Liquid drainage shell structure of integrated photoetching equipment

By adopting an integrated lithography equipment drain housing structure with a straight-through drain interface connected to the main collection pipe in semiconductor manufacturing equipment, the blockage and leakage problems caused by overflow drain structures are solved, achieving efficient waste liquid discharge and stable equipment operation.

CN224052552UActive Publication Date: 2026-03-27SHANGHAI HUALI INTEGRATED CIRCUIT CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-18
Publication Date
2026-03-27

AI Technical Summary

Technical Problem

In existing semiconductor manufacturing equipment, the overflow drainage structure of the TEL I-Line machine's drainage housing causes solvent evaporation during the discharge of photoresist waste liquid, resulting in blockages and waste liquid backflow, increasing downtime and leakage risks.

Method used

A straight-through drain interface is adopted to directly connect with the main collection pipe, increasing the cross-sectional area of ​​the drain outlet and forming a hydrophobic coating on the interface surface. Combined with the anti-residue guide groove and detachable clamp structure, the waste liquid is ensured to flow continuously and avoid crystal accumulation.

Benefits of technology

This reduces the frequency of equipment cleaning, decreases downtime and product scrap rate caused by photoresist crystallization, and improves drainage efficiency and equipment reliability.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model provides a liquid drainage shell structure of integrated photoetching equipment, which comprises a shell body and a waste liquid inlet, and photoresist waste liquid flows into the shell body through the waste liquid inlet; the shell body is provided with a straight-through type liquid discharging connector. The straight-through type liquid discharge interface is directly communicated with a collecting header pipe of the photoresist waste liquid, and the solvent is kept in the collecting header pipe to circularly flow; and the cross sectional area of the straight-through type liquid discharge interface is larger than that of the liquid discharge port of the front overflow type liquid discharge shell structure. According to the utility model, the cleaning frequency of equipment caused by photoresist crystallization can be reduced, and scrapping of products caused by leakage is avoided.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technical field especially relates to a kind of integrated photoetching equipment drainage shell structure. BACKGROUND

[0002] TEL I-Line machine drainage shell is generally used overflow drainage structure in existing semiconductor manufacturing equipment. Figure 1 The prior art structure only when waste liquid accumulates to fixed liquid level, liquid can be discharged by overflow. Since photoresist waste liquid contacts air during discharge, solvent volatilizes, causing photoresist crystals to accumulate and deposit on the inner wall of the drain port, ultimately causing the drain passage to be blocked. According to actual operation statistics, this structure requires an average of about 2 hours of downtime for manual cleaning every week, and a single device has an annual downtime of up to 104 hours. More seriously, the waste liquid backflow phenomenon caused by blockage is extremely likely to induce machine leakage accidents, resulting in an increase in product scrap rate.

[0003] Traditional solutions mainly increase downtime frequency or change cleaning agent ratio, but neither can completely solve the blockage problem caused by structural design defects.

[0004] To solve the above problems, a new type of integrated photoetching equipment drainage shell structure is needed. UTILITY MODEL CONTENT

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide an integrated photoetching equipment drainage shell structure to solve the problem that the prior art mainly increases downtime frequency or changes cleaning agent ratio, but neither can completely solve the blockage problem caused by structural design defects.

[0006] To achieve the above-mentioned purposes and other related purposes, the utility model provides an integrated photoetching equipment drainage shell structure, which comprises a shell body and a waste liquid inlet, characterized by:

[0007] The photoresist waste liquid flows into the shell body through the waste liquid inlet;

[0008] The shell body is provided with a straight-through drainage port;

[0009] The straight-through drainage port is directly communicated with the collection main pipe of the photoresist waste liquid, and the collection main pipe is kept circulating flow inside;

[0010] The cross-sectional area of the straight-through drainage port is larger than that of the drain port of the previous overflow drainage shell structure.

[0011] Preferably, the cross section of the straight-through drainage port is circular.

[0012] Preferably, a hydrophobic coating is formed on the surface of the straight-through drainage port.

[0013] Preferably, the straight-through liquid discharge interface is arranged at the bottom of the shell body.

[0014] Preferably, the inner surface of the shell body is provided with a residual prevention flow guide groove, which is from the waste liquid inlet to the straight-through liquid discharge interface.

[0015] Preferably, the solvent includes a photoresist solvent.

[0016] Preferably, the collecting main pipe is connected with the straight-through liquid discharge interface through a detachable clamp structure.

[0017] Preferably, the inner side of the clamp is provided with a chemical corrosion resistant sealing gasket.

[0018] As described above, the integrated photolithography equipment liquid discharge shell structure has the following beneficial effects:

[0019] The integrated photolithography equipment liquid discharge shell structure can reduce the cleaning frequency caused by photoresist crystallization, and avoid product scrapping caused by leakage. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 An integrated photolithography equipment liquid discharge shell structure is shown as a prior art schematic diagram;

[0021] Figure 2 An integrated photolithography equipment liquid discharge shell structure is shown as a prior art schematic diagram. DETAILED DESCRIPTION

[0022] The embodiments of the present application will be described in detail below with specific examples. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the specification. The present application can also be implemented or applied in different specific embodiments, and the details in the specification can be modified or changed based on different views and applications without departing from the spirit of the present application.

