body and the first side subassembly and the second side subassembly can be realized, the close tolerance in the assembly process of the power device module can be realized, and then the high yield in the production process of the power device module can be realized. BRIEF DESCRIPTION OF DRAWINGS
[0007] The specific embodiment of the utility model will be described in detail below with reference to the drawings.
[0008] Figure 1 The utility model provides a kind of power device module's three-dimensional structure explosion schematic view.
[0009] Figure 2 For Figure 1 The partial section structure schematic view of the power device module shown in the figure after accommodating power device.
[0010] Figure 3 For Figure 1 The partial structure enlarged schematic view of the power device module shown in the figure.
[0011] Figure 4A third power device module three-dimensional structure explosion schematic view provided by the embodiment of the utility model.
[0012] Figure 5 For Figure 4 The partial structure amplification schematic view of the power device module shown in the figure.
[0013] Figure 6 Another power device module three-dimensional structure explosion schematic view provided by the embodiment of the utility model.
[0014] Figure 7 A third power device module three-dimensional structure explosion schematic view provided by the embodiment of the utility model.
[0015] Figure 8 For Figure 7 The partial structure amplification schematic view of the power device module shown in the figure.
[0016]
MAIN FIGURE MARK EXPLANATION
[0017] 10, insulating frame body;10B, first side;10T, second side;100, containing space;101, second positioning part;103, positioning pin;30, first side subassembly;301, first positioning part;303, positioning piece;50, insulating cover body;501, positioning through hole;70, printed circuit board;701, positioning through hole;B1, first direction;B2, second direction;B3, third direction;91, base plate;93, power device;931, signal pin;d1, d2, pitch;θ, included angle. DETAILED DESCRIPTION
[0018] In order to make the above-mentioned purpose, features and advantages of the utility model more obvious and easy to understand, the specific implementation of the utility model will be described in detail below with the help of the accompanying drawings.
[0019] In order to make the person skilled in the art better understand the technical scheme of the utility model, the technical scheme in the embodiment of the utility model will be described clearly and completely below with the help of the accompanying drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment in the utility model, all other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the utility model.
[0020] It should be noted that the terms "first", "second", and the like in the description and in the claims of the utility model of the present application and the above-mentioned drawings are used to distinguish similar objects and do not have to be used to describe a specific order or chronological sequence. It should be understood that the terms thus used can be interchanged under appropriate circumstances so that the utility model embodiments described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.
[0021] It should also be noted that the division of the multiple embodiments in the utility model is only for the convenience of description and should not constitute a special limitation. The features in various embodiments can be combined and mutually referenced without contradiction.
[0022] Referring to Figure 1 , Figure 2 and Figure 3 , the utility model embodiment provides a kind of power device module, it includes for example: insulating frame 10, first side subassembly 30, and second side subassembly such as insulating cover 50;The insulating frame 10 has opposite first side 10B and second side 10T in first direction B1, the first side subassembly 30 and the second side subassembly such as insulating cover 50 are respectively installed in the first side 10B and the second side 10T of the insulating frame 10, the insulating frame 10 is configured with accommodating space 100, and the accommodating space 100 is used to accommodate at least one power device 93. The side of the first side subassembly 30 facing the insulating frame 10 is provided with a plurality of first positioning parts 301, the first side 10B of the insulating frame 10 is provided with a plurality of second positioning parts 101, and the second side 10T of the insulating frame 10 is provided with a plurality of positioning pins 103, and the second side subassembly such as insulating cover 50 is provided with a plurality of positioning through holes 501. The plurality of second positioning parts 101 and the plurality of first positioning parts 301 are connected one by one in hole-pin cooperation mode;In the second direction B2 perpendicular to the first direction B1, each second positioning part 101 is spaced apart from the most adjacent positioning pin 103 in the plurality of positioning pins 103;The plurality of positioning pins 103 and the plurality of positioning through holes 501 are connected one by one.
