Electronic device

Abstract

An electronic device includes: a display layer; a sensor layer disposed on the display layer and including an active area and a peripheral area adjacent to the active area; and a sensor driver driving the sensor layer. The sensor layer includes: a plurality of sensing electrodes disposed in the active region; a plurality of sensing lines disposed in the peripheral region and connected to the plurality of sensing electrodes, respectively; and a noise measurement electrode disposed in the peripheral region. The noise measuring electrode includes: a first electrode; and a second electrode. The sensor driver includes a first differential circuit including a first input terminal electrically connected to one of the plurality of sense lines and a second input terminal electrically connected to the first electrode.

Description

[0001] Cross Reference to Related Applications

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2024-0034437, filed on March 12, 2024, in the Korean Intellectual Property Office (KIPO), the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] Embodiments of the disclosure described herein relate to an electronic device improved in sensing reliability and sensing accuracy. BACKGROUND

[0004] Multimedia electronic devices such as televisions (TVs), cellular phones, tablet computers, navigation systems, and game consoles include electronic devices that display images. In addition to typical input devices such as buttons, keyboards, or mice, the electronic devices can include a sensor layer that provides touch-based input for enabling a user to intuitively, conveniently, and easily input information or commands. The sensor layer can sense a touch by a user's physical body. SUMMARY

[0005] Embodiments of the disclosure provide an electronic device improved in sensing reliability and sensing accuracy.

[0006] According to embodiments of the disclosure, an electronic device can include a display layer, a sensor layer disposed on the display layer and including an active area and a peripheral area adjacent to the active area, and a sensor driver that drives the sensor layer. The sensor layer can include a plurality of sensing electrodes disposed in the active area, a plurality of sensing lines disposed in the peripheral area and respectively connected to the plurality of sensing electrodes, and a noise measurement electrode disposed in the peripheral area. The noise measurement electrode can include a first electrode spaced apart from the plurality of sensing electrodes with the plurality of sensing lines interposed between the first electrode and the plurality of sensing electrodes, and a second electrode adjacent to the first electrode. The sensor driver includes a first differential circuit including a first input terminal electrically connected to one of the plurality of sensing lines and a second input terminal electrically connected to the first electrode.

[0007] The sensor layer can further include a resistance control circuit electrically connected between the first electrode and the first input terminal.

[0008] The resistance control circuit can include a variable resistor.

[0009] The electronic device can further include a flexible substrate. The sensor driver can be mounted on the flexible substrate, and the resistance control circuit can be mounted on the flexible substrate.

[0010] The first and second electrodes can be disposed in different layers and overlap each other in a plan view.

[0011] The first and second electrodes can be spaced apart from the plurality of sensing lines in a first direction in a plan view, and each of the first and second electrodes can extend in a second direction intersecting the first direction.

[0012] Each of the first and second electrodes can include a first portion extending in the second direction, the first portion being adjacent to the sensor driver and having a first width in the first direction, and a second portion extending in the second direction, the second portion being spaced apart from the sensor driver while the first portion is interposed between the second portion and the sensor driver, and having a second width greater than the first width in the first direction.

[0013] Each of the first and second electrodes can include a first portion spaced apart from the plurality of sensing lines in the first direction and extending in a second direction intersecting the first direction, and a second portion extending in the first direction from an end of the first portion.

[0014] The first and second electrodes can be disposed in the same layer, and the second electrode can be electrically connected to a ground pad of the sensor driver.

[0015] The second electrode can include a first portion spaced apart from the plurality of sensing lines in a first direction while the first electrode is interposed between the first portion and the plurality of sensing lines, and extending in a second direction intersecting the first direction, and a second portion extending in the first direction from an end of the first portion. BRIEF DESCRIPTION OF DRAWINGS

[0016] The above and other objects and features of the present disclosure will become apparent from specific embodiments thereof which will be described in detail by referring to the attached drawings.

[0017] Figure 1 is a schematic block diagram of an electronic device according to an embodiment of the present disclosure.

[0018] Figure 2 is a schematic block diagram illustrating an operation of an electronic device according to an embodiment of the present disclosure.

[0019] Figure 3 is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure.

[0020] Figure 4 is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure.

[0021] Figure 5 is a plan view of a display layer, a flexible substrate, and a sensor driver according to an embodiment of the present disclosure.

[0022] Figure 6 is a plan view of a sensor layer according to an embodiment of the present disclosure.

[0023] Figure 7 is a schematic cross-sectional view of a sensor layer according to an embodiment of the present disclosure taken along Figure 6 line I-I' of FIG. 5A.

[0024] Figure 8A is a schematic view of an equivalent circuit of a first electrode that senses a capacitive noise according to an embodiment of the present disclosure.

[0025] Figure 8B is a schematic view of an equivalent circuit of a noise measurement electrode that senses an inductive noise according to an embodiment of the present disclosure.

[0026] Figure 9 is a schematic view of an equivalent circuit of a sensor driver according to an embodiment of the present disclosure.

[0027] Figure 10 is a plan view of a sensor layer according to an embodiment of the present disclosure.

[0028] Figure 11 is a plan view of a sensor layer according to an embodiment of the present disclosure.

[0029] Figure 12A is a plan view of a sensor layer according to an embodiment of the present disclosure.

[0030] Figure 12B is a schematic cross-sectional view of a sensor layer according to an embodiment of the present disclosure taken along Figure 12A line II-II' of FIG. 6A.

[0031] Figure 13A is a plan view of a sensor layer according to an embodiment of the present disclosure.

[0032] Figure 13B is a schematic cross-sectional view of a sensor layer according to an embodiment of the present disclosure taken along Figure 13A line III-III' of FIG. 7A.

[0033] Figure 14is a plan view of a sensor layer according to an embodiment of the disclosure.

[0034] Figure 15 is a schematic view of an equivalent circuit of a sensor driver according to an embodiment of the disclosure. DETAILED DESCRIPTION

[0035] When an element or layer is referred to as being "on", "connected to", or "coupled to" another element or layer, it can be directly on, connected to, or coupled to the other element or layer, or intervening elements or layers can be present. In contrast, when an element or layer is referred to as being "directly on", "directly connected to", or "directly coupled to" another element or layer, there are no intervening elements or layers present. To this end, the term "connected" can refer to physical or electrical connection, electrical connection with or without wires, and / or fluid connection, with or without intervening elements. Further, when an element is referred to as being "in contact with" or "contacted by" another element, the element can be "electrically in contact with" or "electrically contacted by" the other element; or "physically in contact with" or "physically contacted by" the other element.

[0036] The same reference numbers can be assigned to the same components. Further, in the drawings, the thickness, proportions, and dimensions of components can be exaggerated for effective description of technical features. The term "and / or" includes any and all combinations of one or more of the associated components.

[0037] Although the terms "first", "second", and the like can be used to describe various components, the components should not be construed as being limited to the terms. The terms are only used to distinguish one component from another. For example, a "first component" can be termed a "second component", and, similarly, a "second component" can be termed a "first component" without departing from the scope and spirit of the disclosure. The singular forms are intended to include the plural forms unless the context clearly indicates otherwise.

[0038] Spatially relative terms, such as "under", "below", "lower", "above", "upper", "on", "over", "higher", and "side" (e.g., as in "side wall") can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientations depicted in the figures. For example, if a device in the figures is turned over, elements described as "below" or "under" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. Moreover, the device can be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and, as such, the spatially relative descriptors used herein are to be interpreted in the context as presented, and are not to be construed as limited to only orientations described.

[0039] In the description and claims, the phrase "at least one of" followed by a list of two or more items is to be understood to mean one or more of the items in the list can be used, i.e., at least one, but not all of the items in the list can be employed. Also, each individual recited item can be used, i.e., some or all of the items in the list can be utilized. The phrase "at least one of," followed by a comma separating a list of terms and followed by "or" or "and" is to be understood to mean that at least one of the terms of the list can be used, i.e., at least one, but not all of the terms in the list can be employed. In addition, each individual term in the list can be used, i.e., some or all of the terms in the list can be utilized. Similarly, the phrases "at least one of," "one or more of," and "one or more" are to be understood to mean that at least one of the terms of the list can be used, i.e., at least one, but not all of the terms in the list can be employed. Also, each individual term in the list can be used, i.e., some or all of the terms in the list can be utilized.

[0040] It will also be understood that the terms "comprises", "comprising", "includes", "including" or "has", "having" or "has / have", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

[0041] Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification are intended to have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. Further, unless otherwise defined, terms such as "a", "an" and "the" are not intended to be limiting, unless the context clearly indicates so. It will be further understood that terms, such as "comprise" and "comprising", when used in this specification, specify the presence of stated features, integers, steps, or components, but do not preclude the presence or addition of one or more other features, integers, steps, components, or groups thereof.

[0042] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0043] Figure 1is a schematic block diagram of an electronic device according to an embodiment of the disclosure.

[0044] Referring to Figure 1 The electronic device 1000 can output various information through the display device DD in the operating system. In a case where the host processor 1000C executes an application program stored in the memory 1300, the display device DD can provide application information for a user through the display layer 100.

[0045] The host processor 1000C can acquire an external input through the input module 1400 or the sensor module 1610, and execute an application corresponding to the external input. For example, in a case where a user selects a camera icon displayed through the display layer 100, the host processor 1000C can acquire a user input through the input sensor 1612, and can activate the camera module 1710. The host processor 1000C can transmit frame data corresponding to an image captured through the camera module 1710 to the display device DD. The display device DD can display an image corresponding to the captured image through the display layer 100.

[0046] For example, in a case where authentication is performed with respect to personal information in the display device DD, the fingerprint sensor 1611 can acquire input fingerprint information as input data. For example, the host processor 1000C can compare the input data acquired through the fingerprint sensor 1611 with verification data stored in the memory 1300, and can execute an application in accordance with a comparison result. The display device DD can display information executed in accordance with a logic of the application through the display layer 100.

[0047] For example, in a case where a user selects a music streaming icon displayed in the display device DD, the host processor 1000C can acquire a user input through the input sensor 1612, and activate a music streaming application stored in the memory 1300. In a case where a music play instruction is input to the music streaming application, the host processor 1000C can activate the sound output module 1630 and provide sound information corresponding to the music play instruction for a user.

