Pot

Abstract

The utility model provides a pot. The cookware comprises a cookware base body and a non-magnetic metal coating, and the non-magnetic metal coating is at least arranged on the bottom wall of the cookware base body and serves as a magnetic conduction layer of the cookware. According to the cookware, the non-magnetic metal coating serves as the magnetic conductive layer of the cookware, the non-magnetic metal coating is not prone to being burnt out, the non-magnetic metal coating can be tightly combined with the cookware base body under the condition that the normal magnetic induction heating function is guaranteed, the non-magnetic metal coating is not prone to falling off, and therefore the magnetic conductive service life of the cookware can be prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to a pot technical field, concretely relates to a pot. BACKGROUND

[0002] At present, in the design of electromagnetic induction heating cookware, two methods are generally used to realize the magnetic induction heating function: one is to paste a magnetic conductive film on the outer wall of the cookware body, and the other is to thermally spray a metal magnetic conductive layer on the bottom wall of the cookware body.

[0003] However, the magnetic conductive film is easy to burn out during use, causing the magnetic induction heating function to fail, and the thermally sprayed metal magnetic conductive layer is usually thick and may fall off due to high stress, also causing the magnetic induction heating function to fail.

[0004] The above problems will cause the magnetic induction heating function to fail, thereby reducing the magnetic conductive life of the cookware. SUMMARY

[0005] Therefore, the utility model aims to provide a pot to solve the problem that the magnetic conductive layer and the base body are easy to burn out or fall off, affecting the magnetic conductive life of the pot.

[0006] The utility model aims to provide a pot, wherein the pot comprises a pot base body and a non-magnetic metal plating layer, the non-magnetic metal plating layer is arranged on the bottom wall of the pot base body as a magnetic conductive layer of the pot.

[0007] According to the pot provided by the utility model embodiment, the non-magnetic metal plating layer is used as the magnetic conductive layer of the pot, the non-magnetic metal plating layer is not easy to burn out, can be tightly combined with the pot base body under the condition of ensuring normal magnetic induction heating function, has small stress and is not easy to fall off, thereby the magnetic conductive life of the pot can be improved.

[0008] In some embodiments, the thickness of the non-magnetic metal plating layer is 5-25 microns; and / or the resistance of the non-magnetic metal plating layer is 20-80 ohms, which can realize the magnetic conductive performance matched with the induction cooker when using non-magnetic material, and the non-magnetic metal plating layer is used as the magnetic conductive layer of the pot.

[0009] In some embodiments, the non-magnetic metal plating layer is formed on the outer surface and / or inner surface of the bottom wall, the forming position is diversified, and various types of cookware can be easily formed.

[0010] In some embodiments, the non-magnetic metal plating layer extends from the bottom wall of the pot body to a wall region of the pot body connected to the bottom wall. When the magnetic conductive layer of the non-magnetic metal plating layer extends to the outer wall region, it can help to distribute heat more evenly on the bottom wall and the side wall of the pot, thereby improving thermal efficiency and enabling the food to be heated more evenly during cooking.

[0011] In some embodiments, the non-magnetic metal plating layer includes a copper plating layer, an aluminum plating layer, or a zinc plating layer. Since the copper plating layer, the aluminum plating layer, or the zinc plating layer has a lower hardness and a smaller thermal expansion coefficient than the pot, it produces less stress and thermal deformation when heated, adheres more firmly, and further reduces the risk of the magnetic conductive layer falling off.

[0012] In some embodiments, the non-magnetic metal plating layer is a whole circle or includes a plurality of magnetic conductive rings, wherein, in the case where the non-magnetic metal plating layer includes a plurality of magnetic conductive rings, the plurality of magnetic conductive rings are arranged in sequence from the center of the bottom wall to the edge of the bottom wall, and a gap is provided between adjacent magnetic conductive rings. The shape of the non-magnetic metal plating layer is diversified, thereby enabling the formation of multiple types of magnetic conductive pots.