[0023] As an illustrative example, the first side sub-assembly 30 is, for example, a base plate, which has a thickness of two millimeters or more and may be made of metal or a metal matrix composite. Furthermore, a thin coating may be provided on the surface of the base plate facing the insulating frame 10, such as a nickel coating to improve weldability, or made of a transition metal such as gold or silver to facilitate sintering. The insulating frame 10 is, for example, electrically insulating, and may be a hollow annular structure, and may be made of thermosetting or thermoplastic plastics. This insulating frame 10 can be manufactured using injection molding technology. The insulating cover 50 may also be made of thermosetting or thermoplastic plastics. Furthermore, the number of the plurality of first positioning portions 301, the plurality of second positioning portions 101, the plurality of positioning pins 103, and the plurality of positioning through holes 501 are, for example, four each. Taking the right front second positioning portion 101 as an example, the positioning pin 103 closest to it is the right front positioning pin 103. Figure 3 As shown, in the second direction B2, there is a non-zero distance d1 between the geometric centers of the right front second positioning part 101 and its nearest right front positioning pin 103. There are also non-zero distances between the geometric centers of the other second positioning parts 101 and their respective nearest positioning pins 103, which will not be elaborated further here. Furthermore, it is worth mentioning that the number of the plurality of first positioning parts 301, the plurality of second positioning parts 101, the plurality of positioning pins 103, and the plurality of positioning through holes 501 are not limited to... Figure 1 The four shown could also be two, three, or other quantities. Furthermore, in this embodiment, by inserting the plurality of positioning pins 103 one-to-one into the plurality of positioning through holes 501, the second side sub-assembly, such as the insulating cover 50, can be aligned and assembled to the second side 10T of the insulating frame 10; and by connecting the plurality of second positioning parts 101 and the plurality of first positioning parts 301 one-to-one in a pin-and-hole engagement manner, the first side sub-assembly 30 can be aligned and assembled to the first side 10B of the insulating frame 10.
[0024] From the above, the utility model discloses an embodiment through being provided with multiple positioning structure such as the multiple second positioning part 101 and the multiple positioning pin 103 on the opposite two sides (that is the first side 10B and the second side 10T) of the insulating frame body 10 configured with the accommodation space 100 for accommodating power device 93, and being provided with multiple positioning structure such as the multiple first positioning part 301 and the multiple positioning through -hole 501 on the first side subassembly 30 and the second side subassembly such as insulating cover body 50 respectively, then combining the relative position relation such as interval arrangement in the second direction B2 of the multiple second positioning part 101 and the multiple positioning pin 103, it can realize the alignment assembly between the insulating frame body 10 and the first side subassembly 30 and the second side subassembly such as insulating cover body 50, can realize the close tolerance in the assembly process of power device module, and then realize the high finished product rate in the production process of power device module.
[0025] In some embodiments, referring to Figure 1 and Figure 3 Further, in the third direction B3 perpendicular to the first direction B1 and the second direction B2, each second positioning part 101 is spaced apart from the closest positioning pin 103 of the multiple positioning pins 103, for example, there is a non-zero spacing d2 between the geometric centers, so that the distance between each second positioning part 101 and the closest positioning pin 103 of the multiple positioning pins 103 has an acute angle θ with respect to the second direction B2. This offset between the multiple second positioning parts 101 and the closest positioning pins 103 serves as a "foolproof" design to improve assembly efficiency.
[0026] In some embodiments, referring to Figure 1 Each second positioning part 101 is a positioning pin, and each first positioning part 301 is a positioning hole; by inserting the second positioning part 101 in the form of a positioning pin into the corresponding first positioning part 301 in the form of a positioning hole, the insulating frame body 10 and the first side subassembly 30 can be aligned and assembled together through this hole-pin fitting method.
