IC carrying shuttle device

Abstract

The utility model belongs to the technical field of IC carrying, and particularly discloses an IC carrying shuttle device. The IC carrier comprises the shell, the carrying assembly is arranged in the shell, the carrying assembly comprises the first IC carrier plate and the second IC carrier plate, the two motors are arranged on one side of the shell, the first IC carrier plate and the second IC carrier plate can be carried at the same time through the carrying assembly, the effect of carrying the double-layer IC carrier plates is achieved, it means that the number of ICs capable of being carried at the same time is doubled, and the carrying efficiency is improved. The carrying efficiency is greatly improved, the overall production cycle is effectively shortened, the high-efficiency requirement of large-scale integrated circuit production is met, the first IC carrier plate and the second IC carrier plate can accurately carry ICs to designated positions through stable movement and track limitation, the accuracy of subsequent IC testing, processing and other links is improved, and the production efficiency is improved. The defective rate caused by carrying errors is reduced, and the product quality and the production reliability are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to IC handling technical field more specifically, relate to a kind of IC handling shuttle device. BACKGROUND

[0002] In integrated circuit IC sorting machine, IC handling refers to the process of moving IC from initial position (such as feeding tray, wafer, etc.) to test station, marking station, packaging station and other designated positions with the help of specific mechanical structure and power system.

[0003] Under the existing operation mode, the sorting machine relies on shuttle to handle IC, each IC is placed on a carrier plate, and then transported to the test position for testing. Since each shuttle can only handle one IC at a time, the number of handling times increases exponentially in a large-scale production environment, which makes the sorting machine spend most of the time in repeated handling process, resulting in low efficiency and directly affecting the production capacity. UTILITY MODEL CONTENT

[0004] To solve the above problems, the utility model provides an IC handling shuttle device.

[0005] The utility model provides an IC handling shuttle device adopts the following technical scheme:

[0006] An IC handling shuttle device includes a housing, and a handling assembly is arranged inside the housing.

[0007] The handling assembly includes a first IC carrier plate and a second IC carrier plate, and two motors are arranged on one side of the housing. The two motors are used to drive the first IC carrier plate and the second IC carrier plate to handle simultaneously.

[0008] Further, the output end of each of the two motors is fixedly connected with a driving synchronous pulley, and two driven synchronous pulleys are rotatably connected inside the housing. A toothed synchronous belt is arranged between each driving synchronous pulley and the corresponding driven synchronous pulley.

[0009] Further, the two driven synchronous pulleys are distributed in parallel.

[0010] Further, the first IC carrier plate is located above the second IC carrier plate, and the bottom of the first IC carrier plate and the second IC carrier plate is provided with a lower mounting plate. The bottom of each lower mounting plate is provided with a support seat.

[0011] Further, a linear bearing is arranged between each lower mounting plate and the corresponding support seat, and a guide shaft is connected to one side of each linear bearing.

[0012] Further, two limiting rods are arranged inside the housing, and the two limiting rods are arranged in parallel. A plurality of limiting pulleys are arranged at the bottom of each support seat.

[0013] Further, the outer wall of each limiting pulley is provided with an anti-friction coating.

[0014] Through the above technical scheme, the first IC carrier plate and the second IC carrier plate can be simultaneously carried, achieving the effect of double-layer IC carrier plate carrying.

[0015] Further, the first IC carrier plate and the second IC carrier plate are provided with a buffer gasket between the corresponding lower mounting plate, and each buffer gasket is made of silica gel material.

[0016] Through the above technical scheme, the impact force in the carrying process can be effectively buffered.

[0017] In summary, the utility model has at least one of the following beneficial technical effects:

[0018] The utility model discloses a carrying assembly, which can simultaneously carry the first IC carrier plate and the second IC carrier plate, achieving the effect of double-layer IC carrier plate carrying, which means that the number of ICs that can be carried in the same time is doubled, greatly improving the carrying efficiency, effectively shortening the overall production cycle, meeting the efficient demand of large-scale integrated circuit production, and making the carrier plate do linear motion when moving through the cooperation of the linear bearing between the lower mounting plate and the supporting seat and the guide shaft, ensuring the stability of the carrier plate movement process, reducing shaking and deviation, and simultaneously, the limiting pulley at the bottom of the supporting seat is matched with the limiting rod, the anti-friction coating on the outer wall of the pulley not only reduces the friction loss, but also further limits the movement track of the carrier plate, prevents deviation, ensures the stability of the carrying process, and through stable movement and track limitation, the first IC carrier plate and the second IC carrier plate can accurately carry ICs to the specified position, improving the accuracy of subsequent IC testing, processing and other links, reducing the defective rate caused by carrying errors, and improving product quality and production reliability. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a whole structure schematic view of the utility model;

