Electronic equipment auxiliary material bonding equipment

Abstract

The utility model discloses auxiliary material bonding equipment for electronic equipment, and belongs to the technical field of electronic product manufacturing. An auxiliary material bonding device for electronic equipment comprises a portal frame which is combined with an X-axis movement system, a Y-axis movement system and a Z-axis movement system to provide complete three-dimensional space positioning. The mounting plate is arranged on the portal frame; the pressing part is fixedly mounted on the mounting plate and is used for accurately applying the heat dissipation paste to the electronic equipment auxiliary material; the visual positioning system is used in cooperation with the pressing part, real-time position correction is carried out by capturing images so as to ensure accurate application of the heat dissipation paste, through the arrangement of the pressing part, a pressing frame makes contact with adhesive tape firstly, along with continuous driving of an air cylinder, a spring is compressed, a suction cup makes contact with the heat dissipation paste, and through two-section type downward pressing, the heat dissipation paste can be accurately applied. The heat dissipation paste is accurately applied to the auxiliary materials of the electronic equipment, and the unevenness of the heat dissipation paste in the picking process is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic product manufacturing technical field especially relates to a kind of electronic equipment auxiliary material bonding equipment. BACKGROUND

[0002] With the development of science and technology, electronic devices become more and more complex and diversified in function, which leads to higher and higher requirements for manufacturing process and assembly precision. Various components in electronic devices, such as circuit boards, screens, and shells, usually need to be fixed together in various ways to ensure the integrity and stability of the product. In these processes, bonding technology is widely used as an important connection method.

[0003] The role of the heat dissipation sticker in the electronic device auxiliary material bonding equipment is crucial, as it not only affects the thermal management performance of the electronic device but also has a direct impact on the reliability and lifespan of the device. By using a heat dissipation sticker, a stable physical connection can be formed between the electronic components and the heat sink, even in the case of slight displacement due to vibration or other mechanical stress during device operation. This helps maintain consistent heat dissipation and avoids temperature fluctuations caused by poor contact.

[0004] However, the heat dissipation sticker is flat on the adhesive tape before use and is grabbed by a mechanical hand. But in the process of grabbing by the mechanical hand, the adhesive tape is easily taken up together, resulting in uneven grabbing of the heat dissipation sticker. SUMMARY

[0005] The utility model aims at solving the problem of uneven grabbing of the heat dissipation sticker in the process of grabbing by the mechanical hand in the prior art and proposes an electronic device auxiliary material bonding equipment.

[0006] To achieve the above-mentioned purpose, the utility model adopts the following technical solutions:

[0007] An electronic device auxiliary material bonding equipment includes a gantry, an XYZ three-axis motion system, a mounting plate, a pressing part, and a visual positioning system. The XYZ three-axis motion system provides complete three-dimensional spatial positioning. The mounting plate is installed on the gantry. The pressing part is fixedly installed on the mounting plate and is used to accurately apply the heat dissipation sticker to the electronic device auxiliary material. The visual positioning system is used in conjunction with the pressing part and performs real-time position correction through image capture to ensure accurate application of the heat dissipation sticker.

[0008] In order to pick up the heat dissipation paste, preferably, the pressing part mainly comprises a cylinder and a positioning block, both of which are fixedly installed on the mounting plate, a connecting block is fixedly installed on the output end of the cylinder, a first sliding rod and a second sliding rod are fixedly installed on the connecting block, one end of the first sliding rod away from the connecting block penetrates through the positioning block and is fixedly installed with a pressing frame, one end of the second sliding rod away from the connecting block penetrates through the positioning block and is fixedly installed with a horizontal plate, a suction cup is fixedly installed on the horizontal plate and located in the pressing frame.

[0009] In order to accurately apply the heat dissipation paste to the electronic device auxiliary material, further, the horizontal plate is slidingly installed on the first sliding rod, a spring is movably installed on the first sliding rod, and both ends of the spring are fixedly connected with the pressing frame and the horizontal plate respectively.