[0027] In some embodiments, referring to Figure 1, the side of the first side subassembly 30 facing away from the insulation frame 10 is provided with a plurality of positioning members 303, such as a plurality of positioning pins; in this way, when the first side subassembly 30 is a bottom plate, it can be externally connected to a cooler provided with a plurality of positioning holes through the plurality of positioning members 303. It can be understood that, in other embodiments, when the first side subassembly 30 is a cooler, the plurality of positioning members 303 can no longer be provided. Furthermore, in the second direction B2, each first positioning part 301 is spaced apart from the nearest positioning member 303 of the plurality of positioning members 303, such as a non-zero spacing between geometric centers; further, in the third direction B2, each first positioning part 301 can also be spaced apart from the nearest positioning member 303 of the plurality of positioning members 303, such as a non-zero spacing between geometric centers; thus, the relative position offset design is also adopted between each first positioning part 301 and the nearest positioning member 303 of the plurality of positioning members 303.
[0028] In some embodiments, referring to Figure 1 and Figure 2 , when the second side subassembly is an insulation cover 50 provided with the plurality of positioning through holes 501, the plurality of positioning pins 103 partially protrude out of the respective corresponding positioning through holes 501 after passing through the respective corresponding positioning through holes 501. Furthermore, the power device module can further include a printed circuit board 70, and the printed circuit board 70 is provided with a plurality of positioning through holes 701; in the first direction B1, the plurality of positioning through holes 501 of the insulation cover 50 and the plurality of positioning through holes 701 of the printed circuit board 70 are one-to-one aligned; and the plurality of positioning pins 103 are sequentially connected to the plurality of positioning through holes 501 of the insulation cover 50 and the plurality of positioning through holes 701 of the printed circuit board 70 one-to-one. In this way, the power device module of the present embodiment can align and assemble a plurality of subassemblies, such as the insulation cover 50 and the printed circuit board 70 shown in Figure 1 , through the plurality of positioning pins 103 on the second side 10T of the insulation frame 10. Moreover, it is also convenient to align and assemble the printed circuit board 70 on site for the end customer.
[0029] In some embodiments, as shown in Figure 1 and Figure 2 , the accommodation space 100 accommodates at least one substrate 91 and the at least one power device 93, Figure 2 two substrates 91 and two power devices 93 are shown as an example. Each of the substrates 91 is connected to the surface of the first side subassembly 30 facing the insulation frame 10, and at least one (such as Figure 2In one embodiment, there is one power device 93, and in other embodiments, there can be multiple power devices 93. Each power device 93 has a signal pin 931, and each signal pin 931 passes through the second side subassembly, such as the insulating cover 50, and is partially exposed to the side of the second side subassembly, such as the insulating cover 50, which is away from the insulating frame 10, and can even pass through the printed circuit board 70 and be partially exposed to the side of the printed circuit board 70, which is away from the insulating frame 10. As an illustrative example, each substrate 91 is a multilayer substrate, such as one that includes an insulating base layer and metal layers disposed on opposite sides of the insulating base layer, which can be made of copper, copper alloy, aluminum, aluminum alloy, or other metals, and the insulating base layer is, for example, a ceramic base layer made of aluminum oxide, aluminum nitride, or silicon nitride. Each substrate 91 can be connected to the first side subassembly 30, such as the bottom plate or the cooler, by a connecting material, such as a sintering material or a soldering material. Each power device 93 includes, for example, a controllable semiconductor switch, such as a MOSFET, an IGBT, a JFET, or a thyristor, or is a diode. Accordingly, as an example, the signal pin 931 is, for example, an external pin electrically connected to the gate or the source of a MOSFET, or an external pin electrically connected to the gate or the emitter of an IGBT, or an external pin electrically connected to the anode of a diode.
[0030] In some embodiments, referring to Figure 4 and Figure 5 Each second positioning part 101 is a positioning hole, and each first positioning part 301 is a positioning pin. Thus, the insulating frame 10 and the first side subassembly 30 can be assembled together in alignment by inserting the first positioning part 301 in the form of a positioning pin into the corresponding second positioning part 101 in the form of a positioning hole through a hole-pin fitting. Furthermore, from Figure 5 It can be seen that in the second direction B2, each second positioning part 101 in the form of a positioning hole is spaced apart from its nearest positioning pin 103, such as the geometric centers, with a non-zero spacing d1, and even in the third direction B3, each second positioning part 101 in the form of a positioning hole is spaced apart from its nearest positioning pin 103, such as the geometric centers, with a non-zero spacing d2, so that the distance between each second positioning part 101 and its nearest positioning pin 103 has an acute angle θ with respect to the second direction B2. This relative positional offset design between multiple second positioning parts 101 and their respective nearest positioning pins 103, as a kind of “fool-proof” design, is beneficial to improve assembly efficiency.
