Auxiliary device for cutting crystal ingot

Abstract

The utility model provides a crystal ingot cutting auxiliary device, which comprises a detection platform, a laser ranging assembly, at least one moving assembly and a processor, and is characterized in that the detection platform is configured to bear a to-be-processed crystal ingot; the laser ranging assembly is arranged in the preset direction of the detection platform and is configured to measure the distance between the laser ranging assembly and the to-be-machined crystal ingot. The at least one moving assembly is configured to drive at least one of the detection platform and the laser ranging assembly to move, so that the detection platform and the laser ranging assembly move relatively; the processor is configured to control the detection platform and the laser ranging assembly to move relatively through the at least one moving assembly; by adjusting the detection positions of the laser ranging assembly on the to-be-machined end face of the to-be-machined crystal ingot for multiple times, the detection distances corresponding to the multiple detection positions are obtained; and based on the detection distances corresponding to the multiple detection positions, the cutting position of the to-be-machined crystal ingot is determined.

Description

TECHNICAL FIELD

[0001] The present specification relates to the field of crystal ingot processing, particularly to a crystal ingot cutting auxiliary device. BACKGROUND

[0002] After the growth of the crystal ingot is completed, the end face of the crystal ingot may not be a plane, presenting an arc surface that is convex upward or concave downward. Therefore, the end face of the crystal ingot needs to be cut to obtain a crystal ingot with a flat end face. The traditional cutting method relies on single-wire cutting technology, but usually requires manual operation to determine the absolute equal-diameter position of the dome of the crystal ingot. Due to the difference in skill level of the operators, this process often cannot achieve fast and accurate positioning, resulting in material waste and low processing efficiency. SUMMARY

[0003] To solve the above problems, the present utility model provides a crystal ingot cutting auxiliary device. The device aims to quickly and accurately determine the equal-diameter position of the crystal ingot to be processed through automated and precise measurement technology, thereby improving cutting efficiency and reducing material loss.

[0004] One of the contents of the present utility model provides a crystal ingot cutting auxiliary device, which comprises a detection platform, a laser ranging component, at least one moving component, and a processor. The crystal ingot to be processed is arranged between the detection platform and the laser ranging component, and is placed on the detection platform. The laser ranging component is arranged in a predetermined direction of the detection platform and is configured to measure the distance between the crystal ingot to be processed. The at least one moving component is configured to drive at least one of the detection platform and the laser ranging component to move, so that the detection platform and the laser ranging component move relative to each other. The processor is configured to control the relative movement of the detection platform and the laser ranging component through the at least one moving component, adjust the detection position of the laser ranging component on the end face of the crystal ingot to be processed multiple times, obtain the detection distances corresponding to the multiple detection positions, and determine the cutting position of the crystal ingot to be processed based on the detection distances corresponding to the multiple detection positions.

[0005] The beneficial effects brought by the above invention content include but are not limited to: (1) the crystal ingot cutting auxiliary device can be applied to the determination of the equal-diameter position of crystal ingots of various sizes and qualities; (2) after obtaining the detection positions, the cutting position of the crystal ingot to be processed can be determined more quickly and accurately by screening the distance data between the end face to be processed and the laser ranging component from the data of multiple detection positions; (3) the cutting position can be marked accurately by the laser marking component, which reduces the difficulty of cutting and the cutting error. BRIEF DESCRIPTION OF DRAWINGS

[0006] Figure 1 is an exemplary structural schematic diagram of a crystal ingot cutting auxiliary device shown according to some embodiments of the present specification;

[0007] Figure 2 is an exemplary schematic diagram of a detection position shown according to some embodiments of the present specification;

[0008] Figure 3 is an exemplary schematic diagram of a first detection position and a second detection position shown according to some embodiments of the present specification;

[0009] Figure 4 is an exemplary schematic diagram of a cutting position shown according to some embodiments of the present specification. DETAILED DESCRIPTION

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present specification, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some examples or embodiments of the present specification, and for those skilled in the art, the present specification can also be applied to other similar scenarios without creative labor on the basis of these drawings. Unless it is clear from the language environment or otherwise stated, the same reference numbers in the drawings represent the same structure or operation.