[0020] Figure 2 It is a shell internal structure schematic view of the utility model;

[0021] Figure 3 It is a whole structure schematic view of the first IC carrier plate and the second IC carrier plate of the utility model;

[0022] Figure 4 It is a whole structure top view of the first IC carrier plate and the second IC carrier plate of the utility model;

[0023] Figure 5The utility model discloses a first IC carrier plate and second IC carrier plate bottom structure schematic view of the utility model discloses a

[0024] Figure 6 The utility model discloses a Figure 2 The structure amplification diagram of A of the utility model discloses a

[0025] Mark explanation: 1, the shell, 2, first IC carrier plate, 3, second IC carrier plate, 4, linear bearing, 5, lower mounting plate, 6, support seat, 7, limit pulley, 8, motor, 9, driving synchronous pulley, 10, driven synchronous pulley, 11, toothed synchronous belt, 12, limit rod, 13, buffer gasket, 14, guide shaft. Specific implementation

[0026] The technical scheme in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model; Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments, and all other embodiments obtained by the person skilled in the art without creative labor based on the embodiments in the utility model belong to the range of the utility model protection.

[0027] Refer to Figures 1-6 An IC carrying shuttle device, including shell 1, the inside of shell 1 is equipped with carrying assembly;

[0028] Carrying assembly includes first IC carrier plate 2 and second IC carrier plate 3, and one side of shell 1 is equipped with two motors 8, and the two motors 8 are used to drive first IC carrier plate 2 and second IC carrier plate 3 to carry simultaneously.

[0029] Refer to Figures 1-6 The output end of two motors 8 is fixedly connected with driving synchronous pulley 9, and the inside of shell 1 is rotatably connected with two driven synchronous pulleys 10, and the toothed synchronous belt 11 is arranged between each driving synchronous pulley 9 and corresponding driven synchronous pulley 10, and the two driven synchronous pulleys 10 are in parallel distribution, and first IC carrier plate 2 is located above second IC carrier plate 3, and the bottom of first IC carrier plate 2 and second IC carrier plate 3 is equipped with lower mounting plate 5, and the bottom of each lower mounting plate 5 is equipped with support seat 6, and the linear bearing 4 is arranged between each lower mounting plate 5 and corresponding support seat 6, and the side of each linear bearing 4 is connected with guide shaft 14, and the inside of shell 1 is equipped with two limit rods 12, and the two limit rods 12 are in parallel, and the bottom of each support seat 6 is equipped with a plurality of limit pulleys 7, and each limit pulley 7 is matched with the side of corresponding limit rod 12 respectively, and the outer wall of each limit pulley 7 is equipped with anti-friction coating.

[0030] The first IC carrier plate 2 and the second IC carrier plate 3 can be simultaneously carried by the carrying assembly, thereby achieving the carrying of double-layer IC carrier plates. Specifically, first, the two motors 8 arranged on one side of the shell 1 are started, and the output ends of the motors 8 drive the driving synchronous pulleys 9 to rotate. Since each driving synchronous pulley 9 is connected with a corresponding driven synchronous pulley 10 through a toothed synchronous belt 11, the rotation of the driving synchronous pulley 9 drives the toothed synchronous belt 11 to move, thereby driving the driven synchronous pulley 10 to rotate. The lower mounting plate 5 at the bottom of the first IC carrier plate 2 and the second IC carrier plate 3 is connected with the toothed synchronous belt 11, and under the drive of the toothed synchronous belt 11, the first IC carrier plate 2 and the second IC carrier plate 3 start to move. Meanwhile, the linear bearing 4 between the lower mounting plate 5 and the support seat 6 is sleeved on the guide shaft 14, so that the carrier plate moves linearly along the guide shaft 14 during the movement, ensuring the stability and accuracy of the movement. The plurality of limiting pulleys 7 at the bottom of the support seat 6 are matched with the limiting rods 12 arranged in parallel in the shell 1, and the outer wall of the limiting pulley 7 has an anti-friction coating. The limiting pulley 7 rolls along the limiting rod 12, further limiting the movement track of the carrier plate and preventing it from deviating, so as to finally achieve the simultaneous, stable and accurate carrying of the first IC carrier plate 2 and the second IC carrier plate 3.

