Integrated TCON control panel with heat dissipation module and electric device

Abstract

The utility model relates to the technical field of logic boards, in particular to an integrated TCON control board with a heat dissipation module and an electric device. An integrated TCON control panel with a heat dissipation module comprises a substrate, a plurality of heating devices, a heat dissipation channel and a heat dissipation fan. The plurality of heating devices are arranged on the substrate. The heat dissipation channels are arranged on the heating devices and used for absorbing heat of the heating devices. The heat dissipation fan is arranged on the substrate and right faces the air opening of the heat dissipation channel. Through the reasonably designed structures of the heat dissipation channel, the heat dissipation fan and the like, the problem of poor heat dissipation effect of the existing TCON control panel is effectively solved. The heat dissipation channel is tightly matched with the heating device, heat can be efficiently absorbed and discharged through the heat dissipation fan, and therefore it is guaranteed that the TCON control panel stably works in the high-load and complex environment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of logic boards, and particularly relates to an integrated TCON control board with a heat dissipation module and an electric device. BACKGROUND

[0002] A logic board is an important component in modern electronic devices for processing signals, executing instructions and controlling system operations. It completes tasks such as data transmission, processing and control through integrated electronic components and circuit boards, and is widely used in many fields such as computers, communication devices and industrial automation systems. With the continuous progress of technology, the existing logic board is constantly improving in function and performance, but its heat dissipation capacity still has certain deficiencies.

[0003] The existing logic board usually adopts a conventional heat dissipation design, such as reducing the temperature of electronic components through layout optimization on the board or adding a heat sink. However, as the integration of electronic components is getting higher and higher, the power consumption is also increasing, and the traditional heat dissipation method cannot effectively cope with the heat generated by high power consumption, resulting in an increase in the temperature of the logic board during long-time operation or high-load work, which further affects the stability and life of the components in the board. Excessive temperature not only may cause component damage, but also may cause system failure, seriously affecting the operation reliability of the entire device. CONTENT OF THE INVENTION

[0004] To solve at least one problem existing in the prior art, according to one aspect of the present application, an integrated TCON control board with a heat dissipation module and an electric device are provided, which can improve the heat dissipation effect.

[0005] The present application provides an integrated TCON control board with a heat dissipation module, comprising a substrate, a plurality of heat generating devices, a heat dissipation channel and a heat dissipation fan. The plurality of heat generating devices are arranged on the substrate. The heat dissipation channel is arranged on the plurality of heat generating devices for absorbing heat of the heat generating devices. The heat dissipation fan is arranged on the substrate and faces the air outlet of the heat dissipation channel.

[0006] Optionally, the heat dissipation channel comprises a plurality of heat absorption sections and a plurality of connecting sections. Each heat absorption section is arranged on one heat generating device; the connecting section is arranged between two heat absorption sections and connects two adjacent heat absorption sections.

[0007] Optionally, the substrate and the heat absorption section are arranged horizontally, and the length direction of the substrate is consistent with the extension direction of the heat absorption section.

[0008] Optionally, the connecting lines of at least two heat generating devices intersect with the length direction of the substrate, the extension direction of the connecting section intersects with the length direction of the substrate, and the included angle is between 10°-80°.

[0009] Optionally, the heat dissipation channel further comprises a heat dissipation fin, which is arranged in the heat absorption section and directly opposite to the corresponding heat generating device.

[0010] Optionally, the sizes of the at least two heat generating devices are different in the projection plane in the vertical direction, and the size of the heat absorption section corresponding to the larger heat generating device is larger than that of the heat absorption section corresponding to the smaller heat generating device.

[0011] Optionally, one end of the connecting section is connected with the larger heat generating device, and the other end is connected with the smaller heat generating device, and the opening of the connecting section gradually decreases towards the smaller heat generating device.

[0012] Optionally, the heat dissipation channel is arranged spaced apart from the substrate, and a support leg is arranged between the heat dissipation channel and the substrate.

