Semiconductor wafer drying equipment
By clamping and rotating the semiconductor wafer, combined with hot air drying, the problem of uneven heating during the semiconductor wafer drying process was solved, achieving uniform heating and efficient drying, thus improving production yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-28
- Publication Date
- 2026-03-27
AI Technical Summary
In the prior art, semiconductor wafers are heated unevenly during the drying process due to their fixed position, resulting in localized overheating, which affects the drying effect and may damage the wafers.
Semiconductor wafers are held in place by wafer clamping wheels and wafer drive wheels and rotated, while a hot air blower dries them to ensure uniform heating.
This achieves uniform heating of semiconductor wafers, improves drying efficiency, avoids localized overheating damage, and increases production yield.
Smart Images
Figure CN224050902U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to semiconductor wafer manufacturing equipment technical field especially relates to semiconductor wafer drying equipment. BACKGROUND
[0002] The surface of semiconductor wafer will be attached with various metal impurities, organic matter and inorganic matter in the manufacturing process, and the semiconductor wafer cleaning is to remove the pollutants attached to the surface, which can cause leakage, voltage collapse and integrated circuit short circuit, after cleaning, the semiconductor wafer needs to be dried to remove moisture to prevent wafer surface oxidation or water stain formation, affect the subsequent process, in order to improve the drying efficiency, the cleaned semiconductor wafer will be placed in the wafer box currently, and then the moisture is evaporated through hot air drying, the position of semiconductor wafer is fixed in the wafer box during the drying process, which can cause uneven heating of semiconductor wafer, poor drying effect, and local overheating, which can damage the semiconductor wafer. SUMMARY
[0003] The utility model discloses a purpose at through wafer clamping wheel clamping semiconductor wafer, again through wafer drive wheel drive semiconductor wafer rotation, to solve the above-mentioned background art when drying semiconductor wafer, because the position of semiconductor wafer is fixed in the wafer box, lead to uneven heating, poor drying effect, and local overheating, also can damage the semiconductor wafer problem.
[0004] The specific technical scheme of the utility model is as follows:
[0005] A kind of semiconductor wafer drying equipment, including drying table, drying table is equipped with drying pool, blowing pipe is equipped in drying pool, blowing pipe is connected with external air heater;The upper surface of drying table is equipped with support frame, the upper surface of support frame is equipped with rack, support frame is slidably connected with mobile platform, stepper motor and telescopic push rod motor one are installed on mobile platform, the drive shaft of stepper motor is connected with gear, and the gear is engaged with rack;Telescopic push rod motor one is equipped with push rod one, and push rod one terminal is connected with clamping platform, telescopic push rod motor two and telescopic push rod motor three are installed on clamping platform, telescopic push rod motor two is equipped with push rod two, and push rod two terminal is connected with clamping mechanism, clamping mechanism and semiconductor wafer contact part are equipped with wafer clamping wheel, telescopic push rod motor three is equipped with push rod three, and push rod three terminal is connected with micro motor, and the shaft of micro motor is connected with wafer drive wheel.
[0006] Further, the clamping mechanism includes a cross-arm type clamp, the chuck of the cross-arm type clamp is connected with the wafer clamping wheel, the rear portions of the two clamping arms of the cross-arm type clamp are respectively provided with sliding grooves, the end of the push rod two is provided with a sliding shaft, the sliding shaft and the sliding grooves form a slot-pin pair, the two sides of the clamping platform are oppositely provided with fixed rods, the fixed rods are provided with rotating shafts, and the two clamping arms of the cross-arm type clamp are provided with shaft holes matched with the rotating shafts.
[0007] Further, the chuck head of the cross arm type clamp is fixed with a hub one, a plurality of wafer clamping wheels are sleeved on the hub one, a hub two is connected with the machine shaft of the micro motor, and a plurality of wafer driving wheels are sleeved on the hub two.