[0013] In some embodiments, the non-magnetic metal plating layer is a chemical plating layer or an electroplating layer, which can be formed in multiple ways, thereby simplifying the manufacturing of the pot.

[0014] In some embodiments, the pot further includes a protective layer arranged outside the non-magnetic metal plating layer, which can reduce the risk of the non-magnetic metal plating layer being directly exposed and damaged, and further improve the magnetic conductive life of the pot.

[0015] In some embodiments, the surface of the non-magnetic metal plating layer has a rough structure, and the protective layer is arranged on the rough structure, which can form the protective layer on the non-magnetic metal plating layer in a way similar to the mortise-tenon joint, thereby improving the bonding strength between the non-magnetic metal plating layer and the protective layer, and further avoiding the problem of the magnetic conductive layer falling off during use.

[0016] In some embodiments, the protective layer is a ceramic coating layer, and the temperature resistance of the ceramic coating layer is 350-650°C. In this way, the ceramic coating layer itself can withstand high temperatures to better protect the non-magnetic metal plating layer.

[0017] In some embodiments, the thickness of the protective layer is 5-25 microns, which can provide long-term protection and avoid the failure of the protective function caused by the local falling off of the protective layer.

[0018] In some embodiments, the thickness of the pot base is 3-5mm, so that the thickness can ensure the overall strength of the formed pot. The pot base is a ceramic base, a glass base or a stone base, which can realize the magnetic performance of the ceramic cooker, and is particularly suitable for the manufacture of soup pots. BRIEF DESCRIPTION OF DRAWINGS

[0019] The above and other objects and features of the present application will become more apparent from the following description of embodiments taken in conjunction with the accompanying drawings, in which:

[0020] Figure 1 is a sectional view of the structure of the pot according to an embodiment of the present application;

[0021] Figure 2 is a sectional view of the structure of the pot according to another embodiment of the present application;

[0022] Figure 3 is Figure 2 is an enlarged view of I in FIG. 20.

[0023] SYMBOL EXPLANATION

[0024] 10, pot base;

[0025] 11, side wall; 12, bottom wall;

[0026] 20, non-magnetic metal plating layer; 30, protective layer. DETAILED DESCRIPTION

[0027] The following detailed description is provided to help the reader obtain a thorough understanding of the methods, devices, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, devices, and / or systems described herein will be clear to those skilled in the art after understanding the disclosure provided herein. For example, the order of the operations described herein is merely an example, and is not limited to those set forth herein, but can be changed as will be clear to those skilled in the art after understanding the disclosure provided herein, except for operations that must occur in a specific order. In addition, the description of features known in the art can be omitted for the sake of clarity and brevity.

[0028] The features described herein can be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided so as to merely show some of the many possible ways of implementing the methods, devices, and / or systems described herein, which will be clear to those skilled in the art after understanding the disclosure provided herein.

[0029] As used herein, the term "and / or" includes any one of the associated listed items, as well as any combination of any two or more of the associated listed items.

[0030] Although terms such as "first", "second", and "third" can be used herein to describe various components, assemblies, regions, layers or sections, these components, assemblies, regions, layers or sections should not be limited by these terms. Instead, these terms are only used to distinguish one component, assembly, region, layer or section from another component, assembly, region, layer or section. Thus, a first component, a first assembly, a first region, a first layer or a first section as referred to in the examples described herein can also be termed a second component, a second assembly, a second region, a second layer or a second section without departing from the teachings of the examples.

[0031] In the description, when an element such as a layer, a region, or a substrate is referred to as "on" another element, "connected to" or "mounted to" another element, it can be "directly on" the other element, "directly connected to" or "directly mounted to" the other element, or one or more other elements can be interposed therebetween. In contrast, when an element is referred to as being "directly on" another element, "directly connected to" or "directly mounted to" another element, there are no other elements interposed therebetween.

[0032] The terms used herein are only used to describe various examples and not to limit the present application. The singular form also intends to include the plural form unless the context clearly indicates otherwise. The terms "comprise", "include" and "have" indicate the presence of the stated feature, number, operation, component, element, and / or combination thereof, but do not exclude the presence or addition of one or more other features, numbers, operations, components, elements, and / or combinations thereof. The term "a plurality of" represents any number of two or more.