[0011] The "system", "device", "unit" and / or "module" used herein is a method for distinguishing different components, elements, parts, portions or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

[0012] Unless the context clearly indicates otherwise, the words "one", "an", "a" and / or "the" do not mean to specify the singular, but also include the plural. Generally speaking, the terms "comprise" and "include" only indicate the inclusion of the steps and elements explicitly identified, and these steps and elements do not constitute an exclusive list, and the method or device can also include other steps or elements.

[0013] After the growth of the crystal ingot ends, since the end face of the crystal ingot can not be a plane, presenting an arc surface with convex top or concave bottom, it is necessary to cut the end face of the crystal ingot to obtain a crystal ingot with a flat end face. The traditional cutting method relies on single-wire cutting technology, but usually needs manual operation to determine the absolute equal-diameter position of the dome of the crystal ingot. Due to the difference in skill level of the operators, this process is often difficult to achieve fast and accurate positioning, resulting in material waste and low processing efficiency.

[0014] To solve the above problems, the embodiments of the present specification propose a new ingot cutting auxiliary device. The device aims to measure the distance through the laser ranging probe by automatic and accurate measurement technology, measure the multi-ring nesting of the ingot dome surface, find the lowest point for laser marking and display the lowest thickness, mark the side (cylindrical surface) by side laser marking to determine the cutting position. The device can quickly and accurately determine the constant diameter position of the ingot, thereby improving the cutting efficiency and reducing the material loss.

[0015] Figure 1 is an exemplary structural schematic diagram of an ingot cutting auxiliary device according to some embodiments of the present specification.

[0016] As shown in Figure 1 , the ingot cutting auxiliary device 100 includes a detection platform 110, a laser ranging assembly 120, at least one moving assembly 130, and a processor 140. Among them: the detection platform 110 is configured to carry the ingot to be processed 150. The laser ranging assembly 120 is arranged in a preset direction of the detection platform 110 and is configured to measure the distance between the laser ranging assembly 120 and the ingot to be processed 150. At least one moving assembly 130 is configured to drive at least one of the detection platform 110 and the laser ranging assembly 120 to move, so that the detection platform 110 and the laser ranging assembly 120 move relative to each other.

[0017] The detection platform 110 is a platform for placing the ingot to be processed 150. The detection platform 110 can be any feasible structure, for example, a cylindrical table, a square column table, etc. The detection platform 110 can be a high-precision platform dedicated to ingot detection and measurement, and the surface for placing the ingot to be processed 150 can be parallel to the horizontal plane.

[0018] The ingot to be processed 150 is an ingot to be cut. For example, the ingot to be processed 150 can be a silicon carbide ingot, etc. In some embodiments, the ingot with uneven cross section can be determined as the ingot to be processed 150. The embodiments of the present specification do not limit the type and size of the ingot to be processed, and the ingot cutting auxiliary device 100 can be applicable to the determination of the constant diameter position of ingots of various sizes and various qualities.

[0019] In some embodiments, the ingot to be processed 150 can be placed on the detection platform 110 to determine the cutting position of the ingot to be processed 150. During crystal growth, one end of the seed crystal is bonded to the seed crystal holder, and the other end is grown by pulling in the melt, so the end surface of the grown ingot bonded to the seed crystal holder (hereinafter referred to as the contact end surface) is flat, and the other side surface (i.e. the end surface to be processed) in contact with the melt can be uneven (for example, there can be an arc surface, etc.). The contact end surface and the end surface to be processed are two opposite end surfaces.

[0020] The laser ranging assembly 120 is an assembly for measuring distance by laser ranging principle. For example, the laser ranging assembly 120 can be a laser range finder or the like.

[0021] In some embodiments, the laser ranging assembly 120 can be arranged in a preset direction of the detection platform 110. The preset direction can be a direction away from a contact surface between the to-be-processed ingot 150 and the detection platform 110. As shown in FIG. 1, the direction R indicated in the figure is a direction away from the contact surface between the to-be-processed ingot 150 and the detection platform 110, i.e., the preset direction. Figure 1

[0022] In some embodiments, the to-be-processed ingot 150 is arranged between the detection platform 110 and the laser ranging assembly 120. The laser ranging assembly 120 can measure the distance between itself and the to-be-processed end surface of the to-be-processed ingot 150.