[0048] The operation of the electronic device 1000 has been briefly described above. Hereinafter, components of the electronic device 1000 will be described in detail. Some of the components of the electronic device 1000 described below can be integrated with each other, and can be provided in the form of one component, or one component of the electronic device 1000 can be separated into two components.

[0049] The electronic device 1000 can communicate with an external electronic device 2000 through a network (e.g., a short-range wireless communication network, or a long-range wireless communication network). According to an embodiment, the electronic device 1000 can include a host processor 1000C, a memory 1300, an input module 1400, a display device DD, a power module 1500, an embedded module 1600, and an external module 1700. According to an embodiment, the electronic device 1000 can be configured such that at least one of the above-described components is omitted or other components are additionally included. According to an embodiment, some (e.g., the sensor module 1610, the antenna module 1620, or the sound output module 1630) of the above-described components can be integrated into another component (e.g., the display device DD).

[0050] The host processor 1000C can execute software to control at least one other component (e.g., a hardware or software component) of the electronic device 1000 connected with the host processor 1000C, and can perform various data processing and computation operations. According to an embodiment, as at least a part of the data processing operations and computation operations, the host processor 1000C can store a command or data received from another component (e.g., the input module 1400, the sensor module 1610, or the communication module 1730) in the volatile memory 1310, can process the command or data stored in the volatile memory 1310, and can store the result data in the non-volatile memory 1320.

[0051] According to an embodiment, the host processor 1000C can include a main processor 1100 and an auxiliary processor 1200. The main processor 1100 (MCU) can include at least one of a central processing unit (CPU) 220 and an application processor (AP). The main processor 1100 can further include at least one of a graphic processing unit (GPU) 1110, a communication processor (CP), and an image signal processor (ISP). The main processor 1100 can further include a neural processing unit (NPU) 1120. The neural processing unit 1120 can be a processor specialized for processing an artificial intelligence (AI) model, and the AI model can be created through machine learning. The AI model can include multiple artificial neural network (ANN) layers. The ANN can include a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of the above networks, but the disclosure is not limited thereto. The AI model can additionally or alternatively include a software structure in addition to a hardware structure. At least two of the above processing units and processors can be integrally implemented in the form of one unitary component (e.g., a single chip), or each of the above processing units and processors can be implemented in the form of separate components (e.g., multiple chips).

[0052] The auxiliary processor 1200 can include an image processing unit 210, a data conversion circuit 1210, a gamma correction circuit 1220, and a rendering circuit 1230.

[0053] The image processing unit 210 can output image data by converting a data format of the image data.

[0054] The data conversion circuit 1210 can receive frame data from the drive controller 100C, compensate the frame data so that an image is displayed with desired luminance in accordance with characteristics of the electronic device 1000 or a user setting, or can convert the frame data to reduce power consumption or to compensate for an afterimage. The gamma correction circuit 1220 can convert the frame data or a gamma reference voltage so that an image displayed in the electronic device 1000 has a desired gamma characteristic. The rendering circuit 1230 can receive frame data from the drive controller 100C and can perform rendering of the frame data based on a pixel arrangement applied to the display layer 100 of the electronic device 1000. At least one of the data conversion circuit 1210, the gamma correction circuit 1220, and the rendering circuit 1230 can be integrated with another component (e.g., the main processor 1100 or the drive controller 100C). At least one of the data conversion circuit 1210, the gamma correction circuit 1220, and the rendering circuit 1230 can be integrated into a data driver DIC described below.

[0055] The memory 1300 can store various data used by at least one component (e.g., the main processor 1000C or the sensor module 1610) of the electronic device 1000, and can store input data or output data of commands related to various data. The memory 1300 can include at least one of, for example, a volatile memory 1310 and a nonvolatile memory 1320.

[0056] The input module 1400 can receive a command or data to be used by at least one component (e.g., the main processor 1000C, the sensor module 1610, or the sound output module 1630) of the electronic device 1000, from the outside (e.g., a user or the external electronic device 2000) of the electronic device 1000.

[0057] The input module 1400 can include a first input module 1410 that receives a command or data from a user and a second input module 1420 that receives a command or data from an external electronic device 2000. The first input module 1410 can include, for example, a microphone, a mouse, a keyboard (e.g., a button), or a pen (e.g., a passive pen or an active pen). The second input module 1420 can support a protocol that can be connected to the external electronic device 2000 wirelessly or wiredly. According to an embodiment, the second input module 1420 can include at least one of a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and an audio interface. The second input module 1420 can include a connector that is physically connected to the external electronic device 2000, such as an HDMI connector, a USB connector, an SD card connector, and an audio connector (e.g., a headphone connector).

[0058] The display device DD can visually provide information to a user. The display device DD can include a display layer 100, a driving controller 100C, and a data driver DIC. The display device DD can further include a window, a chassis, and a bracket to protect the display layer 100. The display device DD can further include an emission driving circuit and a voltage generator. Details of the display device DD will be described below.

[0059] The power module 1500 can supply power to components of the electronic device 1000. The power module 1500 can include a battery that charges a power source. The battery can include a primary cell that is not rechargeable, a secondary cell that is rechargeable, or a fuel cell. The power module 1500 can include a power management integrated circuit (PMIC). The PMIC can supply optimized power to the above-described modules and the below-described modules. The PMIC can supply optimized power to the above-described components and the below-described components. The power module 1500 can include a wireless power transmitting / receiving means connected to the battery. The wireless power transmitting / receiving means can include a plurality of antenna radiators in the form of a coil.

[0060] The electronic device 1000 can further include embedded modules 1600 and external modules 1700. The embedded modules 1600 can include a sensor module 1610, an antenna module 1620, and a sound output module 1630. The external modules 1700 can include a camera module 1710, a light module 1720, and a communication module 1730.

[0061] The sensor module 1610 can sense an input made by a physical body of a user or by a pen of the first input module 1410, and generate an electrical signal or a data value corresponding to the input. The sensor module 1610 can include at least one of a fingerprint sensor 1611, an input sensor 1612, and a digitizer 1613.

[0062] The fingerprint sensor 1611 can generate a data value corresponding to a fingerprint of a user. The fingerprint sensor 1611 can include at least one of a fingerprint sensor in an ultrasonic scheme, an optical scheme, and a capacitive scheme.

[0063] The input sensor 1612 can generate a data value corresponding to coordinate information of an input made by a physical body of a user or coordinate information of an input made by a user. The input sensor 1612 can generate a change in capacitance made by an input in the form of a data value. The input sensor 1612 can sense an input made by a passive pen, and can transmit or receive data with an active pen.

[0064] The input sensor 1612 can measure a biometric signal such as blood pressure, humidity, or body fat. For example, in the case where a user contacts a sensor layer or a sensing panel with a part of a physical body without a movement for a specific time, the input sensor 1612 can sense a biometric signal based on a change in an electric field made by the part of the physical body, and output information desired by the user to the display device DD.

[0065] The digitizer 1613 can generate a data value corresponding to coordinate information of an input made by a pen. The digitizer 1613 can generate data based on a change in an electric field made by an input. The digitizer 1613 can sense an input made by a passive pen, and transmit or receive data with an active pen.

[0066] At least one of the fingerprint sensor 1611, the input sensor 1612, and the digitizer 1613 can be implemented in the form of a sensor layer formed on the display layer 100 through subsequent processing. The fingerprint sensor 1611, the input sensor 1612, and the digitizer 1613 can be disposed at an upper portion of the display layer 100, or at least one (e.g., the digitizer 1613) of the fingerprint sensor 1611, the input sensor 1612, and the digitizer 1613 can be disposed at a lower portion of the display layer 100.

[0067] At least two of the fingerprint sensor 1611, the input sensor 1612, and the digitizer 1613 can be integrated into one sensing panel through the same process. In the case where at least two of the fingerprint sensor 1611, the input sensor 1612, and the digitizer 1613 are integrated into one sensing panel, the sensing panel can be interposed between the display layer 100 and a window disposed at an upper portion of the display layer 100. According to an embodiment, the sensing panel can be disposed on the window, but the location of the sensing panel is not particularly limited thereto.

[0068] At least one of the fingerprint sensor 1611, the input sensor 1612, and the digitizer 1613 can be implemented in the display layer 100. In other words, at least one of the fingerprint sensor 1611, the input sensor 1612, and the digitizer 1613 can be simultaneously formed through a process for forming elements (e.g., a light emitting element and a transistor) included in the display layer 100.

[0069] The sensor module 1610 can generate an electrical signal or a data value corresponding to an internal or external state of the electronic device 1000. For example, the sensor module 1610 can further include a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip strength sensor, a proximity sensor, a color sensor, an infrared sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0070] The antenna module 1620 can include at least one antenna to transmit or receive a signal or power to or from the outside. According to an embodiment, the communication module 1730 can transmit or receive a signal adapted to a communication method to or from the external electronic device 2000. An antenna pattern of the antenna module 1620 can be integrated in the form of one component (e.g., the display layer 100 or the input sensor 1612) of the display device DD.

[0071] The sound output module 1630 is a device that outputs a sound signal to the outside of the electronic device 1000, and can include a speaker for general purposes, such as reproducing multimedia or recording, and a receiver dedicated to receiving a remote communication. According to an embodiment, the receiver can be integrally formed with the speaker, or can be formed separately from the speaker. A sound output pattern of the sound output module 1630 can be integrated with the display device DD.

[0072] The camera module 1710 can capture still images and moving images. According to an embodiment, the camera module 1710 can include at least one lens, an image sensor, or an image signal processor. The camera module 1710 can further include an infrared camera to measure the presence of a user, the position of a user, or the gaze of a user.

[0073] The light module 1720 can provide light. The light module 1720 can include a light emitting diode or a xenon lamp. The light module 1720 can operate in linkage with the camera module 1710, or can operate independently of the camera module 1710.