[0033] The orientation terms such as "upper", "lower", "inner", "outer" and the like in the present application are defined based on the orientation of the pot in the normal use state as the reference. This definition will help to ensure that the reader or user can clearly understand the relative positional relationship of each component and function, and should not be understood as a limitation of the present application.

[0034] Unless otherwise defined, all terms used herein, including technical terms and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs after the understanding of the present application. Unless explicitly defined herein, terms such as those defined in a general dictionary should be interpreted as having the same meaning as their meanings in the context of the relevant art and the present application, and should not be interpreted ideally or too formally.

[0035] In addition, in the description of the examples, when it is considered that a detailed description of the related components or functions that are well known will cause a blurred interpretation of the present application, such a detailed description will be omitted.

[0036] The embodiments of the utility model will be introduced below Figures 1 to 3 The pot provided by the embodiments of the utility model.

[0037] According to the first aspect of the utility model provides a kind of pot, specifically, stew body or pot. As shown in Figures 1 to 3 The pot includes pot base body 10 and non-magnetic metal coating 20, wherein the pot base body 10 has the basic structure of conventional pot made of metal material, ceramic, glass and stone, and the non-magnetic metal coating 20 is a coating formed by non-magnetic metal material, which is at least provided on the bottom wall of the pot base body 10 as a magnetic conducting layer of the pot.

[0038] According to the pot provided by the embodiments of the utility model, the non-magnetic metal coating 20 is used as the magnetic conducting layer of the pot, which is not easy to burn out and can be closely combined with the pot base body 10 under the condition of ensuring normal magnetic induction heating function, with small stress and not easy to fall off, thereby improving the magnetic conducting life of the pot.

[0039] In the embodiments according to the utility model, the non-magnetic metal coating 20 is a layer formed by chemical plating or electroplating of non-magnetic metal material. Here, the non-magnetic metal material is also called non-magnetic metal material, which specifically refers to other metal materials except magnetic metal materials (iron, cobalt or nickel, or materials containing iron, cobalt or nickel).

[0040] According to the utility model, the pot base body 10 includes a bottom wall 12 and a side wall 11 connected to the bottom wall 12, and has no magnetic conductivity. In this case, the non-magnetic metal coating 20 is at least formed on the outer surface of the bottom wall to realize the normal magnetic conducting function of the pot. It should be noted that the non-magnetic metal coating 20 is formed on at least part of the bottom wall of the pot base body 10 by chemical plating, which means that the non-magnetic metal coating 20 is formed on the bottom wall or part of the bottom wall. When the non-magnetic metal coating 20 only needs to be formed on part of the bottom wall, a film covering can be used to cover other bottom wall areas except the formed part.

[0041] In the prior art, the magnetic conducting layer formed by spraying has a relatively thin thickness, which generally needs to be controlled to be more than 60 microns. If the formed magnetic conducting layer is too thin (for example, less than 25 microns), the eddy current formed is not enough to drive the movement of charge carriers in the magnetic conducting layer due to the resistance of the conductor itself, so that the magnetic conducting layer cannot be heated by magnetic induction on the induction cooker. In addition, if the formed magnetic conducting layer is too thin, the magnetic conducting layer has magnetism at this time, but it cannot meet the demand of starting the induction cooker. On the contrary, if the formed magnetic conducting layer is too thick, its bonding force is not strong and it is easy to be damaged.

[0042] According to the utility model, the magnetically conductive layer formed by chemical plating or electroplating is dense and can meet the requirement of the magnetically conductive heating function of the pot under the condition of thinness.

[0043] According to the utility model, the non-magnetic metal plating layer 20 is used as the magnetically conductive layer of the pot, and the thickness is 5-25 microns, and the stress is small.

[0044] According to the utility model, the non-magnetic metal plating layer 20 can conduct magnetism, because, according to Maxwell electromagnetic field theory, metal materials (conductor materials) in a changing magnetic field can produce eddy current.