[0023] The moving assembly 130 is an assembly for moving other assemblies. For example, the moving assembly 130 can be a telescopic connecting rod, a roller or the like structure.

[0024] In some embodiments, the moving assembly 130 can drive the detection platform 110 to rotate axially along the axis of the detection platform 110. In some embodiments, the moving assembly 130 can drive the detection platform 110 to move horizontally along a direction perpendicular to the axis of the detection platform 110, i.e., a third direction described later. For example, the moving assembly 130 can include a roller and a motor, and the roller and the motor can be arranged below the detection platform 110. The roller can be driven to rotate by the motor, so as to drive the detection platform 110 to rotate axially along the axis of the detection platform 110 or to move horizontally along a direction perpendicular to the axis of the detection platform 110.

[0025] In some embodiments, the moving assembly 130 can drive the laser ranging assembly 120 to move horizontally along a direction perpendicular to the axis of the detection platform 110, i.e., the third direction described later. For example, the laser ranging assembly 120 is arranged on a telescopic connecting rod, and the telescopic connecting rod is driven to extend or retract by a motor, so as to drive the laser ranging assembly 120 to move horizontally along a direction perpendicular to the axis of the detection platform 110.

[0026] In some embodiments, at least one moving assembly 130 can be included. The moving assembly 130 can be connected to the detection platform 110 or the laser ranging assembly 120, so as to drive the detection platform 110 or the laser ranging assembly 120 to move along the first direction and / or the second direction.

[0027] In some embodiments, at least one moving assembly 130 can be included. The moving assembly 130 can be connected to the detection platform 110 or the laser ranging assembly 120, so as to drive the detection platform 110 or the laser ranging assembly 120 to move along the first direction and / or the second direction.

[0028] ​In some embodiments, the at least one moving component 130 can cause the detection platform 110 to move relative to the laser ranging components 120. For example, when the at least one moving component 130 includes one, the detection platform 110 moves relative to one of the laser ranging components 120, and the other one remains stationary. For another example, when the at least one moving component 130 includes multiple, different moving components 130 can cause the corresponding connected components to move in different directions, or at different speeds, so that the detection platform 110 moves relative to the laser ranging components 120.

[0029] In some embodiments, the at least one moving component 130 includes a first moving component 131 connected to the laser ranging components 120 to drive the laser ranging components 120 to move in a first direction and / or a second direction, and / or a second moving component 132 connected to the detection platform 110 to drive the detection platform 110 to move in the first direction and / or the second direction, wherein at least two of the first direction, the second direction and a third direction are perpendicular to each other, and the third direction is perpendicular to the detection platform. The third direction can also be referred to as a preset direction (e.g. the direction shown by R in FIG. 1). Figure 1

[0030] The first moving component 131 is configured to drive the laser ranging components 120 to move in the first direction and / or the second direction. The second moving component 132 is configured to drive the detection platform 110 to move in the first direction and / or the second direction. At least one of the first direction and the second direction is perpendicular to the third direction.

[0031] The first moving component 131 and the second moving component 132 can be any component capable of moving other components. For example, the first moving component 131 can include a roller and a motor, and the motor drives the roller to rotate and in turn drives the detection platform 110 to rotate and / or move. The second moving component 132 can include a telescopic rod and a motor, and the motor drives the telescopic rod to extend and retract and in turn drives the laser ranging components 120 to move.

[0032] In some embodiments, the at least two of the first direction, the second direction and the third direction being perpendicular to each other includes one of the following: the first direction is perpendicular to the third direction, the second direction is perpendicular to the third direction, and the first direction and the second direction are both perpendicular to the third direction.

[0033] In some embodiments, the at least one moving component 130 further includes a first rotating component (e.g. a rotating motor) connected to the detection platform 110 to drive the detection platform 110 to rotate in a third direction, and / or a second rotating component (e.g. a rotating motor) connected to the laser ranging components 120 to drive the laser ranging components 120 to rotate in the third direction. Figure 1 ​The first rotating assembly is configured to drive the detection platform 110 to rotate around a third direction (not shown). The first rotating assembly can be any structure capable of driving the detection platform 110 to rotate around the third direction. For example, the first rotating assembly can include a roller and a motor, and the motor drives the roller to rotate and in turn drives the detection platform 110 to rotate axially along the third direction.