[0074] The communication module 1730 can establish a wired communication channel or a wireless communication channel between the electronic device 1000 and the external electronic device 2000, and support communication through the established wired communication channel or wireless communication channel. The communication module 1730 can include at least one of a wireless communication module such as a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module, and a wired communication module such as a local area network (LAN) communication module, a power line communication module. The communication module 1730 can communicate with the external electronic device 2000 through a short-range communication network such as Bluetooth, wireless fidelity (Wi-Fi) direct, or infrared data association (IrDA), or a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., LAN or WAN). The above-described types of the communication module 1730 can be implemented in the form of a single chip or separate multiple chips.

[0075] The input module 1400, the sensor module 1610, and the camera module 1710 can be linked to the host processor 1000C to control the operation of the display device DD.

[0076] The host processor 1000C can output a command or data to the display device DD, the sound output module 1630, the camera module 1710, or the light module 1720 based on input data received from the input module 1400. For example, the host processor 1000C can generate frame data corresponding to input data applied from a mouse or an active pen, and can output the frame data to the display device DD, or can generate command data corresponding to the input data, and can output the input data and the command data to the camera module 1710 or the light module 1720. In the case where no input data is received from the input module 1400 during a certain period of time, the host processor 1000C can switch the operation mode of the electronic device 1000 to a low power consumption mode or a sleep mode, thereby reducing the power consumption of the electronic device 1000.

[0077] The host processor 1000C can output a command or data to the display device DD, the sound output module 1630, the camera module 1710, or the light module 1720 based on the sensing data received from the sensor module 1610. For example, the host processor 1000C can compare input data acquired by the fingerprint sensor 1611 with authentication data stored in the memory 1300, and can execute an application program in dependence on a comparison result. The host processor 1000C can execute a command based on sensing data sensed by the input sensor 1612 or the digitizer 1613, or can output frame data corresponding to the sensing data to the display device DD. In the case where the sensor module 1610 includes a temperature sensor, the host processor 1000C can receive temperature data associated with a measured temperature from the sensor module 1610, and can also perform brightness correction of image data based on the temperature data.

[0078] The host processor 1000C can receive measurement data regarding presence of a user, a location of the user, and a gaze of the user from the camera module 1710. The host processor 1000C can additionally perform correction of brightness for frame data based on the measurement data. For example, the host processor 1000C that determines presence of a user through input from the camera module 1710 can display corrected frame data of brightness through the data conversion circuit 1210 or the gamma correction circuit 1220.

[0079] At least some of the plurality of components can be connected to each other by communication means (for example, a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), a mobile industry processor interface (MIPI), or a ultra path interconnect (UPI) link) between peripheral devices, and can exchange signals (for example, commands or data) with each other. The host processor 1000C can communicate with the display device DD through an interface. For example, one of the above-described communication means can be used, but the present disclosure is not limited thereto.

[0080] The electronic device 1000 can be provided in various types. For example, the electronic device 1000 can be at least one of a portable communication device (for example, a smartphone), a computer device, a portable multimedia device, a mobile medical device, a camera, a wearable device, and a home appliance. However, the electronic device is not limited to the above-described electronic devices.

[0081] Figure 2 is a schematic block diagram illustrating an operation of an electronic device according to an embodiment of the present disclosure.

[0082] Referring to Figure 2 , the electronic device 1000 can include a display layer 100, a sensor layer 200, a driving controller 100C, a sensor driver 200C, and a host processor 1000C.

[0083] The display layer 100 can be a component that substantially generates an image and displays the image. The display layer 100 can be an emissive display layer. For example, the display layer 100 can be an organic emissive display layer, a quantum dot display layer, a micro light emitting diode (LED) display layer, or a nano LED display layer. The display layer 100 can be a display panel.

[0084] The sensor layer 200 can be disposed on the display layer 100. The sensor layer 200 can sense an external input 3000 applied from the outside. The external input 3000 can include an input unit that provides a change in capacitance. For example, the sensor layer 200 can sense an input made by an active type input unit to provide a transmission signal, and sense a passive type input unit such as a human body of a user. The sensor layer 200 can be a sensor, a touch layer, a touch panel, an input sensing layer, or an input sensing panel.

[0085] The host processor 1000C can control overall operations of the electronic device 1000. For example, the host processor 1000C can control operations of the drive controller 100C and the sensor driver 200C. The host processor 1000C can include at least one microprocessor.

[0086] The drive controller 100C can drive the display layer 100. The drive controller 100C can receive a data signal DATA and a control signal D-CS from the host processor 1000C. The data signal DATA can be an MIPI signal. The control signal D-CS can include various signals. For example, the control signal D-CS can include an input vertical synchronization signal, an input horizontal synchronization signal, a master clock, and a data enable signal. The drive controller 100C can generate a scan control signal and a data control signal for controlling driving of the display layer 100 in response to the control signal D-CS.

[0087] The drive controller 100C can generate image data DT formed by converting a format of the data signal DATA to match an interface specification of the display layer 100.

[0088] The sensor driver 200C can drive the sensor layer 200. The sensor driver 200C can receive a control signal I-CS from the host processor 1000C. The control signal I-CS can include a clock signal of the sensor layer 200.

[0089] The sensor driver 200C can output a transmission signal TS to the sensor layer 200. The sensor driver 200C can calculate input coordinate information based on a reception signal RS received from the sensor layer 200, and can provide a coordinate signal I-SS having the coordinate information to the host processor 1000C. The host processor 1000C can perform an operation corresponding to a user input in response to the coordinate signal I-SS. For example, the host processor 1000C can operate the drive controller 100C so that a new application image is displayed on the display layer 100.

[0090] Figure 3 is a schematic cross-sectional view of a display device according to an embodiment of the disclosure.

[0091] Referring to Figure 3 , the display device DD can include a display layer 100 and a sensor layer 200.

[0092] The display layer 100 can include a base layer 110, a circuit layer 120, an emission element layer 130, and an encapsulation layer 140.

[0093] The base layer 110 can be a member that provides a base surface for disposing the circuit layer 120. The base layer 110 can be a glass substrate, a metal substrate, or a polymer substrate. However, the disclosure is not limited thereto, and the base layer 110 can be an inorganic layer, an organic layer, or a composite material layer.

[0094] The base layer 110 can have a multi-layer structure. For example, the base layer 110 can include a first synthetic resin layer, a silicon oxide (SiO x ) layer disposed on the first synthetic resin layer, an amorphous silicon (a-Si) layer disposed on the silicon oxide layer, and a second synthetic resin layer disposed on the amorphous silicon layer. The silicon oxide layer and the amorphous silicon layer can be referred to as a "base barrier layer".

[0095] Each of the first synthetic resin layer and the second synthetic resin layer can include a polyimide-based resin. In another embodiment, each of the first synthetic resin layer and the second synthetic resin layer can include at least one of an acrylate-based resin, a methacrylate-based resin, a polyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, a polyurethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyamide-based resin, and a perfluoroalkylene-based resin. In this specification, the term "~~-based resin" can mean that the "~~-based resin" includes a functional group of "~~".

[0096] A circuit layer 120 can be disposed on the display layer 100. The circuit layer 120 can include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. The insulating layer, the semiconductor layer, and the conductive layer can be formed on the base layer 110 by a coating process or a deposition process. Thereafter, the insulating layer, the semiconductor layer, and the conductive layer can be selectively patterned by a plurality of photolithography processes. Thereafter, the semiconductor pattern, the conductive pattern, and the signal line included in the circuit layer 120 can be formed.

[0097] A light emitting element layer 130 can be disposed on the circuit layer 120. The light emitting element layer 130 can include a light emitting element. For example, the light emitting element layer 130 can include an organic light emitting material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED.

[0098] A packaging layer 140 can be disposed on the light emitting element layer 130. The packaging layer 140 can protect the light emitting element layer 130 from foreign substances such as moisture, oxygen, and dust particles.

[0099] A sensor layer 200 can be disposed on the display layer 100. The sensor layer 200 can sense an external input applied from the outside. The external input can be a user input. The user input can include various external inputs such as an input made by a part of a user's physical body, light, heat, a pen, pressure, or a combination thereof.

[0100] The sensor layer 200 can be formed on the display layer 100 by a continuous process. In an embodiment, the sensor layer 200 can be directly disposed on the display layer 100. The term "directly disposed" can indicate that a third component is not interposed between the sensor layer 200 and the display layer 100. In other words, an additional adhesive member can not be interposed between the sensor layer 200 and the display layer 100. In another embodiment, the sensor layer 200 can be bonded to the display layer 100 by an adhesive member. The adhesive member can include a typical adhesive or an adhesive.

[0101] Although not shown, the display device DD can further include an anti-reflection layer and an optical layer disposed on the sensor layer 200. The anti-reflection layer can reduce the reflectance of external light incident from the outside of the display device DD. The optical layer can improve the front brightness of the display device 1000 by controlling the direction of light incident to the display layer 100.

[0102] Figure 4 is a schematic cross-sectional view of a display device according to an embodiment of the disclosure.

[0103] Referring to Figure 4At least one inorganic layer can be formed on the top surface of the base layer 110. The inorganic layer can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer can be formed in multiple layers. The multiple inorganic layers can constitute a barrier layer and / or a buffer layer. According to an embodiment, the display layer 100 can include a buffer layer BFL.

[0104] The buffer layer BFL can improve the bonding force between the base layer 110 and the semiconductor pattern. The buffer layer BFL can include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer BFL can include a structure in which a silicon oxide layer and a silicon nitride layer are alternately stacked with each other.

[0105] The semiconductor pattern can be disposed on the buffer layer BFL. The semiconductor pattern can include polysilicon. However, the disclosure is not limited thereto, and the semiconductor pattern can include amorphous silicon, low-temperature polysilicon, or an oxide semiconductor.

[0106] Figure 4 Only a portion of the semiconductor pattern is schematically illustrated, and the semiconductor pattern can also be disposed in another region. The semiconductor pattern can be arranged in a certain pattern across a pixel. The semiconductor pattern can have an electrical characteristic depending on a doping condition. The semiconductor pattern can include a first region having a high conductivity and a second region having a low conductivity. The first region can be doped with an N-type dopant or a P-type dopant. A P-type transistor can include a doped region doped with a P-type dopant, and an N-type transistor can include a doped region doped with an N-type dopant. The second region can be an undoped region, or can be a region having a doping concentration lower than that of the first region.