[0023] Please refer to Figure 2 The present application provides an integrated photolithography equipment liquid discharge shell structure, which comprises a shell body, a waste liquid inlet, a straight-through liquid discharge interface, a collecting main pipe, a clamp, and a chemical corrosion resistant sealing gasket.

[0024] The photoresist waste liquid flows into the shell body 101 through the waste liquid inlet 102.

[0025] The shell body 101 is provided with a straight-through liquid discharge interface 103.

[0026] In some embodiments, the cross section of the straight-through liquid discharge interface 103 is circular. The circular cross section design makes the waste liquid flow path more uniform, further reducing the risk of crystallization caused by local flow rate discontinuity, while adapting to standardized pipeline connections. In certain application scenarios, the surface of the straight-through liquid discharge interface 103 is formed with a hydrophobic coating, such as a fluorocarbon coating formed by a plasma vapor deposition process. The hydrophobic coating can significantly reduce the adhesion rate of photoresist waste liquid to the inner wall of the liquid discharge port, reduce the accumulation of hard deposits, and avoid physical damage to the pipeline during manual cleaning.

[0027] In some embodiments, the straight-through liquid discharge interface 103 is arranged at the bottom of the housing body 101 and forms a height difference with the waste liquid inlet 102 of the housing body 101. To enhance the efficiency of waste liquid discharge, the surface of the housing body 101 is provided with a residue-resistant flow guide groove extending from the waste liquid inlet 102 to the straight-through liquid discharge interface 103. This can accelerate the liquid discharge process and reduce the liquid residence time, especially for the discharge treatment of high-viscosity photoresist waste liquid.

[0028] The straight-through liquid discharge interface 103 is directly connected to the collection main pipe of the photoresist waste liquid, and the inside of the collection main pipe is kept circulating with solvent to dissolve the photoresist crystallization;

[0029] In some embodiments, the solvent includes photoresist solvents such as ethylene glycol monomethyl ether acetate. The solvent is connected to the straight-through liquid discharge interface 103 in a sealed manner through a detachable clamp structure. The inside of the clamp is provided with a chemical corrosion-resistant sealing gasket, such as one made of perfluorinated rubber or polytetrafluoroethylene material. The combination of the clamp and the sealing gasket ensures reliable connection of the liquid discharge interface and the main pipe.

[0030] The cross-sectional area of the straight-through liquid discharge interface 103 is larger than that of the liquid discharge port of the previous overflow type liquid discharge shell structure. By optimizing the size and connection mode of the liquid discharge interface, continuous flow of waste liquid is achieved, avoiding the formation of crystalline accumulation due to solvent evaporation of residual liquid, thereby improving the liquid discharge efficiency and reducing the need for downtime maintenance.

[0031] Test data show that the frequency of cleaning due to photoresist crystallization is reduced from once a week to once a month, and the annual downtime of a single device is saved by more than 100 hours, while the scrap rate of products due to leakage is reduced.

[0032] It should be noted that the diagrams provided in the present embodiment only illustrate the basic concept of the present application in a schematic manner, and only the components related to the present application are shown in the diagrams, rather than being drawn according to the number, shape and size of the components in actual implementation. The shape, number and proportion of each component in actual implementation can be arbitrarily changed, and the layout pattern of the components can be more complex.

[0033] In summary, the utility model can reduce the cleaning frequency caused by photoresist crystallization, and avoid product scrap caused by leakage.

[0034] The above-mentioned embodiments only exemplarily illustrate the principles and effects of the utility model, and are not used to limit the utility model. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and category of the utility model. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the utility model should be covered by the claims of the utility model.

Claims

1. An integrated photoetching equipment liquid discharge shell structure, comprising a shell body and a waste liquid inlet, characterized in that: photoresist waste liquid flows into the shell body through the waste liquid inlet; the shell body is provided with a straight-through liquid discharge interface; the straight-through liquid discharge interface is directly communicated with a collection main pipe of the photoresist waste liquid, and the collection main pipe is internally kept with a solvent circulating flow; the cross-sectional area of the straight-through liquid discharge interface is larger than that of a liquid discharge port of a previous overflow liquid discharge shell structure; the cross section of the straight-through liquid discharge interface is circular; a hydrophobic coating is formed on the surface of the straight-through liquid discharge interface; the straight-through liquid discharge interface is arranged at the bottom of the shell body; a residual prevention guide groove is arranged on the inner surface of the shell body, and the guide groove is from the waste liquid inlet to the straight-through liquid discharge interface; the solvent comprises a photoresist solvent; the collection main pipe is connected with the straight-through liquid discharge interface through a detachable clamp structure; and a chemical corrosion resistant sealing washer is arranged on the inner side of the clamp. ​ ​ ​ ​ 2. The integrated lithographic apparatus drain casing structure of claim 1, wherein: ​ 3. The integrated lithographic apparatus drain casing structure of claim 1, wherein: ​ 4. The integrated lithographic apparatus drain casing structure of claim 1, wherein: ​ 5. The integrated lithographic apparatus drain casing structure of claim 4, wherein: ​ 6. The integrated lithographic apparatus drain casing structure of claim 1, wherein: ​ 7. The integrated lithographic apparatus drain casing structure of claim 1, wherein: ​ 8. The integrated lithographic apparatus drain casing structure of claim 7, wherein: ​