[0045] According to the calculation formula Q=I 2 R, if the conductive performance of the magnetically conductive layer of the pot is too good, for example, the aluminum spraying layer is a good conductor, and the resistance R is very small, so according to the Joule heat formula, the generated heat is very small, and because the resistance is very small, the induced current generated will be very large, which will cause the electromagnetic furnace to overcurrent protection, resulting in that the magnetically conductive heating function cannot be started, which is why it is said that the aluminum pot is not magnetically conductive.

[0046] As an example, the resistance of the non-magnetic metal plating layer 20 is about 20-80Ω, and the thickness is 5-25 microns, which can realize that the non-magnetic material is used to match the magnetically conductive performance of the electromagnetic furnace, and is used as the magnetically conductive layer of the pot.

[0047] In some embodiments, the non-magnetic metal plating layer 20 is formed on the outer surface and / or inner surface of the bottom wall, the forming position is diversified, and various types of cookware can be easily formed.

[0048] In some embodiments, the non-magnetic metal plating layer 20 extends from the bottom wall of the pot body 10 to the wall region of the pot body 10 connected with the bottom wall. When the magnetic conductive layer of the non-magnetic metal plating layer 20 extends to the outer wall region, it can help to distribute heat more evenly on the bottom wall and the side wall of the pot, thereby improving the thermal efficiency and enabling the food to be heated more evenly during cooking.

[0049] In some embodiments, the non-magnetic metal plating layer 20 is integrally circular or comprises a plurality of magnetic conductive rings, wherein, in the case that the non-magnetic metal plating layer 20 comprises a plurality of magnetic conductive rings, a gap is provided between any two adjacent magnetic conductive rings, and the magnetic conductive rings are sequentially arranged outward around the center of the bottom wall. The shape of the non-magnetic metal plating layer 20 is diversified, thereby enabling the formation of multiple types of magnetic conductive pots.

[0050] In some embodiments, the non-magnetic metal plating layer 20 is a chemical plating layer or an electroplating layer, and the non-magnetic metal plating layer 20 can be formed in multiple ways, thereby simplifying the manufacturing of the pot.

[0051] In some embodiments, the non-magnetic metal plating layer 20 comprises a copper plating layer, an aluminum plating layer or a zinc plating layer. It can be understood that the non-magnetic metal plating layer 20 comprises a chemical copper plating layer, a chemical aluminum plating layer or a chemical zinc plating layer, or can comprise an electroplated copper plating layer, an electroplated aluminum plating layer or an electroplated zinc plating layer. Here, it should be noted that since the copper plating layer, the aluminum plating layer or the zinc plating layer has a lower hardness and a smaller thermal expansion coefficient than the pot body, the stress and thermal deformation generated during heating are smaller, and the adhesion is more firm, thereby further reducing the risk of the magnetic conductive layer falling off. In addition, it should be noted that chemical plating has no requirement for the electrical conductivity of the pot body 10, and electroplating requires the pot body 10 to have electrical conductivity. Specifically, in the case that the pot body 10 is made of a metal material, the non-magnetic metal plating layer 20 can be formed by electroplating or chemical plating. In the case that the pot body 10 is made of ceramic, glass and stone, etc., the non-magnetic metal plating layer 20 can be formed by chemical plating. The pot body can also be pre-charged, for example, a metal coating layer is formed on the pot body 10 made of ceramic, glass and stone in advance.

[0052] In some embodiments, the surface of the non-magnetic metal plating layer 20 has a rough structure, and the protective layer 30 is arranged on the rough structure. In this way, the protective layer can be formed on the non-magnetic metal plating layer 20 in a manner similar to the mortise and tenon joint, thereby improving the bonding strength between the non-magnetic metal plating layer 20 and the protective layer, and further avoiding the problem of the magnetic conductive layer falling off during use.

[0053] In some embodiments, the pot further comprises a protective layer 30 arranged outside the non-magnetic metal plating layer, so that the risk of damage of the non-magnetic metal plating layer exposed directly outside can be reduced, thereby further improving the magnetic conduction life of the pot.