[0034] The processor 140 can process data and / or information obtained from other devices. The processor 140 can execute program instructions based on the data, information, and / or processing results to perform one or more functions described in the present disclosure. For example, the processor 140 can determine a cutting position of the ingot 150 to be processed based on detection data (e.g., a detection distance, etc.) of the laser ranging assembly 120. In some embodiments, the processor 140 can include one or more sub-processing devices (e.g., single-core processing devices or multi-core multi-core processing devices). For example only, the processor 140 can include a central processing unit (CPU), an application-specific integrated circuit (ASIC), an application-specific instruction-set processor (ASIP), a graphics processing unit (GPU), a physics processing unit (PPU), a digital signal processor (DSP), a field-programmable gate array (FPGA), a programmable logic device (PLD), a controller, a microcontroller unit, a reduced instruction set computer (RISC), a microprocessor, or the like, or any combination thereof.

[0035] In some embodiments, the processor 140 is configured to control relative motion between the detection platform 110 and the laser ranging assembly 120 by the at least one moving assembly 130.

[0036] For example, the processor 140 can control the detection platform 110 to move by the moving assembly 130 connected to the detection platform 110, so that the detection platform 110 and the laser ranging assembly 120 move relative to each other.

[0037] For example, the processor 140 can control the laser ranging assembly 120 to move by the moving assembly 130 connected to the laser ranging assembly 120, so that the detection platform 110 and the laser ranging assembly 120 move relative to each other.

[0038] For another example, when the at least one moving assembly 130 includes the first moving assembly 131 and the second moving assembly 132, the processor 140 can drive the laser ranging assembly 120 to move along the first direction by the first moving assembly 131, and drive the detection platform to move along the second direction by the second moving assembly 132, so that the detection platform 110 and the laser ranging assembly 120 move relative to each other.

[0039] In some embodiments, the processor 140 is configured to obtain a plurality of detection distances corresponding to a plurality of detection positions of the laser ranging assembly 120 on the to-be-processed end surface of the to-be-processed ingot 150 by adjusting the detection position of the laser ranging assembly 120 on the to-be-processed end surface of the to-be-processed ingot 150 for a plurality of times.

[0040] The detection position refers to a position point at which the laser ranging assembly 120 measures a distance. The position point is located on the to-be-processed end surface of the to-be-processed ingot 150.

[0041] The processor 140 can adjust the detection position of the laser ranging assembly 120 on the to-be-processed end surface of the to-be-processed ingot 150 in various ways. For example, the processor 140 can adjust the position of the laser ranging assembly 120 by moving the assembly 130, thereby adjusting the detection position of the laser ranging assembly 120 on the to-be-processed end surface of the to-be-processed ingot 150. For another example, the processor 140 can adjust the position of the detection platform 110 by moving the assembly 130, thereby adjusting the detection position of the laser ranging assembly 120 on the to-be-processed end surface of the to-be-processed ingot 150.

[0042] In some embodiments, the processor 140 can control the laser ranging assembly 120 to adjust the detection position on the to-be-processed end surface of the to-be-processed ingot 150 for a plurality of times according to a movement step distance.

[0043] The movement step distance refers to the distance by which the laser ranging assembly 120 moves each time. In some embodiments, the movement step distance can be determined by user input. For example, the user can input the movement step distance through the display screen 170. More details about the display screen 170 are described later.

[0044] In some embodiments, the movement step distance is related to the size and / or processing precision of the to-be-processed ingot, and the processor 140 can autonomously determine the corresponding movement step distance based on the size and / or processing precision of the to-be-processed ingot. For example, the smaller the crystal size, the smaller the movement step distance. For another example, the higher the processing precision of the crystal, the smaller the movement step distance. The processor 140 can pre-set a corresponding relationship between the movement step distance and the size and / or processing precision of the to-be-processed ingot. For example, the processor 140 can determine the corresponding relationship between the movement step distance and the size and / or processing precision of the to-be-processed ingot based on historical data or user input.