[0013] Optionally, the heat dissipation silicon grease is coated on the heat generating device and in contact with the heat dissipation channel.

[0014] The application also provides a power consumption device comprising an integrated TCON control panel with a heat dissipation module.

[0015] Compared with the prior art, the integrated TCON control panel with a heat dissipation module of the application has the beneficial effects that:

[0016] By reasonably designing the heat dissipation channel, heat dissipation fan and other structures, the problem of poor heat dissipation effect of the existing TCON control panel is effectively solved. By closely matching the heat dissipation channel with the heat generating device, heat can be efficiently absorbed and discharged through the heat dissipation fan, thereby ensuring the stable operation of the TCON control panel under high load and complex environment. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a perspective view of an integrated TCON control panel in an embodiment of the application.

[0018] Figure 2 is an exploded view of an integrated TCON control panel in an embodiment of the application.

[0019] Figure 3 is a perspective view of a heat dissipation channel in an embodiment of the application.

[0020] Figure 4 is a top view of an integrated TCON control panel in an embodiment of the application, partially cut away.

[0021] Figure 5 is a side view of an integrated TCON control panel in an embodiment of the application.

[0022] Wherein, the reference signs have the following meanings:

[0023] 100, integrated TCON control board; 10, substrate; 20, heat generating device; 30, heat dissipation channel; 31, heat absorbing section; 32, connecting section; 33, heat dissipation fin; 34, supporting leg; 40, heat dissipation fan; 50, heat dissipation silicone grease. DETAILED DESCRIPTION

[0024] In order for those skilled in the art to better understand the technical solutions of the present application, the present application will be described in detail below in conjunction with the drawings. The description in this part is only exemplary and explanatory, and should not have any limiting effect on the protection scope of the present application.

[0025] It should be noted that: similar reference signs and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0026] It should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the product of the present application is usually placed, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" and the like are only used for differentiation and cannot be understood as indicating or implying relative importance.

[0027] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components must be absolutely horizontal or overhanging, but can be slightly inclined. For example, "horizontal" only means that its direction is relatively more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the specification of the present application herein are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0029] The present application will be described in further detail below in conjunction with the drawings.

[0030] Please refer to Figures 1 to 5 The embodiments of the present application provide an integrated TCON control board 100 with a heat dissipation module, aiming to solve the problem of insufficient heat dissipation effect of the TCON control board in the prior art.

[0031] Please refer to Figure 1 and Figure 2 The integrated TCON control board 100 includes a substrate 10, heat generating devices 20, heat dissipation channels 30, and a heat dissipation fan 40. The substrate 10 serves as the base component of the control board 100, carrying all the electronic components, i.e., the heat generating devices 20, and providing physical support and electrical connections. A plurality of heat generating devices 20 are arranged on the substrate 10, which generate heat during operation. The heat generating devices 20 can be chips, MOS tubes, or other components that generate heat during operation. The heat dissipation channels 30 are arranged on the heat generating devices 20 as a heat dissipation module, specifically for absorbing the heat generated by the heat generating devices 20. The heat dissipation fan 40 is installed on the substrate 10 and directly opposite the air outlet of the heat dissipation channels 30, responsible for carrying away the heat in the heat dissipation channels 30, thereby maintaining the normal operating temperature of the TCON control board 100.

[0032] Through the integrated design of the heat dissipation channels 30 and the heat dissipation fan 40, the heat dissipation effect of the TCON control board 100 is improved. This design ensures that the heat generated by the heat generating devices 20 can be quickly absorbed and effectively discharged, so that the TCON control board 100 can maintain stability and efficiency during high-power operation. Further, the size of the heat dissipation fan 40 can be set to be similar to the size of the air outlet of the heat dissipation channels 30, i.e., the heat dissipation fan 40 can be set to be smaller and lower in power, which is beneficial to reducing energy consumption.

