Laterally-placed lower image wafer cutting device

Abstract

The utility model relates to a side-placed type lower image wafer cutting device. The side-placed type lower image wafer cutting device comprises a wafer rotary cutting mechanism, a supporting mechanism, an X-axis movement module and a Y-axis movement module, the X-axis movement module and the Y-axis movement module which are located below the cross beam drive the wafer rotary cutting mechanism to move in the left-right direction and the front-back direction correspondingly. The left side of the supporting stand column is provided with a side laying-down image mechanism, and the side laying-down image mechanism is located below the wafer rotary cutting mechanism. The wafer cutting and transferring device comprises a mechanism capable of obtaining the outline of the lower surface of the wafer and also comprises a lifting mechanism capable of transferring the wafer, all the mechanisms are matched together to complete cutting processing of the polymer surface of the wafer and transferring of the wafer, and normal production of the next working procedure is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer cutting processing related technical field especially, it is a kind of side lay type lower image wafer cutting device. BACKGROUND

[0002] One of the wafer processing procedures is to cut its boundary, during processing, wafer needs to be placed according to the following requirements, that is, the upper surface of wafer is polymer surface, and the lower surface is glass surface, the glass surface of lower surface cannot be seen on the polymer surface of upper surface, before cutting wafer, the profile data of cutting wafer needs to be obtained, since the center of polymer packaging surface and the center of glass surface are different during encapsulation, in order to ensure better stripping effect in the next process, the center of polymer packaging surface and the center of wafer glass surface need to be accurately found, therefore, the center of wafer glass surface needs to be obtained, according to the center of glass surface and the center of polymer surface, a difference between the two can be given, which is compensated in cutting processing, so as to ensure the accuracy of cutting, facilitate the separation of next process, therefore, an mechanism is needed to obtain the profile of the lower surface of wafer, and during the process of placing wafer on wafer cutting platform, a lifting mechanism capable of supplying wafer transfer in wafer platform is also needed.

[0003] In view of the above-mentioned defects, the present design person actively researches and innovates, in order to create a side lay type lower image wafer cutting device, so that it has more industrial utilization value. CONTENT OF THE UTILITY MODEL

[0004] To solve any one of the above technical problems, the utility model aims at providing a side lay type lower image wafer cutting device.

[0005] To achieve the above-mentioned purpose, the utility model adopts the following technical solutions:

[0006] The side lay type lower image wafer cutting device includes wafer rotary cutting mechanism, support mechanism, X-axis movement module and Y-axis movement module; the support mechanism includes bottom fixed plate, support column and crossbeam, support column is installed on the left and right sides of the bottom of crossbeam, the bottom of support column is connected with the bottom fixed plate installed below through adapter plate, the X-axis movement module and Y-axis movement module below crossbeam drive wafer rotary cutting mechanism to move in left-right direction and front-back direction respectively;

[0007] Side lay lower image mechanism is installed on the left side of support column, and the side lay lower image mechanism is below wafer rotary cutting mechanism;

[0008] The side laying image mechanism comprises a bottom support plate installed on a support column, a sliding table module installed on the bottom support plate drives a lens support plate to move in the front-back direction, a lens and a light source are installed on the lens support plate in sequence from back to front, a camera is installed at the rear end of the lens, and a reflecting mirror is installed on the bottom support plate in front of the light source.

[0009] As a further improvement of the present application, a front pressing plate and a rear pressing plate are respectively installed at the front and rear ends of the lens, and the light source is installed on the bottom support plate in front of the front pressing plate through a light source adapter plate.

[0010] As a further improvement of the present application, the reflecting mirror is installed on an adjusting frame, and the adjusting frame is installed on the bottom support plate through an adjusting frame support plate.

[0011] As a further improvement of the present application, the wafer rotating and cutting mechanism comprises a torque motor installed on a stage base, and the torque motor drives the adsorbing stage above to rotate.

[0012] As a further improvement of the present application, a sliding plate is installed at the bottom of the stage base, and the stage base is installed on the sliding plate below through a plurality of stage adjusting screws.

[0013] As a further improvement of the present application, an adsorbing and lifting stage mechanism for loading and unloading the wafer on the wafer rotating and cutting mechanism is installed on the right side of the wafer rotating and cutting mechanism.

[0014] As a further improvement of the present application, the adsorbing and lifting stage mechanism comprises an adsorbing and lifting base installed on the wafer rotating and cutting mechanism, a lead screw motor is installed on the middle of the bottom of the adsorbing and lifting base through a motor fixing plate, the lead screw motor drives a jacking platform above the adsorbing and lifting base to move in the vertical direction, and a mechanical hand finger is installed on the jacking platform through a mechanical hand pressing plate.