[0045] In some embodiments of the present specification, by setting a suitable movement step distance, the detection position can be sufficient to cover the to-be-processed end surface of the to-be-processed ingot 150, so as to perform omnidirectional measurement on the to-be-processed end surface of the to-be-processed ingot 150, improve the cutting precision, and ensure that the constant diameter position of the to-be-processed ingot is accurately identified.

[0046] When the position of the laser ranging assembly 120 and / or the detection platform 110 is adjusted, the processor 140 can control the laser ranging assembly 120 to perform laser ranging to obtain a detection distance corresponding to the detection position. The detection distance is the distance (e.g., the shortest straight-line distance in the third direction, etc.) between the laser ranging assembly 120 and the to-be-processed end surface of the to-be-processed ingot 150.

[0047] For example only, the moving assembly 130 (e.g., the first moving assembly 131) can carry the laser ranging assembly 120 to measure the distance at the outermost periphery of the to-be-processed end surface of the to-be-processed ingot 150, and then control the detection platform 110 to rotate one full circle for the first time and control the laser ranging assembly 120 to detect the distance between the laser ranging assembly 120 and the plurality of ranging points at the outermost periphery of the to-be-processed end surface. Then, the moving assembly 130 (e.g., the first moving assembly 131) can carry the laser ranging assembly 120 to move to the inside of the to-be-processed end surface by a moving step distance, and after moving to the corresponding position, control the detection platform 110 to rotate one full circle for the second time and control the laser ranging assembly 120 to detect the distance between the laser ranging assembly 120 and the plurality of ranging points at the position of the circle; repeat the above operations until the laser ranging assembly 120 moves to the center of the to-be-processed end surface, and stop the laser ranging. The plurality of detection positions obtained through the above operations are shown in FIG. 8, where the circular surface in FIG. 8 is the to-be-processed end surface, and the point S corresponds to the detection position. Figure 2 Figure 2

[0048] In some embodiments, the processor 140 is configured to determine a cutting position of the to-be-processed ingot based on the detection distances corresponding to the plurality of detection positions. For example, the processor 140 can select one detection position from the plurality of detection positions as the cutting position based on the detection distances corresponding to the plurality of detection positions, and determine a cutting surface as a plane containing the detection position and perpendicular to the third direction.

[0049] In some embodiments, the processor 140 can determine the cutting position based on the maximum detection distance in the detection distances corresponding to the plurality of detection positions. For example, the processor 140 can select the detection position at which the maximum detection distance is located as the cutting position, and determine a cutting surface as a plane containing the detection position and perpendicular to the third direction. As shown in FIG. 9, the detection position W in FIG. 9 is the detection position corresponding to the maximum detection distance, and the cutting surface Q is a plane containing the detection position W and perpendicular to the third direction. Figure 4

[0050] In some embodiments, the processor 140 can also determine a target detection position as a detection position whose detection distance is less than a preset threshold, and determine the cutting position based on the detection distance corresponding to the target detection position.

[0051] ​​​The preset threshold value is a threshold condition related to the detection distance. The preset threshold value can be a system default value, an empirical value, a human pre-set value, or any combination thereof, and can be set according to actual needs, which is not limited in the specification.

[0052] In some embodiments, the processor 140 can determine the cutting position in multiple ways based on the detection distance corresponding to the target detection position. For example, the processor 140 can determine the cutting position based on the target detection position corresponding to the maximum detection distance. For another example, the processor 140 can determine the cutting position based on the target position corresponding to the detection distance that appears most frequently in the detection distance corresponding to the target detection position.

[0053] In some embodiments, the detection position includes a first detection position and a second detection position, and the processor 140 is further configured to: obtain detection distances corresponding to a plurality of first detection positions by adjusting the first detection position of the laser ranging assembly 120 on the to-be-processed end face of the to-be-processed ingot 150 multiple times, wherein the distance between two adjacent first detection positions is not less than a first distance threshold; determine a target region in the to-be-processed end face based on the detection distances corresponding to the plurality of first detection positions; obtain detection distances corresponding to a plurality of second detection positions by adjusting the second detection position in the target region multiple times, wherein the distance between two adjacent second detection positions is not greater than a second distance threshold, and the second distance threshold is less than the first distance threshold; and determine the cutting position of the to-be-processed ingot based on the detection distances corresponding to the plurality of second detection positions.