[0107] The conductivity of the first region can be higher than that of the second region. The first region can substantially function as an electrode or a signal line. The second region can correspond to an active region (or a channel) of a transistor. In other words, a portion of the semiconductor pattern can be an active region of a transistor, another portion of the semiconductor pattern can be a source region or a drain region of a transistor, and still another portion of the semiconductor pattern can be a connection electrode or a connection signal line.

[0108] Each of the plurality of pixels can have a circuit including seven transistors, one capacitor, and an emission element 100PE, but the disclosure is not limited thereto, and the circuit of the pixel can be modified in various forms. Figure 4 It is shown that, according to an embodiment, a pixel includes one transistor 100PC and one emission element 100PE.

[0109] A source region SC, an active region AL, and a drain region DR of the transistor 100PC can be formed from a semiconductor pattern. In a cross-sectional view, the source region SC and the drain region DR can extend in directions opposite to each other from the active region AL. Figure 4A portion of the connection signal line SCL formed from the semiconductor pattern is shown. Although not shown separately, in a plan view, the connection signal line SCL can be connected to the drain region DR of the transistor 100PC.

[0110] The first insulating layer 10 can be provided on the buffer layer BFL. The first insulating layer 10 can be generally provided in a plurality of pixels and cover the semiconductor pattern. The first insulating layer 10 can be an inorganic layer and / or an organic layer, and can have a single layer or a multi-layer structure. The first insulating layer 10 can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. According to an embodiment, the first insulating layer 10 can be a silicon oxide layer having a single layer structure. The first insulating layer 10 and the insulating layer of the circuit layer 120 described below can be an inorganic layer and / or an organic layer, and can have a single layer structure or a multi-layer structure. The inorganic layer can include, but is not limited to, at least one of the above-described materials.

[0111] The gate GT of the transistor 100PC can be provided on the first insulating layer 10. The gate GT can be a portion of a metal pattern. The gate GT can overlap the active layer AL in a plan view. The gate GT can be used as a mask in a process of doping the semiconductor pattern.

[0112] The second insulating layer 20 can be provided on the first insulating layer 10 and cover the gate GT. The second insulating layer 20 can be generally provided over a pixel. The second insulating layer 20 can be an inorganic layer and / or an organic layer, and can have a single layer or a multi-layer structure. The second insulating layer 20 can include at least one of silicon oxide, silicon nitride, and silicon oxynitride. According to an embodiment, the second insulating layer 20 can have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0113] The third insulating layer 30 can be provided on the second insulating layer 20. The third insulating layer 30 can have a single layer structure or a multi-layer structure. According to an embodiment, the third insulating layer 30 can have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0114] A first connection electrode CNE1 can be provided on the third insulating layer 30. The first connection electrode CNE1 can be connected to the connection signal line SCL through a contact hole CNT-1 formed through the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30.

[0115] A fourth insulating layer 40 can be provided on the third insulating layer 30. According to an embodiment, the fourth insulating layer 40 can be a silicon oxide layer in a single layer. A fifth insulating layer 50 can be provided on the fourth insulating layer 40. The fifth insulating layer 50 can be an organic layer.

[0116] The second connection electrode CNE2 can be disposed on the fifth insulating layer 50. The second connection electrode CNE2 can be connected to the first connection electrode CNE1 through a contact hole CNT-2 formed through the fourth insulating layer 40, the fifth insulating layer 50.

[0117] The sixth insulating layer 60 can be disposed on the fifth insulating layer 50, and can cover the second connection electrode CNE2. The sixth insulating layer 60 can be an organic layer.

[0118] The emission element layer 130 can be disposed on the circuit layer 120. The emission element layer 130 can include an emission element 100PE. For example, the emission element layer 130 can include an organic emission material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED. The following description will be based on an emission element 100PE including an organic emission element according to an embodiment, but the present disclosure is not particularly limited thereto.

[0119] The emission element 100PE can include an anode electrode AE, an emission layer EL, and a cathode electrode CE.

[0120] The anode electrode AE can be disposed on the sixth insulating layer 60. The anode electrode AE can be connected with the second connection electrode CNE2 through a contact hole CNT-3 formed through the sixth insulating layer 60.

[0121] The pixel definition layer 70 can be disposed on the sixth insulating layer 60, and can cover a portion of the anode electrode AE. An opening 70-OP can be defined in the pixel definition layer 70. The opening 70-OP of the pixel definition layer 70 can expose at least a portion of the anode electrode AE.

[0122] The display device DD can include an emission area PXA and a non-emission area NPXA adjacent to the emission area PXA. The non-emission area NPXA can surround the emission area PXA. According to an embodiment, the emission area PXA can correspond to a portion of the anode electrode AE exposed by the opening 70-OP.

[0123] The emission layer EL can be disposed on the anode electrode AE. The emission layer EL can be disposed in an area corresponding to the opening 70-OP. In other words, the emission layer EL can be formed individually in each of the plurality of pixels. In a case where the emission layer EL is individually formed in each pixel, each of the plurality of emission layers EL can emit light of at least one of blue, red, and green. However, the present disclosure is not limited thereto. In another embodiment, the emission layer EL can be connected with the pixel and commonly provided in the pixel, and the emission layer EL can provide blue light or white light.

[0124] The cathode electrode CE can be disposed on the emission layer EL. The cathode electrode CE can have an integral form, and can be commonly disposed in the pixel.

[0125] Although not shown, a hole control layer can be disposed between the anode electrode AE and the emission layer EL. The hole control layer can be commonly disposed in the emission area PXA and the non-emission area NPXA. The hole control layer can further include a hole transport layer and a hole injection layer. Although not shown, an electron control layer can be interposed between the emission layer EL and the cathode electrode CE. The electron control layer can include an electron transport layer, and can further include an electron injection layer. The hole control layer and the electron control layer can be commonly formed in the pixel by using an opening mask.

[0126] An encapsulation layer 140 can be disposed on the emission element layer 130. The encapsulation layer 140 can include inorganic layers, organic layers, and inorganic layers stacked in order, but the layers constituting the encapsulation layer 140 are not limited thereto.

[0127] The inorganic layer can protect the emission element layer 130 from moisture and oxygen, and the organic layer can protect the emission element layer 130 from foreign substances such as dust particles. The inorganic layer can include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer can include an acrylic-based organic layer, but the present disclosure is not limited thereto.

[0128] The sensor layer 200 can include a base layer 201, a first conductive layer 202, a sensing insulating layer 203, a second conductive layer 204, and a cover insulating layer 205.

[0129] The base layer 201 can be an inorganic layer including at least one of silicon nitride, silicon oxynitride, and silicon oxide. In another embodiment, the base layer 201 can be an organic layer including an epoxy resin, an acrylic resin, or an imine-based resin. The base layer 201 can have a single layer structure including layers stacked in a third direction DR3 or a multi-layer structure.

[0130] Each of the first conductive layer 202 and the second conductive layer 204 can have a single layer structure or a multi-layer structure including layers stacked in the third direction DR3.

[0131] The conductive layer having a single layer structure can include a metal layer or a transparent conductive layer. The metal layer can include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer can include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). In another embodiment, the transparent conductive layer can include a conductive polymer such as poly(3,4-ethylenedioxythiophene) (PEDOT), a metal nanowire, or graphene.

[0132] The conductive layer in the multi-layer structure can include a metal layer. The metal layer can have a three-layer structure of titanium / aluminum / titanium, for example. The conductive layer in the multi-layer structure can include at least one metal layer and at least one transparent conductive layer.

[0133] At least one of the sensing insulating layer 203 and the cover insulating layer 205 can include an inorganic layer. The inorganic layer can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0134] At least one of the sensing insulating layer 203 and the cover insulating layer 205 can include an organic layer. The organic layer can include at least one of acrylate-based resin, methacrylate-based resin, polyisoprene, vinyl-based resin, epoxy-based resin, polyurethane-based resin, cellulose-based resin, siloxane-based resin, polyimide-based resin, polyamide-based resin, and perfluoroalkenyl resin.

[0135] A parasitic capacitor Cb can be formed between the sensor layer 200 and the cathode electrode CE. The parasitic capacitor Cb can be referred to as a bulk capacitor. As a distance between the sensor layer 200 and the cathode electrode CE decreases, a capacitance of the parasitic capacitor Cb can increase. As the capacitance of the parasitic capacitor Cb increases, a ratio of a change in capacitance to a reference value can decrease. The change in capacitance can be a change in capacitance caused by a physical body (external input 3000) of a user before and after input (see Figure 2 ).

[0136] A sensor driver 200C (see Figure 2 ) for processing a signal sensed from the sensor layer 200 can perform a leveling operation of removing a value corresponding to a capacitance of the parasitic capacitor Cb from the sensed signal. The ratio of the change in capacitance to the reference value can be increased by the leveling operation, and thus, a sensing sensitivity can be improved.

[0137] Figure 5 is a plan view of a display layer, a flexible substrate, and a sensor driver according to an embodiment of the disclosure.

[0138] Referring to Figure 2 and Figure 5 , the display device DD can include the display layer 100, a power supply pattern VDD, a data driver DIC, the flexible substrate CF, the sensor driver 200C, a display signal line L1, a sensor signal line L2, a first communication line DTL, and a connector CNT.

[0139] A display area DP-DA and a peripheral area DP-NDA adjacent to the display area DP-DA can be defined at the display layer 100. The display area DP-DA can be an area for displaying an image. The pixels PX can be disposed in the display area DP-DA. The peripheral area DP-NDA can be an area for a driving circuit or a driving wire.

[0140] The display layer 100 can include a base layer 110, pixels PX, signal lines GL, DL, PL, and ECL, display pads P1 and P2, and a sensing pad PDT.

[0141] Each of the plurality of pixels PX can display one of primary colors and one of mixed colors. The primary colors can include red, green, or blue. The mixed colors can include various colors such as white, yellow, cyan, or magenta. However, the colors displayed by each of the plurality of pixels PX are not limited thereto.