[0031] In some embodiments, referring to Figure 6The second side subassembly of the power device module can also be a printed circuit board 70 provided with a plurality of positioning through holes 701 instead of the insulating cover 50, so that the printed circuit board 70 can be directly assembled to the second side 10T of the insulating frame 10 by inserting the plurality of positioning pins 103 of the second side 10T of the insulating frame 10 into the corresponding positioning through holes 701, respectively; in this case, the printed circuit board 70 also serves as the cover of the insulating frame 10.
[0032] Referring to Figure 7 and Figure 8 , another power device module is provided, which comprises an insulating frame 10, a first side subassembly 30 and a second side subassembly, for example, an insulating cover 50; the insulating frame 10 has a first side 10B and a second side 10T opposite in a first direction B1, the first side subassembly 30 and the second side subassembly, for example, the insulating cover 50, are respectively installed on the first side 10B and the second side 10T of the insulating frame 10, and the insulating frame 10 is provided with a receiving space 100 for accommodating at least one power device 93 (as shown in Figure 2 The side of the first side subassembly 30 facing the insulating frame 10 is provided with a plurality of first positioning parts 301, the first side 10B of the insulating frame 10 is provided with a plurality of second positioning parts 101, and the second side 10T of the insulating frame 10 is provided with a plurality of positioning pins 103, and the second side subassembly, for example, the insulating cover 50, is provided with a plurality of positioning through holes 501. The plurality of second positioning parts 101 and the plurality of first positioning parts 301 are connected one by one in a hole-pin cooperation mode, and the plurality of second positioning parts 101 and the plurality of positioning pins 103 are one by one, each of the second positioning parts 101 is a positioning hole extending from the surface of the first side 10B of the insulating frame 10 to the corresponding positioning pin 103 in the first direction B1; the plurality of positioning pins 103 and the plurality of positioning through holes 501 are connected one by one.
[0033] As an illustrative example, the first side subassembly 30 is, for example, a bottom plate, which has a thickness of, for example, two millimeters or even more, and can be composed of metal or composed of metal matrix composite. Further, a thin coating, for example, a nickel coating for improving weldability or composed of a transition metal such as gold or silver for facilitating sintering connection, can be provided on the surface of the side of the bottom plate facing the insulating frame 10. The insulating frame 10 is, for example, electrically insulating, such as a hollow ring-like structure, and can be composed of thermosetting plastic or composed of thermoplastic plastic, and such an insulating frame 10 can be manufactured by means of injection molding technology. The insulating cover 50 can also be composed of thermosetting plastic or composed of thermoplastic plastic. Further, the number of the plurality of first positioning portions 301, the number of the plurality of second positioning portions 101, the number of the plurality of positioning pins 103, and the number of the plurality of positioning through holes 501 are, for example, all four, but can also be other numbers, such as two, three, etc. In addition, from the above it can be seen that each of the second positioning portions 101 is in the form of a positioning hole, which penetrates through the side wall of the insulating frame 10 in the first direction B1 and extends into the corresponding positioning pin 103, so that each of the positioning pins 103 is a hollow structure. In this way, by inserting each of the first positioning portions 301 in the form of a positioning pin into the corresponding second positioning portion 101 in the form of a positioning hole, respectively, the first side subassembly 30 can be assembled in alignment to the first side 10B of the insulating frame 10; and by inserting the plurality of positioning pins 103 into the plurality of positioning through holes 501 one by one in one-to-one correspondence, the second side subassembly, for example, the insulating cover 50, can be assembled in alignment to the second side 10T of the insulating frame 10. Figure 8
[0034] From the above, it can be seen that, by providing a plurality of positioning structures, for example, the plurality of second positioning portions 101 and the plurality of positioning pins 103, on the opposite two sides, namely the first side 10B and the second side 10T, of the insulating frame 10 configured with the accommodation space 100 for accommodating the power device 93, and by providing a plurality of positioning structures, for example, the plurality of first positioning portions 301 and the plurality of positioning through holes 501, on the first side subassembly 30 and the second side subassembly, for example, the insulating cover 50, respectively, and by the relative positional relationship between the plurality of second positioning portions 101 and the plurality of positioning pins 103, for example, being arranged in alignment in the first direction B1 and each of the positioning pins 103 being a hollow structure, the alignment assembly between the insulating frame 10 and the first side subassembly 30 and the second side subassembly, for example, the insulating cover 50, can be achieved, the tight tolerance during the assembly of the power device module can be achieved, and thus the high yield during the production process of the power device module can be achieved.