[0054] The first detection position refers to a preliminarily determined detection position. In some cases, part of the determined detection position can not belong to the to-be-processed end face, but to the detection platform 110. In some embodiments, the first detection position can include a position point on the to-be-processed end face and / or a position point on the detection platform 110. The manner of adjusting the first detection position is similar to the manner of adjusting the detection position described above, and more details are described above.

[0055] The first distance threshold is a threshold condition related to the distance between two adjacent first detection positions. The first distance threshold can be a system default value, an empirical value, a human pre-set value, or any combination thereof, and can be set according to actual needs, which is not limited in the specification.

[0056] The target region refers to the range of the region for which more detailed distance measurement is performed.

[0057] In some embodiments, the processor 140 can determine the target region in the end face to be processed in multiple ways based on the detection distances corresponding to the plurality of first detection positions. In some embodiments, the processor 140 can select the maximum detection distance from the detection distances corresponding to the plurality of first detection positions, and determine the target region according to the first detection position corresponding to the maximum detection distance. For example, the processor 140 can take the first detection position corresponding to the maximum detection distance as the center, and take the preset distance as the radius, to determine a circular region as the target region. The processor 140 can also determine the target region in other arbitrary feasible ways. As shown in FIG. 13, the inner region of the annular ring T is the target region, the detection positions outside the annular ring T (e.g., the positions of the black dots shown in FIG. 13) are the first detection positions, and the detection positions inside the annular ring T (e.g., the positions of the black dots shown in FIG. 13) are the second detection positions. Figure 3 Figure 4 Figure 4

[0058] The second detection position refers to a detection position determined in the target region. In some embodiments, the first detection position can include a position point on the end face to be processed. The manner of adjusting the second detection position is similar to the manner of adjusting the detection position described above, and more details are described above.

[0059] The second distance threshold is a threshold condition related to the distance between two adjacent second detection positions. The second distance threshold can be a system default value, an empirical value, a human pre-set value, or any combination thereof, and can be set according to actual needs, which is not limited in the present specification.

[0060] In some embodiments, the processor 140 can determine the cutting position of the ingot to be processed in multiple ways based on the detection distances corresponding to the plurality of second detection positions. For example, the processor 140 can determine the cutting position based on the maximum detection distance in the detection distances corresponding to the plurality of second detection positions. The manner of determining the cutting position based on the detection distances corresponding to the plurality of second detection positions is similar to the manner of determining the cutting position based on the detection distances corresponding to the plurality of detection positions, and more details are described above.

[0061] In some embodiments of the present specification, after obtaining the detection positions, the cutting position of the ingot to be processed can be determined more quickly and accurately by screening the data of the plurality of detection positions to screen the distance data between the end face to be processed and the laser ranging assembly.

[0062] ​​​In some embodiments, the ingot cutting auxiliary device 100 can further comprise a laser marking assembly 160 configured to mark the ingot 150 to be processed by laser; the at least one moving assembly 130 further comprises a third moving assembly 133 connected with the laser marking assembly 160, used to drive the laser marking assembly 160 to move in a third direction, and the third direction is perpendicular to the detection platform 110.

[0063] The laser marking assembly 160 is a device that uses high-energy density laser to locally irradiate and mark the crystal (for example, the ingot 150 to be processed). For example, the laser marking assembly 160 can be a component that uses infrared laser to mark by laser. In some embodiments, the laser marking assembly 160 can comprise a laser marking head 161 and a laser 162. The laser marking head 161 can focus and guide the laser generated by the laser 162 to mark the ingot 150 to be processed.

[0064] The third moving assembly 133 is a component used to control the movement of the laser marking assembly 160 in the third direction. In some embodiments, the third moving assembly 133 can be a servo lead screw or the like structure.