[0008] Further, a clamping groove matched with the edge of the semiconductor wafer is arranged on the wafer clamping wheel and the wafer driving wheel respectively.
[0009] Further, the material of the wafer clamping wheel and the wafer driving wheel is high-temperature-resistant rubber.
[0010] Further, two air blowing pipes are arranged in the drying pool, and the two air blowing pipes are respectively arranged on the left side and the right side of the drying pool, a plurality of air blowing nozzles are arranged on the air blowing pipes.
[0011] Further, the air blowing pipe is arranged on the upper portion of the drying pool, and the air blowing nozzles are inclined downward.
[0012] Further, the bottom surface of the drying pool is a slope, a sewage pipe is arranged at the lowest position of the slope, and a sewage valve is connected to the end of the sewage pipe.
[0013] Further, operation tables are arranged on the left side and the right side of the drying table respectively, a limiting convex part is arranged on the upper surface of the operation table, a wafer storage box is arranged on the table top of the operation table, a limiting groove matched with the limiting convex part is arranged on the lower surface of the wafer storage box, and a plurality of wafer placing grooves are arranged on the upper surface of the wafer storage box.
[0014] Further, a linear sliding groove is arranged on the front vertical surface of the support frame, and a sliding block matched with the linear sliding groove is arranged on the moving platform.
[0015] Compared with the prior art, the utility model has the following beneficial effects:
[0016] When the semiconductor wafer drying operation is performed, the cleaned semiconductor wafer is placed in the wafer storage box, the stepping motor is started, the clamping platform is moved above the wafer storage box, the telescopic push rod motor one is started, the clamping platform is lowered, at this time the stepping motor and the telescopic push rod motor one are closed, the telescopic push rod motor two is started, the cross arm type clamp is controlled by lifting the push rod two, the semiconductor wafer in the wafer storage box is clamped by the wafer clamping wheel, then the telescopic push rod motor two is closed, the telescopic push rod motor three is started, the micro motor is lowered by the push rod three, the semiconductor wafer is pressed by the wafer driving wheel, at this time the semiconductor wafer is taken out from the wafer storage box by the stepping motor and the telescopic push rod motor one and falls into the drying pool, the micro motor is started, the micro motor drives the wafer driving wheel to rotate, the semiconductor wafer also starts to rotate, at this time the air heater is opened, the hot air is blown to the semiconductor wafer by the blowing nozzle, the semiconductor wafer is dried, the semiconductor wafer rotates continuously in the drying process, the semiconductor wafer is uniformly heated, the drying effect is improved, and the problem that the semiconductor wafer is locally seriously heated and damaged is avoided, and the yield of the semiconductor wafer production is improved. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 It is a three-dimensional structure schematic view of the embodiment of the utility model;
[0018] Figure 2 It is a three-dimensional schematic view of the bottom structure of the embodiment of the utility model;
[0019] Figure 3 It is a schematic view of the clamping mechanism in the embodiment of the utility model clamping the wafer on the wafer storage box;
[0020] Figure 4 It is Figure 3 It is a partial enlarged schematic view of A in the figure;
[0021] Figure 5 It is a schematic view of the semiconductor wafer in the embodiment of the utility model in the drying state;
[0022] Figure 6 It is an assembly schematic view of the moving platform and the clamping platform in the embodiment of the utility model;
[0023] Figure 7 It is Figure 6 It is a partial enlarged schematic view of B in the figure;
[0024] REFERENCE SIGNS:
[0025] 1, drying table; 11, drying pool; 111, blowing pipe; 112, blowing nozzle; 113, blow-off pipe; 114, blow-off valve; 12, support frame; 121, rack; 122, linear sliding groove; 13, operation table; 131, limiting protruding part;
[0026] 2, mobile platform; 21, stepping motor; 211, gear; 22, telescopic push rod motor one; 221, push rod one; 23, sliding block;
[0027] 3, clamping platform; 32, telescopic push rod motor two; 321, push rod two; 322, sliding shaft; 33, telescopic push rod motor three; 331, push rod three; 34, micro motor; 341, wheel hub two; 35, wafer drive wheel; 36, wafer clamping wheel; 37, cross arm type clamp; 371, sliding groove; 372, shaft hole; 373, wheel hub one; 38, fixed rod; 381, rotating shaft;
[0028] 4, wafer storage box; 41, wafer placing groove. DETAILED DESCRIPTION
[0029] In order to better understand the purpose, structure and function of the utility model, the technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings.