[0142] The plurality of signal lines GL, DL, PL, and ECL can be disposed on the base layer 110. The plurality of signal lines GL, DL, PL, and ECL can be connected to the plurality of pixels PX to transmit electrical signals to the plurality of pixels PX. The plurality of signal lines GL, DL, PL, and ECL can include scan lines GL, data lines DL, power lines PL, and emission control lines ECL. However, the configuration of the plurality of signal lines GL, DL, PL, and ECL is not limited thereto. For example, the plurality of signal lines GL, DL, PL, and ECL according to an embodiment of the disclosure can further include an initialization voltage line.

[0143] A power pattern VDD can be disposed in the peripheral area DP-NDA. The power pattern VDD can be connected to the plurality of power lines PL. Each of the plurality of pixels PX can receive a first power voltage ELVDD provided through the power line PL.

[0144] A plurality of display pads P1 and P2 can be disposed in the peripheral area DP-NDA. The display pads P1 and P2 can include first pads P1 and second pads P2. A plurality of first pads P1 can be provided. The plurality of first pads P1 can be respectively connected to the plurality of data lines DL. The second pads P2 can be connected to the power pattern VDD to be electrically connected to the power lines PL. The display panel DP can provide electrical signals provided from the outside through the display pads P1 and P2 to the pixels PX. In an embodiment, the display pads P1 and P2 can include pads that receive another electrical signal in addition to the first pads P1 and the second pads P2, and are not limited to any one embodiment.

[0145] A data driver DIC can be mounted in the peripheral area DP-NDA. The data driver DIC can be a timing control circuit provided in the form of a chip. The data driver DIC can output a gray level voltage to the data line DL in response to frame data of image data DT. The plurality of data lines DL can be respectively electrically connected to the plurality of first pads P1 via the data driver DIC. However, the disclosure is not limited thereto, and the data driver DIC according to another embodiment of the disclosure can be mounted on a film separate from the display layer 100. The data driver DIC can be electrically connected to the display pads P1 and P2 through the film. For example, the film can be a flexible substrate CF.

[0146] A plurality of sensing pads PDT can be disposed in the peripheral area DP-NDA. The plurality of sensing pads PDT can be electrically connected to the sensing electrodes of the sensor layer 200, respectively. The plurality of sensing pads PDT can include a plurality of first sensing pads TD1, a plurality of second sensing pads TD2, and a plurality of third sensing pads TD3.

[0147] The flexible substrate CF can be electrically connected to the display pads P1 and P2 and the sensing pads PDT.

[0148] The sensor driver 200C can be mounted on the flexible substrate CF. The sensor driver 200C can be electrically connected to the sensing pads PDT.

[0149] The connector CNT can electrically connect the host processor 1000C to the display layer 100. The connector CNT can be disposed on the flexible substrate CF.

[0150] The display signal line L1 can be electrically connected between the display layer 100 and the host processor 1000C. For example, the display signal line L1 can be connected between the display pads P1 and P2 and the connector CNT. The display signal line L1 can transmit and receive a data signal DATA. The display signal line L1 can be disposed on the flexible substrate CF.

[0151] The sensor signal line L2 can be electrically connected between the sensor layer 200 and the sensor driver 200C. For example, the sensor signal line L2 can be connected between the sensing pads PDT and the sensor driver 200C. The sensor signal line L2 can transmit and receive a transmission signal TS (see Figure 2 ) and a reception signal RS (see Figure 2 ). The sensor signal line L2 can be disposed on the flexible substrate CF.

[0152] The first communication line DTL can be electrically connected between the sensor driver 200C and the connector CNT. The first communication line DTL can transmit driving information of the sensor layer 200. The first communication line DTL can include various communication lines to transmit the driving information to the host processor 1000C. For example, the first communication line DTL can include a general purpose input / output (GPIO).

[0153] Figure 6 is a plan view of a sensor layer according to an embodiment of the disclosure, and Figure 7 is a schematic cross-sectional view of the sensor layer taken along the line I-I' of Figure 6 .

[0154] Referring to Figure 5 to Figure 7The sensor layer 200 can include an active region AR and a non-active region NAR adjacent to the active region AR. The active region AR can be a region activated by an electrical signal. The active region AR can be a region for sensing an input. The active region AR can overlap the display region DP-DA of the display layer 100 in a plan view. The non-active region NAR can overlap the non-active region DP-NDA of the display layer 100 in a plan view.

[0155] The sensor layer 200 can include a base layer 201, a plurality of sensing electrodes SP, a plurality of sensing lines TL1 and TL2, a noise measurement electrode NSE, and a resistance control circuit RCS. The plurality of first sensing electrodes TE1 and the plurality of second sensing electrodes TE2 can be disposed in the active region AR, and the sensing lines TL1 and TL2, the noise measurement electrode NSE, and the resistance control circuit RCS can be disposed in the non-active region NAR. However, the configuration of the resistance control circuit RCS is not limited thereto. For example, the resistance control circuit RCS can be mounted on the flexible substrate CF without being included in the sensor layer 200.

[0156] The base layer 201 can be an inorganic layer including at least one of silicon nitride, silicon oxynitride, and silicon oxide. In another embodiment, the base layer 201 can be an organic layer including an epoxy resin, an acrylic resin, or an imine-based resin. The base layer 201 can be formed directly on the display layer 100. In another embodiment, the base layer 201 can be coupled to the display layer 100 by an adhesive member.

[0157] The plurality of sensing electrodes SP can include the first sensing electrodes TE1 and the second sensing electrodes TE2. The sensor layer 200 can acquire information of an external input through a change in capacitance between the first sensing electrodes TE1 and the second sensing electrodes TE2.

[0158] Each of the plurality of first sensing electrodes TE1 can extend in a first direction DR1, and the plurality of first sensing electrodes TE1 can be arranged in a second direction DR2. Each of the plurality of first sensing electrodes TE1 can include a plurality of first portions SP1 and a plurality of second portions BSP1. The plurality of first portions SP1 and the plurality of second portions BSP1 can be included in the second conductive layer 204 (see Figure 4 ).

[0159] Each of the plurality of second portions BSP1 can electrically connect two adjacent first portions SP1. The plurality of first portions SP1 and the plurality of second portions BSP1 can have a mesh structure. The plurality of first portions SP1 can be referred to as a plurality of first sensing parts SP1. The plurality of second portions BSP1 can be referred to as a plurality of first connecting parts BSP1.

[0160] The plurality of second sensing electrodes TE2 can extend in the second direction DR2 and can be arranged in the first direction DR1. The plurality of second sensing electrodes TE2 can include a plurality of sensing patterns SP2 and a plurality of bridge patterns BSP2. The plurality of sensing patterns SP2 can be included in the second conductive layer 204 (see Figure 4 ). The plurality of bridge patterns BSP2 can be included in the first conductive layer 202 (see Figure 4 ).

[0161] Each of the plurality of bridge patterns BSP2 can electrically connect two adjacent sensing patterns SP2. The plurality of sensing patterns SP2 can have a mesh structure. The plurality of sensing patterns SP2 can be referred to as a plurality of second sensing units SP2. The plurality of bridge patterns BSP2 can be referred to as a plurality of second connection units BSP2.

[0162] The second portions BSP1 and the bridge patterns BSP2 can be provided at different layers. The bridge patterns BSP2 can be insulated from the first sensing electrodes TE1 while crossing the first sensing electrodes TE1. For example, the plurality of second portions BSP1 can be respectively insulated from the plurality of bridge patterns BSP2 when crossing the plurality of bridge patterns BSP2.

[0163] The plurality of sensing lines TL1 and TL2 can include a plurality of first sensing lines TL1 and a plurality of second sensing lines TL2. The plurality of first sensing lines TL1 can be respectively electrically connected to the plurality of first sensing electrodes TE1. The plurality of second sensing lines TL2 can be respectively electrically connected to the plurality of second sensing electrodes TE2.

[0164] The plurality of first sensing lines TL1 can be respectively electrically connected to the plurality of first sensing pads TD1 through contact holes. The sensor driver 200C can receive a reception signal RS (see Figure 2 ) from the first sensing electrodes TE1 through the first sensing lines TL1.

[0165] The plurality of second sensing lines TL2 can be respectively electrically connected to the plurality of second sensing pads TD2 through contact holes. The sensor driver 200C can transmit a transmission signal TS (see Figure 2 ) to the second sensing electrodes TE2 through the second sensing lines TL2.

[0166] The noise measurement electrode NSE can extend in the second direction DR2. The noise measurement electrode NSE can be connected to the resistance control circuit RCS. The noise measurement electrode NSE can be electrically connected to the third sensing pad TD3 through a contact hole.

[0167] A plurality of noise measurement electrodes NSE can be provided. The noise measurement electrodes NSE can be spaced apart from each other in the first direction DR1 with the active region AR interposed therebetween.

[0168] The noise measurement electrode NSE can include a first electrode E1 and a second electrode E2. The first electrode E1 can be spaced apart from the sensing electrode SP with the first sensing line TL1 interposed therebetween. The second electrode E2 can be adjacent to the first electrode E1.

[0169] The first electrode E1 and the second electrode E2 can be disposed in different layers.

[0170] The second electrode E2 can be disposed on the base layer 201. The second electrode E2 and the first conductive layer 202 can be disposed in the same layer. The sensing insulating layer 203 can cover the second electrode E2. The second electrode E2 can extend in the second direction DR2.

[0171] The first electrode E1 can be disposed on the second electrode E2. The first electrode E1 can be disposed on the sensing insulating layer 203. The first electrode E1 and the second conductive layer 204 can be disposed in the same layer. The cover insulating layer 205 can cover the first electrode E1. The first electrode E1 can extend in the second direction DR2.

[0172] In a plan view, the first electrode E1 and the second electrode E2 can overlap each other. In a plan view, the first electrode E1 and the second electrode E2 can be spaced apart from the first sensing line TL1 in the first direction DR1.