[0054] In some embodiments, the protective layer 30 is formed of ceramic paint, and the ceramic paint is ceramic paint resistant to a temperature higher than 350 DEG C. It can be understood that the protective layer 30 is a ceramic paint layer, and the ceramic paint layer is resistant to a temperature of 350 DEG C-650 DEG C. Thus, the ceramic paint layer itself can withstand high temperature to better protect the non-magnetic metal plating layer 20.

[0055] In some embodiments, the ceramic protective layer completely covers the non-magnetic metal plating layer 20, and specifically covers the outer surface of the non-magnetic metal plating layer 20. For example, the outer surface can be the side surface and the lower surface of the non-magnetic metal plating layer 20.

[0056] In some embodiments, the magnetic conduction layer of the pot is circular, and the diameter of the magnetic conduction layer is close to the diameter of the coil of the electromagnetic oven, so that normal magnetic conduction can be ensured. In some exemplary embodiments, the non-magnetic metal plating layer 20 is an integral circular shape with a diameter of 11 cm-16 cm, which is adapted to the bottom wall plane of the pot. In other exemplary embodiments, the non-magnetic metal plating layer 20 comprises a plurality of magnetic conduction rings. In the case that the non-magnetic metal plating layer 20 comprises a plurality of magnetic conduction rings, the plurality of magnetic conduction rings are arranged in sequence from the center of the bottom wall to the edge of the bottom wall, and a gap is arranged between any two adjacent magnetic conduction rings.

[0057] In these embodiments, the shape of the non-magnetic metal plating layer 20 is diversified, so that a plurality of types of magnetic conduction pots can be formed.

[0058] According to the second aspect of the present application, a manufacturing method of a pot is provided. It should be noted that the manufacturing of the pot of the present application is not limited to the manufacturing method described herein, and those skilled in the art can select other feasible methods to manufacture the pot of the present application under the guidance of the present application.

[0059] According to the exemplary embodiments of the present application, the pot can be used at least in combination with an electromagnetic oven, and the manufacturing method of the pot comprises:

[0060] Step S101, providing a pot base.

[0061] Step S102, immersing the pot base in copper plating solution to form a non-magnetic metal plating layer on at least the bottom wall of the pot base as a magnetic conduction layer of the pot.

[0062] According to the manufacturing method of the pot provided in the embodiment of the present application, the non-magnetic metal coating layer 20 is used as the magnetic conductive layer of the pot, the non-magnetic metal coating layer 20 is not easy to burn out, and can be tightly combined with the pot base 10 under the condition of ensuring the normal magnetic induction heating function and is not easy to fall off, so that the magnetic conductive life of the pot can be improved.

[0063] Hereinafter, the manufacturing method of the pot according to an exemplary embodiment of the present application will be described in detail.

[0064] Providing a pot base

[0065] According to some embodiments of the present application, the pot base is made of at least one of metal material, ceramic, glass and stone material.

[0066] In some embodiments, the obtained pot base has the basic structure of a conventional pot. In some embodiments, the thickness of the pot base is generally 2.5mm-5mm, and such thickness can ensure the overall strength of the formed pot.

[0067] Pre-treatment

[0068] The manufacturing method of the pot according to the present application further comprises the step of chemically removing oil from the pot base. Specifically, the oil removal tank liquid can be used to remove oil from the pot base at a preset temperature for a preset time to complete the step of chemically removing oil from the pot base. The oil removal tank liquid comprises a mixture of sodium hydroxide, sodium carbonate and sodium phosphate. According to an exemplary embodiment of the present application, in the oil removal tank liquid, the mass concentration of sodium hydroxide is 15g / L-25g / L, the mass concentration of sodium carbonate is 25g / L-35g / L, and the mass concentration of sodium phosphate is 25g / L-35g / L. The preset temperature is 60℃-80℃, and the preset time is 3min-5min.

[0069] The manufacturing method of the pot according to the present application further comprises the step of washing and drying the pot base after oil removal. Specifically, the pot base after oil removal is washed clean and dried for standby.