[0035] In some embodiments, referring to Figure 7 , the side of the first side subassembly 30 facing away from the insulation frame 10 is provided with a plurality of positioning members 303, such as a plurality of positioning pins; in this way, when the first side subassembly 30 is a bottom plate, it can be externally fitted with a cooler provided with a plurality of positioning holes through the plurality of positioning members 303. It can be understood that, in other embodiments, when the first side subassembly 30 is a cooler, the plurality of positioning members 303 can no longer be provided. Furthermore, in the second direction B2, each first positioning part 301 is spaced apart from the nearest positioning member 303 of the plurality of positioning members 303, such as a non-zero spacing between geometric centers; further, in the third direction B2, each first positioning part 301 can also be spaced apart from the nearest positioning member 303 of the plurality of positioning members 303, such as a non-zero spacing between geometric centers; thus, the relative position offset design is also adopted between each first positioning part 301 and the nearest positioning member 303 of the plurality of positioning members 303.
[0036] In some embodiments, referring to Figure 7 and in combination with Figure 2 , when the second side subassembly is an insulation cover 50 provided with the plurality of positioning through holes 501, the plurality of positioning pins 103 partially protrude out of the respective corresponding positioning through holes 501 after passing through the respective corresponding positioning through holes 501. Furthermore, the power device module can further include a printed circuit board 70, and the printed circuit board 70 is provided with a plurality of positioning through holes 701; in the first direction B1, the plurality of positioning through holes 501 of the insulation cover 50 and the plurality of positioning through holes 701 of the printed circuit board 70 are one-to-one aligned; and the plurality of positioning pins 103 are sequentially connected to the plurality of positioning through holes 501 of the insulation cover 50 and the plurality of positioning through holes 701 of the printed circuit board 70 one-to-one. In this way, the power device module of the present embodiment can align and assemble a plurality of subassemblies, such as Figure 7 the insulation cover 50 and the printed circuit board 70 shown in the figure, on the second side 10T of the insulation frame 10 through the plurality of positioning pins 103. Moreover, it also facilitates the alignment and assembly of the printed circuit board 70 on site at the end customer.
[0037] In some embodiments, referring to Figure 7 and in combination with Figure 2 , the accommodation space 100 accommodates at least one substrate 91 and the at least one power device 93, Figure 2 two substrates 91 and two power devices 93 are shown in the figure only as an example. Each of the substrates 91 is connected to the surface of the first side subassembly 30 facing the insulation frame 10, and at least one (such as Figure 2In one of the embodiments, the power device module 90 can include one or more power devices 93, each of which has a signal pin 931 that is exposed to the second side subassembly, such as the insulating cover 50, and even to the printed circuit board 70. As an illustrative example, each of the substrates 91 is a multilayer substrate that includes an insulating base layer and metal layers disposed on opposite sides of the insulating base layer, which can be made of copper, copper alloy, aluminum, aluminum alloy, or other metals, and the insulating base layer is a ceramic base layer made of aluminum oxide, aluminum nitride, silicon nitride, or the like. Each of the substrates 91 can be connected to the first side subassembly 30, such as the base plate or the cooler, by a connecting material, such as a sintering material or a soldering material. Each of the power devices 93 includes a controllable semiconductor switch, such as a MOSFET, an IGBT, a JFET, a thyristor, or the like, or an incontrollable semiconductor switch, such as a diode. Accordingly, as an example, the signal pin 931 is an external pin electrically connected to the gate or the source of a MOSFET, or the gate or the emitter of an IGBT, or the anode of a diode.