[0015] As a further improvement of the present application, a plurality of guide shafts are installed on the adsorbing and lifting base through linear bearings, and the top of the guide shaft is installed on the bottom of the jacking platform through a guide rod fixing plate.

[0016] As a further improvement of the present application, a lifting sensor is installed on one side of the adsorbing and lifting base through a cushion block, a lifting sensing sheet matched with the lifting sensor is installed on the bottom of the jacking platform, and a proximity sensor is installed on the side of the adsorbing and lifting base close to the wafer rotating and cutting mechanism through a sensor fixing plate.

[0017] By the above scheme, the present application has at least the following advantages:

[0018] The utility model discloses a mechanism that can obtain the profile of the lower surface of the wafer, and a lifting mechanism that can supply the wafer transfer, and the mechanisms are matched together to complete the cutting processing of the wafer polymer surface and the wafer transfer, and ensure the normal production of the next process.

[0019] The adsorption stage of the utility model can rotate, and through the movement of the X-axis movement module and the Y-axis movement module, it is moved to a suitable position, and then the stage rotates to identify the back surface parameters of the wafer.

[0020] The above description is only a summary of the technical scheme of the utility model, in order to more clearly understand the technical means of the utility model, and can be implemented according to the content of the specification, the following detailed description of the preferred embodiments of the utility model and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will briefly introduce the drawings needed in the embodiments, and it should be understood that the following drawings only show some embodiments of the utility model, and should not be regarded as the limitation to the scope, and for the ordinary skilled person in the art, other related drawings can also be obtained according to these drawings without creative labor.

[0022] Figure 1 It is a structure schematic view of the side-lying type lower image wafer cutting device of the utility model;

[0023] Figure 2 It is Figure 1 The structure schematic view of the side-lying type lower image mechanism;

[0024] Figure 3 It is Figure 1 The structure schematic view of the wafer rotary cutting mechanism;

[0025] Figure 4 It is Figure 1 The structure schematic view of the adsorption lifting stage mechanism;

[0026] Figure 5 It is Figure 4 The structure schematic view of the other side;

[0027] Figure 6 It is Figure 1 The structure schematic view of the supporting mechanism.

[0028] In the drawings, the meanings of various reference signs are as follows.

[0029] The side-lying type lower image mechanism 1, the wafer rotary cutting mechanism 2, the adsorption lifting stage mechanism 3, the supporting mechanism 4, the X-axis movement module 5, the Y-axis movement module 6;

[0030] Camera 101, lens 102, back pressing plate 103, front pressing plate 104, light source adapter plate 105, lens support plate 106, mirror 107, adjusting frame 108, adjusting frame support plate 109, bottom support plate 110, light source 111, slide table module 112;

[0031] Stage base 201, torque motor 202, adsorption stage 203, slide plate 204, stage adjusting screw 205;

[0032] Guide shaft 301, mechanical finger 302, lifting sensor 303, lifting sensing sheet 304, cushion block 305, jacking table top 306, mechanical hand pressing plate 307, pipe joint 308, motor fixing plate 309, guide rod fixing plate 310, lead screw motor 311, adsorption lifting base 312, proximity sensor 313, sensor fixing plate 314, fixing screw 315, linear bearing 316;

[0033] Bottom fixing plate 401, adapter plate 402, support column 403, cross beam 404. DETAILED DESCRIPTION

[0034] The specific embodiments of the present application will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the present application, but not to limit the scope of the present application.

[0035] In order to enable the personnel in the technical field to better understand the present application scheme, the technical scheme in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of the present application.

[0036] EMBODIMENT

[0037] As Figures 1-6 shown,

[0038] A side-lying type lower image wafer cutting device mainly comprises a side-lying lower image mechanism 1, a wafer rotating cutting mechanism 2, an adsorption lifting table mechanism 3, a supporting mechanism 4, an X-axis movement module 5 and a Y-axis movement module 6.

[0039] 1. The support mechanism 4 serves as the bottom support mechanism of the overall device, mainly including a bottom fixing plate 401, a support column 403, and a crossbeam 404. Support columns 403 are installed on both the left and right sides of the bottom of the crossbeam 404. The bottom of the support column 403 is connected to the bottom fixing plate 401 below it through an adapter plate 402. The X-axis motion module 5 and the Y-axis motion module 6 located below the crossbeam 404 drive the wafer rotary cutting mechanism 2 to move in the left-right direction and the front-back direction, respectively.

[0040] 2. A side-mounted imaging mechanism 1 is installed on the left side of the support column 403, and the side-mounted imaging mechanism 1 is located below the wafer rotation dicing mechanism 2. The side-mounted imaging mechanism 1 is mainly used to acquire the contour of the lower surface of the wafer on the adsorption stage 203.