[0030] Referring to Figures 1 to 7 , the embodiment discloses a semiconductor wafer drying equipment, which comprises a drying table 1, the drying table 1 is provided with a drying pool 11, the drying pool 11 is provided with a blowing pipe 111, the blowing pipe 111 is connected with an external air heater, the air heater blows hot air to the semiconductor wafer through the blowing pipe 111; the upper surface of the drying table 1 is provided with a support frame 12, the upper surface of the support frame 12 is provided with a rack 121, the support frame 12 is slidingly connected with a mobile platform 2, a stepping motor 21 and a telescopic push rod motor one 22 are installed on the mobile platform 2, a driving shaft of the stepping motor 21 is connected with a gear 211, the gear 211 is engaged with the rack 121, and the stepping motor 21 drives the mobile platform 2 to move horizontally; the telescopic push rod motor one 22 is provided with a push rod one 221, the push rod one 221 is connected with a clamping platform 3 at the tail end, the telescopic push rod motor one 22 drives the clamping platform 3 to move vertically, a telescopic push rod motor two 32 and a telescopic push rod motor three 33 are installed on the clamping platform 3, the telescopic push rod motor two 32 is provided with a push rod two 321, the push rod two 321 is connected with a clamping mechanism at the tail end, the clamping mechanism is provided with a wafer clamping wheel 36 at the contact position of the semiconductor wafer, the push rod two 321 is lowered, the clamping mechanism clamps the semiconductor wafer by using the wafer clamping wheel 36, the telescopic push rod motor three 33 is provided with a push rod three 331, the push rod three 331 is connected with a micro motor 34 at the tail end, a wafer drive wheel 35 is connected with the shaft of the micro motor 34, the micro motor 34 is lowered by using the push rod three 331, the semiconductor wafer is pressed by using the wafer drive wheel 35, the micro motor 34 is started, the micro motor 34 drives the wafer drive wheel 35 to rotate, and the semiconductor wafer also starts to rotate.
[0031] The clamping mechanism comprises a cross-arm type clamp 37, the clamping head of the cross-arm type clamp 37 is connected with a wafer clamping wheel 36, the rear part of the two clamping arms of the cross-arm type clamp 37 is respectively provided with a sliding groove 371, the end of the push rod two 321 is provided with a sliding shaft 322, the sliding shaft 322 and the sliding groove 371 form a groove-pin pair, the two sides of the clamping platform 3 are oppositely provided with a fixed rod 38, the fixed rod 38 is provided with a rotating shaft 381, the two clamping arms of the cross-arm type clamp 37 are provided with a shaft hole 372 matched with the rotating shaft 381, the push rod two 321 is lowered, the cross-arm type clamp 37 is opened, and vice versa, the push rod two 321 is raised, and the cross-arm type clamp 37 is closed.
[0032] The clamping head of the cross-arm type clamp 37 is fixedly provided with a hub one 373, a plurality of wafer clamping wheels 36 are sleeved on the hub one 373, the wafer clamping wheels 36 are connected with the hub one 373 through bearings, the shaft of the micro motor 34 is connected with a hub two 341, a plurality of wafer driving wheels 35 are sleeved on the hub two 341, and the wafer driving wheels 35 are fixedly connected with the hub two 341, when the wafer driving wheels 35 drive the semiconductor wafer to rotate, the wafer clamping wheels 36 also passively rotate on the hub one 373, so that the semiconductor wafer rotates more smoothly, and a plurality of semiconductor wafers can be clamped and pressed at the same time by arranging a plurality of wafer clamping wheels 36 and wafer driving wheels 35, and the drying efficiency is improved.