[0010] In order to monitor the applied pressure in the pressing process in real time, still further, a pressure sensor is fixedly installed on the side of the pressing frame close to the electronic device, so as to ensure the appropriate bonding strength.

[0011] In order to guide the precise positioning and correction of the pressing part 3, preferably, the visual positioning system comprises: a high-definition camera for capturing the image of the object to be bonded; and image processing software for analyzing the image and automatically correcting the bonding position deviation.

[0012] In order to improve the efficiency and adaptability, preferably, the pressing part is provided with two groups and symmetrically installed on the mounting plate.

[0013] Compared with the prior art, the electronic device auxiliary material bonding equipment has the following beneficial effects:

[0014] 1. The electronic device auxiliary material bonding equipment, through the setting of the pressing part, the pressing frame first contacts the adhesive tape, the spring is compressed as the cylinder continues to be driven, and the suction cup contacts the heat dissipation paste, so that the heat dissipation paste is accurately applied to the electronic device auxiliary material through two-stage pressing, and the unevenness of the heat dissipation paste in picking up is reduced.

[0015] 2. The electronic device auxiliary material bonding equipment, when two same tasks need to be processed at the same time, such as bonding two electronic device auxiliary materials in symmetrical positions, two groups of pressing parts can be started at the same time and coordinated by the same control system, so as to ensure that the two actions are synchronized and improve the production efficiency. For tasks that need to be processed separately, such as different types of auxiliary materials or asymmetric positions, two groups of pressing parts can be independently operated, and each group can perform position correction and bonding operation according to the information provided by the visual positioning system, thereby increasing the flexibility of the system. The design of the double-group pressing part can also help to distribute the work load, reduce the wear of individual components, and prolong the service life of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A whole structure schematic view of an electronic equipment auxiliary material bonding equipment is provided in the utility model.

[0017] Figure 2 A pressing part structure schematic view of an electronic equipment auxiliary material bonding equipment is provided in the utility model.

[0018] Figure 3 A visual positioning system structure schematic view of an electronic equipment auxiliary material bonding equipment is provided in the utility model.

[0019] Figure 4 A sucking disc structure schematic view of an electronic equipment auxiliary material bonding equipment is provided in the utility model.

[0020] In the drawing: 1, portal frame; 2, mounting plate; 3, pressing part; 301, air cylinder; 302, positioning block; 303, connecting block; 304, first sliding rod; 305, second sliding rod; 306, pressing frame; 307, transverse plate; 308, sucking disc; 309, spring; 4, visual positioning system. Specific implementation

[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0022] In the description of the utility model, it is understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0023] Embodiment:

[0024] Refer to Figures 1-4An electronic device auxiliary material bonding device, including a gantry 1, provides structural support, can withstand long-term work load, its top and both sides are equipped with guide rails, combined with XYZ three-axis motion system, provides complete three-dimensional space positioning, XYZ three-axis motion system is composed of X axis, Y axis and Z axis, each axis is equipped with high-precision servo motor and linear guide rail, ensures smooth movement and accurate positioning, this design makes the pressing part 3 can move freely in three-dimensional space, suitable for bonding tasks of various complex structures, also includes; mounting plate 2, set on the gantry 1, provides installation platform for other components; pressing part 3, equipped with pneumatic or electric pressure adjusting mechanism, can adjust the applied pressure according to the requirements of different auxiliary materials, fixedly installed on the mounting plate 2, used for accurately applying heat dissipation paste to electronic device auxiliary materials, ensuring bonding effect, wherein, the heat dissipation paste is evenly distributed on the adhesive tape; visual positioning system 4, used in cooperation with the pressing part 3, through image capture for real-time position correction, to ensure accurate application of heat dissipation paste, by identifying the preset marker point or feature contour, automatically calculating the position deviation that needs to be adjusted, and sending instructions to the XYZ three-axis motion system, guiding the pressing part 3 to accurately position and correct, reducing human error, ensuring high-quality products.