[0173] The first electrode E1 and the second electrode E2 can form a noise capacitor Cc.

[0174] Figure 8A is a schematic diagram of an equivalent circuit of a first electrode sensing a noise capacitance according to an embodiment of the disclosure.

[0175] Referring to Figure 2 and Figure 8A The first electrode E1 can be connected to the first node N1. The first electrode E1 can include resistors R1 and R2.

[0176] The cathode electrode CE can receive a second power voltage ELVSS having a voltage level lower than a first power voltage ELVDD (see Figure 5 ). The cathode electrode CE can include cathode resistors Ra and Rb.

[0177] The first noise source NC1 can be configured to provide a display signal to the display layer 100. For example, the first noise source NC1 can include a driving controller 100C.

[0178] The display signal can be transmitted to the cathode electrode CE through the capacitor Ca formed between the first noise source NC1 and the cathode electrode CE while being used as the first noise signal NS1, and can be applied to the sensor layer 200 through the parasitic capacitor Cb formed between the display layer 100 and the sensor layer 200. The first noise signal NS1 can be referred to as a capacitive noise signal.

[0179] The first noise signal NS1 can be transmitted to the sensor layer 200 by the noise of the cathode electrode CE of the display layer 100, the low frequency noise, the processing deviation, the offset, and / or the abnormal film formation.

[0180] The parasitic capacitor Cb can be formed between the cathode electrode CE and the first electrode E1.

[0181] In a case where the abnormal film formation of the cathode electrode CE is caused, the sizes of the first cathode resistor Ra and the second cathode resistor Rb of the cathode electrode CE can be different from each other. For example, in a case where the abnormal film formation is caused in the region of the cathode electrode CE having the second cathode resistor Rb, the size of the second cathode resistor Rb can be greater than the size of the first cathode resistor Ra. Accordingly, the first noise signal NS1 can be transmitted to the first electrode E1 through the parasitic capacitor Cb, instead of being transmitted to the terminal to which the second power voltage ELVSS is applied. The first noise signal NS1 can be transmitted to the first node N1 along the first electrode E1.

[0182] The first node N1 can be electrically connected to the sensor driver 200C. The sensor driver 200C can receive the first noise signal NS1 generated by the parasitic capacitor Cb.

[0183] The sensor driver 200C can individually amplify and convert the received first noise signal NS1 and the received signal RS to obtain a noiseless signal. Details thereof will be described below.

[0184] Figure 8B is a schematic view of an equivalent circuit of a noise measuring electrode that senses induction noise according to an embodiment of the disclosure.

[0185] Referring to Figure 2 and Figure 8B , the second noise source NC2 can form a magnetic field. For example, the second noise source NC2 can include a wireless power transmission / reception member of the power module 1500 (see Figure 1 ).

[0186] An induced electromotive force v(t) can be generated from the first electrode E1 by the second noise source NC2. An induced current generated based on the induced electromotive force v(t) can be transmitted to the first node N1 while being used as the second noise signal NS2. The second noise signal NS2 can be referred to as an induction noise signal.

[0187] The induced current can be expressed in Equation 1 below.

[0188] [Equation 1]

[0189]

[0190] In Equation 1, i(t) can be an induced current, Cb can be a capacitance of a parasitic capacitor, Cc can be a capacitance of a noise capacitor, and v(t) can be an induced electromotive force. "d / dx" can be a symbol representing a differential.

[0191] One end of each of the parasitic capacitor Cb and the noise capacitor Cc can be grounded. One end of the noise capacitor Cc can be the second electrode E2.

[0192] The capacitance of the noise capacitor Cc can be greater than the capacitance of the parasitic capacitor Cb.

[0193] Unlike the present disclosure, in the case where the noise measurement electrode NSE (see Figure 7 ) does not include the second electrode E2, the noise capacitor Cc can not be formed. The noise affects the touch of the sensor layer due to the magnetic field, but the induced current formed only by the parasitic capacitor Cb is negligible compared to the embodiment in which the noise capacitor Cc is formed. Accordingly, the induced current can not be measured. Thus, it can be difficult to remove the noise. However, according to the present disclosure, the noise measurement electrode NSE can include the first electrode E1 and the second electrode E2 spaced apart from each other to form the noise capacitor Cc. The induced current can be relatively increased through Equation 1 of the noise capacitor Cc. The second noise signal NS2 can be provided to the first node N1. The sensor driver 200C can easily sense the induced noise. Accordingly, the electronic device 1000 can improve in terms of sensing reliability and accuracy.

[0194] Figure 9 is a schematic view of an equivalent circuit of a sensor driver according to an embodiment of the present disclosure.

[0195] Referring to Figure 6 and Figure 9 , the first node N1 can be electrically connected to the noise measurement electrode NSE. For example, the first node N1 can be connected to the first electrode E1. The first noise signal NS1 and the second noise signal NS2 can be provided to the resistance control circuit RCS through the first node N1. The resistance control circuit RCS can include a variable resistor PM.

[0196] The second node N2 can be electrically connected to each of the plurality of first sensing electrodes TE1. For example, the second node N2 can be connected to the first sensing line TL1 and the first sensing pad TD1. The reception signal RS can be provided through the second node N2.

[0197] The first noise signal NS1 and the second noise signal NS2 having passed through the resistance control circuit RCS can be converted into a converted signal NS. The resistance control circuit RCS can control the amplitude and the phase of the converted signal NS such that the amplitude and the phase of the converted signal NS are equal to the amplitude and the phase of the reception signal RS. In other words, the resistance control circuit RCS can be a component for impedance matching between the second noise signal NS2 and the reception signal RS.

[0198] The sensor driver 200C can include a first differential circuit DA1, a filter FT, and a conversion circuit ADC. The sensor driver 200C can be implemented in the form of an analog front end (AFE) including at least one amplifier.

[0199] The first differential circuit DA1 can receive the reception signal RS and the converted signal NS. The first differential circuit DA1 can independently amplify and output the reception signal RS and the converted signal NS. The first differential circuit DA1 can include a first amplifier AMP1. For example, the first amplifier AMP1 can include an operational amplifier (OP).

[0200] The first differential circuit DA1 can include a first input terminal IN1 and a second input terminal IN2.

[0201] The first input terminal IN1 can be electrically connected to the second node N2. In other words, the first input terminal IN1 can be electrically connected to one of the plurality of sensing lines TL1 and TL2. The reception signal RS can be provided to the first input terminal IN1. The first input terminal IN1 can be referred to as an inverting input terminal. A first capacitor C1 can be connected in parallel between the first input terminal IN1 and an output terminal. The first capacitor C1 can control the amplitude of the reception signal RS.

[0202] The second input terminal IN2 can be electrically connected to the first node N1. In other words, the second input terminal IN2 can be electrically connected to the first electrode E1. The converted signal NS can be provided to the second input terminal IN2. The second input terminal IN2 can be referred to as a non-inverting input terminal. A second capacitor C2 can be connected in parallel between the second input terminal IN2 and the output terminal. The second capacitor C2 can control the amplitude of the converted signal NS.

[0203] In a case where a plurality of first differential circuits DA1 is provided, a plurality of first sensing lines TL1 can be connected to the plurality of first differential circuits DA1, respectively. The second input terminal IN2 of each of the plurality of first differential circuits DA1 can be commonly connected to the first electrode E1. However, the connection relationship of the second input terminal IN2 of each of the plurality of first differential circuits DA1 is not limited thereto. For example, some of the plurality of second input terminals IN2 of the plurality of first differential circuits DA1 can be electrically connected to the first electrode E1, and the remaining second input terminals IN2 of the plurality of first differential circuits DA1 can be grounded or can receive a constant voltage. In other words, the noise measurement electrode NSE can be connected only to some of the plurality of first differential circuits DA1 connected to the first sensing electrode TE1, which are weakly affected by noise.

[0204] According to the present disclosure, the output terminal of the first differential circuit DA1 can remove noise by superimposing signals provided from the first input terminal IN1 and the second input terminal IN2 and canceling noise signals provided from the first input terminal IN1 and the second input terminal IN2 from each other. The first differential circuit DA1 can operate in a common mode ground. Thus, an undesired signal can be removed, and a desired signal is not distorted. Capacitive noise of the sensor layer 200 can be removed based on the first noise signal NS1, and inductive noise of the sensor layer 200 can be removed based on the second noise signal NS2. Both the capacitive noise and the inductive noise can be removed by the first differential circuit DA1. The sensitivity can be improved by increasing the signal-to-noise ratio (SNR) of the sensor layer 200. Thus, an electronic device 1000 (see Figure 1 ) in which a noise component is reduced or removed can be provided, and an electronic device 1000 (see Figure 1 ) in which sensing reliability and accuracy are improved can be provided.

[0205] Unlike the present disclosure, in a case where there is no resistance control circuit RCS between the noise measurement electrode NSE and the sensor driver 200C, an unconverted second noise signal NS2 can be provided to the first differential circuit DA1. In a case where impedance matching is not performed, it can not be possible to easily cancel inductive noise by a differential circuit. However, according to the present disclosure, an electronic device 1000 (see Figure 1 ) can include a component that controls the resistance of the noise measurement electrode NSE. For example, an electronic device 1000 (see Figure 1) can include a resistance control circuit RCS connected between the noise measurement electrode NSE and the sensor driver 200C. The second noise signal NS2 sensed by the noise measurement electrode NSE can include induction noise. The second noise signal NS2 can be impedance-matched by the resistance control circuit RCS to be converted into a converted signal NS. The first differential circuit DA1 can remove the induction noise from the reception signal RS based on the converted signal NS. Accordingly, an electronic device 1000 (see Figure 1 ) that is improved in sensing reliability and accuracy can be provided.

[0206] The filter FT can be connected to the first differential circuit DA1. The filter FT can include a band-pass filter and a low-pass filter.

[0207] The conversion circuit ADC can be connected to the filter FT. The conversion circuit ADC can convert an analog signal input from the filter FT into a digital signal. The conversion circuit ADC can include an analog-to-digital converter. The conversion circuit ADC can output a coordinate signal I-SS.