[0038] In some embodiments, the power device module 90 can include one or more power devices 93, each of which has a signal pin 931 that is exposed to the second side subassembly, such as the insulating cover 50, and even to the printed circuit board 70. As an illustrative example, each of the substrates 91 is a multilayer substrate that includes an insulating base layer and metal layers disposed on opposite sides of the insulating base layer, which can be made of copper, copper alloy, aluminum, aluminum alloy, or other metals, and the insulating base layer is a ceramic base layer made of aluminum oxide, aluminum nitride, silicon nitride, or the like. Each of the substrates 91 can be connected to the first side subassembly 30, such as the base plate or the cooler, by a connecting material, such as a sintering material or a soldering material. Each of the power devices 93 includes a controllable semiconductor switch, such as a MOSFET, an IGBT, a JFET, a thyristor, or the like, or an incontrollable semiconductor switch, such as a diode. Accordingly, as an example, the signal pin 931 is an external pin electrically connected to the gate or the source of a MOSFET, or the gate or the emitter of an IGBT, or the anode of a diode. Figure 7 Please refer to Figure 6 In some embodiments, the power device module 90 can include one or more power devices 93, each of which has a signal pin 931 that is exposed to the second side subassembly, such as the insulating cover 50, and even to the printed circuit board 70. As an illustrative example, each of the substrates 91 is a multilayer substrate that includes an insulating base layer and metal layers disposed on opposite sides of the insulating base layer, which can be made of copper, copper alloy, aluminum, aluminum alloy, or other metals, and the insulating base layer is a ceramic base layer made of aluminum oxide, aluminum nitride, silicon nitride, or the like. Each of the substrates 91 can be connected to the first side subassembly 30, such as the base plate or the cooler, by a connecting material, such as a sintering material or a soldering material. Each of the power devices 93 includes a controllable semiconductor switch, such as a MOSFET, an IGBT, a JFET, a thyristor, or the like, or an incontrollable semiconductor switch, such as a diode. Accordingly, as an example, the signal pin 931 is an external pin electrically connected to the gate or the source of a MOSFET, or the gate or the emitter of an IGBT, or the anode of a diode.
[0039] The above merely provides the preferred embodiments of the present application, but shall not be construed to limit the present application in any form. Although the present application has been disclosed by the preferred embodiments, it is not intended to limit the present application, and any person skilled in the art can make some changes or modifications to the above disclosed technical contents to form equivalent embodiments without departing from the technical solution of the present application. Any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application shall still fall within the scope of the technical solution of the present application.
Claims
1. A power device module, characterized by The power device module comprises: an insulating frame body having a first side and a second side opposite in a first direction, a first side subassembly and a second side subassembly respectively mounted on the first side and the second side of the insulating frame body, the insulating frame body being configured with a containing space for accommodating at least one power device; wherein: a side of the first side subassembly facing the insulating frame body is provided with a plurality of first positioning portions, the first side of the insulating frame body is provided with a plurality of second positioning portions, and the second side of the insulating frame body is provided with a plurality of positioning pins, and the second side subassembly is provided with a plurality of positioning through holes; the plurality of second positioning portions and the plurality of first positioning portions are connected one by one in a hole-pin fitting manner; in a second direction perpendicular to the first direction, each second positioning portion is arranged in a spaced manner with the most adjacent positioning pin among the plurality of positioning pins; and the plurality of positioning pins and the plurality of positioning through holes are connected one by one.