[0031] The carrying assembly can simultaneously carry the first IC carrier plate 2 and the second IC carrier plate 3, achieving the effect of carrying double-layer IC carrier plates. This means that the number of ICs that can be carried at the same time is doubled, greatly improving the carrying efficiency and effectively shortening the overall production cycle, meeting the efficient demand of large-scale integrated circuit production. Moreover, the linear bearing 4 between the lower mounting plate 5 and the support seat 6 cooperates with the guide shaft 14, so that the carrier plate moves linearly during the movement, ensuring the stability of the movement process and reducing shaking and deviation. Meanwhile, the limiting pulleys 7 at the bottom of the support seat 6 are matched with the limiting rods 12, and the anti-friction coating on the outer wall of the pulley not only reduces friction loss but also further limits the movement track of the carrier plate, preventing it from deviating and ensuring the stability of the carrying process. Through stable movement and track limitation, the first IC carrier plate 2 and the second IC carrier plate 3 can accurately carry the ICs to the designated position, improving the accuracy of subsequent IC testing, processing and other links, reducing the rate of defective products caused by carrying errors, and improving product quality and production reliability.

[0032] Referring to Figure 4 A buffer gasket 13 is arranged between the first IC carrier plate 2 and the second IC carrier plate 3 and the corresponding lower mounting plate 5. Each buffer gasket 13 is made of silica gel material.

[0033] The buffer gasket 13 can effectively buffer the impact force during the carrying process, protect the IC from vibration damage, reduce wear between the carrier plate and the lower mounting plate 5, and prolong the service life of the equipment.

[0034] Working principle: first, start the two motors 8 arranged on one side of the shell 1, the motor 8 output end drives the driving synchronous pulley 9 to rotate, because each driving synchronous pulley 9 and corresponding driven synchronous pulley 10 are connected with toothed synchronous belt 11, the rotation of driving synchronous pulley 9 will drive toothed synchronous belt 11 movement, in turn drive driven synchronous pulley 10 to rotate, the first IC carrier plate 2 and the second IC carrier plate 3 bottom lower mounting plate 5 is connected with toothed synchronous belt 11, under the drive of toothed synchronous belt 11, the first IC carrier plate 2 and the second IC carrier plate 3 start to move, at the same time, the linear bearing 4 between lower mounting plate 5 and support seat 6 is sleeved on the guide shaft 14, make the carrier plate do linear motion along the guide shaft 14 in the moving process, ensure the stability and accuracy of movement, the plurality of limiting pulleys 7 on the bottom of support seat 6 are matched with the limiting rod 12 arranged in parallel in the shell 1, and the outer wall of limiting pulley 7 has anti-friction coating, limiting pulley 7 rolls along limiting rod 12, further restricts the movement track of carrier plate, prevents it from deviating, finally realizes that the first IC carrier plate 2 and the second IC carrier plate 3 are simultaneously, stably and accurately handled.

[0035] The above are preferred embodiments of the present application, not limited by the above, and the protection scope of the present application is not limited by the above, so: equivalent changes made according to the structure, shape, principle of the present application should be covered in the protection scope of the present application.

Claims

1. An IC handling shuttle device comprising a housing (1), characterized in that The inside of the shell (1) is provided with a conveying assembly; The conveying assembly comprises a first IC carrier plate (2) and a second IC carrier plate (3), and one side of the shell (1) is provided with two motors (8) for driving the first IC carrier plate (2) and the second IC carrier plate (3) to be conveyed simultaneously.

2. An IC handling shuttle apparatus according to claim 1, wherein: The output end of each of the two motors (8) is fixedly connected with a driving synchronous pulley (9), and the inside of the shell (1) is rotatably connected with two driven synchronous pulleys (10), and each driving synchronous pulley (9) is provided with a toothed synchronous belt (11) between the corresponding driven synchronous pulley (10).

3. An IC handling shuttle apparatus according to claim 2, wherein: The two driven synchronous pulleys (10) are in parallel distribution.

4. An IC handling shuttle apparatus according to claim 3, wherein: The first IC carrier plate (2) is located above the second IC carrier plate (3), and the bottom of each of the first IC carrier plate (2) and the second IC carrier plate (3) is provided with a lower mounting plate (5), and the bottom of each lower mounting plate (5) is provided with a support seat (6).

5. An IC handling shuttle apparatus according to claim 4, wherein: Each lower mounting plate (5) and the corresponding support seat (6) are provided with a linear bearing (4), and one side of each linear bearing (4) is connected with a guide shaft (14).

6. An IC handling shuttle apparatus according to claim 5, wherein: The inside of the shell (1) is provided with two limiting rods (12), and the two limiting rods (12) are in parallel, and the bottom of each support seat (6) is provided with a plurality of limiting pulleys (7).

7. An IC handling shuttle apparatus as claimed in claim 6, wherein: Each limiting pulley (7) is matched with one side of the corresponding limiting rod (12), and the outer wall of each limiting pulley (7) is provided with an anti-friction coating.

8. The IC handling shuttle apparatus of claim 1, wherein: The first IC carrier plate (2) and the second IC carrier plate (3) are provided with a buffer gasket (13) between the corresponding lower mounting plate (5).

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