[0208] Figure 10 is a plan view of a sensor layer according to an embodiment of the disclosure. In the following description made below with reference to Figure 10 , the same reference numerals will be assigned to components described with reference to Figure 6 and details thereof will be omitted.

[0209] Referring to Figure 10 , a noise measurement electrode NSE-1 can be disposed in the peripheral area NAR. The noise measurement electrode NSE-1 can include a first electrode E1-1 and a second electrode E2-1. The first electrode E1-1 can be spaced apart from the sensing electrode SP in the first direction DR1 while the first sensing line TL1 is interposed between the first electrode E1-1 and the sensing electrode SP.

[0210] The first electrode E1-1 and the second electrode E2-1 can be disposed in different layers. The first electrode E1-1 can be disposed on the second electrode E2-1. In the plan view, the first electrode E1-1 and the second electrode E2-1 can overlap each other.

[0211] The first electrode E1-1 can include a first portion P1-1 and a second portion P2-1 extending from the first portion P1-1. The first portion P1-1 and the second portion P2-1 can be integrally provided with each other.

[0212] The first portion P1-1 can extend in the second direction DR2. The first portion P1-1 can be disposed adjacent to the sensor driver 200C (see Figure 2 ). The first portion P1-1 can have a first width W1 in the first direction DR1.

[0213] The second portion P2-1 can extend in the second direction DR2. The second portion P2-1 can be spaced apart from the sensor driver 200C while the first portion P1-1 is interposed between the second portion P2-1 and the sensor driver 200C. The second portion P2-1 can have a second width W2 in the first direction DR1. The second width W2 can be greater than the first width W1. In other words, the second portion P2-1 can be wider than the first portion P1-1.

[0214] The second electrode E2-1 can include a first portion corresponding to the first portion P1-1 and a second portion corresponding to the second portion P2-1. In a plan view, the first electrode E1-1 and the second electrode E2-1 can have the same shape.

[0215] A capacitance of a noise capacitor Cc (see Figure 8B ) between the second portion P2-1 of the first electrode E1-1 and the second portion of the second electrode E2-1 can be greater than a capacitance of a noise capacitor Cc (see Figure 8B ) between the first portion P1-1 of the first electrode E1-1 and the first portion of the second electrode E2-1.

[0216] In other words, a capacitance of a noise capacitor Cc (see Figure 8B ) formed between the first electrode E1-1 and the second electrode E2-1 can be greater than a capacitance of a noise capacitor having a constant width formed between the first electrode and the second electrode.

[0217] According to the present disclosure, an induced current can be relatively increased by the noise capacitor Cc. A second noise signal NS2 (see Figure 8B ) can be provided to the first node N1. The sensor driver 200C (see Figure 2 ) can easily sense and remove the induced noise. Accordingly, the electronic device 1000 (see Figure 2 ) can improve in sensing reliability and accuracy.

[0218] Figure 11 is a plan view of a sensor layer according to an embodiment of the present disclosure. In the following description made with reference to Figure 11 , the same reference numerals will be assigned to components described with reference to Figure 6 , and details thereof will be omitted.

[0219] With reference to Figure 11 , a noise measurement electrode NSE-2 can be disposed in the peripheral area NAR. The noise measurement electrode NSE-2 can include a first electrode E1-2 and a second electrode E2-2.

[0220] The first electrode E1-2 and the second electrode E2-2 can be disposed in different layers. The first electrode E1-2 can be disposed on the second electrode E2-2. In a plan view, the first electrode E1-2 and the second electrode E2-2 can overlap each other.

[0221] The first electrode E1-2 can include a first portion P1-2 and a second portion P2-2 extending from the first portion P1-2. The first portion P1-2 and the second portion P2-2 can be integrally provided with each other.

[0222] The first portion P1-2 can extend in the second direction DR2. The first portion P1-2 can be spaced apart from the first sensing line TL1 in the first direction DR1.

[0223] The second portion P2-2 can extend from one end of the first portion P1-2 in the first direction DR1. In a plan view, the second portion P2-2 can be disposed on the sensing electrode SP.

[0224] The second electrode E2-2 can include a first portion corresponding to the first portion P1-2 and a second portion corresponding to the second portion P2-2. In a plan view, the first electrode E1-2 and the second electrode E2-2 can have the same shape.

[0225] A capacitance of a noise capacitor Cc (see Figure 8B ) formed between the first electrode E1-2 and the second electrode E2-2 can be defined by an area in which the first electrode E1-2 overlaps the second electrode E2-2.

[0226] Figure 12A is a plan view of a sensor layer according to an embodiment of the disclosure, and Figure 12B is a schematic cross-sectional view of the sensor layer taken along Figure 12A line II-II' of Figure 12A and Figure 12B will be assigned the same reference numerals and details thereof will be omitted. Figure 6 and Figure 7 .

[0227] Referring to Figure 12A and Figure 12B , a noise measurement electrode NSE-3 can be disposed in the peripheral area NAR. The noise measurement electrode NSE-3 can include a first electrode E1-3 and a second electrode E2-3.

[0228] The first electrode E1-3 and the second electrode E2-3 can be disposed in the same layer. The first electrode E1-3 and the second electrode E2-3 can be disposed on the sensing insulating layer 203. However, the arrangement relationship between the first electrode E1-3 and the second electrode E2-3 is not limited thereto. For example, the first electrode E1-3 and the second electrode E2-3 can be disposed on the base layer 201.

[0229] The first electrode E1-3 can extend in the second direction DR2. The first electrode E1-3 can be spaced apart from the sensing electrode SP in the first direction DR1, with the first sensing line TL1 interposed between the first electrode E1-3 and the first sensing line TL1. The first electrode E1-3 can be connected to the resistance control circuit RCS.

[0230] The second electrode E2-3 can be disposed at the outermost portion of the peripheral area NAR. The second electrode E2-3 can be electrically connected to a ground pad (see Figure 2 ) of the sensor driver 200C.

[0231] According to the present disclosure, electrostatic introduced from the outside can be disposed at the outermost portion, and can be blocked by the second electrode E2-3 electrically connected to the ground pad. The second electrode E2-3 can prevent electrostatic discharge (ESD). Accordingly, the electronic device 1000 (see Figure 1 ) can improve reliability.

[0232] The second electrode E2-3 can include a first portion P1-3 and a second portion P2-3 extending from the first portion P1-3. The first portion P1-3 and the second portion P2-3 can be integrally provided with each other.

[0233] The first portion P1-3 can extend in the second direction DR2. The first portion P1-3 can be spaced apart from the first sensing line TL1 in the first direction DR1, with the first electrode E1-3 interposed between the first portion P1-3 and the first sensing line TL1.

[0234] The second portion P2-3 can extend from one end of the first portion P1-3 in the first direction DR1. In a plan view, the second portion P2-3 can be disposed on the sensing electrode SP.

[0235] The noise capacitor Cca can be formed between the first electrode E1-3 and the second electrode E2-3.

[0236] According to the present disclosure, an induced current can be relatively increased by the noise capacitor Cca. The second noise signal NS2 (see Figure 8B ) can be provided to the first node N1. The sensor driver 200C (see Figure 2 ) can easily sense and remove the induced noise. Accordingly, the electronic device 1000 (seeFigure 2 ) can be improved in terms of sensing reliability and accuracy.

[0237] Figure 13A is a plan view of a sensor layer according to an embodiment of the present disclosure, and Figure 13B is a schematic cross-sectional view of the sensor layer taken along Figure 13A line III-III' of Figure 13A and Figure 13B and Figure 12B the description made below with reference to Figure 6 and Figure 7 the same reference numerals will be assigned to components described with reference to

[0238] With reference to Figure 13A and Figure 13B , a noise measurement electrode NSE-4 can be provided in the peripheral area NAR. The noise measurement electrode NSE-4 can include a first electrode E1-4 and a second electrode E2-4.

[0239] In the plan view, the first electrode E1-4 and the second electrode E2-4 can overlap each other. The first electrode E1-4 and the second electrode E2-4 can be alternately provided in the second direction DR2. For example, the first electrode E1-4 can be provided on the second electrode E2-4, or the second electrode E2-4 can be provided on the first electrode E1-4 in the second direction DR2.

[0240] The first electrode E1-4 can include a first auxiliary electrode E1-4a and a second auxiliary electrode E1-4b. The first auxiliary electrode E1-4a and the second auxiliary electrode E1-4b can be provided in different layers and can be electrically connected to each other through a first contact hole CNT1.

[0241] The first auxiliary electrode E1-4a can be provided on the sensing insulating layer 203. The second auxiliary electrode E1-4b can be provided below the first auxiliary electrode E1-4a. The second auxiliary electrode E1-4b can be provided on the base layer 201.

[0242] The second electrode E2-4 can include a third auxiliary electrode E2-4a and a fourth auxiliary electrode E2-4b. The third auxiliary electrode E2-4a and the fourth auxiliary electrode E2-4b can be provided in different layers and can be electrically connected to each other through a second contact hole CNT2.

[0243] A third auxiliary electrode E2-4a can be disposed on the sensing insulating layer 203. The third auxiliary electrode E2-4a can be disposed on the second auxiliary electrode E1-4b and the fourth auxiliary electrode E2-4b. In a plan view, the third auxiliary electrode E2-4a and the second auxiliary electrode E1-4b can overlap each other. The fourth auxiliary electrode E2-4b can be disposed under the third auxiliary electrode E2-4a. The fourth auxiliary electrode E2-4b can be disposed on the base layer 201. In a plan view, the fourth auxiliary electrode E2-4b and the first auxiliary electrode E1-4a can overlap each other.

[0244] According to an embodiment of the disclosure, a resistance control circuit RCS (see Figure 6 ) can be omitted. The first electrode E1-4 can include the first auxiliary electrode E1-4a and the second auxiliary electrode E1-4b connected through the contact hole CNT1, and the second electrode E2-4 can include the third auxiliary electrode E2-4a and the fourth auxiliary electrode E2-4b connected through the contact hole CNT2. The resistance of each of the first electrode E1-4 and the second electrode E2-4 can be increased by the contact holes CNT1 and CNT2. The resistance control circuit RCS (see Figure 6 ) can function as a noise measurement electrode NSE-4.