[0025] It should be noted that the front end of the pressing part 3 is provided with a heating device, which can preheat the heat dissipation paste before bonding, improve the bonding strength and reliability, at the same time, its surface is covered with anti-sticking coating, to prevent unnecessary sticking phenomenon during bonding process.

[0026] Place the electronic device auxiliary material to be bonded on the workbench, ensure its position stable and easy to access, select appropriate heat dissipation paste according to specific needs and load it onto the work platform, start the visual positioning system 4, the camera starts to capture the image of the target area, and analyzes the data through the image processing unit, identifies the key feature points, the YZ three-axis motion system drives the pressing part 3 to move to the predetermined position, and makes necessary fine adjustment to ensure the best alignment, after the pressing part 3 reaches the specified position, start the pressure adjusting mechanism, apply appropriate pressure according to the set parameters, firmly bond the heat dissipation paste to the electronic device auxiliary material, if necessary, the heating device can be enabled to preheat the heat dissipation paste, enhance the bonding effect, after bonding is completed, the visual positioning system 4 captures the image again, confirms whether the bonding quality meets the standard, for the case that does not meet the requirements, the system will prompt the operator to make manual correction; for qualified products, record relevant information and prepare for the next operation.

[0027] The pressing part 3 mainly comprises a cylinder 301 and a positioning block 302, both of which are fixedly installed on the mounting plate 2, the cylinder 301 serves as a driving source to control the up-down movement during pressing, the output end of the cylinder 301 is fixedly installed with a connecting block 303, the connecting block 303 is fixedly installed with a first sliding rod 304 and a second sliding rod 305, one end of the first sliding rod 304 away from the connecting block 303 penetrates through the positioning block 302 and is fixedly installed with a pressing frame 306, the first sliding rod 304 ensures the linear movement of the pressing frame 306 and provides necessary guiding effect, the pressing frame 306 applies pressure to the adhesive tape to keep it flat, one end of the second sliding rod 305 away from the connecting block 303 penetrates through the positioning block 302 and is fixedly installed with a horizontal plate 307, the horizontal plate 307 is fixedly installed with a suction cup 308, which is located in the pressing frame 306 and used to adsorb and fix the heat dissipation sticker to ensure that it will not be displaced during bonding.

[0028] When bonding operation is needed, the cylinder 301 is started to push the connecting block 303 to move downward, the connecting block 303 drives the first sliding rod 304 and the second sliding rod 305 to move downward synchronously, so that the pressing frame 306 and the horizontal plate 307 descend together, the pressing frame 306 presses the adhesive tape flat, and the heat dissipation sticker is accurately applied to the electronic device auxiliary material by the adsorption of the suction cup 308, while the adhesive tape will not be lifted, the positioning block 302 ensures the linear movement of the sliding rod, improving the accuracy and stability of bonding.

[0029] The horizontal plate 307 is slidingly installed on the first sliding rod 304, the first sliding rod 304 is movably installed with a spring 309, both ends of the spring 309 are fixedly connected with the pressing frame 306 and the horizontal plate 307.

[0030] During pressing, the pressing frame 306 first contacts the adhesive tape, and as the cylinder 301 continues to drive, the spring 309 is compressed, and the suction cup 308 contacts the heat dissipation sticker, which is accurately applied to the electronic device auxiliary material through two-stage pressing.

[0031] A pressure sensor is fixedly installed on the side of the pressing frame 306 close to the electronic device, which is used to monitor the pressure applied during pressing in real time, to ensure appropriate bonding strength and avoid problems such as poor bonding or damage to the electronic device caused by excessive or insufficient pressure.

[0032] The visual positioning system 4 comprises: a high-definition camera installed on the mounting plate 2 for capturing images of the object to be bonded; image processing software running in the control system for analyzing the images captured by the high-definition camera, for analyzing the images and automatically correcting the bonding position deviation, and sending instructions to the XYZ three-axis motion system to guide the pressing part 3 to accurately position and correct.