[0065] In some embodiments, the processor 140 is further configured to control the third moving assembly 133 to move to a target position based on the cutting position, and control the laser marking assembly 160 to mark the cutting position of the ingot 150 to be processed by laser.

[0066] In some embodiments, the target position is perpendicular to the third direction with the plane where the cutting position is located, that is, the coordinates of the target position and the cutting position in the third direction are consistent.

[0067] The processor 140 can control the laser marking assembly 160 to mark the ingot to be processed by laser in various ways. For example, the processor 140 moves the laser marking head 161 to the laser focus point by the third moving assembly 133, which is the thinnest horizontal plane (i.e. the lowest point) of the ingot, the laser 162 generates laser to mark the ingot to be processed, and at the same time the first rotating assembly controls the detection platform 110 to rotate one circle, so that the laser marks the entire cylindrical surface, and finally completes the marking.

[0068] In some embodiments, when the laser marking assembly 160 is included in the ingot cutting auxiliary device 100, the at least one moving assembly 130 further comprises a second rotating assembly (not shown) connected with the detection platform 110, used to control the detection platform 110 to rotate in a second direction, and the second direction is perpendicular to the first direction. Figure 1The second rotating assembly is configured to drive the laser marking assembly 160 to rotate around the third direction with the center point of the platform 110 as the axis. For example, the processor 140 moves the laser marking head 161 to the level of the thinnest part of the ingot (i.e., the lowest point) through the third moving assembly 133, and the laser 162 generates a laser to mark the ingot. Then, the second rotating assembly controls the laser marking head 161 to rotate one circle, so that the laser marks the entire cylindrical surface, and finally completes the marking.

[0069] After the marking is completed, the convex or concave part of the end surface of the ingot to be processed can be removed by cutting based on the marked position.

[0070] In some embodiments of the present specification, the cutting position is marked by the laser marking assembly. The cutting position can be accurately marked by the laser, which reduces the difficulty of cutting and reduces the cutting error.

[0071] In some embodiments, the ingot cutting auxiliary device 100 can further include a display screen 170. In some embodiments, the display screen 170 is configured to display the detection distances corresponding to the plurality of detection positions and / or the cutting position. In some embodiments, the display screen 170 is configured to display the maximum detection distance in the detection distances corresponding to the plurality of detection positions. In some embodiments, the display screen 170 is configured to display the target detection position and the corresponding detection distance.

[0072] It should be noted that, Figure 1 The detection platform 110, the laser ranging assembly 120, the moving assembly 130, the processor 140, the ingot to be processed 150, the laser marking assembly 160, and the display screen 170 in the present specification are only schematic and can be different from the actual shape. The actual shape of the detection platform 110, the laser ranging assembly 120, the moving assembly 130, the processor 140, the ingot to be processed 150, the laser marking assembly 160, and the display screen 170 can be set as needed.

[0073] The above has described the basic concept. It is obvious that the above detailed disclosure is only an example for those skilled in the art, and does not constitute a limitation on the present specification. Although it is not explicitly stated here, those skilled in the art can make various modifications, improvements and corrections to the present specification. Such modifications, improvements and corrections are suggested in the present specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of the present specification.

[0074] Meanwhile, specific words are used in the present specification to describe the embodiments of the present specification. For example, “one embodiment” “one embodiment” and / or "some embodiments" means a certain feature, structure, or characteristic being discloses in relation to at least one implementation of the present specification. Therefore, it is noted that a variety of implementations of the present specification can encompass one or more features of the specification. It is further noted that not all of the features, structures, or characteristics of any implementation of the present specification need to be included in all implementations of the present specification. In addition, some implementations of the present specification can be implemented in a way that one or more features, structures, or characteristics are combined in a single implementation of the present specification or spread over several implementations of the present specification.

[0075] Similarly, it is noted that the present specification can make frequent reference to a single implementation of the present specification in the description of the present specification. However, as will be understood by those skilled in the art, all combinations of the various features and elements, whether mandatory or optional, can be implemented without departing on the scope of the present specification. It is further noted that symbols, numbers, letters and the like as presented in the drawings herein are used for ease of description only and are not intended to limit the scope of the present specification. Finally, it is to be understood that all terminology used herein is for the purpose of describing only the present specification. The terms used herein should not be construed to form a limitation or otherwise play a defining role.