[0245] According to the disclosure, the resistance of the noise measurement electrode NSE-4 can be adjusted through the structure of the noise measurement electrode NSE-4. The second noise signal NS2 (see Figure 9 ) sensed by the noise measurement electrode NSE-4 can include induced noise. The second noise signal NS2 (see Figure 9 ) can be impedance-matched by the noise measurement electrode NSE-4 to be converted into a converted signal NS (see Figure 9 ). The first differential circuit DA1 (see Figure 9 ) can remove the induced noise from the reception signal RS (see Figure 9 ) based on the converted signal NS (see Figure 9 ). Accordingly, the electronic device 1000 (see Figure 1 ) can improve in sensing reliability and accuracy.

[0246] Figure 14 is a plan view of a sensor layer according to an embodiment of the disclosure. In the following description made with reference to Figure 14 , the same reference numerals will be assigned to components described with reference to Figure 6 and details thereof will be omitted.

[0247] With reference to Figure 14 , a noise measurement electrode NSE-5 can be disposed in the peripheral area NAR. The noise measurement electrode NSE-5 can include a first electrode E1-5 and a second electrode E2-5.

[0248] The first electrode E1-5 can be disposed on the second electrode E2-5. In a plan view, the first electrode E1-5 and the second electrode E2-5 can overlap each other.

[0249] In a plan view, the first electrode E1-5 and the second electrode E2-5 can be spaced apart from the first sensing line TL1 in the first direction DR1.

[0250] The first electrode E1-5 can include a first portion P1-5 and a second portion P2-5 extending from the first portion P1-5. The first portion P1-5 and the second portion P2-5 can be integrally provided with each other.

[0251] The first portion P1-5 can extend in the second direction DR2.

[0252] The second portion P2-5 can extend from one end of the first portion P1-5, and can have a pattern. For example, the pattern can include a sawtooth pattern. A length of the second portion P2-5 can be increased by the pattern, compared to a second portion having a shape extending in the second direction DR2. A resistance of the second portion P2-5 can be increased by the pattern.

[0253] The second electrode E2-5 can include a first portion corresponding to the first portion P1-5 and a second portion corresponding to the second portion P2-5. In a plan view, the first electrode E1-5 and the second electrode E2-5 can have the same shape.

[0254] According to an embodiment of the disclosure, a resistance control circuit RCS (see Figure 6 ) can be omitted. Each of the first electrode E1-5 and the second electrode E2-5 can include a second portion P2-5 having a pattern. A resistance of each of the first electrode E1-5 and the second electrode E2-5 can be increased by the pattern. The noise measurement electrode NSE-5 can function as the resistance control circuit RCS (see Figure 6 ).

[0255] According to the disclosure, a resistance of the noise measurement electrode NSE-5 can be adjusted by a structure of the noise measurement electrode NSE-5. A second noise signal NS2 (see Figure 9 ) sensed by the noise measurement electrode NSE-5 can include an induction noise. The second noise signal NS2 (see Figure 9 ) can be impedance-matched by the noise measurement electrode NSE-5 to be converted into a converted signal NS (see Figure 9 ). The first differential circuit DA1 (see Figure 9 ) can convert the converted signal NS (see Figure 9 ) into a first differential signal DS1 (see Figure 9) remove induction noise. Accordingly, the electronic device 1000 (see Figure 1 ) can improve in sensing reliability and accuracy.

[0256] Figure 15 is a schematic view of an equivalent circuit of a sensor driver according to an embodiment of the disclosure. In the following description made with reference to Figure 15 , the same reference numerals will be assigned to components described with reference to Figure 9 and details thereof will be omitted.

[0257] With reference to Figure 6 and Figure 15 , the sensor driver 200Ca can include a first differential circuit DA1, a second differential circuit DA2, a filter FT, and a conversion circuit ADC.

[0258] The (2-1)th node N2a and the (2-2)th node N2b can be electrically connected to the first sensing electrode TE1, respectively. For example, the (2-1)th node N2a and the (2-2)th node N2b can be connected to the first sensing line TL1 and the first sensing pad TD1 (see Figure 9 ).

[0259] The (2-1)th node N2a can be connected to one of a plurality of first sensing lines TL1, and the (2-2)th node N2b can be connected to another of the plurality of first sensing lines TL1. For example, the (2-1)th node N2a can be electrically connected to one of a plurality of first sensing electrodes TE1, and the (2-2)th node N2b can be electrically connected to another first sensing electrode adjacent to the one of the plurality of first sensing electrodes TE1.

[0260] The first reception signal RSa can be provided from one of the plurality of first sensing electrodes TE1 through the (2-1)th node N2a. The second reception signal RSb can be provided from another of the first sensing electrodes TE1 through the (2-2)th node N2b.

[0261] The second differential circuit DA2 can receive the first reception signal RSa and the second reception signal RSb. The second differential circuit DA2 can independently amplify and output the first reception signal RSa and the second reception signal RSb. The second differential circuit DA2 can include a second amplifier AMP2. For example, the second amplifier AMP2 can include an operational amplifier (OP).

[0262] The second differential circuit DA2 can include a first input terminal IN1a and a second input terminal IN2a.

[0263] The first input terminal IN1a can be electrically connected to a first (2-1) node N2a. A first reception signal RSa can be provided to the first input terminal IN1a. The first input terminal IN1a can be referred to as an inverting input terminal.

[0264] The second input terminal IN2a can be electrically connected to a second (2-2) node N2b. A second reception signal RSb can be provided to the second input terminal IN2a. The second input terminal IN2a can be referred to as a non-inverting input terminal.

[0265] An output terminal of the second differential circuit DA2 can be connected to a first input terminal IN1 of the first differential circuit DA1.

[0266] The second differential circuit DA2 can provide a signal output by independently sensing between two adjacent first sensing electrodes TE1 to the first input terminal IN1 of the first differential circuit DA1, and the second differential circuit DA2 can operate in a differential mode.

[0267] As described above, the noise measurement electrode can include the first electrode and the second electrode spaced apart from each other to form a noise capacitor. The induced current can be relatively increased by the noise capacitor. The noise signal can be provided to the first node. The sensor driver can easily sense the induced noise. Accordingly, an electronic device improved in sensing reliability and sensing accuracy can be provided.

[0268] As described above, the output terminal of the first differential circuit can remove noise by superimposing signals provided from the first input terminal and the second input terminal and canceling noise signals provided from the first input terminal and the second input terminal from each other. Accordingly, an undesirable signal can be removed, and a desirable signal can not be distorted. Based on the noise signal, a capacitive noise and an induced noise can be removed from the sensor layer. The capacitive noise and the induced noise can be removed in total by the first differential circuit. The sensitivity of the sensor layer can be improved by increasing a signal-to-noise ratio (SNR). Accordingly, an electronic device can be provided with reduced or not provided noise components. Accordingly, an electronic device improved in sensing reliability and sensing accuracy can be provided.

[0269] The above description is an example of technical features of the disclosure, and those skilled in the art related to the disclosure will be able to make various modifications and changes. Accordingly, the above-described embodiments of the disclosure can be implemented alone or in combination with each other.

[0270] Therefore, the embodiments disclosed in the present disclosure are not intended to limit the technical spirit of the present disclosure, but to describe the technical spirit of the present disclosure, and the scope of the technical spirit of the present disclosure is not limited by these embodiments. The scope of protection of the present disclosure should be interpreted by the appended claims, and all technical spirits within the equivalent scope should be interpreted to be included in the scope of the present disclosure.

Claims

1. An electronic device, characterized by comprising: The electronic device includes: a display layer; a sensor layer disposed on the display layer and including an active area and a peripheral area adjacent to the active area; and a sensor driver driving the sensor layer, wherein the sensor layer includes: a plurality of sensing electrodes disposed in the active area; a plurality of sensing lines disposed in the peripheral area and respectively connected to the plurality of sensing electrodes; and a noise measurement electrode disposed in the peripheral area, the noise measurement electrode includes: a first electrode spaced apart from the plurality of sensing electrodes with the plurality of sensing lines interposed therebetween; and a second electrode adjacent to the first electrode, and the sensor driver includes a first differential circuit including a first input terminal electrically connected to one of the plurality of sensing lines and a second input terminal electrically connected to the first electrode. 2.The electronic device of claim 1, wherein, The sensor layer further includes a resistance control circuit electrically connected between the first electrode and the first input terminal. 3.The electronic device of claim 2, wherein, The resistance control circuit includes a variable resistor. 4.The electronic device of claim 2, wherein, The electronic device further includes: a flexible substrate, wherein the sensor driver is mounted on the flexible substrate, and the resistance control circuit is mounted on the flexible substrate. 5.The electronic device of claim 1, wherein, In a plan view, the first electrode and the second electrode are disposed in different layers and overlap each other. 6.The electronic device of claim 5, wherein, in the plan view, the first electrode and the second electrode are spaced apart from the plurality of sensing lines in a first direction, and each of the first electrode and the second electrode extends in a second direction intersecting the first direction. 7.The electronic device of claim 6, wherein, Each of the first electrode and the second electrode includes: a first portion extending in the second direction, the first portion being adjacent to the sensor driver, and the first portion having a first width in the first direction; and a second portion extending in the second direction, the second portion being spaced apart from the sensor driver with the first portion interposed therebetween, and the second portion having a second width greater than the first width in the first direction. 8.The electronic device of claim 5, wherein, Each of the first electrode and the second electrode includes: a first portion spaced apart from the plurality of sensing lines in a first direction and extending in a second direction intersecting the first direction; and a second portion extending in the first direction from an end of the first portion. 9.The electronic device of claim 1, wherein the first electrode and the second electrode are disposed in the same layer, and the second electrode is electrically connected to a ground pad of the sensor driver. 10.The electronic device of claim 9, wherein, The second electrode includes: a first portion spaced apart from the plurality of sensing lines in a first direction with the first electrode interposed therebetween, and the first portion extending in a second direction intersecting the first direction; and a second portion extending in the first direction from an end of the first portion.

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