[0041] The side-mounted imaging mechanism 1 includes a bottom support plate 110 mounted on a support column 403. A slide module 112 mounted on the bottom support plate 110 drives a lens support plate 106 to move in the front-back direction. A lens 102 and a light source 111 are mounted sequentially from back to front on the lens support plate 106. A camera 101 is mounted at the rear end of the lens 102. A front pressure plate 104 and a rear pressure plate 103 are mounted at the front and rear ends of the lens 102, respectively. The light source 111 is mounted on the bottom support plate 110 in front of the front pressure plate 104 via a light source adapter plate 105. A reflector 107 is mounted on the bottom support plate 110 in front of the light source 111. The reflector 107 is mounted on an adjustment frame 108, which is tilted on the bottom support plate 110 via an adjustment frame support plate 109.

[0042] 3. The wafer rotary dicing mechanism 2 includes a torque motor 202 mounted on a stage base 201, which drives the upper adsorption stage 203 to rotate. A sliding plate 204 is mounted on the bottom of the stage base 201, and the stage base 201 is mounted on the sliding plate 204 below by several stage adjustment screws 205. The mounting position of the stage base 201 on the sliding plate 204 can be adjusted by adjusting the stage adjustment screws 205.

[0043] 4. An adsorption lifting platform mechanism 3 for loading and unloading wafers on the wafer rotary dicing mechanism 2 is installed on the right side of the wafer rotary dicing mechanism 2.

[0044] The adsorption lifting platform mechanism 3 comprises an adsorption lifting base 312 mounted on the wafer rotating cutting mechanism 2, a lead screw motor 311 is mounted in the middle of the bottom of the adsorption lifting base 312 through a motor fixing plate 309, the lead screw motor 311 drives a jacking platform 306 located above the adsorption lifting base 312 to move in the vertical direction, and a pipe joint 308 is mounted on the jacking platform 306. The motor fixing plate 309 is mounted on the adsorption lifting base 312 through a plurality of fixing screws 315. A mechanical hand finger 302 is mounted on the jacking platform 306 through a mechanical hand pressing plate 307, the mechanical hand finger 302 is used for wafer feeding and discharging treatment, and a vacuum chuck or the like grabbing structure can be mounted on the mechanical hand finger 302.

[0045] The guide structure comprises a plurality of guide shafts 301 mounted on the adsorption lifting base 312 through linear bearings 316, and the top of the guide shaft 301 is mounted on the bottom of the jacking platform 306 through a guide rod fixing plate 310.

[0046] The sensor structure comprises a lifting sensor 303 mounted on one side of the adsorption lifting base 312 through a cushion block 305, a lifting sensing sheet 304 matched with the lifting sensor 303 is mounted on the bottom of the jacking platform 306, and a proximity sensor 313 is mounted on one side of the adsorption lifting base 312 close to the wafer rotating cutting mechanism 2 through a sensor fixing plate 314.

[0047] The working process of the utility model is briefly described as follows:

[0048] When the boundary of the wafer is cut, the upper and lower surface contour data need to be obtained first, the wafer with the polymer is placed on the adsorption stage 203, the vacuum adsorption wafer is opened, the X-axis motion module 5 and the Y-axis motion module 6 are moved, the wafer rotating cutting mechanism 2 is driven to the appropriate position of the side placing image placing mechanism 1, then the torque motor 202 in the wafer rotating cutting mechanism 2 rotates to drive the upper adsorption stage 203 to rotate, and the camera 101 in the side placing image placing mechanism 1 obtains the back glass data of the wafer through the lens 102 and the light source 111 via the reflector 107, the software obtains the center data by calculation, after cutting, the lead screw motor 311 in the adsorption lifting platform mechanism 3 drives the jacking platform 306 to move up and down, and then drives the mechanical hand finger 302 to move up and down, and drives the wafer to interact with the mechanical hand for feeding and discharging.

[0049] In the present text, the X-axis direction is the left-right direction as shown in the figure, Figure 1 In the present text, the Y-axis direction is the front-rear direction as shown in the figure, Figure 1 In the present text, the Z-axis direction is the up-down direction as shown in the figure, Figure 1 In the present text, the Z-axis direction is the up-down direction as shown in the figure.

[0050] The utility model discloses a mechanism that can obtain the profile of the lower surface of the wafer, and a lifting mechanism that can supply the wafer transfer, and the mechanisms are matched together to complete the cutting processing of the wafer polymer surface and the wafer transfer, and ensure the normal production of the next process.