[0076] Finally, it should be noted that the embodiments described herein are merely examples for illustrating the principles of the present specification. Other variations can also be possible within the scope of the present specification. Therefore, as an example and not a limitation, alternative configurations of the embodiments of the present specification can be considered consistent with the teachings of the present specification. Accordingly, the embodiments of the present specification are not limited to the embodiments explicitly introduced and described in the present specification.

Claims

1. A crystal ingot cutting assist device characterized by comprising: The device comprises a detection platform, a laser ranging assembly, at least one moving assembly, and a processor, wherein: The detection platform is configured to carry a crystal ingot to be processed; The laser ranging assembly is arranged in a preset direction of the detection platform and is configured to measure a distance between the crystal ingot to be processed; The at least one moving assembly is configured to drive at least one of the detection platform and the laser ranging assembly to move, so that the detection platform and the laser ranging assembly move relative to each other; The processor is configured to: control the detection platform and the laser ranging assembly to move relative to each other through the at least one moving assembly; obtain a plurality of detection distances corresponding to a plurality of detection positions of the laser ranging assembly on a processed end face of the crystal ingot to be processed by adjusting the detection positions multiple times; determine a cutting position of the crystal ingot to be processed based on the detection distances corresponding to the plurality of detection positions.

2. The apparatus of claim 1, wherein, The at least one moving assembly comprises a first moving assembly and / or a second moving assembly, The first moving assembly is connected with the laser ranging assembly to drive the laser ranging assembly to move in a first direction and / or a second direction; The second moving assembly is connected with the detection platform to drive the detection platform to move in the first direction and / or the second direction.

3. The apparatus of claim 2, wherein, The at least one moving assembly further comprises a first rotating assembly for driving the detection platform to rotate around a third direction, wherein the third direction is perpendicular to the detection platform, and at least two of the first direction, the second direction, and the third direction are perpendicular to each other.

4. The apparatus of claim 1, wherein, The processor is further configured to: determine the cutting position based on a maximum detection distance in the detection distances corresponding to the plurality of detection positions.

5. The apparatus of claim 1, wherein, The processor is further configured to: determine a target detection position from the detection positions whose detection distances are less than a preset threshold; determine the cutting position based on a detection distance corresponding to the target detection position.

6. The apparatus of claim 1, wherein, The processor is further configured to: control the laser ranging assembly to adjust the detection position on the processed end face of the crystal ingot to be processed multiple times at a moving step distance, wherein the moving step distance is related to a size and / or a processing precision of the crystal ingot to be processed.

7. The apparatus of claim 1, wherein, The detection position comprises a first detection position and a second detection position, and the processor is further configured to: obtain a plurality of detection distances corresponding to a plurality of first detection positions by adjusting the first detection positions multiple times, wherein a distance between two adjacent first detection positions is not less than a first distance threshold; determine a target area in the processed end face based on the detection distances corresponding to the plurality of first detection positions; obtain a plurality of detection distances corresponding to a plurality of second detection positions by adjusting the second detection positions multiple times in the target area, wherein a distance between two adjacent second detection positions is not greater than a second distance threshold, and the second distance threshold is less than the first distance threshold; Determine a cutting position of the ingot to be processed based on the detection distances corresponding to the plurality of second detection positions.

8. The apparatus of claim 1, wherein, The device further comprises a laser marking assembly configured to mark the ingot to be processed by laser. The at least one moving assembly further comprises a third moving assembly connected with the laser marking assembly, configured to drive the laser marking assembly to move in a third direction, wherein the third direction is perpendicular to the detection platform. The processor is further configured to: Control the third moving assembly to move to a target position based on the cutting position, and control the laser marking assembly to mark the cutting position of the ingot to be processed by laser.

9. The apparatus of claim 8, wherein, The at least one moving assembly further comprises a second rotating assembly configured to drive the laser marking assembly to rotate around the third direction with the center point of the detection platform as the axis.

10. The apparatus of claim 1, wherein, The device further comprises a display screen configured to display the detection distances corresponding to the plurality of detection positions and / or the cutting position.

Images