[0033] One application scenario of the visual positioning system 4:

[0034] 1. Image capture: The high-definition camera first captures the image of the object to be bonded, especially the key feature points or marker points in the target area, which ensures the accuracy of subsequent analysis and correction;

[0035] 2. Image analysis: The image processing software analyzes the received image, identifies and extracts key feature points or contour information. By comparing with the pre-set standard template, the software can calculate the deviation between the actual position and the ideal position;

[0036] 3. Position correction: Based on the calculated position deviation, the image processing software generates corresponding correction instructions and sends them to the XYZ three-axis motion system. The XYZ three-axis motion system adjusts the position of the pressing part 3 according to these instructions to ensure its accurate alignment with the target area;

[0037] 4. Real-time feedback: During the entire bonding process, the visual positioning system 4 continuously captures and analyzes images, monitors the changes in the bonding position in real time, and makes necessary adjustments in time to ensure the continuity and accuracy of the bonding process.

[0038] The pressing part 3 is provided with two groups, symmetrically installed on the mounting plate 2.

[0039] Allows simultaneous or separate bonding operations on electronic device accessories in symmetrical positions, improving efficiency and adaptability.

[0040] When two identical tasks need to be processed at the same time, such as bonding two electronic device accessories in symmetrical positions, the two groups of pressing parts 3 can be started at the same time, coordinated by the same control system, ensuring that the two actions are synchronized, improving production efficiency. For tasks that need to be processed separately, such as different types of accessories or asymmetric positions, the two groups of pressing parts 3 can be operated independently, each performing position correction and bonding operations according to the information provided by the visual positioning system 4, increasing the flexibility of the system. The design of the double-group pressing part 3 can also help to distribute the workload and reduce the wear and tear of individual components, prolonging the service life of the equipment.

[0041] The above is only the preferred specific implementation of the present application, but the protection scope of the present application is not limited to this. Any skilled person in the art can make equivalent substitutions or changes within the technical scope disclosed by the present application according to the technical scheme and concept of the present application, which should be covered within the protection scope of the present application.

Claims

1. An electronic device auxiliary material bonding apparatus comprising a gantry (1) incorporating an XYZ three-axis motion system providing complete three-dimensional spatial positioning, characterized in that, Also include: The mounting plate (2) is arranged on the portal frame (1); Pressing part (3), fixedly installed on the mounting plate (2), for accurate application of heat dissipation paste on the electronic device; Visual positioning system (4), used with the pressing part (3), real-time position correction by capturing images to ensure accurate application of heat dissipation paste; The pressing part (3) mainly includes a cylinder (301) and a positioning block (302), the cylinder (301) and the positioning block (302) are fixedly installed on the mounting plate (2), the output end of the cylinder (301) is fixedly installed with a connecting block (303), the connecting block (303) is fixedly installed with a first sliding rod (304) and a second sliding rod (305), one end of the first sliding rod (304) away from the connecting block (303) penetrates the positioning block (302) and is fixedly installed with a pressing frame (306), one end of the second sliding rod (305) away from the connecting block (303) penetrates the positioning block (302) and is fixedly installed with a cross plate (307), the cross plate (307) is fixedly installed with a suction cup (308), and the suction cup (308) is located in the pressing frame (306).

2. The electronic device subcomponent bonding apparatus of claim 1, wherein, The cross plate (307) is slidably installed on the first sliding rod (304), the first sliding rod (304) is movably installed with a spring (309), and the two ends of the spring (309) are fixedly connected with the pressing frame (306) and the cross plate (307) respectively.

3. The electronic device subcomponent bonding apparatus of claim 2, wherein, The pressing frame (306) is fixedly installed with a pressure sensor on the side close to the electronic device, which ensures the appropriate bonding strength.

4. The electronic device subcomponent bonding apparatus of claim 1, wherein, The visual positioning system (4) includes: High-definition camera, for capturing images of the object to be bonded; Image processing software, for analyzing images and automatically correcting bonding position deviation.

5. The electronic device subcomponent bonding apparatus of claim 1, wherein The pressing part (3) is provided with two groups, which are symmetrically installed on the mounting plate (2).

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