2. The power device module of claim 1, wherein, In a third direction perpendicular to both the first direction and the second direction, each second positioning portion is arranged in a spaced manner with the most adjacent positioning pin among the plurality of positioning pins, so that the distance between each second positioning portion and the most adjacent positioning pin among the plurality of positioning pins has an acute angle with respect to the second direction.
3. The power device module according to claim 1 or 2, characterized in that Each second positioning portion is a positioning pin, and each first positioning portion is a positioning hole; or, each second positioning portion is a positioning hole, and each first positioning portion is a positioning pin.
4. The power device module according to claim 1 or 2, characterized in that A side of the first side subassembly away from the insulating frame body is provided with a plurality of positioning members; in the second direction, each first positioning portion is arranged in a spaced manner with the most adjacent positioning member among the plurality of positioning members.
5. The power device module according to claim 1 or 2, characterized in that, The first side subassembly is a bottom plate or a cooler, and the second side subassembly is an insulating cover body or a printed circuit board provided with the plurality of positioning through holes.
6. The power device module of claim 5, wherein, The second side subassembly is an insulating cover body provided with the plurality of positioning through holes, and the plurality of positioning pins partially protrude out of the respective corresponding positioning through holes after passing through the respective corresponding positioning through holes; The power device module further comprises a printed circuit board, and the printed circuit board is provided with a plurality of positioning through holes; in the first direction, the plurality of positioning through holes of the insulating cover body and the plurality of positioning through holes of the printed circuit board are arranged one by one in alignment; and the plurality of positioning pins are connected one by one in correspondence with the plurality of positioning through holes of the insulating cover body and the plurality of positioning through holes of the printed circuit board.
7. The power device module according to claim 1 or 2, characterized in that The containing space contains at least one substrate and the at least one power device, each substrate is connected to a surface of the first side subassembly facing the insulating frame body, at least one power device is mounted on a surface of each substrate away from the first side subassembly, each power device has a signal pin, and each signal pin passes through the second side subassembly and is partially exposed to a side of the second side subassembly away from the insulating frame body.
8. A power device module, characterized by The power device module comprises: An insulating frame body having a first side and a second side opposite in a first direction, a first side subassembly and a second side subassembly mounted on the first side and the second side of the insulating frame body respectively, the insulating frame body being configured with a receiving space for accommodating at least one power device; wherein: A side of the first side subassembly facing the insulating frame body is provided with a plurality of first positioning portions, the first side of the insulating frame body is provided with a plurality of second positioning portions, and the second side of the insulating frame body is provided with a plurality of positioning pins, and the second side subassembly is provided with a plurality of positioning through holes; The plurality of second positioning portions and the plurality of first positioning portions are connected one by one in a hole-pin fitting manner, and the plurality of second positioning portions and the plurality of positioning pins are one by one, each of the second positioning portions being a positioning hole extending from the surface of the first side of the insulating frame body to the corresponding positioning pin in the first direction; the plurality of positioning pins and the plurality of positioning through holes are connected one by one.
9. The power device module of claim 8, wherein, A side of the first side subassembly away from the insulating frame body is provided with a plurality of positioning members; in a second direction perpendicular to the first direction, each of the first positioning portions is spaced apart from the closest positioning member in the plurality of positioning members.
10. The power device module according to claim 8 or 9, characterized in that The first side subassembly is a bottom plate or a cooler, and the second side subassembly is an insulating cover or a printed circuit board provided with the plurality of positioning through holes; and / or The plurality of positioning pins partially protrude out of the corresponding positioning through holes after passing through the corresponding positioning through holes; and / or The receiving space accommodates at least one substrate and the at least one power device, each of the substrates being connected to the surface of the first side subassembly facing the insulating frame body, and at least one power device being mounted on the surface of each of the substrates away from the first side subassembly, each of the power devices having a signal pin, and each of the signal pins passing through the second side subassembly and being partially exposed to the side of the second side subassembly away from the insulating frame body.