[0033] Please refer to Figure 3 In some embodiments, the heat dissipation channels 30 include a plurality of heat absorption sections 31 and a plurality of connection sections 32. Each heat absorption section 31 is arranged on a heat generating device 20 and is responsible for absorbing the heat generated by the heat generating device 20. The connection section 32 is located between two heat absorption sections 31 and is used to connect the two heat absorption sections 31, so that the airflow can smoothly flow in the heat dissipation channels 30, and at the same time, the heat absorption section 31 can transfer heat to the connection section 32, so as to improve the heat dissipation effect.

[0034] The design of the heat absorption section 31 is adapted to the layout of the heat generating device 20, ensuring that the heat of each heat generating device 20 can be effectively conducted to the corresponding heat dissipation channel 30. The arrangement of the connection section 32 optimizes the heat transfer path, so that the heat dissipation channel 30 can more efficiently conduct heat out.

[0035] Optionally, the material of the heat dissipation channels 30 is a metal material, specifically, the material of the heat dissipation channels 30 is aluminum alloy or pure aluminum.

[0036] In some embodiments, the substrate 10 and the heat absorption section 31 are arranged horizontally, and the length direction of the substrate 10 is consistent with the extension direction of the heat absorption section 31.

[0037] The substrate 10 and the heat absorption section 31 are parallel, which is conducive to increasing the contact area between the heat absorption section 31 and the heat generating device 20, thereby improving the heat absorption effect of the heat absorption section 31.

[0038] In some embodiments, the connecting lines of the at least two heat generating devices 20 intersect the length direction of the substrate 10, and the extension direction of the connecting section 32 intersects the length direction of the substrate 10 at an angle between 10° and 80°.

[0039] The design of the heat generating device 20 is usually determined according to actual needs. The connecting lines of the two heat generating devices 20 can be parallel to the length of the substrate 10, or can intersect the length of the substrate 10, that is, the positions of the two heat generating devices 20 in the length direction and the width direction of the substrate 10 are inconsistent. By setting the extension direction of the heat absorption section 31 parallel to the length direction of the substrate 10, the heat generated by the heat generating device 20 can be better absorbed. By setting the connecting section 32 to connect the two heat generating devices 20 whose positions in the length direction and the width direction of the substrate 10 are inconsistent, the airflow generated by the cooling fan 40 can pass through the entire cooling channel 30. By setting the extension direction of the connecting section 32 to intersect the length direction of the substrate 10 at an angle between 10° and 80°, the situation that the airflow is blocked by the connecting section 32 can be reduced.

[0040] It should be noted that in some embodiments, the heights of the heat generating devices 20 are also different. The connecting section can be designed to be inclined, with one end being higher for connecting a higher heat absorption section 31, and the other end being lower for connecting a lower heat absorption section 31.

[0041] Please refer to Figure 2 , Figure 3 and Figure 4 In some embodiments, the cooling channel 30 further comprises a cooling fin 33, which is arranged in the heat absorption section 31 and directly opposite the corresponding heat generating device 20.

[0042] The cooling fin 33 is arranged in the heat absorption section 31 of the cooling channel 30 and directly opposite the corresponding heat generating device 20. The cooling fin 33 serves to further enhance the cooling effect by increasing the contact area for heat transfer and more effectively guiding the heat generated by the heat generating device 20 to the cooling fan 40.

[0043] The cooling fin 33 is usually made of high thermal conductivity materials such as aluminum or copper to enhance its thermal conductivity. The cooling fin 33 is designed in cooperation with the heat absorption section 31 to improve the heat dispersion capability and ensure good cooling performance of the equipment during long-time high-load operation.

[0044] In some embodiments, the sizes of the at least two heat generating devices 20 are different in the vertical projection plane, and the size of the heat absorption section 31 corresponding to the larger heat generating device 20 is larger than the size of the heat absorption section 31 corresponding to the smaller heat generating device 20.