[0033] A clamping groove matched with the edge of the semiconductor wafer is arranged on the wafer clamping wheel 36 and the wafer driving wheel 35 in a circumferential direction, so that the position of the semiconductor wafer is more stable when the semiconductor wafer is clamped and rotated.
[0034] The wafer clamping wheel 36 and the wafer driving wheel 35 are made of high-temperature-resistant rubber, so as to prevent the wafer clamping wheel 36 and the wafer driving wheel 35 from aging rapidly in a hot air drying environment, and reduce the loss cost of the equipment.
[0035] Two air blowing pipes 111 are arranged in the drying pool 11, and the two air blowing pipes 111 are respectively located on the left side and the right side of the drying pool 11, a plurality of air blowing nozzles 112 are arranged on the air blowing pipe 111, the hot air blown out by the air blowing nozzles 112 can be dispersed, and the plurality of semiconductor wafers can be heated more uniformly.
[0036] The air blowing pipe 111 is located at the upper part of the drying pool 11, and the air blowing nozzles 112 are downwardly inclined, which is helpful to blow the cleaning residual liquid on the semiconductor wafer down.
[0037] The inner bottom surface of the drying pool 11 is inclined, which is helpful to flow the cleaning liquid in the drying pool 11 clean, a sewage pipe 113 is arranged at the lowest part of the inclined surface, and a sewage valve 114 is connected to the end of the sewage pipe 113.
[0038] The operation table 13 is arranged on the left and right sides of the drying table 1, and the upper surface of the operation table 13 is provided with a limiting protrusion 131, which is a cylinder in this embodiment, and a clamping piece is arranged on the edge of the cylinder.
[0039] The front vertical surface of the support frame 12 is provided with a linear sliding groove 122, and a sliding block 23 matched with the linear sliding groove 122 is arranged on the moving platform 2, so that the sliding block 23 and the linear sliding groove 122 are matched to realize the sliding connection between the moving platform 2 and the support frame 12.
[0040] Working principle: when the semiconductor wafer drying operation is performed, the cleaned semiconductor wafer is first placed in the wafer storage box 4, the stepping motor 21 is started, the clamping platform 3 is moved above the wafer storage box 4, the telescopic push rod motor one 22 is started, the clamping platform 3 is lowered, the telescopic push rod motor two 32 is started, the cross arm type clamp 37 is controlled by lifting the push rod two 321, the wafer clamping wheel 36 clamps the semiconductor wafer in the wafer storage box 4, then the telescopic push rod motor two 32 is closed, the telescopic push rod motor three 33 is started, the push rod three 331 is used to lower the micro motor 34, the wafer driving wheel 35 is used to press the semiconductor wafer, then the semiconductor wafer is taken out from the wafer storage box 4 by the stepping motor 21 and the telescopic push rod motor one 22, and falls into the drying pool 11, the micro motor 34 is started, the micro motor 34 drives the wafer driving wheel 35 to rotate, and the semiconductor wafer also starts to rotate, then the air blower is opened, the hot air is blown to the semiconductor wafer by the blowing nozzle 112, the semiconductor wafer is dried, the semiconductor wafer rotates continuously during the drying process, the semiconductor wafer is uniformly heated, the drying effect is improved, and the problem of local overheating of the semiconductor wafer and damage to the semiconductor wafer is avoided, and the yield of the semiconductor wafer production is improved.
[0041] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any skilled person in the art can make equivalent replacement or change according to the technical scheme and concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.