[0051] The adsorption loading platform can rotate, and through the movement of the X-axis movement module and the Y-axis movement module, it is moved to a suitable position, and then the loading platform rotates to identify the back surface parameters of the wafer.

[0052] In the description of the utility model, it is understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implying the number of the technical features indicated. Therefore, the features limited by "first", "second" and the like can explicitly or implicitly include one or more features. In the description of the utility model, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0053] In the description of the utility model, it should be explained that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, can be fixed connection, can be detachable connection, or integrally connected, can be mechanical connection, can be electrical connection, can be directly connected, can be indirectly connected through an intermediate medium, can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood through specific circumstances.

[0054] The above is only the preferred embodiment of the utility model, and is not used to limit the utility model, and it should be pointed out that, for ordinary skilled in the art, on the premise of not departing from the technical principles of the utility model, a number of improvements and modifications can be made, and these improvements and modifications should be regarded as the protection scope of the utility model.

Claims

1. A side-lying lower image wafer cutting device, comprising a wafer rotating cutting mechanism (2), a support mechanism (4), an X-axis movement module (5) and a Y-axis movement module (6); the support mechanism (4) comprises a bottom fixed plate (401), a support column (403) and a crossbeam (404), support columns (403) are installed on the left and right sides of the bottom of the crossbeam (404), the bottom of the support column (403) is connected to the bottom fixed plate (401) below through an adapter plate (402), and the X-axis movement module (5) and the Y-axis movement module (6) below the crossbeam (404) drive the wafer rotating cutting mechanism (2) to move in the left-right direction and the front-back direction, respectively; characterized in that: a side-lying lower image mechanism (1) is installed on the left side of the support column (403), and the side-lying lower image mechanism (1) is located below the wafer rotating cutting mechanism (2); the side-lying lower image mechanism (1) comprises a bottom support plate (110) installed on the support column (403), a sliding table module (112) installed on the bottom support plate (110) drives a lens support plate (106) to move in the front-back direction, a lens (102) and a light source (111) are installed on the lens support plate (106) from back to front, a camera (101) is installed at the rear end of the lens (102), and a mirror (107) is installed on the bottom support plate (110) in front of the light source (111).

2. The sideways gummy wafer cutting device of claim 1, wherein, a front pressing plate (104) and a rear pressing plate (103) are installed at the front and rear ends of the lens (102), respectively, and the light source (111) is installed on the bottom support plate (110) in front of the front pressing plate (104) through a light source adapter plate (105).

3. The sideways gummy wafer cutting device of claim 1, wherein, the mirror (107) is installed on an adjusting frame (108), and the adjusting frame (108) is obliquely installed on the bottom support plate (110) through an adjusting frame support plate (109).

4. The sideways gummy wafer cutting device of claim 1, wherein, the wafer rotating cutting mechanism (2) comprises a torque motor (202) installed on a stage base (201), and the torque motor (202) drives an adsorption stage (203) above to rotate.

5. The sideways gummy wafer cutting device of claim 4, wherein, a sliding plate (204) is installed at the bottom of the stage base (201), and the stage base (201) is installed on the sliding plate (204) below through a plurality of stage adjusting screws (205).

6. The sideways gummy wafer cutting device of claim 1, wherein, an adsorption lifting stage mechanism (3) for loading and unloading wafers on the wafer rotating cutting mechanism (2) is installed on the right side of the wafer rotating cutting mechanism (2).

7. The sideways gummy wafer cutting device of claim 6, wherein, the adsorption lifting stage mechanism (3) comprises an adsorption lifting base (312) installed on the wafer rotating cutting mechanism (2), a lead screw motor (311) is installed on the middle of the bottom of the adsorption lifting base (312) through a motor fixing plate (309), the lead screw motor (311) drives a jacking platform (306) above the adsorption lifting base (312) to move in the vertical direction, and a mechanical hand (302) is installed on the jacking platform (306) through a mechanical hand pressing plate (307).

8. The sideways gummy wafer cutting device of claim 7, wherein, Several guide shafts (301) are installed on the adsorption lifting base (312) through linear bearings (316), and the top of the guide shafts (301) is fixed on the bottom of the jacking platform (306) through a guide rod fixing plate (310).

9. The sideways gummy wafer cutting device of claim 7, wherein, A lifting sensor (303) is installed on one side of the adsorption lifting base (312) through a cushion block (305), and a lifting sensing sheet (304) matched with the lifting sensor (303) is installed on the bottom of the jacking platform (306); a proximity sensor (313) is installed on one side of the adsorption lifting base (312) close to the wafer rotating cutting mechanism (2) through a sensor fixing plate (314).

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