[0070] According to an aspect of the present application, the manufacturing method of the pot further comprises the step of roughening the surface to be formed of the pot base, which provides a good bonding basis for the nickel-phosphorus alloy magnetic conductive layer formed in the subsequent chemical plating step. Specifically, before chemical plating, sandblasting or shot blasting is used to roughen the surface of the pot to form a rough structure (e.g. pattern and roughness) on the pot base that is conducive to the deposition of the chemical plating layer. It should be noted that the surface to be formed here can be the outer wall surface of the pot base. Specifically, the pot base comprises a bottom wall and a side wall connected to the bottom wall, and the surface to be formed can be the outer surface (outer wall surface) of the bottom wall of the pot base.

[0071] According to one aspect of the present application, the manufacturing method of the pot further comprises forming an activated surface on the bottom wall of the pot body by pickling.

[0072] forming a non-magnetic metal plating layer

[0073] According to the present application, the copper plating solution comprises copper sulfate, potassium sodium tartrate, sodium hypophosphite, EDTA and sodium citrate, wherein, in the copper plating solution, the mass concentration of copper sulfate is 6g / L-10g / L, the mass concentration of potassium sodium tartrate is 10g / L-30g / L, the mass concentration of sodium hypophosphite is 17g / L-20g / L, the mass concentration of EDTA is 0.01g / L-0.03g / L, and the mass concentration of sodium citrate is 0.05g / L-0.2g / L. After the copper plating solution is prepared, the pH value is adjusted to 10-12 with ammonia water, and then the pot body is placed in the copper plating solution with a temperature of 50℃-70℃ for 20min-40min of immersion plating, so as to form a copper layer with a film thickness of 5-25 microns on the pot body as a non-magnetic metal plating layer.

[0074] Here, although a specific example of a copper plating layer is shown, those skilled in the art can form other types of non-magnetic metal plating layers according to the present application in existing ways.

[0075] forming a protective layer

[0076] According to the present application, after forming the nickel-phosphorus alloy magnetic conductive layer, a ceramic protective layer is formed on the outer surface of the nickel-phosphorus alloy magnetic conductive layer by air spraying ceramic paint.

[0077] In some embodiments, the ceramic paint can be a ceramic paint with a methylsiloxane polymer as the main non-stick component, which can withstand a temperature higher than 350℃, specifically in the temperature range of 350℃-650℃, so that a ceramic protective layer with good temperature resistance can be formed, which can withstand high temperature to better protect the nickel-phosphorus alloy magnetic conductive layer.

[0078] In some embodiments, the protective layer is formed by air spraying of ceramic paint. As an example, the parameters of air spraying include a spraying distance of 140mm-180mm, an air pressure of 0.2MPa-0.4MPa, and a flow rate of 5L / min-10L / min. After spraying, the pot with the protective layer can also be sintered, specifically at a temperature of 200℃-300℃ for 8min-15min, so as to form a pot with a nickel-phosphorus alloy magnetic conductive layer and a protective layer. The thickness of the protective layer can be in the range of 5-25 microns, so that the thickness can provide long-term protection and prevent the protective layer from falling off locally and causing the protection function to fail.

[0079] The manufacturing method of the pot and the pot according to the inventive concept are described in detail above in combination with the exemplary embodiments. In the following, the advantages of the inventive concept will be described in more detail in combination with specific embodiments, but the protection scope of the inventive concept is not limited to the embodiments.

[0080] Example 1

[0081] The pot according to Embodiment 1 is manufactured by the following method.

[0082] Step S10, providing a pot base made of ceramic with a thickness of 4 mm.