[0045] By reasonably adjusting the size of the heat absorption section 31, the size of the heat absorption section 31 can be matched with the size of the heat generating device 20, which is beneficial to save materials, and by adjusting the size of the heat absorption section 31, each heat absorption section 31 can be optimized according to the heat size of the corresponding heat generating device 20, thereby improving the overall heat dissipation efficiency.

[0046] In some embodiments, the connecting section 32 is connected to the heat generating device 20 with a larger size at one end and connected to the heat generating device 20 with a smaller size at the other end, and the opening of the connecting section 32 gradually decreases towards the smaller heat generating device 20.

[0047] By gradually reducing the connecting section 32 instead of similar 90° bending, the airflow is facilitated to flow out of another air outlet.

[0048] In some embodiments, the heat dissipation channel 30 is spaced apart from the substrate 10, and a support leg 34 is arranged between the heat dissipation channel 30 and the substrate 10.

[0049] Please refer to Figure 5 , the heat dissipation channel 30 and the substrate 10 are spaced apart by the support leg 34, which ensures that the heat dissipation channel 30 and the substrate 10 maintain a certain space, which can facilitate the heat dissipation of the heat dissipation channel 30, and also prevent the heat dissipation channel 30 from transferring heat to the substrate 10 in the opposite direction.

[0050] Please refer to Figure 2 and Figure 5 In some embodiments, the heat dissipation silicone grease 50 is coated on the heat generating device 20 and in contact with the heat dissipation channel 30.

[0051] The heat dissipation silicone grease 50 is coated on the surface of the heat generating device 20, which serves as a heat conducting medium and can effectively improve the heat conduction efficiency. The silicone grease is in contact with the heat dissipation channel 30, which ensures that the heat can be quickly conducted from the heat generating device 20 to the heat dissipation channel 30 and discharged.

[0052] Embodiments of the present application also provide an electronic device including an integrated TCON control board 100 with a heat dissipation module. The electronic device can include, but is not limited to, industrial controllers, automation equipment, vehicle-mounted display systems, vehicle-mounted computing modules, smart televisions, cameras, and the like.

[0053] In summary, the embodiment of the present application provides an integrated TCON control board 100 with a heat dissipation module and an electronic device. Through the reasonable design of the heat dissipation channel 30, the heat dissipation fan 40 and other structures, the problem of poor heat dissipation effect of the existing TCON control board 100 is effectively solved. By closely matching the heat dissipation channel 30 with the heat generating device 20, heat can be efficiently absorbed and discharged through the heat dissipation fan 40, thereby ensuring the stable operation of the TCON control board 100 under high load and complex environment. In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "arrange", "mount", "connect", "connect" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0054] It should be noted that in this paper, the relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the term "include", "contain" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or includes elements inherent in such process, method, article or equipment. Without more limitations, the element defined by the sentence "including a" does not exclude the presence of other identical elements in the process, method, article or equipment including the element.

[0055] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, replacements and variations of the embodiments can be made without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. An integrated TCON control board with a heat dissipation module, characterized in that, The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model discloses a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module.

2. The integrated TCON control board with a heat dissipation module according to claim 1, characterized in that, The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module.

3. The integrated TCON control board with a heat dissipation module according to claim 2, characterized in that, The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module.

4. The integrated TCON control board with a heat dissipation module according to claim 3, characterized in that, The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module.

5. The integrated TCON control board with a heat dissipation module according to claim 2, characterized in that, The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module.

6. The integrated TCON control board with a heat dissipation module according to claim 2, wherein, The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module.

7. The integrated TCON control board with a heat dissipation module according to claim 6, characterized in that, The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module.

8. The integrated TCON control board with a heat dissipation module according to any one of claims 1-7, characterized in that, The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module.

9. The integrated TCON control board with heat dissipation module according to any one of claims 1-7, characterized in that, The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module.

10. An electrical device, characterized by The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated TCON control board with the heat dissipation module. The utility model relates to a heat dissipation module and an integrated T

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