Claims
1. A semiconductor wafer drying apparatus, characterized by: The utility model provides a drying table (1) is equipped with drying pool (11), is equipped with blowing pipe (111) in drying pool (11), blowing pipe (111) is connected with outside air heater, drying table (1) upper surface is equipped with support frame (12), support frame (12) upper surface is equipped with rack (121), support frame (12) slidingly connected with mobile platform (2), install stepper motor (21) and telescopic push rod motor one (22) on mobile platform (2), the drive shaft of stepper motor (21) is connected with gear (211), and gear (211) engages with rack (121), telescopic push rod motor one (22) is equipped with push rod one (221), and push rod one (221) end is connected with clamping platform (3), install telescopic push rod motor two (32) and telescopic push rod motor three (33) on clamping platform (3), and telescopic push rod motor two (32) is equipped with push rod two (321), and push rod two (321) end is connected with clamping mechanism, and clamping mechanism and semiconductor wafer contact part are equipped with wafer clamping wheel (36), and telescopic push rod motor three (33) is equipped with push rod three (331), and push rod three (331) end is connected with micro motor (34), and the axle of micro motor (34) is connected with wafer drive wheel (35).
2. The semiconductor wafer drying apparatus according to claim 1, wherein The clamping mechanism includes a cross-arm type clamp (37), the chuck of the cross-arm type clamp (37) is connected with the wafer clamping wheel (36), the rear parts of the two clamping arms of the cross-arm type clamp (37) are respectively provided with sliding grooves (371), the end of the push rod two (321) is provided with a sliding shaft (322), the sliding shaft (322) and the sliding grooves (371) form a slot-pin pair, the opposite sides of the clamping platform (3) are respectively provided with fixed rods (38), the fixed rods (38) are provided with rotating shafts (381), and the two clamping arms of the cross-arm type clamp (37) are provided with shaft holes (372) matched with the rotating shafts (381).
3. The semiconductor wafer drying apparatus according to claim 2, wherein The chuck of the cross-arm type clamp (37) is fixedly provided with a hub one (373), a plurality of wafer clamping wheels (36) are sleeved on the hub one (373), the axle of the micro motor (34) is connected with a hub two (341), and a plurality of wafer drive wheels (35) are sleeved on the hub two (341).
4. The semiconductor wafer drying apparatus of claim 1, wherein A plurality of clamping grooves matched with the edges of the semiconductor wafers are circumferentially arranged on the wafer clamping wheels (36) and the wafer drive wheels (35).
5. The semiconductor wafer drying apparatus according to claim 4, wherein The wafer clamping wheels (36) and the wafer drive wheels (35) are made of high-temperature-resistant rubber.
6. The semiconductor wafer drying apparatus of claim 1, wherein Two blowing pipes (111) are arranged in the drying pool (11), and the two blowing pipes (111) are respectively arranged on the left and right sides of the drying pool (11), a plurality of blowing nozzles (112) are arranged on the blowing pipes (111).
7. The semiconductor wafer drying apparatus according to claim 6, wherein The blowing pipe (111) is arranged on the upper part of the drying pool (11), and the blowing nozzles (112) are downwardly inclined.
8. The semiconductor wafer drying apparatus of claim 1, wherein The inner bottom surface of the drying pool (11) is inclined, a sewage discharge pipe (113) is arranged at the lowest part of the inclined surface, and the end of the sewage discharge pipe (113) is connected with a sewage discharge valve (114).
9. The semiconductor wafer drying apparatus of claim 1, wherein The drying table (1) is respectively provided with an operation table (13) on the left and right sides, the upper surface of the operation table (13) is provided with a limiting protrusion (131), the table top of the operation table (13) is placed with a wafer storage box (4), the lower surface of the wafer storage box (4) is provided with a limiting groove matched with the limiting protrusion (131), and the upper surface of the wafer storage box (4) is provided with a plurality of wafer placing grooves (41).
10. The semiconductor wafer drying apparatus of claim 1, wherein The front vertical surface of the support frame (12) is provided with a linear sliding groove (122), and the moving platform (2) is provided with a sliding block (23) matched with the linear sliding groove (122).