[0083] Step S20, immersing the pot base in a copper plating solution for 30 min to form a copper layer with a thickness of 20 microns on the outer surface of the bottom wall of the pot base as a non-magnetic metal plating layer. Specifically, the copper plating solution includes copper sulfate, potassium sodium tartrate, sodium hypophosphite, EDTA, and sodium citrate, wherein the mass concentration of copper sulfate in the copper plating solution is 8 g / L, the mass concentration of potassium sodium tartrate is 20 g / L, the mass concentration of sodium hypophosphite is 18 g / L, the mass concentration of EDTA is 0.02 g / L, the mass concentration of sodium citrate is 0.1 g / L, the pH value is adjusted to 11 with ammonia water, and then the pot base is placed in the copper plating solution at a temperature of 50-70°C for 30 min to form a copper plating layer with a film thickness of 20 microns on the pot base as a non-magnetic metal plating layer.

[0084] Step S30, forming a protective layer with a thickness of 20 microns outside the non-magnetic metal plating layer by air spraying with ceramic paint. The parameters of air spraying are a spraying distance of 160 mm, an air pressure of 0.3 MPa, and a flow rate of 8 L / min, thereby obtaining the pot of Embodiment 1.

[0085] Example 2

[0086] Except that the thickness of the non-magnetic metal plating layer is set to 25 microns in step S20 (the chemical plating time is extended to 40 min), the pot of Embodiment 2 is manufactured by the same method as Embodiment 1.

[0087] Example 3

[0088] Except that the thickness of the non-magnetic metal plating layer is set to 5 microns in step S20 (the chemical plating time is shortened to 20 min), the pot of Embodiment 3 is manufactured by the same method as Embodiment 1.

[0089] Example 4

[0090] A pot of Example 4 was manufactured in the same manner as Example 1, except that the spray thickness of the protective layer was set to 30 micrometers in step S40.

[0091] Example 5

[0092] A pot of Example 5 was manufactured in the same manner as Example 1, except that the spray thickness of the protective layer was set to 10 micrometers in step S40.

[0093] Example 6

[0094] A pot of Example 6 was manufactured in the same manner as Example 1, except that a different material was used to form the pot body in step S10 (the material of this example was glass).

[0095] Comparative Example 1

[0096] A pot of Comparative Example 1 was manufactured in the same manner as Example 1, except that the magnetic permeable layer was formed in a different manner in step S20 (this comparative example used nickel to form a magnetic permeable layer on the pot body by chemical plating to a thickness of 20 micrometers, it should be noted that in this case, a uniform and defect-free layer could not be formed).

[0097] Comparative Example 2

[0098] A pot of Comparative Example 2 was manufactured in the same manner as Example 1, except that the magnetic permeable layer was formed in a different manner in step S20 (this comparative example used nickel to form a magnetic permeable layer on the pot body by thermal spraying to a thickness of 200 micrometers).

[0099] Comparative Example 3

[0100] A pot of Comparative Example 3 was manufactured in the same manner as Example 1, except that the magnetic permeable layer was formed in a different manner in step S20 (this comparative example attached a stainless steel magnetic permeable sheet to a thickness of 450 micrometers).

[0101] Performance index test

[0102] The pots of Examples 1-6 and Comparative Examples 1-3 were tested for performance, the testing method was as follows, and the results are recorded in Table 1 below.

[0103] The pots prepared in the examples and comparative examples were tested for the amount of inner concave, magnetic permeable life, bonding strength, and heat shock resistance.

[0104] (1) Testing method and result determination of magnetic permeable life

[0105] Under the heating power condition of the electromagnetic oven 2100W, the time when the magnetically conductive film is damaged, such as ablation and collapse, is detected during continuous boiling. The test time can reflect the magnetically conductive life of the pot. Generally, the test time of the pot needs to reach 360h or more.

[0106] (2) Bonding force test method and result determination

[0107] The bonding force of the pot is determined by the cross-hatch test. 11 straight lines with an interval of 1mm are drawn on the surface of each magnetically conductive layer using a blade, and then 11 straight lines with an interval of 1mm are drawn in the vertical direction. The cross-hatch area is pasted with 3M tape, one end of the tape is held by hand, the tape is at an angle of 45 degrees with the plating layer, and the tape is peeled off in an instant. Finally, observe the peeling of the magnetically conductive layer in the cross-hatch area. If it does not fall off, it is qualified, and if it falls off, it is unqualified.

[0108] (3) Heat shock resistance test method and determination rules

[0109] The pot is placed in an oven at 250℃ for 30min, then taken out and immediately immersed in normal temperature water, repeated 20 times. Under this test condition, if there is no damage such as collapse and cracking, it is qualified, and if there is damage such as collapse and cracking, it is unqualified.

[0110] Table 1 Performance index test data of the pot of the embodiment of the present application and the comparative examples

[0111] Serial number Magnetic conduction life (h) Bonding force test Heat shock resistance test Example 1 591 Pass Pass Example 2 650 Pass Pass Example 3 580 Pass Pass Example 4 599 Pass Pass Example 5 586 Pass Pass Example 6 600 Pass Pass Comparative Example 1 324 Pass Pass Comparative Example 2 375 Pass Pass Comparative Example 3 388 Fail Fail

[0112] In summary, according to the pot of the embodiment of the present application, the magnetically conductive life is long, and from the bonding force and heat shock resistance test, it can be seen that the bonding force of the magnetically conductive film of the pot of the present application is good and is not easy to delaminate, thereby improving the user's experience.

[0113] The pot of comparative example 1 is made of nickel layer, which is easy to be damaged due to over-temperature, so the magnetically conductive life is short.

[0114] The pot of comparative example 2 has a conventional spraying thickness of the magnetically conductive layer, which basically meets the basic requirements of the pot for bonding performance, magnetically conductive life and heat shock resistance test, but the above performance is not outstanding, and has far failed to meet the requirements of the development of the pot. Moreover, the thickness of the magnetically conductive layer required is usually thick to ensure the magnetically conductive performance, and in the case of being set thinner, the magnetically conductive performance is very poor.

[0115] The pot of comparative example 3 has been gradually eliminated from the market due to poor bonding performance.

[0116] Although the embodiments of the present application have been described in detail above, those skilled in the art can make various modifications and variations to the embodiments of the present application without departing from the spirit and scope of the present application. However, it should be understood that these modifications and variations will still fall within the spirit and scope of the embodiments of the present application defined by the claims.

Claims

1. A pan, characterized in that The pot comprises: a pot base; a non-magnetic metal plating layer provided at least on a bottom wall of the pot base as a magnetic conducting layer of the pot; wherein the non-magnetic metal plating layer is in a whole circular shape or comprises a plurality of magnetic conducting rings.

2. The pan of claim 1, wherein The non-magnetic metal plating layer comprises a copper plating layer, an aluminum plating layer or a zinc plating layer; and / or, the non-magnetic metal plating layer has a thickness of 5-25 microns; and / or, the non-magnetic metal plating layer has an electrical resistance of 20-80 Ω.

3. The pan of claim 1, wherein The non-magnetic metal plating layer is formed on an outer surface and / or an inner surface of the bottom wall; and / or, the non-magnetic metal plating layer is a chemical plating layer or an electroplating layer.

4. The pan of claim 1, wherein The non-magnetic metal plating layer extends from the bottom wall of the pot base to a wall region of the pot base connected with the bottom wall.

5. The pan of claim 1, wherein In the case that the non-magnetic metal plating layer comprises a plurality of magnetic conducting rings, the plurality of magnetic conducting rings are sequentially arranged from a center of the bottom wall to an edge of the bottom wall, and a gap is arranged between adjacent magnetic conducting rings.

6. The pan of claim 1, wherein The pot further comprises a protective layer arranged outside the non-magnetic metal plating layer.

7. The pan of claim 6, wherein A surface of the non-magnetic metal plating layer has a rough structure, and the protective layer is arranged on the rough structure.

8. The pan of claim 6, wherein The protective layer is a ceramic coating layer, and the ceramic coating layer has a temperature resistance of 350-650 ℃.

9. The pan of claim 6, wherein The protective layer has a thickness of 5-25 microns.

10. The pan of any one of claims 1 to 9, wherein, The pot base has a thickness of 3-5 mm; and / or, the pot base is a ceramic base, a glass base or a stone base.

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